CN103858525A - Printed circuit board, component and circuit assembly - Google Patents
Printed circuit board, component and circuit assembly Download PDFInfo
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- CN103858525A CN103858525A CN201280033028.4A CN201280033028A CN103858525A CN 103858525 A CN103858525 A CN 103858525A CN 201280033028 A CN201280033028 A CN 201280033028A CN 103858525 A CN103858525 A CN 103858525A
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- welding
- parts
- welding material
- pcb
- spacing layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09909—Special local insulating pattern, e.g. as dam around component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Provided are a printed circuit board, a component and a circuit assembly. The printed circuit board is used for welding a component, and a welding material stopping layer is provided on a welding surface of the printed circuit board which is used for welding the component; and the welding material stopping layer is used for limiting a welding material used for welding the component in at least two areas divided by the welding material stopping layer. By way of providing a welding material stopping layer on a welding surface of a printed circuit board or on a welding surface of a component, or providing the welding material stopping layer between the welding surfaces of the printed circuit board and the component, the flow of soldering tin can be controlled by the welding material stopping layer in the welding process, so as to improve the distribution uniformity of the soldering tin on the welding surfaces, thereby preventing a large-area cavity from occurring between the welding surfaces after welding, guaranteeing the welding effect, and thereby guaranteeing the product reliability.
Description
Technical field
The present invention relates to electronic technology field, relate in particular to a kind of printed circuit board (PCB), a kind of parts and a kind of circuit unit.
Background technology
Printed circuit board (PCB) (PCB, Printed Circuit Board) (comprise solder side with parts, and can for PCB(but be not limited to PCB) be called parts by the object being weldingly connected, as metal substrate, the device that components and parts or multiple components and parts are combined into etc.) there is considerable influence in welding cavity to product reliability, prior welding mode is that printed circuit board (PCB) and parts solder side directly carry out sintering, as Fig. 1, during printed circuit board (PCB) 1 shown in Fig. 2 is illustrated with components and parts 2 welded structures with heat radiation metal substrate 2 welded structures (what wherein Fig. 2 provided is the signal of printed circuit board (PCB) 1 and solder side 11 thereof) of power tube 3 and the printed circuit board (PCB) of Fig. 61, all that the solder side of printed circuit board (PCB) and institute's welding assembly is directly carried out to sintering, the problem of its existence is: make to weld between rear PCB and parts solder side and occur large area cavity, affect product reliability.
Summary of the invention
Embodiment of the present invention provides a kind of printed circuit board (PCB), a kind of parts and a kind of circuit unit, can solve the problem that occurs large area cavity between the rear solder side of welding, can realize flowing of Control Welding Process welding material, improve the uniformity that solder side welding material distributes, thereby avoid large area cavity between solder side to occur, guarantee product reliability.
A kind of printed circuit board (PCB), described printed circuit board (PCB) is for welding assembly, described printed circuit board (PCB) be provided with the spacing layer of welding material for welding the solder side of described parts, the spacing layer of described welding material is for being limited in the described parts of welding welding material used at least two regions being cut apart by the spacing layer of described welding material.
A kind of parts, described parts comprise solder side, the solder side of described parts is provided with the spacing layer of welding material, and the spacing layer of described welding material is for being limited in the described parts of welding welding material used at least two regions being cut apart by the spacing layer of described welding material.
Make a method for printed circuit board (PCB), described printed circuit board (PCB) is for welding assembly, and the method comprises:
Described printed circuit board (PCB) for welding on the solder side of described parts, the spacing layer of welding material is set, the spacing layer of described welding material is for being limited in the described parts of welding welding material used at least two regions being cut apart by the spacing layer of described welding material.
A method for manufacture component, described parts comprise solder side, the method comprises:
The spacing layer of welding material is set on the solder side of described parts, and the spacing layer of described welding material is for being limited in the described parts of welding welding material used at least two regions being cut apart by the spacing layer of described welding material.
A kind of circuit unit, comprises parts and printed circuit board (PCB), is useful on the welding material of welding between the solder side of described printed circuit board (PCB) and the solder side of described parts,
Between the solder side of described printed circuit board (PCB) and the solder side of described parts, be also provided with the spacing layer of welding material, the spacing layer of described welding material is for being limited in described welding material at least two regions being cut apart by the spacing layer of described welding material.
Manufacture a method for circuit unit, described circuit unit comprises parts and printed circuit board (PCB), and described method is included in the welding material that is provided for welding between the solder side of described printed circuit board (PCB) and the solder side of described parts, and the method also comprises:
The spacing layer of welding material is set between the solder side of described printed circuit board (PCB) and the solder side of described parts, and the spacing layer of described welding material is for being limited in described welding material at least two regions being cut apart by the spacing layer of described welding material.
Can be found out by the above-mentioned technical scheme providing, the spacing layer of welding material is set on the solder side by the solder side at printed circuit board (PCB) or parts in embodiment of the present invention or the spacing layer of welding material is set between printed circuit board (PCB) and the solder side of parts, can realize and in welding process, control flowing of scolding tin by the spacing layer of welding material, improve the uniformity that solder side scolding tin distributes, thereby avoid welding and between rear solder side, occur large area cavity, guarantee welding effect, and then guarantee the reliability of product.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain other accompanying drawings according to these accompanying drawings.
The printed circuit board (PCB) that Fig. 1 provides for prior art and the heat radiation metal substrate welded structure schematic diagram of power tube;
The schematic diagram of the solder side of the printed circuit board (PCB) that Fig. 2 provides for prior art;
The schematic diagram of the circuit unit that Fig. 3 provides for the embodiment of the present invention 1;
The schematic diagram of the PCB that Fig. 4 provides for the embodiment of the present invention 1;
The schematic diagram of the circuit unit that Fig. 5 provides for the embodiment of the present invention 2;
Printed circuit board (PCB) and components and parts welded structure schematic diagram that Fig. 6 provides for prior art;
The schematic diagram of the components and parts that Fig. 7 provides for the embodiment of the present invention 2;
The schematic diagram of the circuit unit that Fig. 8 provides for the embodiment of the present invention 1;
The schematic diagram of the circuit unit that Fig. 9 provides for the embodiment of the present invention 2;
The welding printed circuit board (PCB) that Figure 10 provides for the embodiment of the present invention 6 and the flow chart of parts method.
Embodiment
For ease of understanding, below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, rather than whole embodiment.Based on the embodiment in the present invention, those of ordinary skills, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
The embodiment of the present invention provides a kind of circuit unit, this circuit unit comprises parts (22,25) and printed circuit board (PCB) (PCB, Printed Circuit Board) (21), between the solder side of printed circuit board (PCB) and the solder side of parts, be useful on the welding material of welding, between the solder side of printed circuit board (PCB) and the solder side of parts, be also provided with the spacing layer of welding material (24), the spacing layer of described welding material is for being limited in described welding material at least two regions being cut apart by the spacing layer of described welding material.
Wherein, parts are the object that comprises solder side, and it can be with PCB(but is not limited to PCB) by being weldingly connected, it can comprise metal substrate, components and parts or device, but is not limited to this.
Between the solder side of PCB and the solder side of parts, be also provided with the spacing layer of welding material, can be as shown in Fig. 3 or Fig. 8, be arranged on the solder side of PCB, also can be as shown in Fig. 5 or Fig. 9, be arranged on the solder side of parts, can also be arranged on the solder side of PCB and parts simultaneously, also can be used as independent one deck, be arranged between PCB and the solder side of parts.
Wherein, the spacing layer of welding material can be solder mask (Solder Mask), and its material is solder resist material, and this solder resist material can be green oil.
Wherein, welding material can be scolding tin, also can for other can be mobile material, in the embodiment of the present invention, be not limited to this.
Wherein, the shape of the spacing layer of welding material can be latticed, but is not limited to this, and it can be the shape that welding material can be limited in at least two regions.But in order further to improve the uniformity that welding material distributes, its shape can be the latticed of even partition.
Wherein, in the time that the spacing layer of welding material is arranged at least one the solder side in pcb board and parts, the spacing layer of this welding material can arrange in the mode being adjacent to, such as, arrange in the mode of printing, but be not limited to this.Can further guarantee the connection of welding material between solder side with the mode setting of pressing close to, avoid occurring the problem in welding tomography or large area cavity.
The circuit unit that the embodiment of the present invention provides can limit welding material by least two regions that are made up of solder resist material between solder side, thereby improve the uniformity that solder side scolding tin distributes, avoid welding between rear printed circuit board (PCB) and parts solder side and occur large area cavity, guarantee welding effect, and then guarantee the reliability of product.
Below, take parts as strengthening the metal substrate of power tube 3 thermal diffusivities, the spacing layer of welding material is arranged on the solder side of PCB and welding material is that scolding tin is example, and above circuit unit is further elaborated.
The spacing layer of scolding tin 24 can be adjacent on the solder side that is arranged on PCB21, and the spacing layer 24 of scolding tin can be for being printed on the solder mask of the fenestral fabric that the solder side of PCB21 forms by solder resist material.Be equivalent to so the spacing layer 24 of scolding tin and be complex as a whole structure with PCB21 solder side, in the time of PCB21 solder side and metal substrate welding, flow between PCB21 solder side and metal substrate 22 by the spacing layer 24 restriction scolding tin of scolding tin, avoid welding and between rear PCB1 and metal substrate 22, occur large area Kong Beamy, thereby effectively guaranteed the welding effect between PCB21 and metal substrate 22.
Above in power amplifier the solder mask of the solder side printing net trellis of PCB as the spacing layer of welding material, pass through compression tooling, PCB and metal substrate are compressed and close contact, under heating environment, realize sintering, PCB and metal substrate after welding welding large area cavity minimizing like this, has promoted the welding effect between PCB and metal substrate in power amplifier.Wherein, be production process technology equipment in " frock " of machinery production manufacture field: the general name of various tool used in referring to manufacture process.
Fig. 4 and Figure 8 shows that parts are the situation of components and parts 25.Except parts be components and parts 25 from parts in above embodiment be metal substrate 22 different, other all can be with reference to the description in above embodiment.
Further, the embodiment of the present invention also provides a kind of PCB, this PCB is for welding assembly, this PCB is provided with the spacing layer of welding material for welding the solder side of these parts, and the spacing layer of this welding material is for being limited in these parts of welding welding material used at least two regions being cut apart by the spacing layer of this welding material.The specific features of this PCB can be with reference to the PCB described in above circuit unit.
The embodiment of the present invention also provides a kind of circuit unit, and this circuit unit comprises above PCB.
The embodiment of the present invention provides a kind of circuit unit, and the still metal substrate take parts as enhancing power tube 3 thermal diffusivities, and welding material is that scolding tin is example, and above circuit unit is further elaborated.Basic identical with the example that embodiment 1 provides, different, the spacing layer of this scolding tin 24 is arranged on the solder side of metal substrate 22 (as shown in Figure 5, the spacing layer of scolding tin 24 structure can with reference to Fig. 4).This welded structure is in the time that the solder side of PCB21 and metal substrate 22 weld, flow between PCB21 solder side and the solder side of metal substrate 22 by the spacing layer 24 restriction scolding tin of scolding tin, avoid welding and between rear PCB21 and metal substrate 22, occur large area Kong Beamy, thereby effectively guaranteed the welding effect between PCB21 and metal substrate 22.The spacing layer of scolding tin 24 can be for being printed on the solder mask of the fenestral fabric that the solder side of metal substrate 22 forms by solder resist material.
Fig. 7 and Figure 9 shows that parts are the situation of components and parts 25.Except parts be components and parts 25 from parts in above embodiment be metal substrate 22 different, other all can be with reference to the description in above embodiment.
Further, the embodiment of the present invention also provides a kind of parts, and these parts comprise solder side, and this solder side can be for parts and PCB(but is not limited to PCB) welding.The solder side of these parts is provided with the spacing layer of welding material, and the spacing layer of this welding material is for being limited in these parts of welding welding material used at least two regions being cut apart by the spacing layer of this welding material.These parts can comprise metal substrate, components and parts or device.The specific features of these parts can be with reference to the parts described in above circuit unit.
The embodiment of the present invention also provides a kind of circuit unit, and this circuit unit comprises with upper-part.
The embodiment of the present invention further provides a kind of method of making printed circuit board (PCB), and this printed circuit board (PCB) is for welding assembly, and the method comprises:
This printed circuit board (PCB) for welding on the solder side of these parts, the spacing layer of welding material is set, the spacing layer of this welding material is for being limited in these parts of welding welding material used at least two regions being cut apart by the spacing layer of described welding material.
This welding material can be scolding tin, but is not limited to this.
The spacing layer of this welding material can be solder mask, and this solder mask is made up of solder resist material, and this solder resist material can be green oil, but is not limited to this.
The spacing layer of above welding material can be latticed, also can comprise for other shape of at least two cut zone.Further, can also be the latticed of even partition, the uniformity distributing further to improve welding material.
Above printed circuit board (PCB) with for the corresponding solder side of welding assembly on the spacing layer of welding material is set can comprises: what solder resist material is printed on to printed circuit board (PCB) forms the spacing layer of latticed welding material for welding on the solder side of described parts.
Some details in the method for this making PCB, can be with reference to some descriptions in other embodiment.The PCB that the method providing by the embodiment of the present invention is produced, can go up at least two regions that are made up of solder resist material by PCB limits welding material, thereby improve the uniformity that solder side scolding tin distributes, avoid welding between rear PCB and parts solder side and occur large area cavity, guarantee welding effect, and then guarantee the reliability of product.
Embodiment 4
The embodiment of the present invention further provides a kind of method of manufacture component, and these parts comprise solder side, and this solder side can be for the welding between these parts and PCB, but is not limited to the welding between PCB.The method comprises:
The spacing layer of welding material is set on the solder side of these parts, and the spacing layer of this welding material is for being limited in these parts of welding welding material used at least two regions being cut apart by the spacing layer of described welding material.
This welding material can be scolding tin, but is not limited to this.
The spacing layer of this welding material can be solder mask, and this solder mask is made up of solder resist material, and this solder resist material can be green oil, but is not limited to this.
The spacing layer of above welding material can be latticed, also can comprise for other shape of at least two cut zone.Further, can also be the latticed of even partition, the uniformity distributing further to improve welding material.
The spacing layer of welding material is set above on the solder side of parts can be comprised: solder resist material is printed on the solder side of parts and forms the spacing layer of latticed welding material.
Some details in the method for these making parts, can be with reference to some descriptions in other embodiment.The parts that the method providing by the embodiment of the present invention is produced, can limit welding material by least two regions that formed by solder resist material on parts, thereby improve the uniformity that solder side scolding tin distributes, avoid welding and between rear solder side, occur large area cavity, guarantee welding effect, and then guarantee the reliability of product.
Embodiment 5
The embodiment of the present invention provides a kind of method of manufacturing circuit unit, and this circuit unit comprises parts and printed circuit board (PCB), and the method is included in the welding material that is provided for welding between the solder side of printed circuit board (PCB) and the solder side of parts, and the method also comprises:
The spacing layer of welding material is set between the solder side of printed circuit board (PCB) and the solder side of parts, and the spacing layer of welding material is for being limited in described welding material at least two regions being cut apart by the spacing layer of described welding material.
Wherein, can comprise spacing independent layer of soldering material layer is arranged between PCB and the solder side of parts the spacing layer of welding material is set between the solder side of printed circuit board (PCB) and the solder side of parts.
Wherein, more than arranging can be for to arrange in the mode being adjacent to.
Some details in this method, can, with reference to the description in other embodiment, not repeat them here.
Embodiment 6
The embodiment of the present invention provides a kind of method of PCB of welding and parts, for having printed circuit board (PCB) and the parts welding of corresponding solder side, as shown in figure 10, comprises the following steps:
Step 101, the welding region between described printed circuit board (PCB) and described parts arranges the spacing layer of welding material, and the spacing layer of described welding material arranging is matched with the welding region of described printed circuit board (PCB) and described parts;
Step 102, is arranged on welding material on the solder side of welding region of described printed circuit board (PCB) and described parts, flows by the described welding material of the spacing layer restriction of described welding material, and described printed circuit board (PCB) and parts are welded by welding material.
In the method for above-mentioned welding, the spacing layer of welding material can be arranged on the solder side of welding region of described printed circuit board (PCB) in the mode being adjacent to, as the mode of printing;
Or the spacing layer of welding material can be arranged on the solder side of welding region of described parts in the mode being adjacent to, as the mode of printing;
Or independently one deck of the spacing layer conduct of welding material is arranged between printed circuit board (PCB) and the solder side of parts in welding process.
Above welding material can be scolding tin, but is not limited to this.
The spacing layer of above welding material can be solder mask, but is not limited to this.
The material of above solder mask is solder resist material, and this solder resist material can be green oil, but is not limited to this.
Wherein, spacing welding material layer is arranged on the solder side of welding region of described printed circuit board (PCB), can comprises at least one in following mode: solder resist material is printed on to the solder mask that forms fenestral fabric on the solder side of welding region of described printed circuit board (PCB); Or
Solder resist material printing is printed on to the solder mask that forms fenestral fabric on the solder side of welding region of described parts.
Some details in the method providing in the embodiment of the present invention, can be with reference to the description in other embodiment.
Embodiment 7
The present embodiment provides a kind of device, and this device can comprise any one circuit unit described in above embodiment.This device can comprise power amplifier, sender or base station, but be not limited to this.
This device can be the device that communication equipment, power amplifying device etc. need to be used printed circuit board (PCB) and parts welding, particularly including the parts of large (being generally greater than 4 square millimeters) of the area of solder side, or at least one in the larger printed circuit board (PCB) of the area of solder side.
Through the above description of the embodiments, the method that those skilled in the art can be well understood in the embodiment of the present invention can realize by hardware, and the mode that also can add necessary general hardware platform by software realizes.Based on such understanding, technical scheme of the present invention can embody with the form of software product, it (can be CD-ROM that this software product can be stored in a non-volatile memory medium, USB flash disk, portable hard drive etc.) in, comprise that some instructions are in order to make a computer equipment (can be personal computer, server, or the network equipment etc.) carry out the method described in each embodiment of the present invention.
The above; only for preferably embodiment of the present invention, but protection scope of the present invention is not limited to this, is anyly familiar with in technical scope that those skilled in the art disclose in the present invention; the variation that can expect easily or replacement, within all should being encompassed in protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of claim.
Claims (25)
1. a printed circuit board (PCB), described printed circuit board (PCB) is for welding assembly, it is characterized in that, described printed circuit board (PCB) be provided with the spacing layer of welding material for welding the solder side of described parts, the spacing layer of described welding material is for being limited in the described parts of welding welding material used at least two regions being cut apart by the spacing layer of described welding material.
2. printed circuit board (PCB) according to claim 1, is characterized in that, the material of the spacing layer of described welding material is solder resist material.
3. printed circuit board (PCB) according to claim 2, is characterized in that, described solder resist material is green oil.
4. according to the printed circuit board (PCB) described in any one in claims 1 to 3, it is characterized in that, being shaped as of the spacing layer of described welding material is latticed.
5. according to the printed circuit board (PCB) described in any one in claim 1 to 4, it is characterized in that, the spacing layer of described welding material is arranged on described printed circuit board (PCB) in the mode being adjacent to.
6. according to the printed circuit board (PCB) described in any one in claim 1 to 5, it is characterized in that, described parts comprise metal substrate, components and parts or device.
7. according to the printed circuit board (PCB) described in any one in claim 1 to 6, it is characterized in that, described welding material is scolding tin.
8. parts, described parts comprise solder side, it is characterized in that, the solder side of described parts is provided with the spacing layer of welding material, and the spacing layer of described welding material is for being limited in the described parts of welding welding material used at least two regions being cut apart by the spacing layer of described welding material.
9. parts according to claim 8, is characterized in that, the material of the spacing layer of described welding material is solder resist material.
10. parts according to claim 9, is characterized in that, described solder resist material is green oil.
Parts described in 11. according to Claim 8 to 10 any one, is characterized in that, being shaped as of the spacing layer of described welding material is latticed.
Parts in 12. according to Claim 8 to 11 described in any one, is characterized in that, the spacing layer of described welding material is arranged on described parts in the mode being adjacent to.
Parts in 13. according to Claim 8 to 12 described in any one, is characterized in that, described parts comprise metal substrate, components and parts or device.
Parts in 14. according to Claim 8 to 13 described in any one, is characterized in that, described welding material is scolding tin.
15. 1 kinds of circuit units, is characterized in that, comprise at least one in printed circuit board (PCB) and the parts as described in any one in claim 8 to 14 as claimed in any of claims 1 to 7 in one of claims.
16. 1 kinds of devices, is characterized in that, comprise circuit unit as claimed in claim 15.
17. devices according to claim 16, is characterized in that, described device comprises power amplifier, sender or base station.
Make the method for printed circuit board (PCB) for 18. 1 kinds, described printed circuit board (PCB) is used for welding assembly, it is characterized in that, the method comprises:
Described printed circuit board (PCB) for welding on the solder side of described parts, the spacing layer of welding material is set, the spacing layer of described welding material is for being limited in the described parts of welding welding material used at least two regions being cut apart by the spacing layer of described welding material.
19. methods according to claim 18, is characterized in that, the material of the spacing layer of described welding material is solder resist material.
20. methods according to claim 19, it is characterized in that described on the solder side of described parts, the spacing layer of welding material being set and comprising for welding at described printed circuit board (PCB): what described solder resist material is printed on to described printed circuit board (PCB) forms the spacing layer of latticed welding material for welding on the solder side of described parts.
The method of 21. 1 kinds of manufacture component, described parts comprise solder side, it is characterized in that, comprising:
The spacing layer of welding material is set on the solder side of described parts, and the spacing layer of described welding material is for being limited in the described parts of welding welding material used at least two regions being cut apart by the spacing layer of described welding material.
22. methods according to claim 21, is characterized in that, the material of the spacing layer of described welding material is solder resist material.
23. methods according to claim 22, is characterized in that, the described spacing layer of welding material that arranges on the solder side of described parts comprises: described solder resist material is printed on the solder side of described parts and forms the spacing layer of latticed welding material.
24. 1 kinds of circuit units, comprise parts and printed circuit board (PCB), are useful on the welding material of welding between the solder side of described printed circuit board (PCB) and the solder side of described parts, it is characterized in that,
Between the solder side of described printed circuit board (PCB) and the solder side of described parts, be also provided with the spacing layer of welding material, the spacing layer of described welding material is for being limited in described welding material at least two regions being cut apart by the spacing layer of described welding material.
Manufacture the method for circuit unit for 25. 1 kinds, described circuit unit comprises parts and printed circuit board (PCB), described method is included in the welding material that is provided for welding between the solder side of described printed circuit board (PCB) and the solder side of described parts, it is characterized in that, the method also comprises:
The spacing layer of welding material is set between the solder side of described printed circuit board (PCB) and the solder side of described parts, and the spacing layer of described welding material is for being limited in described welding material at least two regions being cut apart by the spacing layer of described welding material.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2012/084626 WO2014075251A1 (en) | 2012-11-15 | 2012-11-15 | Printed circuit board, component and circuit assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103858525A true CN103858525A (en) | 2014-06-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280033028.4A Pending CN103858525A (en) | 2012-11-15 | 2012-11-15 | Printed circuit board, component and circuit assembly |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103858525A (en) |
| WO (1) | WO2014075251A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106488663A (en) * | 2015-08-31 | 2017-03-08 | 英飞凌科技股份有限公司 | Using spacing keeper, the first weldment is welded on the method on the second weldment |
| KR20170117110A (en) * | 2015-02-15 | 2017-10-20 | 후아웨이 테크놀러지 컴퍼니 리미티드 | Power tube connection structure and power amplifier of power amplifier |
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- 2012-11-15 CN CN201280033028.4A patent/CN103858525A/en active Pending
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20170117110A (en) * | 2015-02-15 | 2017-10-20 | 후아웨이 테크놀러지 컴퍼니 리미티드 | Power tube connection structure and power amplifier of power amplifier |
| JP2018506860A (en) * | 2015-02-15 | 2018-03-08 | 華為技術有限公司Ｈｕａｗｅｉ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏ．，Ｌｔｄ． | Power pipe connection structure for power amplifier and power amplifier |
| US10165687B2 (en) | 2015-02-15 | 2018-12-25 | Huawei Technologies Co., Ltd. | Power tube connection structure of power amplifier and power amplifier |
| KR101968035B1 (en) * | 2015-02-15 | 2019-04-10 | 후아웨이 테크놀러지 컴퍼니 리미티드 | Power tube connection structure and power amplifier of power amplifier |
| US10426036B2 (en) | 2015-02-15 | 2019-09-24 | Huawei Technologies Co., Ltd. | Power tube connection structure of power amplifier and power amplifier |
| CN106488663A (en) * | 2015-08-31 | 2017-03-08 | 英飞凌科技股份有限公司 | Using spacing keeper, the first weldment is welded on the method on the second weldment |
| CN106488663B (en) * | 2015-08-31 | 2019-08-23 | 英飞凌科技股份有限公司 | The method being welded on the first weldment using spacing retainer on the second weldment |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014075251A1 (en) | 2014-05-22 |
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