CN103878499B - The Pb-Cd-Sn-Ag alloy brazed material used under a kind of condition of ultralow temperature - Google Patents
The Pb-Cd-Sn-Ag alloy brazed material used under a kind of condition of ultralow temperature Download PDFInfo
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- CN103878499B CN103878499B CN201210557322.7A CN201210557322A CN103878499B CN 103878499 B CN103878499 B CN 103878499B CN 201210557322 A CN201210557322 A CN 201210557322A CN 103878499 B CN103878499 B CN 103878499B
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/268—Pb as the principal constituent
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention belongs to braze material, the Pb-Cd-Sn-Ag alloy brazed material used under being specifically related to a kind of condition of ultralow temperature. The Pb-Cd-Sn-Ag alloy brazed material used under condition of ultralow temperature, comprises the following compositions of weight percent, Pb45 ~ 62.5%, Cd17.5 ~ 32%, Sn17 ~ 22%, Ag0.5��2.0%, and all the other are impurity. The unusual effect of the present invention is: the solder using Pb, Cd, Sn, Ag ratio of the present invention, tensile strength height (tensile strength of tradition tin-lead solder is no more than 20MPa) can be reached, rate height by pricker, low-temperature performance good (tradition tin-lead solder has low temperature brittleness), simultaneously the brazing filler metal melts temperature range of the application does not need change welding temperature with tradition is similar, and universal performance is good.
Description
Technical field
The invention belongs to braze material, the Pb-Cd-Sn-Ag alloy brazed material used under being specifically related to a kind of condition of ultralow temperature.
Background technology
At present, low-temperature superconducting technology is widely used in a lot of high-grade, precision and advanced field. Such as in thermonuclear fusion experimental reactor, for realizing low-temperature superconducting, it is necessary to liquid helium, superconducting coil is cooled to-269 DEG C. Superconducting coil box is cooled by the cooling tube being connected with liquid helium, if the connection of cooling tube and housing adopts melting, can't detect leakage at normal temperatures, but may reveal at low temperatures after assembling, it is difficult to ensure reliability. And soldering tech is compared with melting, can effectively avoid the damage to cooling line. But, due to composition and the harsh Service Environment of mother metal complexity, solder used needs to be had by austenitic stainless steel mother metal the performance such as good wettability, fusing point be lower, affect mother metal performance to avoid or cause bigger thermal distortion, needing still to keep enough intensity and brittle failure does not occur at-269 DEG C simultaneously. Existing series low temperature brazing material is as plumbous in tin, tin silver solder low temperature brittleness is relatively big, cannot meet above-mentioned requirements.
Summary of the invention
The present invention is directed to the defect of prior art, it is provided that the Pb-Cd-Sn-Ag alloy brazed material that a kind of intensity is big when ultra-low temperature surroundings, fragility is low.
The Pb-Cd-Sn-Ag alloy brazed material that the present invention uses under being achieved in that a kind of condition of ultralow temperature, comprises the following compositions of weight percent, Pb45 ~ 62.5%, Cd17.5 ~ 32%, Sn17 ~ 22%, Ag0.5��2.0%, and all the other are impurity.
The Pb-Cd-Sn-Ag alloy brazed material used under a kind of very low temperature as above, wherein, comprises the following compositions of weight percent, Pb46 ~ 52%, Cd28 ~ 32%, Sn18 ~ 20%, Ag2.0%, and all the other are impurity.
The Pb-Cd-Sn-Ag alloy brazed material used under a kind of very low temperature as above, wherein, comprises the following compositions of weight percent, Pb52%, Cd28%, Sn18%, Ag2.0%.
The Pb-Cd-Sn-Ag alloy brazed material used under a kind of very low temperature as above, wherein, comprises the following compositions of weight percent, Pb50%, Cd29%, Sn19%, Ag2.0%.
The Pb-Cd-Sn-Ag alloy brazed material used under a kind of very low temperature as above, wherein, comprises the following compositions of weight percent, Pb46%, Cd32%, Sn20%, Ag2.0%.
The unusual effect of the present invention is: the solder using Pb, Cd, Sn, Ag ratio of the present invention, tensile strength height (tensile strength of tradition tin-lead solder is no more than 20MPa) can be reached, rate height by pricker, low-temperature performance good (tradition tin-lead solder has low temperature brittleness), simultaneously the brazing filler metal melts temperature range of the application does not need change welding temperature with tradition is similar, and universal performance is good.
Embodiment
Below in conjunction with embodiment, the present invention will be further described:
The Pb-Cd-Sn-Ag alloy brazed material used under condition of ultralow temperature, comprises the following compositions of weight percent, Pb45��62.5%, Cd17.5��32%, Sn17��22%, Ag0.5��2.0%, and all the other are impurity.
The method of processing the application's solder alloy can adopt protection of inert gas method to carry out solder alloy melting.
Provide several concrete examples below
Alloy formula, as shown in table 1
Table 1
Above-mentioned alloy carries out shearing resistance, rate by tensile strength, pricker, molten temperature region and low-temperature performance experiment, and the result obtained is as shown in table 2.
Table 2
Shearing resistance in upper table, tensile strength, pricker rate and are referred to and as solder, stainless steel is carried out brazing filler metal using with above-mentioned materials, then sheared by brazing filler metal joint, stretch and rate test experience by pricker, obtain corresponding experimental result.
Molten temperature region in upper table refers to that the temperature starting fusing when material is the lower limit of molten temperature region to above-mentioned materials heating, and the temperature melted completely when material is the upper limit of molten temperature region.
Low-temperature performance in upper table refers to, with liquid nitrogen, above-mentioned materials is cooled to liquid nitrogen temperature, then liquid nitrogen is removed, material is made to recover normal temperature, so 15 times repeatedly, observe whether material surface exists crackle, if there is crackle, judge that material has low temperature brittleness, otherwise judge that material does not have low temperature brittleness.
Sequence number in table 2 represents the solder that in table 1, corresponding sequence number represents.
Claims (4)
1. the Pb-Cd-Sn-Ag alloy brazed material used under a condition of ultralow temperature, it is characterised in that: the following compositions comprising weight percent, Pb46��52%, Cd28��32%, Sn18��20%, Ag2.0%, all the other are impurity.
2. the Pb-Cd-Sn-Ag alloy brazed material used under a kind of condition of ultralow temperature as claimed in claim 1, it is characterised in that: the following compositions comprising weight percent, Pb52%, Cd28%, Sn18%, Ag2.0%.
3. the Pb-Cd-Sn-Ag alloy brazed material used under a kind of condition of ultralow temperature as claimed in claim 1, it is characterised in that: the following compositions comprising weight percent, Pb50%, Cd29%, Sn19%, Ag2.0%.
4. the Pb-Cd-Sn-Ag alloy brazed material used under a kind of condition of ultralow temperature as claimed in claim 1, it is characterised in that: the following compositions comprising weight percent, Pb46%, Cd32%, Sn20%, Ag2.0%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210557322.7A CN103878499B (en) | 2012-12-20 | 2012-12-20 | The Pb-Cd-Sn-Ag alloy brazed material used under a kind of condition of ultralow temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210557322.7A CN103878499B (en) | 2012-12-20 | 2012-12-20 | The Pb-Cd-Sn-Ag alloy brazed material used under a kind of condition of ultralow temperature |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103878499A CN103878499A (en) | 2014-06-25 |
| CN103878499B true CN103878499B (en) | 2016-06-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210557322.7A Active CN103878499B (en) | 2012-12-20 | 2012-12-20 | The Pb-Cd-Sn-Ag alloy brazed material used under a kind of condition of ultralow temperature |
Country Status (1)
| Country | Link |
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| CN (1) | CN103878499B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4168027A (en) * | 1974-08-19 | 1979-09-18 | Multicore Solders Limited | Aluminium soldering |
| CN85100578A (en) * | 1985-04-01 | 1986-08-20 | 南京工学院 | The antioxidation plumber solder that contains rare earth element |
| EP0753374A1 (en) * | 1995-07-13 | 1997-01-15 | Toshiba Corporation | Low-melting alloy and cream solder using a powder of the alloy |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5662941A (en) * | 1979-10-30 | 1981-05-29 | Senjiyu Kinzoku Kogyo Kk | Solder alloy for soldering lead of silver electrode of ceramic capacitor |
| CA2666363C (en) * | 2006-10-17 | 2018-04-24 | Fry's Metals, Inc. | Materials for use with interconnects of electrical devices and related methods |
-
2012
- 2012-12-20 CN CN201210557322.7A patent/CN103878499B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4168027A (en) * | 1974-08-19 | 1979-09-18 | Multicore Solders Limited | Aluminium soldering |
| CN85100578A (en) * | 1985-04-01 | 1986-08-20 | 南京工学院 | The antioxidation plumber solder that contains rare earth element |
| EP0753374A1 (en) * | 1995-07-13 | 1997-01-15 | Toshiba Corporation | Low-melting alloy and cream solder using a powder of the alloy |
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| Publication number | Publication date |
|---|---|
| CN103878499A (en) | 2014-06-25 |
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