Summary of the invention
The invention provides a kind of interior enhanced heat transfer component manufacturing process of pipe of the heat exchanger tube with enhanced heat transfer component, the problems such as the heat exchange efficiency existing in prior art is not high in order to overcome, the easy coking of tube wall.
For achieving the above object, the invention provides a kind of interior enhanced heat transfer component manufacturing process of pipe of the heat exchanger tube with enhanced heat transfer component, manufacturing process comprises surfacing link and grinds link, surfacing link realizes by coating soldering equipment, grind link and realize by milling apparatus, coating soldering equipment comprises console, Laser Power Devices, process gas switch board, Electrical and Electronic switch board, laser head, drive chuck, powder feeder, running gear, intermediate bracket and bracket; Milling apparatus comprises whirligig, cooling fluid conveying device, grinding tool rotating driving device, band abrasive lapping brush, bull stick and connecting rod;
Manufacturing process comprises the following steps:
With the complete compo pipe inwall of acetone surface cleaning, and be dried to passing into compressed air in compo pipe, and one end of dried compo pipe be arranged on drive chuck to its other end bracket support;
Laser head is arranged on running gear, by controlling running gear, laser head is imported to compo pipe, and the surfacing nozzle of laser head is adjusted to the original position of setting, wherein, Laser Power Devices are connected with laser head, laser head is furnished with water-cooling system, before surfacing, the cooling water valve of water-cooling system is opened and is kept certain pressure;
Alloy powder is mixed by a certain percentage and packed in the powder feeding tank of powder feeder with agglutinant, open year powder gas valve of powder feeder, carry powder gas flow mixed powder for alloy be delivered to the surfacing nozzle of laser head by the control of process gas switch board, wherein, the carrier pipe of powder feeder is connected with laser head;
Position, shape and size according to the enhanced heat transfer component that will form that pre-enters console in compo pipe, control the circumferential movement of drive chuck and the axially-movable of running gear, and surfacing nozzle is at the inner convex solder joint that forms of compo pipe;
The first end of the compo pipe that forms convex solder joint is clamped on the chuck of whirligig, its second end is fixed on the bracket of cooling fluid conveying device, stainless steel ball bearing is equipped with in cooling fluid conveying device inside, and compo pipe is that taper sealing contacts with the bracket of cooling fluid conveying device;
By grinding tool rotating driving device, the connecting rod being connected with bull stick is moved to the first end of compo pipe, at least one is arranged on the connecting rod of grinding tool rotating driving device with abrasive lapping brush, be wherein with abrasive lapping brush to be made by grinding-material and brush silk;
Start whirligig and grinding tool rotating driving device, whirligig drives compo pipe, grinding tool rotating driving device drives abrasive brush, both move toward one another, alloy pipe convex solder joint grinds, and then by grinding tool whirligig drive connecting rod according to default feed from the first end of compo pipe to the second end motion, in compo pipe, enhanced heat transfer component is ground;
Wherein, starting whirligig and grinding tool rotating driving device while clockwise or in rotating counterclockwise, starting cooling fluid conveying device, cooling fluid is delivered in compo pipe by setting flow set pressure, wash away grinding the abrasive material producing, and carry out cooling to polish-brush process.
Optionally, the chemical composition of solder joint that compo pipe inwall forms is identical with the chemical composition of compo pipe, and dilution rate is not more than 1%.
Optionally, the degree of turning of whirligig is 15~30 turn/min, and the rotating speed of grinding tool rotating driving device is 160~240 turn/min, and it is 2mm/min that grinding tool rotating driving device drives the feed of connecting rod.
Optionally, the flow of cooling fluid conveying device conveying cooling fluid is 25~35m
3/ min, pressure is 1MPa.
Optionally, after grinding, the fineness of compo pipe inwall reaches more than 3.2 microns.
In the above-described embodiments, by the laser cladding technology of based semiconductor optical fiber laser, can realize fast the manufacture of enhanced heat transfer component in pipe, there is thereby realize the heat exchanger tube that strengthens heat-transfer effect, reduces inside pipe wall fouling; And then utilize combination material to brush and high temperature alloy pipes relative rotary motion, the convex solder joint that high temperature alloy inside pipe wall surfacing is formed carries out polish-brush, by the oxide removal in high temperature alloy pipes, and high temperature alloy inside pipe wall is polished, the fineness that improves tube wall, roughness can reach more than 3.2 microns.
The specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, rather than whole embodiment.Based on the embodiment in the present invention, those of ordinary skills, not paying the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
Fig. 1 is the console schematic diagram of the laser coating soldering equipment of one embodiment of the invention; Fig. 2 is the Laser Power Devices schematic diagram of the laser coating soldering equipment of one embodiment of the invention; Fig. 3 is the process gas switch board schematic diagram of the laser coating soldering equipment of one embodiment of the invention; Fig. 5 is the agent structure schematic diagram of the laser coating soldering equipment of one embodiment of the invention; Fig. 6 is the powder feeder schematic diagram of the laser coating soldering equipment of one embodiment of the invention.As shown in Figure 5, this laser coating soldering equipment comprises: console 1, Laser Power Devices 2, process gas switch board 3, laser head 5, drive chuck 6, powder feeder 7, running gear 8, intermediate bracket 10 and bracket 11, wherein:
Drive chuck 6 is for arranging one end of compo pipe 9, and bracket 11 is for supporting the other end of compo pipe 9;
Intermediate bracket 10 comprises upper and lower adjustable two clamping pieces that cooperatively interact, running gear 8 passes through clamping piece, laser head 5 is arranged on running gear 8, laser head 5 is imported compo pipe 9 by running gear 8, and the surfacing nozzle of laser head 5 being adjusted to the original position of setting, Laser Power Devices 2 are connected with laser head 5;
Powder feeder 7 is provided with powder feeding tank, powder feeding tank is for holding the alloy powder and the agglutinant that mix by a certain percentage, powder feeder 7 is provided with and carries powder gas valve and carrier pipe, process gas switch board 3 is controlled and is passed into year powder gas flow that carries powder gas valve, mixed powder for alloy is delivered to the surfacing nozzle of laser head 5 by carrier pipe;
Console 1 is connected with running gear 8 with drive chuck 6 respectively, controls the circumferential movement of drive chuck 6 and the axially-movable of running gear 8.
Fig. 4 is the Electrical and Electronic switch board schematic diagram of the laser coating soldering equipment of one embodiment of the invention; The binding post of console, laser head, Laser Power Devices, running gear and drive chuck is arranged in Electrical and Electronic switch board 4, to realize quick, accurate, stable, safe process.
When specific implementation, console can be led the industrial computer operation and control system of wearing touch-screen, and parameter input, setting and program management all realize by touch-screen.The operation of console device itself is to implement by button.In industrial computer, can store 500 above spraying parameters, it is also equipped with USB interface.Laser Power Devices adopt semiconductor laser system.
For example, laser head is furnished with water cooling plant, before surfacing, the cooling water valve of water cooling plant is opened and is kept certain pressure.
For example, above-mentioned year powder gas can adopt argon gas.
Above-described embodiment, by base laser cladding solder technology, can be realized the manufacture of enhanced heat transfer component in pipe fast, has thereby realize the heat exchanger tube that strengthens heat-transfer effect, reduces inside pipe wall fouling.
Fig. 7 be one embodiment of the invention for grinding the milling apparatus schematic diagram of compo pipe convex solder joint.As shown in the figure, this milling apparatus comprises: whirligig 11, cooling fluid conveying device 13, grinding tool rotating driving device 14, band abrasive lapping brush 15, bull stick 17 and connecting rod 18, wherein, the first end of bull stick 17 is connected with grinding tool rotating driving device 14, grinding tool rotating driving device 14 drives bull stick 17 circumferential and axial motions, the second end of bull stick 17 be connected with the first end of connecting rod 18 (as being threaded), cooling fluid conveying device 13 is arranged on the junction of bull stick 17 and connecting rod 18, on whirligig 11, be provided with chuck, chuck is for clamping the first end A of the compo pipe 12 with convex solder joint, the second end B of compo pipe 12 is arranged in taking over a business of cooling fluid conveying device 13, cooling fluid conveying device 13 inside are provided with bearing (as stainless steel ball bearing), taking over a business of compo pipe 12 and cooling fluid conveying device 13 contacts for taper sealing, at least one band abrasive lapping brush 15 is arranged on connecting rod, in the time that butt welding point is ground, by grinding tool rotating driving device 14, connecting rod 18 is moved forward to the position, A end of compo pipe 12, whirligig 11 and grinding tool rotating driving device 14 clockwise or rotate counterclockwise simultaneously, driving compo pipe 12 and at least one band abrasive lapping brush 15 to rotate in opposite directions alloy pipe 12 convex solder joints grinds, form enhanced heat transfer component.
In the specific implementation, above-mentioned band abrasive lapping brush is made up of grinding-material and brush silk.In the time preparing abrasive lapping brush, selected grinding-material and the combination of brush silk are prepared.In a specific embodiment, abrasive lapping is brushed with two kinds of specifications:
with
,
abrasive lapping brush is contained in the root of connecting rod,
abrasive lapping brush is arranged on
after abrasive lapping brush.
For example, in the time grinding, start whirligig, angular speed is 18 turn/min, and direction of rotation is for turning clockwise; Start grinding tool rotating driving device, direction of rotation is that rotating speed is 180 turn/min clockwise, after grinding tool rotating driving device starts, then the running gear of opening grinding tool rotating driving device, feed is 2mm/min; And start cooling fluid conveying device, if flow is 25m
3/ min, pressure is 1MPa, the abrasive material of grinding is washed away, and polish-brush is played to cooling effect.
In the above-described embodiments, utilize combination material brush and high temperature alloy pipes relative rotary motion, the convex solder joint that high temperature alloy inside pipe wall surfacing is formed carries out polish-brush, by the oxide removal in high temperature alloy pipes, and high temperature alloy inside pipe wall is polished, the fineness that improves tube wall, roughness can reach more than 3.2 microns.
Below to adopt above-mentioned laser coating soldering equipment and milling apparatus manufacture to there is the interior enhanced heat transfer component manufacturing process of pipe of the heat exchanger tube of enhanced heat transfer component, manufacturing process comprises surfacing link and grinds link, surfacing link realizes by above-mentioned coating soldering equipment, grind link and realize by above-mentioned milling apparatus, manufacturing process comprises the following steps:
With the complete compo pipe inwall of acetone surface cleaning, and be dried to passing into compressed air in compo pipe, and one end of dried compo pipe be arranged on drive chuck to its other end bracket support;
Laser head is arranged on running gear, by controlling running gear, laser head is imported to compo pipe, and the surfacing nozzle of laser head is adjusted to the original position of setting, wherein, Laser Power Devices are connected with laser head, laser head is furnished with water-cooling system, before surfacing, the cooling water valve of water-cooling system is opened and is kept certain pressure;
Alloy powder is mixed by a certain percentage and packed in the powder feeding tank of powder feeder with agglutinant, open year powder gas valve of powder feeder, carry powder gas flow mixed powder for alloy be delivered to the surfacing nozzle of laser head by the control of process gas switch board, wherein, the carrier pipe of powder feeder is connected with laser head;
Position, shape and size according to the enhanced heat transfer component that will form that pre-enters console in compo pipe, control the circumferential movement of drive chuck and the axially-movable of running gear, and surfacing nozzle is at the inner convex solder joint that forms of compo pipe;
The first end of the compo pipe that forms convex solder joint is clamped on the chuck of whirligig, its second end is fixed in taking over a business of cooling fluid conveying device, stainless steel ball bearing is equipped with in cooling fluid conveying device inside, and taking over a business of compo pipe and cooling fluid conveying device contacts for taper sealing;
By grinding tool rotating driving device, the connecting rod being connected with bull stick is moved to the first end of compo pipe, at least one is arranged on the connecting rod of grinding tool rotating driving device with abrasive lapping brush, be wherein with abrasive lapping brush to be made by grinding-material and brush silk;
Start whirligig and grinding tool rotating driving device, driving compo pipe and at least one band abrasive lapping brush to rotate in opposite directions alloy pipe convex solder joint grinds, and then by grinding tool whirligig drive connecting rod according to default feed from the first end of compo pipe to the second end motion, in compo pipe, form enhanced heat transfer component;
Wherein, starting whirligig and grinding tool rotating driving device while clockwise or in rotating counterclockwise, starting cooling fluid conveying device, cooling fluid is delivered in compo pipe by setting flow set pressure, wash away grinding the abrasive material producing, and carry out cooling to polish-brush process.
For example, the chemical composition of solder joint that compo pipe inwall forms is identical with the chemical composition of compo pipe, and dilution rate is not more than 1%.In the specific implementation, can be by welding be optimized by the chemical composition of metal dust, make its chemical composition basic identical with compo pipe, and make the solder joint chemical composition dilution rate after welding be not more than 1%, guarantee that the mechanical performance of pipe convex meets the requirement of design.
For example, the degree of turning of whirligig is 15~30 turn/min, and the rotating speed of grinding tool rotating driving device is 160~240 turn/min, and it is 2mm/min that grinding tool rotating driving device drives the feed of connecting rod.
For example, the flow of cooling fluid conveying device conveying cooling fluid is 25~35m
3/ min, pressure is 1MPa.
For example, after grinding, the fineness of compo pipe inwall reaches more than 3.2 microns.The welding slag, the oxide skin etc. that after deposited, produce at inside pipe wall, the special brush of taking turns that contains abrasive material by use, polishes, polishing, makes fineness reach 3.2 microns or more smooth.
In the above-described embodiments, by based on laser cladding solder technology, can realize fast the manufacture of enhanced heat transfer component in pipe, there is thereby realize the heat exchanger tube that strengthens heat-transfer effect, reduces inside pipe wall fouling; And then utilize combination material to brush and high temperature alloy pipes relative rotary motion, the convex solder joint that high temperature alloy inside pipe wall surfacing is formed carries out polish-brush, by the oxide removal in high temperature alloy pipes, and high temperature alloy inside pipe wall is polished, the fineness that improves tube wall, roughness can reach more than 3.2 microns.
One of ordinary skill in the art will appreciate that: accompanying drawing is the schematic diagram of an embodiment, the module in accompanying drawing or flow process might not be that enforcement the present invention is necessary.
One of ordinary skill in the art will appreciate that: the module in the device in embodiment can be described and be distributed in the device of embodiment according to embodiment, also can carry out respective change and be arranged in the one or more devices that are different from the present embodiment.The module of above-described embodiment can be merged into a module, also can further split into multiple submodules.
Finally it should be noted that: above embodiment only, in order to technical scheme of the present invention to be described, is not intended to limit; Although the present invention is had been described in detail with reference to previous embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record previous embodiment is modified, or part technical characterictic is wherein equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution depart from the spirit and scope of embodiment of the present invention technical scheme.