CN103901227A - Silicon micro-resonant type accelerometer - Google Patents

Silicon micro-resonant type accelerometer Download PDF

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Publication number
CN103901227A
CN103901227A CN201410129567.9A CN201410129567A CN103901227A CN 103901227 A CN103901227 A CN 103901227A CN 201410129567 A CN201410129567 A CN 201410129567A CN 103901227 A CN103901227 A CN 103901227A
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mass
shakes
glass
silicon micro
broach
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CN103901227B (en
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董景新
赵淑明
刘云峰
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Tsinghua University
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Tsinghua University
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Abstract

The invention provides a silicon micro-resonant type accelerometer which comprises a glass substrate, a silicon micro-mechanical movable structure, a first vibration beam and a second vibration beam. The silicon micro-mechanical movable structure is bonded to the surface of the glass substrate and comprises a first mass block and a second mass block, and the first mass block and the second mass block are arranged in a mirror symmetry mode, are respectively suspended to the surface of the glass substrate through two supporting beams respectively and rotate with the two supporting beams as shafts; the two ends of the first vibration beam are connected with the first mass block and the second mass block respectively, and a first driving fixed comb tooth and a first detecting fixed comb tooth are oppositely arranged on the two sides of the first vibration beam; the two ends of the second vibration beam are connected with the first mass block and the second mass block respectively, a second driving fixed comb tooth and a second detecting fixed comb tooth are oppositely arranged on the two sides of the second vibration beam, the first vibration beam and the second vibration beam have the different heights in the direction, namely the Z-axis direction, perpendicular to the surface of the glass substrate.

Description

Silicon micro-resonance type accelerometer
Technical field
The invention belongs to the micro-inertia measuring field of microelectromechanical systems, be specifically related to a kind of silicon micro-resonance type accelerometer of the measurement Z axis acceleration based on the not contour beam that shakes.
Background technology
Along with the deep development of micromachining technology, micro-mechanical inertia sensor is being brought into play more and more important effect in navigation field.At present just progressively replace the conventional inertia instrument such as quartz flexible accelerometer in the application of middle low performance.Mems accelerometer has started in navigation and the application of tactical weapon field in the world.Part high precision field also will be substituted by micro electronmechanical accelerometer simultaneously.
For meeting high precision, miniaturization strategic arms equipment Requirement, design realizes the integrated silicon micro-resonance type accelerometer of multiaxis, and sensitive axes becomes single-chip multiaxis integrated silicone micro-resonance type accelerometer design focal point perpendicular to the Z axis silicon micro-resonance type accelerometer of processing plane.
But, less about the design of Z axis silicon micro-resonance type accelerometer, generally adopt the design of electrostatic stiffness formula silicon micro-resonance type accelerometer, complex structure and design difficulty are large, have affected the application of described Z axis silicon micro-resonance type accelerometer.
Summary of the invention
In sum, necessaryly provide a kind of Z axis silicon micro-resonance type accelerometer that can overcome the problems referred to above.
A kind of silicon micro-resonance type accelerometer, comprising: a substrate of glass; One silicon micro mechanical movable structure is bonded in glass basic surface, described silicon micro mechanical movable structure comprises that one first mass, one second mass are mirror image and are symmetrical arranged, described the first mass and the second mass are suspended in described glass basic surface by two brace summers respectively, and rotate take two brace summers as axle; One first beam and one second beam that shakes that shakes is set in parallel between described the first mass and the second mass, the described first two ends that shake beam are connected with the first mass and the second mass respectively, and one first drives and determine broach and one first detection and determines broach and be relatively arranged on the described first beam both sides that shake; The described second two ends that shake beam are connected with described the first mass and the second mass respectively, one second drives and determine broach and one second detection and determines broach and be relatively arranged on the described second beam both sides that shake, and described first beam and second beam that shakes that shakes is in Z-direction, to have different height in the direction perpendicular to glass basic surface.
A kind of silicon micro-resonance type accelerometer, comprising: a substrate of glass; One silicon micro mechanical movable structure is bonded in glass basic surface, and described silicon micro mechanical movable structure comprises that one first mass, one second mass are mirror image and are symmetrical arranged; One central supporting anchor district is arranged between described the first mass and the second mass, described the first mass and the second mass are mirror image about described central supporting anchor district and are symmetrical arranged, described the first mass is connected with described central supporting anchor district by one first brace summer, described the second mass is connected with described central supporting anchor district by one second brace summer, and is suspended in described glass basic surface; One first two ends that shake beam are connected with described central supporting anchor district and the second mass respectively; One second two ends that shake beam are connected with described central supporting anchor district and the second mass respectively, and are symmetrically distributed in both sides, described central supporting anchor district with described first beam that shakes; One first drives and determine broach and one first detection and determines broach and be relatively arranged on the described first beam both sides that shake; One second drives and determine broach and one second detection and determines broach and be relatively arranged on the described second beam both sides that shake, and described first beam and second beam that shakes that shakes is in Z-direction, to have different height in the direction perpendicular to glass basic surface.
With respect to prior art, silicon micro-resonance type accelerometer provided by the invention, adopt plane to rock the responsive Z-axis acceleration of structure, simple in structure, further, change by adopting the not contour girder construction of shaking to detect inertial force, adopt comb structure to carry out static excitation and capacitance detecting, effective compatible plane structure design parameter and electrical specification, improved accuracy of detection.
Accompanying drawing explanation
Fig. 1 is the plan view of the Z axis silicon micro-resonance type accelerometer that provides of first embodiment of the invention.
Fig. 2 is the axis side views such as the three-dimensional of the Z axis silicon micro-resonance type accelerometer that provides of first embodiment of the invention.
Fig. 3 is the not contour axis side views such as beam partial 3 d that shake that first embodiment of the invention provides.
Fig. 4 is the axis side views such as the three-dimensional of the not contour beam Z axis silicon micro-resonance type accelerometer that shakes that second embodiment of the invention provides.
Main element symbol description
Substrate of glass 12
Mass 1、1a、1b
First beam that shakes 2a
Second beam that shakes 2b
The 3rd beam that shakes 2c
The 4th beam that shakes 2d
Broach is determined in the first driving 3a
Broach is determined in the second driving 3b
Broach is determined in the 3rd driving 3c
4 wheel driven moves determines broach 3d
Broach is determined in the first detection 4a
Broach is determined in the second detection 4b
Broach is determined in the 3rd detection 4c
Broach is determined in the 4th detection 4d
Central supporting anchor district 5
The first bonding platform 5a、5b、5c、5d
The second bonding platform 6a、6b
The first brace summer 7a、8a
The second brace summer 7b、8b
Lead-in wire electrode 9a、9b、9c、9d、10
Peripheral bonding region 11
Following specific embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Describe silicon micro-resonance type accelerometer provided by the invention in detail below with reference to accompanying drawing.
The invention provides a kind of Z axis silicon resonance type accelerometer, described Z axis silicon resonance type accelerometer comprises a substrate of glass, a silicon micro mechanical movable structure and a peripheral bonding region.Described silicon machinery movable structure and described peripheral bonding region are arranged at described glass baseplate surface.Described silicon micro mechanical movable structure is arranged in peripheral bonding region, and it is upper to be bonded in substrate of glass one surface by bonding platform, the acceleration with sensing perpendicular to glass basic surface Z-direction.
Described silicon micro mechanical movable structure comprises and rocks mass block structure, at least two brace summers and one and described in rock not at least two beams compositions that shake of equal thickness of mass block structure.The described mass that rocks is suspended and is arranged in substrate of glass by brace summer, produces twisting in the time being subject to the acceleration action of Z-direction.Described two beams that shake are positioned at the differing heights of Z-direction, the described beam one end that shakes is connected with mass, one end is arranged at a driving being oppositely arranged determines broach and detects and determine between broach, passes to described driving and determines broach and detect and determine broach, and be converted into electric signal output with degree of will speed up.In the time that Z axis has acceleration input, the described mass block structure that rocks reverses around brace summer, with rock the beam that shakes that mass block structure is connected and be subject to mass and reverse the pulling force that produces or pressure and produce natural frequency and change, change Z-direction inertial force into the beam axial force of shaking, and pass to detect with the variation of resonance frequency by electric signal and determine broach and detect.
Preferably, described in rock mass block structure for two eccentric mass block structures, thereby increase sensitivity.The described mass block structure that rocks comprises that one first mass and the second mass are planar mirror image distribution and interval setting along an axis of symmetry, and the eccentric direction of the eccentric direction of described the first mass and described the second mass is mirror image distribution.Described the first mass and the second mass are connected by first beam and second beam that shakes that shakes being arranged between the two.
Described first beam and second that shakes shakes the thickness of beam (perpendicular to the direction of glass basic surface, be Z-direction) be less than described mass block structure thickness difference, and described first beam and second beam that shakes that shakes is positioned at perpendicular to the Different Plane in glass baseplate surface direction.
The described first beam both sides that shake are provided with to drive and determine broach and detect and determine broach, are used for respectively load driver power and detection resonance frequency variation; Equally, the described second beam both sides that shake are provided with to drive and determine broach and detect and determine broach, are used for respectively load driver power and detection resonance frequency variation.Described driving is determined broach and is detected and determine broach and be bonded in substrate of glass by bonding platform, is connected with output electrode point by plain conductor.The driving that is positioned at the first resonance beam both sides is determined broach and is detected that to determine broach height identical with the first resonance beam height.The driving that is positioned at the second resonance beam both sides is determined broach and is detected that to determine broach height identical with the second resonance beam height.
In the time that Z axis acceleration is inputted, there is rightabout deflection in described the first mass and the second mass sensitive acceleration, and what make to be connected with the first mass and the second mass is positioned at first of differing heights beam and second beam under tension and the pressure respectively that shakes that shakes.Because the first shake beam and the second axial force of shaking on beam changes, first the shake resonance frequency of beam of beam and second of shaking changes.The beam resonance frequency of shaking of tension increases, and the beam resonance frequency of shaking of pressurized reduces.Described driving is determined broach and is detected the acceleration of determining the input of broach output differential frequency detection Z axis.
Describe silicon micro-resonance type accelerometer provided by the invention in detail below with reference to drawings and the specific embodiments.
See also Fig. 1 to Fig. 3, first embodiment of the invention provides a kind of Z axis silicon resonance type accelerometer, and described silicon resonance type accelerometer comprises that silicon micro mechanical movable structure, peripheral bonding region (11) are arranged at glass substrate (12) surface.Described silicon micro mechanical movable structure comprises one first mass (1a), one second mass (1b), one first beam (2a) that shakes, one second beam (2b) that shakes, broach (3a) is determined in the first driving, broach (4a) is determined in the first detection, broach (3b) is determined in the second driving, broach (4b) is determined in the second detection, two the first brace summer (7a, 7b), two the second brace summer (8a, 8b), two the first bonding platform (5a, 5b), two the second bonding platform (6a, 6b), six lead-in wire electrode (9a, 9b, 9c, 10a, 10b, 10c).Described peripheral bonding region (11) is around described silicon micro mechanical movable structure.Be appreciated that described peripheral bonding region (11) is an optional structure.Described peripheral bonding region (11) has an opening, exposes the surface of described substrate of glass (12), and described silicon micro mechanical movable structure is arranged at substrate of glass (12) surface in described opening.
It is symmetrical that described the first mass (1a) and the second mass (1b) are mirror image, and space arranges.The shape of described the first mass (1a) and the second mass (1b) is concave shape, has respectively a recess and is positioned at the fin of recess both sides, and the recess of described the first mass (1a) and the second mass (1b) is oppositely arranged.Described the first mass (1a) and the second mass (1b) itself are a symmetrical structure, all have along the axis of symmetry of a first direction (as X-direction); Described the first mass (1a) and the second mass (1b) are symmetrical arranged about a second direction (as Y direction) mirror image.Described the first mass (1a) and the second mass (1b) can be 30 microns to 100 microns perpendicular to the thickness in described substrate of glass (12) direction (being Z axis).In the present embodiment, the thickness of described the first mass (1a) and the second mass (1b) is 60 microns.
Described the first mass (1a) supports by symmetrically arranged two the first brace summers (7a, 8a), is suspended in described substrate of glass (12) surface, described the first mass (1a) relatively with described substrate of glass (12) spaced surface setting.Described two the first brace summers (7a, 8a) are symmetrically distributed in the edge of described the first mass (1a) in the second direction perpendicular to first direction, and support described the first mass (1a).Described the first brace summer (7a, 8a), near the axis of symmetry setting between described the first mass (1a) and the second mass (2a), is right avertence core structure thereby make described the first mass (1a).One end of described the first brace summer (7a) is connected with described the first mass (1a), and the other end is connected with the one first bonding platform (5a) being arranged in described substrate of glass (12); One end of described the first brace summer (8a) is connected with described the first mass (1a), and the other end is connected with the first bonding platform (6a) being arranged in described substrate of glass (12).Described the first bonding platform (5a) and the first bonding platform (6a) are all arranged at the marginal position of described glass substrate (12), and are symmetrically distributed in the axis of symmetry both sides of described the first mass (1a) on directions X.
Same, described the second mass (1b) supports by symmetrically arranged the second brace summer (7b, 8b), is suspended in described substrate of glass (12) surface.Described two the second brace summers (7b, 8b) are symmetrically distributed in described the second mass (1b) edge in a first direction, and support described the second mass (1b).Described two the second brace summers (7b, 8b), near the axis of symmetry setting between described the first mass (1a) and the second mass (1b), are a left avertence core structure thereby make described the second mass (1b).Described the second brace summer (7b) one end is connected with the second mass (1b), and the other end is connected with the second bonding platform (5b); Described the second brace summer (8b) one end is connected with the second mass (1b), and the other end is connected with the second bonding platform (6b).Further, described the first brace summer (7a, 8a) and the second brace summer (7b, 8b) are mirror image with respect to the axis of symmetry between described the first mass (1a) and the second mass (2a) and are symmetrical arranged.
Described first beam (2a) and second beam (2b) that shakes that shakes extends along directions X, and connect described the first mass (1a) and the second mass (1b), described first beam (2a) and second beam (2b) that shakes that shakes is symmetrical arranged at the axis of symmetry of directions X about the first mass (1a) and the second mass (1b).Concrete, described first beam (2a) and second beam (2b) that shakes that shakes is parallel and be arranged at intervals in the recess of described the first mass (1a) and the second mass (1b), and described first the shake two ends of beam (2b) of beam (2a) and second that shake are connected respectively described the first mass (1a) and the second mass (1b).Described first the shake length of beam (2b) of beam (2a) and second of shaking can be 500 microns to 2000 microns, and in the present embodiment, described length is 1000 microns.Described first beam (2a) and second beam (2b) that shakes that shakes is identical at the thickness of Z-direction (perpendicular to the direction of X, Y), but is less than the thickness of described the first mass (1a) and the second mass (1b), can be 20 microns.Described first beam (2a) and second beam (2b) that shakes that shakes can be suspended in the surface of described substrate of glass (12), and with the spaced surface setting of described substrate of glass (12).
Further, described first beam (2a) and second beam (2b) that shakes that shakes is positioned at the differing heights in Z-direction.In the present embodiment, described first shakes beam (2a) near described substrate of glass (12) setting, and is connected with described the first mass (1a) and the second mass (1b); Described first shakes beam (2a) near the surface of described substrate of glass (12) and the surface co-planar of the close described substrate of glass (12) of described the first mass (1a).Relative, described second beam (2b) that shakes arranges away from described substrate of glass (12) relatively, described second shake beam (2b) away from the surface of described substrate of glass (12) and described the first mass (1a) surface co-planar away from described substrate of glass (12).
Described first drives and determine broach (3a) and the first detection and determines broach (4a) and be relatively arranged on described first both sides of beam (2a) along Y-direction that shake in the relative mode of broach, the variation that is respectively used to load driver power and detection resonance frequency, realizes static excitation and capacitance detecting.Described first drives and determine broach (3a) and the first detection is determined broach (4a) and can be connected to the lead-in wire electrode (9a, 9c) being arranged in substrate of glass (12) by metal wire.
Similarly, described second drives and determine broach (3b) and the second detection and determines broach (4b) and be relatively arranged on described second beam (2b) both sides that shake in the relative mode of broach, the variation that is respectively used to load driver power and detection resonance frequency, realizes static excitation and capacitance detecting.Described second drives and determine broach (3b) and the second detection is determined broach (4b) and can be connected to the electrode points (10a, 10c) being arranged in substrate of glass (12) by metal wire.Further, described first drive and determine broach (3a), first and detect and determine broach (4a), second and drive and determine broach (3b) and the second detection is determined broach (4b) all along the axis of symmetry distribution between described the first mass (1a) and the second mass (1b).
The principle of work of Z axis silicon micro-resonance type accelerometer of the present invention is as follows, and in the time that Z axis acceleration is inputted, described the first mass (1a) and the second mass (1b) are because eccentric mass effect deflects.In the time that the Z negative acceleration perpendicular to plane is inputted, because the position of the first brace summer (7a, 8a) is near the axis of symmetry setting between the first mass (1a) and the second mass (1b), the second brace summer (7b, 8b) is arranged in XZ plane near the axis of symmetry between the first mass (1a) and the second mass (1b), the first mass (1a) is with respect to the counterclockwise deflection of the first brace summer (7a, 8a), and the second mass (1b) is with respect to the clockwise deflection of the second brace summer (7b, 8b).First beam (2a) that shakes being connected with the first mass (1a) and the second mass (1b) bottom is subject to two mass pressure generation crimps, and second beam (2b) that shakes being connected with the first mass (1a) and the second mass (1b) is subject to two mass pulling force generation stretcher strains.Therefore two shake beam because axial force changes, and cause that resonance frequency changes.Determine broach (3a) and first by the first driving and detect and determine broach (4a) and second and drive and determine broach (3b) and broach (4b) is determined in the second detection, and resonance closed loop circuit system is operated in respectively in resonance frequency separately two beams that shake accordingly.Change and obtain Z axis input acceleration by the resonance frequency of output.
See also Fig. 4, second embodiment of the invention provides a kind of Z axis silicon micro-resonance type accelerometer, comprises that silicon micro mechanical movable structure, peripheral bonding region (11) are arranged at glass substrate (12) surface.Described silicon micro mechanical movable structure comprise the first mass (1a), the second mass (1b), first shake beam (2a), second shake beam (2b), first drive determine broach (3a), second drive determine broach (3b), first detect determine broach (4a), broach (4b), central supporting anchor district (5), two the first brace summers (7a, 8a), two the second brace summers (7b, 8b) are determined in the second detection, five go between electrode (9a, 9b, 9c, 9d, 10), peripheral bonding region (11) and substrate of glass (12).
The silicon micro-resonance type accelerometer that second embodiment of the invention provides and the first example structure are basic identical, its difference is, described in described the second embodiment, silicon micro-resonance type accelerometer further comprises that a central supporting anchor district (5) is arranged between described the first mass (1a) and the second mass (1b), and described the first mass (1a) and the second mass (1b) are mirror image about described central supporting anchor district (5) and are symmetrical arranged.
The length direction in described central supporting anchor district (5) extends and arranges along Y-direction, described first beam (2a) and second beam (2b) that shakes that shakes extends at the axis of symmetry of directions X along described the first mass (1a) and the second mass (1b), and described first beam (2a) and second beam (2b) that shakes that shakes is symmetrical arranged about described central supporting anchor district (5).Described first beam (2a) that shakes comprises relative two ends, and one end is connected with the recess of described the first mass (1a), and the other end is connected with described central supporting anchor district (5).Same, described second beam (2b) one end that shakes is connected with the recess of described the second mass (1b), and the other end is connected with described central supporting anchor district (5).Further, described first beam (2a) and described second beam (2b) that shakes that shakes is positioned at the differing heights in Z-direction.In the present embodiment, described first shakes beam (2a) relatively away from described substrate of glass (12) setting, and described second shakes beam (2b) relatively near described substrate of glass (12) setting.
Described central supporting anchor district (5) is connected with described the first mass (1a) by two the first brace summers (7a, 8a).Described two the first brace summers (7a, 8a) are symmetrically distributed in the axis of symmetry both sides of described the first mass (1a), one end of described two the first brace summers (7a, 8a) is connected with the fin of described the first mass (1a) recess both sides, and the other end is connected with described central supporting anchor district (5).Further, described two the first brace summers (7a, 8a) and described first beam (2a) that shakes is positioned at the differing heights of Z-direction.In the present embodiment, described two the first brace summers (7a, 8a) relatively described first shake beam (2a) near described substrate of glass (12) setting.Thereby the top and described first that makes described the first mass (1a) shakes, beam (2a) is connected, and the bottom of described the first mass (1a) is connected with described two the first brace summers (7a, 8a).The thickness of described two the first brace summers (7a, 8a) in Z-direction can be 20 microns.(7a, 8a) is thinner for described the first brace summer, and Z-direction inertial force is converted into that the beam axial force of shaking is more, and resonance frequency variable quantity is larger, and resolution is higher.
Similarly, described the second brace summer (7b, 8b) is connected with described the second mass (1b) and central supporting anchor district (5), and symmetrical about central supporting anchor district (5) with described the first brace summer (7a, 8a).Described the second brace summer (7b, 8b) and described second beam (2b) that shakes is positioned at the differing heights of Z-direction, and arranges near described substrate of glass (12) with respect to described second beam (2b) that shakes.The thickness of described the second brace summer (7b, 8b) in Z-direction is 20 microns.Equally, (7b, 8b) is thinner for described the second brace summer, and Z-direction inertial force is converted into that the beam axial force of shaking is more, and resonance frequency variable quantity is larger, and resolution is higher.
Described first drive determine broach (3a), second drive determine broach (3b), first detect determine broach (4a), the second detection is determined broach (4b) and is bonded in substrate of glass by bonding platform, be connected with the electrode (9a, 9b, 9c, 9d) that goes between by splash-proofing sputtering metal line.
Described in second embodiment of the invention, the principle of work of Z axis silicon micro-resonance type accelerometer is as follows: in the time that Z axis acceleration is inputted, the first mass (1a), the second mass (1b) deflect under flexible brace summer supports, first beam and second beam that shakes that shakes that stretching or extruding are connected with mass, therefore two shake beam because axial force changes, and cause that resonance frequency changes.By the first driving determine broach (3a), second drive determine broach (3b) and first detect determine broach (4a), the second detection determine broach (4b) and accordingly resonance closed loop circuit system two beams that shake are operated in respectively in resonance frequency separately.Change and detect Z axis input acceleration by the resonance frequency of output.
In addition, those skilled in the art also can do other and change in spirit of the present invention, and these variations of doing according to spirit of the present invention certainly, all should be included in the present invention's scope required for protection.

Claims (10)

1. a silicon micro-resonance type accelerometer, comprising:
One substrate of glass;
One silicon micro mechanical movable structure is bonded in glass basic surface, described silicon micro mechanical movable structure comprises that one first mass, one second mass are mirror image and are symmetrical arranged, described the first mass and the second mass are suspended in described glass basic surface by two brace summers respectively, and rotate take two brace summers as axle; One first beam and one second beam that shakes that shakes is set in parallel between described the first mass and the second mass, the described first two ends that shake beam are connected with the first mass and the second mass respectively, and one first drives and determine broach and one first detection and determines broach and be relatively arranged on the described first beam both sides that shake; The described second two ends that shake beam are connected with described the first mass and the second mass respectively, one second drives and determine broach and one second detection and determines broach and be relatively arranged on the described second beam both sides that shake, and described first beam and second beam that shakes that shakes is in Z-direction, to have different height in the direction perpendicular to glass basic surface.
2. silicon micro-resonance type accelerometer as claimed in claim 1, it is characterized in that, described the first mass and the second mass are planar mirror image distribution and interval setting along an axis of symmetry, and the eccentric direction of the eccentric direction of described the first mass and described the second mass is mirror image distribution.
3. silicon micro-resonance type accelerometer as claimed in claim 2, it is characterized in that, described first beam and second beam that shakes that shakes is different from the thickness of described the first mass and the second mass in Z direction, described first beam and second beam that shakes that shakes is parallel to each other, and two ends are connected with described the first mass and the second mass respectively.
4. silicon micro-resonance type accelerometer as claimed in claim 3, is characterized in that, described the first mass has an axis of symmetry that is parallel to glass basic surface, and described first beam and second beam that shakes that shakes is symmetrically distributed in the both sides of described axis of symmetry.
5. silicon micro-resonance type accelerometer as claimed in claim 1, is characterized in that, described first shake beam near the surface of described substrate of glass and described the first mass the surface co-planar near described substrate of glass; Described second shakes beam relatively away from described substrate of glass setting, and described second shakes beam away from the surface of described substrate of glass, with the surface co-planar of described the first mass away from described substrate of glass.
6. silicon micro-resonance type accelerometer as claimed in claim 1, it is characterized in that, comprise that a peripheral bonding region is arranged at described glass substrate surface, and arrange around the micro-resonance movable structure of described silicon, the micro-resonance movable structure of described silicon is fixed on described glass basic surface by multiple bonding platforms.
7. silicon micro-resonance type accelerometer as claimed in claim 1, is characterized in that, described first beam and second thickness of beam in Z-direction that shakes that shakes is less than the thickness of described the first mass and the second mass.
8. a silicon micro-resonance type accelerometer, comprising:
One substrate of glass;
One silicon micro mechanical movable structure is bonded in glass basic surface, and described silicon micro mechanical movable structure comprises that one first mass, one second mass are mirror image and are symmetrical arranged; One central supporting anchor district is arranged between described the first mass and the second mass, described the first mass and the second mass are mirror image about described central supporting anchor district and are symmetrical arranged, described the first mass is connected with described central supporting anchor district by one first brace summer, described the second mass is connected with described central supporting anchor district by one second brace summer, and is suspended in described glass basic surface; One first two ends that shake beam are connected with described central supporting anchor district and the second mass respectively; One second two ends that shake beam are connected with described central supporting anchor district and the second mass respectively, and are symmetrically distributed in both sides, described central supporting anchor district with described first beam that shakes; One first drives and determine broach and one first detection and determines broach and be relatively arranged on the described first beam both sides that shake; One second drives and determine broach and one second detection and determines broach and be relatively arranged on the described second beam both sides that shake, and described first beam and second beam that shakes that shakes is in Z-direction, to have different height in the direction perpendicular to glass basic surface.
9. silicon micro-resonance type accelerometer as claimed in claim 8, it is characterized in that, described the first brace summer and the second brace summer are positioned at different height in Z direction, one end of described the first brace summer is connected near the bottom of described substrate of glass with described the first mass, and one end of described the second brace summer is connected away from the top of described substrate of glass with described the second mass.
10. silicon micro-resonance type accelerometer as claimed in claim 8, is characterized in that, described the first brace summer and described first beam that shakes is positioned at different height in Z direction, and described first beam that shakes is connected away from the top of described substrate of glass with described the first mass; Described the second brace summer and described second beam that shakes is positioned at described in different height second beam that shakes and is connected near the bottom of described substrate of glass with described the second mass in Z direction.
CN201410129567.9A 2014-04-02 2014-04-02 Silicon micro-resonance type accelerometer Expired - Fee Related CN103901227B (en)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105371831A (en) * 2014-08-19 2016-03-02 精工爱普生株式会社 Physical quantity sensor, electronic device, and mobile body
CN105607249A (en) * 2015-12-21 2016-05-25 西安励德微系统科技有限公司 Micro-torsion mirror driven by one-side unequal height comb teeth
CN106199070A (en) * 2016-06-24 2016-12-07 东南大学 Single anchor points support formula silicon micro-resonance type accelerometer
CN107688103A (en) * 2017-07-31 2018-02-13 北京航空航天大学 A kind of single-axis accelerometer based on graphene resonance characteristic
CN109239400A (en) * 2018-11-12 2019-01-18 中国工程物理研究院电子工程研究所 The double vibrating beam accelerometers of integral type quartz and preparation method
CN109444466A (en) * 2017-08-30 2019-03-08 意法半导体股份有限公司 FM inertial sensor and method for operating FM inertial sensor
CN113419080A (en) * 2021-06-18 2021-09-21 东南大学 Design method of electrostatic stiffness resonant accelerometer based on differential evolution algorithm

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022133312A1 (en) 2020-12-18 2022-06-23 Analog Devices, Inc. Accelerometer with translational motion of masses

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2729731Y (en) * 2004-09-30 2005-09-28 中北大学 Minimechanical digital difference friquency acceleration gauge
CN1844931A (en) * 2006-05-23 2006-10-11 北京航空航天大学 Resonance type micromechanical accelerometer
CN101266259A (en) * 2008-05-08 2008-09-17 南京理工大学 Silicon micro-resonance type accelerometer
CN101858931A (en) * 2010-05-28 2010-10-13 南京理工大学 Frame type capacitive silicon micromechanical accelerometer
CN102062604A (en) * 2009-11-17 2011-05-18 北京大学 Capacitive micromachined tuning fork gyroscope

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2729731Y (en) * 2004-09-30 2005-09-28 中北大学 Minimechanical digital difference friquency acceleration gauge
CN1844931A (en) * 2006-05-23 2006-10-11 北京航空航天大学 Resonance type micromechanical accelerometer
CN101266259A (en) * 2008-05-08 2008-09-17 南京理工大学 Silicon micro-resonance type accelerometer
CN102062604A (en) * 2009-11-17 2011-05-18 北京大学 Capacitive micromachined tuning fork gyroscope
CN101858931A (en) * 2010-05-28 2010-10-13 南京理工大学 Frame type capacitive silicon micromechanical accelerometer

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
李凌宇等: "微机械陀螺仪设计与研究", 《电子科技》 *
许高斌等: "不等高梳齿电容式三轴MEMS加速度传感器", 《电子测量与仪器学报》 *

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105371831A (en) * 2014-08-19 2016-03-02 精工爱普生株式会社 Physical quantity sensor, electronic device, and mobile body
CN105607249A (en) * 2015-12-21 2016-05-25 西安励德微系统科技有限公司 Micro-torsion mirror driven by one-side unequal height comb teeth
CN105607249B (en) * 2015-12-21 2018-06-26 西安励德微系统科技有限公司 A kind of torsional micro-mirror of the not contour pivotal quantity in unilateral side
CN106199070A (en) * 2016-06-24 2016-12-07 东南大学 Single anchor points support formula silicon micro-resonance type accelerometer
CN107688103A (en) * 2017-07-31 2018-02-13 北京航空航天大学 A kind of single-axis accelerometer based on graphene resonance characteristic
CN109444466A (en) * 2017-08-30 2019-03-08 意法半导体股份有限公司 FM inertial sensor and method for operating FM inertial sensor
US10809280B2 (en) 2017-08-30 2020-10-20 Stmicroelectronics S.R.L. FM inertial sensor and method for operating the FM inertial sensor
CN109239400A (en) * 2018-11-12 2019-01-18 中国工程物理研究院电子工程研究所 The double vibrating beam accelerometers of integral type quartz and preparation method
CN109239400B (en) * 2018-11-12 2024-02-09 中国工程物理研究院电子工程研究所 Integrated quartz double-vibration beam accelerometer and preparation method thereof
CN113419080A (en) * 2021-06-18 2021-09-21 东南大学 Design method of electrostatic stiffness resonant accelerometer based on differential evolution algorithm
CN113419080B (en) * 2021-06-18 2022-03-29 东南大学 Design method of electrostatic stiffness resonant accelerometer based on differential evolution algorithm

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