CN103824918A - 均匀电流分布led - Google Patents

均匀电流分布led Download PDF

Info

Publication number
CN103824918A
CN103824918A CN201110458272.2A CN201110458272A CN103824918A CN 103824918 A CN103824918 A CN 103824918A CN 201110458272 A CN201110458272 A CN 201110458272A CN 103824918 A CN103824918 A CN 103824918A
Authority
CN
China
Prior art keywords
layer
electrode
current distribution
cbl
uniform current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201110458272.2A
Other languages
English (en)
Inventor
魏臻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FOCUS LIGHTINGS TECH Inc
Original Assignee
FOCUS LIGHTINGS TECH Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FOCUS LIGHTINGS TECH Inc filed Critical FOCUS LIGHTINGS TECH Inc
Priority to CN201110458272.2A priority Critical patent/CN103824918A/zh
Publication of CN103824918A publication Critical patent/CN103824918A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40Materials therefor
    • H01L33/42Transparent materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0016Processes relating to electrodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)

Abstract

本发明涉及一种均匀电流分布LED,它包括位于底层的基底、位于基底上方的CBL层、覆盖于基底与CBL层上的ITO层、以及位于ITO层上的金属电极,CBL层与金属电极在垂直方向上相对应,ITO层上通过注入形成有氧离子区域,氧离子区域位于金属电极周围。由于采用上述技术方案,通过电极周围区域用离子注入的方式注入氧离子,从而提高了电极周围区域的电阻,从而帮助电流向电流扩展层的电阻阻值低的区域扩展,从而使得电流在整个TCL层上得到更好的扩展。同时,增加的氧可以提高电极周围区域的透光度,从而提高了亮度。<b/>

Description

均匀电流分布LED
技术领域
本发明涉及一种均匀电流分布LED。
背景技术
为了提高LED芯片的出光效率,人们想了许多办法。比如,当前市场上出现了许多亮度较高的ITO芯片的LED,GaN基白光LED中如果用ITO替代Ni/Au作为P型电极芯片的亮度要比采用通用电极的芯片高20%-30%。在众多可作为透明电极(TCL)的材料中,ITO(Indium Tin Oxide氧化铟锡)是被最广泛应用的一种,ITO薄膜即铟锡氧化物半导体透明导电膜,通常有两个性能指标:电阻率和透光率,由于ITO可同时具有低电阻率及高光穿透率的特性,符合了导电性及透光性良好的要求。与其它透明的半导体导电薄膜相比,ITO具有良好的化学稳定性和热稳定性。对衬底具有良好的附着性和图形加工特性。ITO为一种N型氧化物半导体,作为纳米铟锡金属氧化物,具有很好的导电性和透明性,可以切断对人体有害的电子辐射,紫外线及远红外线。
现有技术中的LED芯片,首先是在外延片上沉积一层CBL,然后再沉积一层ITO作发光层。这样做可以减少电极下的电流密度,但不能保证电极外,尤其是远离电极处的电流的均匀性,造成的结果是LED芯片发光的不均匀。
发明内容
本发明的目的是解决现有技术中LED芯片发光不均匀的技术问题,提供一种在发光面积内均匀出光的LED芯片。
为了达到上述技术目的,本发明提供了一种均匀电流分布LED,它包括位于底层的基底、位于所述的基底上方的CBL层、覆盖于所述的基底与CBL层上的ITO层、以及位于所述的ITO层上的金属电极,所述的CBL层与金属电极在垂直方向上相对应,所述的ITO层上通过注入形成有氧离子区域,所述的氧离子区域位于所述的金属电极周围。
优选地,所述的氧离子区域的氧离子浓度从中心向外侧逐渐增高。
优选地,所述的基底为P-GaN层。
由于采用上述技术方案,通过电极周围区域用离子注入的方式注入氧离子,从而提高了电极周围区域的电阻,从而帮助电流向电流扩展层的电阻阻值低的区域扩展,从而使得电流在整个TCL层上得到更好的扩展。同时,增加的氧可以提高电极周围区域的透光度,从而提高了亮度。  
附图说明
附图1为根据本发明的均匀电流分布LED的结构示意图;
附图2为根据本发明的均匀电流分布LED的生产加工流程示意图。
具体实施方式
下面结合附图对本发明的较佳实施例进行详细阐述,以使本发明的优点和特征能更易于被本领域技术人员理解,从而对本发明的保护范围做出更为清楚明确的界定。
附图1为根据本发明的均匀电流分布LED的结构示意图,附图2为根据本发明的均匀电流分布LED的生产加工流程示意图。
如附图1所示,本实施例中的均匀电流分布LED,它包括位于底层的基底、位于基底上方的CBL层、覆盖于基底与CBL层上的ITO层、以及位于ITO层上的金属电极,CBL层与金属电极在垂直方向上相对应,ITO层上通过注入形成有氧离子区域,氧离子区域位于金属电极周围,其中,基底为P-GaN层。
参见附图2所示,首先在P-GaN基层上沉积CBL层,之后在有CBL层的外延片上沉积ITO层,然后在预做电极区域包括周围一定范围内的区域暴露,其他区域用光掩模掩蔽起来,用离子注入的方式对暴露区域进行氧离子注入;然后去除掩模、退火,然后制作芯片其他部分即可。这样,通过电极周围区域用离子注入的方式注入氧离子,从而提高了电极周围区域的电阻,从而帮助电流向电流扩展层的电阻阻值低的区域扩展,从而使得电流在整个TCL层上得到更好的扩展。同时,增加的氧离子可以提高电极周围区域的透光度,从而提高了亮度。
需要指出的是,作为一种可选择的方案,氧离子区域的氧离子浓度可以从中心向外侧逐渐增高,例如通过多次的曝光、注入制程,形成具有一定浓度梯度的氧离子区域,从而使得ITO层的电阻从中心到外侧逐渐降低,以实现更加均匀的电流分布的效果。
以上实施方式只为说明本发明的技术构思及特点,其目的在于让熟悉此项技术的人了解本发明的内容并加以实施,并不能以此限制本发明的保护范围,凡根据本发明精神实质所做的等效变化或修饰,都应涵盖在本发明的保护范围内

Claims (3)

1.一种均匀电流分布LED,它包括位于底层的基底、位于所述的基底上方的CBL层、覆盖于所述的基底与CBL层上的ITO层、以及位于所述的ITO层上的金属电极,所述的CBL层与金属电极在垂直方向上相对应,其特征在于:所述的ITO层上通过注入形成有氧离子区域,所述的氧离子区域位于所述的金属电极周围。
2.根据权利要求1所述的均匀电流分布LED,其特征在于:所述的氧离子区域的氧离子浓度从中心向外侧逐渐增高。
3.根据权利要求1所述的均匀电流分布LED,其特征在于:所述的基底为P-GaN层。
CN201110458272.2A 2011-12-31 2011-12-31 均匀电流分布led Pending CN103824918A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201110458272.2A CN103824918A (zh) 2011-12-31 2011-12-31 均匀电流分布led

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201110458272.2A CN103824918A (zh) 2011-12-31 2011-12-31 均匀电流分布led

Publications (1)

Publication Number Publication Date
CN103824918A true CN103824918A (zh) 2014-05-28

Family

ID=50759875

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110458272.2A Pending CN103824918A (zh) 2011-12-31 2011-12-31 均匀电流分布led

Country Status (1)

Country Link
CN (1) CN103824918A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111564536B (zh) * 2020-05-12 2021-11-05 创维液晶器件(深圳)有限公司 Micro-LED芯片的制备方法、结构及显示终端

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1544685A (zh) * 2003-11-27 2004-11-10 四川大学 用等离子体技术制备透明低阻/高阻复合膜
US20070221944A1 (en) * 2005-11-15 2007-09-27 Myung Cheol Yoo Light emitting diodes and fabrication methods thereof
CN201060869Y (zh) * 2006-12-29 2008-05-14 北京工业大学 一种具有电流输运增透窗口层结构的发光二极管
CN101789478A (zh) * 2010-03-04 2010-07-28 上海蓝光科技有限公司 一种发光二极管芯片及其制造方法
CN202423370U (zh) * 2011-12-31 2012-09-05 聚灿光电科技(苏州)有限公司 均匀电流分布led

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1544685A (zh) * 2003-11-27 2004-11-10 四川大学 用等离子体技术制备透明低阻/高阻复合膜
US20070221944A1 (en) * 2005-11-15 2007-09-27 Myung Cheol Yoo Light emitting diodes and fabrication methods thereof
CN201060869Y (zh) * 2006-12-29 2008-05-14 北京工业大学 一种具有电流输运增透窗口层结构的发光二极管
CN101789478A (zh) * 2010-03-04 2010-07-28 上海蓝光科技有限公司 一种发光二极管芯片及其制造方法
CN202423370U (zh) * 2011-12-31 2012-09-05 聚灿光电科技(苏州)有限公司 均匀电流分布led

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111564536B (zh) * 2020-05-12 2021-11-05 创维液晶器件(深圳)有限公司 Micro-LED芯片的制备方法、结构及显示终端

Similar Documents

Publication Publication Date Title
TWI535055B (zh) 氮化物半導體結構及半導體發光元件
KR101844900B1 (ko) 균일한 밝기 분포를 갖는 유기 발광 디바이스
Wang et al. Interface and transport properties of GaN/graphene junction in GaN-based LEDs
CN103280501A (zh) Led芯片及其制造方法
CN104124321A (zh) 半导体发光元件及其制造方法
Kim et al. Fabrication of wide-bandgap transparent electrodes by using conductive filaments: Performance breakthrough in vertical-type GaN LED
Qi et al. Fabrication and characteristics of excellent current spreading GaN-based LED by using transparent electrode-insulator-semiconductor structure
CN103035787A (zh) 一种高亮度led芯片及其制造方法
KR101014339B1 (ko) 발광 효율이 향상된 질화물 발광 소자 및 그 제조 방법
CN202423370U (zh) 均匀电流分布led
CN105185881B (zh) 一种发光二极管及其制作方法
CN103824918A (zh) 均匀电流分布led
CN105742439B (zh) 半导体发光结构
Son et al. Improved optical and electrical properties of GaN-based micro light-emitting diode arrays
Park et al. Improving the output power of GaN-based light-emitting diode using Ag particles embedded within a SiO2 current blocking layer
CN210805813U (zh) 一种高可靠度的led芯片
Seo et al. Efficiency enhancement of nanorod green light emitting diodes employing silver nanowire-decorated graphene electrode as current spreading layer
Djavid et al. Tunnel injection InGaN/GaN dot-in-a-wire white-light-emitting diodes
Son et al. Thermally stable and conductive nickel-incorporated gallium oxide thin-film electrode for efficient GaN microscale light-emitting diode arrays
CN202384389U (zh) 均匀发光led
US9768359B2 (en) Semiconductor device, method for manufacturing same, light-emitting diode, and method for manufacturing same
CN103280499A (zh) 发光二极管芯片及其制造方法
TW201415665A (zh) 半導體發光元件及其製造方法
CN104465775B (zh) 基于陷阱产生机制的双漏区半导体器件其制造方法及应用
CN103872205B (zh) 均匀发光led

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C53 Correction of patent of invention or patent application
CB02 Change of applicant information

Address after: 215123 Suzhou Province Industrial Park, Jiangsu new road, No. 8

Applicant after: FOCUS LIGHTINGS TECHNOLOGY CO., LTD.

Address before: 215123 Suzhou Province Industrial Park, Jiangsu new road, No. 8

Applicant before: Focus Lightings Tech Inc.

COR Change of bibliographic data

Free format text: CORRECT: APPLICANT; FROM: FOCUS LIGHTING (SUZHOU) CO., LTD. TO: FOCUS LIGHINGS TECHNOLOGY CO., LTD.

C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20140528