CN102542087A - Footprint design automation system and method - Google Patents
Footprint design automation system and method Download PDFInfo
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- CN102542087A CN102542087A CN2010106037302A CN201010603730A CN102542087A CN 102542087 A CN102542087 A CN 102542087A CN 2010106037302 A CN2010106037302 A CN 2010106037302A CN 201010603730 A CN201010603730 A CN 201010603730A CN 102542087 A CN102542087 A CN 102542087A
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- electronic component
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- encapsulation
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Abstract
The invention discloses a footprint design automation system, which comprises an input module and a processing module, wherein the input module is used for inputting setting data of an electronic element to be drawn by a user according to different footprint design modes; and the processing module is used for extracting corresponding information data from the data of the electronic element input through the input module and drawing a footprint of the electronic element according to a footprint design rule in a database. The invention also discloses a footprint design automation method.
Description
Technical field
The present invention system is about corresponding (Footprint) design automation system of a kind of encapsulation pin and method; Be meant especially according to corresponding (Footprint) design rule of the encapsulation pin in the database, with the encapsulation pin corresponding (Footprint) of drawing out this electronic component.
Background technology
Along with the development of integrated circuit densification, increase with electric design automation (Electronic Design Automation; EDA) software carries out the demand of circuit board wiring, and software comparatively commonly used at present has Allegro, Protel etc.
Because making rapid progress of electronic technology; And different design requirement; So that the encapsulation specification of electronic component is difference to some extent, so the user before carrying out the circuit board wiring operation, often need create the solid pattern of corresponding electronic component to each required electronic package.And the establishment mode is to be traditional manual drawing, that is the user needs pin, frame and the framing mask etc. of hand drawn electronic component, and accomplishes the corresponding property setting, defines like aspect.This kind method not only wastes time and energy, and error rate is high, is unfavorable for the wires design work of subsequent conditioning circuit plate.
In addition, those softwares need be imported many data and could accomplish an encapsulation pin corresponding (Footprint) design when drawing encapsulation pin corresponding (Footprint) design usually.For example, an encapsulation pin corresponding (Footprint) design must be set up element body earlier, places pin, places literal, set up the nearly program in tens roads such as textbox.Build the personnel of putting and often on average need could accomplish an encapsulation pin corresponding (Footprint) design above 1 hour time.And various because of handling procedure, error rate also improves relatively.
Therefore, still need and want corresponding (Footprint) design automation system of a kind of encapsulation pin and method, abbreviate, reduce the creation facilities program (CFP) of manual work.
Clearly demarcated content
One of the object of the invention is to provide a kind of encapsulation pin corresponding (Footprint) design automation system, comprising: a load module and a processing module.This load module system uses for the user and encapsulates corresponding (Footprint) design of pin according to difference, imports the setting data of electronic component to be drawn.This processing module is the corresponding information data of extracting data in order to the electronic component of being imported by this load module; And according to corresponding (Footprint) design rule of the encapsulation pin in the database, with encapsulation pin corresponding (Footprint) design of drawing out this electronic component.
On the other hand; The present invention provides a kind of encapsulation pin corresponding (Footprint) design automation method; Comprise: a load module is provided, and is to use for the user to encapsulate corresponding (Footprint) design of pin according to difference, imports the setting data of electronic component to be drawn; And extract corresponding information data in the setting data of the electronic component of importing by this load module; And according to corresponding (Footprint) design rule of the encapsulation pin in the database, with encapsulation pin corresponding (Footprint) design of drawing out this electronic component.
Corresponding (Footprint) design automation system method of the encapsulation pin of being implemented according to the present invention, the user need not import mass data, can reduce the time of drawing encapsulation pin corresponding (Footprint) design.By the explanation of following embodiment, can recognize simultaneously that the present invention carries the embodiment of corresponding (Footprint) design automation system method of encapsulation pin.
Description of drawings
Fig. 1 is the synoptic diagram of corresponding (Footprint) design automation system of encapsulation pin;
It shown in Fig. 2 A to Fig. 2 D the configuration interface that shows different packaged types;
Fig. 3 is the flow chart of steps that shows attaching line design automation method of the present invention;
Fig. 4 shows corresponding (Footprint) design flow diagram of the encapsulation pin of drawing electronic component.
The main element symbol description:
Corresponding (Footprint) design automation system of 100 encapsulation pins
101 display modules
102 load modules
103 processing modules
104 databases
The 301-303 step
The 401-404 step
Embodiment
Below be that conjunction with figs. is explained embodiment of the present invention; Need be appreciated that so element that is indicated in these accompanying drawings and step system are the clear usefulness of explanation, it does not represent actual size and ratio, and for asking drawing succinctly to be beneficial to understand the drafting of also having omitted existing element during part is graphic.
Fig. 1 is the synoptic diagram of corresponding (Footprint) design automation system of encapsulation pin.As shown in the figure, corresponding (Footprint) design automation system 100 of encapsulation pin comprises: a display module 101, a load module 102, a processing module 103.
Fig. 3 is the flow chart of steps that shows attaching line design automation method of the present invention.In the step 301, load module 102 is provided.As stated, load module 102 is to use for the user to encapsulate corresponding (Footprint) design of pin according to difference, imports the setting data of electronic component to be drawn.In the step 302, extract corresponding information data in the setting data of the electronic component of being imported by load module 102.In the step 303,, draw out encapsulation pin corresponding (Footprint) design of this electronic component according to corresponding (Footprint) design rule of the encapsulation pin in the database 104.
Please refer to Fig. 4, is corresponding (Footprint) design flow diagram of encapsulation pin that further step display 303 is drawn electronic component.In the step 401, set one and make graph parameter.In the step 402, set up and place this electronic component.In the step 403, draw the profile of this electronic component.In the step 404, indicate polarity and graticule and size, information and the version that indicates this electronic component of the pin of this electronic component.
Simultaneously, can know because the present invention encapsulates pin correspondence (Footprint) design automation system according to corresponding (Footprint) design rule of difference encapsulation pin, draw encapsulation pin corresponding (Footprint) design of electronic component by Fig. 2 A-Fig. 2 D.Therefore the present invention can select corresponding (Footprint) design rule of corresponding encapsulation pin automatically according to different encapsulation pin corresponding (Footprint) design.The user is as long as the encapsulation pin of selecting to be desired corresponding (Footprint) designs; And importing the dimension information data of this electronic component and the pin information data of this electronic component, system just can draw encapsulation pin corresponding (Footprint) design of electronic component automatically.In sum; Attaching line design automation system and method proposed by the invention because the data base set that is had provides the encapsulation pin corresponding (Footprint) design rule, therefore can provide friendly electronic package pin corresponding (Footprint) design editor interface; Can accomplish electronic package pin corresponding (Footprint) design apace; Therefore can significantly reduce the mistake that is caused because of artificial input in the classic method, effectively promote work efficiency, and reduce manufacturing cost.
Can know that by above-mentioned narration the present invention is the invention of a novelty, progress and tool industrial applicability in fact.Though the present invention discloses as above with preferred embodiment, so it is not that any those skilled in the art is not breaking away from the spirit and scope of the present invention, when doing various changes and retouching in order to qualification the present invention.
Claims (10)
1. one kind encapsulates the corresponding design automation system of pin, it is characterized in that described system comprises:
One load module is to use for the user to encapsulate the corresponding design of pin according to difference, imports the setting data of electronic component to be drawn; And
One processing module is the corresponding information data of extracting data in order to the electronic component of being imported by described load module, and according to the corresponding design rule of the encapsulation pin in the database, with the corresponding design of encapsulation pin of drawing out described electronic component.
2. the corresponding design automation system of encapsulation pin as claimed in claim 1; It is characterized in that described system further comprises: a display module is connected with described processing module; And described display module shows different configuration interfaces according to the corresponding design of difference encapsulation pin.
3. the corresponding design automation system of encapsulation pin as claimed in claim 2 is characterized in that, the setting data of described electronic component to be drawn comprises: the dimension information data of described electronic component and the pin information data of described electronic component.
4. the corresponding design automation system of encapsulation pin as claimed in claim 3; It is characterized in that the corresponding design rule of described encapsulation pin comprises: spherical array packages rule, little external form integrated circuit packing rule, the flat packing rule of square, no lead packing rule and the flat no lead packing rule of square are wherein a kind of.
5. the corresponding design automation system of encapsulation pin as claimed in claim 1; It is characterized in that the corresponding design of the described encapsulation pin of drawing out described electronic component comprises: set one do graph parameter, foundation and place described electronic component, draw described electronic component profile, indicate polarity and graticule and size, information and the version that indicates described electronic component of the pin of described electronic component.
6. one kind encapsulates the corresponding design automation method of pin, it is characterized in that described method comprises:
One load module is provided, and is to use for the user to encapsulate the corresponding design of pin according to difference, imports the setting data of electronic component to be drawn; And
Extract corresponding information data in the setting data of the electronic component of importing by described load module, and according to the corresponding design rule of the encapsulation pin in the database, with the corresponding design of encapsulation pin of drawing out described electronic component.
7. the corresponding design automation method of encapsulation pin as claimed in claim 6; It is characterized in that; Described method further comprises provides a display module; Be connected with described processing module, and described display module system shows different configuration interfaces in order to according to the corresponding design of difference encapsulation pin.
8. the corresponding design automation method of encapsulation pin as claimed in claim 7 is characterized in that, the setting data of described electronic component to be drawn comprises: the dimension information data of described electronic component and the pin information data of described electronic component.
9. the corresponding design automation method of encapsulation pin as claimed in claim 8; It is characterized in that the corresponding design rule of described encapsulation pin comprises: it is wherein a kind of that rule is estimated in the flat no lead encapsulation of spherical array packages rule, little external form integrated circuit packing rule, the flat packing rule of square, no lead packing rule and square.
10. the corresponding design automation method of encapsulation pin as claimed in claim 6; It is characterized in that the corresponding design of the described encapsulation pin of drawing out described electronic component comprises: set one do graph parameter, foundation and place described electronic component, draw described electronic component profile, indicate polarity and graticule and size, information and the version that indicates described electronic component of the pin of described electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106037302A CN102542087A (en) | 2010-12-23 | 2010-12-23 | Footprint design automation system and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106037302A CN102542087A (en) | 2010-12-23 | 2010-12-23 | Footprint design automation system and method |
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| CN102542087A true CN102542087A (en) | 2012-07-04 |
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| CN2010106037302A Pending CN102542087A (en) | 2010-12-23 | 2010-12-23 | Footprint design automation system and method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110263485A (en) * | 2019-06-27 | 2019-09-20 | 珠海泰芯半导体有限公司 | A kind of automatic Plotting System and computer system of chip package figure |
| CN110750905A (en) * | 2019-10-23 | 2020-02-04 | 深圳市元征科技股份有限公司 | PCB element packaging method, device, equipment and medium |
| CN111737931A (en) * | 2020-06-19 | 2020-10-02 | 无锡市同步电子科技有限公司 | Editing and modifying method for PCB component packaging description file |
| WO2024026906A1 (en) * | 2022-08-03 | 2024-02-08 | 上海望友信息科技有限公司 | Package polarity identifier design method and system, electronic device, and storage medium |
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| CN1945586A (en) * | 2006-09-21 | 2007-04-11 | 华为技术有限公司 | Automatic construction system and method for electronic circuit design |
| CN101063985A (en) * | 2006-04-29 | 2007-10-31 | 英业达股份有限公司 | Wire laying data generating system and method |
| US20100287523A1 (en) * | 2007-03-16 | 2010-11-11 | Ichiro Harashima | Design rule management method, design rule management program, rule management apparatus, and rule verification apparatus |
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2010
- 2010-12-23 CN CN2010106037302A patent/CN102542087A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101063985A (en) * | 2006-04-29 | 2007-10-31 | 英业达股份有限公司 | Wire laying data generating system and method |
| CN1945586A (en) * | 2006-09-21 | 2007-04-11 | 华为技术有限公司 | Automatic construction system and method for electronic circuit design |
| US20100287523A1 (en) * | 2007-03-16 | 2010-11-11 | Ichiro Harashima | Design rule management method, design rule management program, rule management apparatus, and rule verification apparatus |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110263485A (en) * | 2019-06-27 | 2019-09-20 | 珠海泰芯半导体有限公司 | A kind of automatic Plotting System and computer system of chip package figure |
| CN110750905A (en) * | 2019-10-23 | 2020-02-04 | 深圳市元征科技股份有限公司 | PCB element packaging method, device, equipment and medium |
| CN111737931A (en) * | 2020-06-19 | 2020-10-02 | 无锡市同步电子科技有限公司 | Editing and modifying method for PCB component packaging description file |
| WO2024026906A1 (en) * | 2022-08-03 | 2024-02-08 | 上海望友信息科技有限公司 | Package polarity identifier design method and system, electronic device, and storage medium |
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Application publication date: 20120704 |