CN103824743A - Deviation monitoring system, deviation monitoring method and plasma processing equipment - Google Patents
Deviation monitoring system, deviation monitoring method and plasma processing equipment Download PDFInfo
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- CN103824743A CN103824743A CN201210465432.0A CN201210465432A CN103824743A CN 103824743 A CN103824743 A CN 103824743A CN 201210465432 A CN201210465432 A CN 201210465432A CN 103824743 A CN103824743 A CN 103824743A
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Abstract
The invention provides a deviation monitoring system, a deviation monitoring method and a piece of plasma processing equipment. The deviation monitoring system is used for monitoring whether a processed work piece is in a standard operation area and a standard operation plane when being placed above a supporting unit, wherein the standard operation area is an area which is pre-arranged on a bearing surface of the supporting unit and used for placing the processed work piece, and the standard operation plane is a pre-arranged horizontal plane where the processed work piece is located when being lifted off the bearing surface of the supporting unit. The deviation monitoring system comprises a center deviation detection unit and a levelness deviation detection unit, wherein the center deviation detection unit is used for detecting the center deviation between the processed work piece and the center position of the standard operation area, and the levelness deviation detection unit is used for detecting the angle deviation between the processed work piece and the standard operation plane. According to the deviation monitoring system provided by the invention, the center deviation and the levelness deviation of the processed work piece can be detected without opening a reaction chamber, thus improving the processing efficiency of the plasma processing equipment.
Description
Technical field
The present invention relates to microelectronic processing technique field, particularly, relate to a kind of deviation monitoring system and deviation monitoring method, plasma processing device.
Background technology
Plasma processing device is the common equipment of processing semiconductor device, in the technical process of enforcement plasma etching (ETCH), physical vapour deposition (PVD) (PVD), chemical vapour deposition (CVD) (CVD) etc., plasma processing device is provided with electrostatic chuck conventionally in reaction chamber, in order to supporting, the workpiece to be machined such as fixing and heated chip.And, in order to realize the handling of the workpieces to be machined such as wafer, push pin device generally need to be set below electrostatic chuck, with cooperative mechanical hand, the workpieces to be machined such as wafer be passed to electrostatic chuck or remove from electrostatic chuck.
Fig. 1 is the structural representation of existing plasma processing device.Refer to Fig. 1, plasma processing device comprises reaction chamber 10 and transmission chamber 11.Wherein, in transmission chamber 11, be provided with manipulator 13, in order to transferring wafer 14 between reaction chamber 10 and transmission chamber 11; In reaction chamber 10, be provided with electrostatic chuck 15, and be shaped with dielectric ring 151 at the periphery wall cover of electrostatic chuck 15, and the upper surface of dielectric ring 151 is higher than the upper surface of electrostatic chuck 15, or mutually concordant with the upper surface of electrostatic chuck 15.Dielectric ring 151 adopts insulating material to make, in order to prevent that electrostatic chuck 15 is by the plasma etching in reaction chamber 10.In the time of implementing process, as shown in Figure 2, wafer 14 should be positioned on standard operation region.So-called standard operation region refers to the region of placement wafer 14 default on the upper surface of electrostatic chuck 15.In addition, below electrostatic chuck 15, be also provided with push pin device, the lifting drive motors 17 that it comprises at least three thimbles 16 and is attached thereto, under the driving of lifting drive motors 17, thimble 16 can pass electrostatic chuck 15, so that its top is higher or lower than the upper surface of electrostatic chuck 15.
The workflow that above-mentioned plasma processing device loads and unloads wafer 14 specifically comprises the following steps: referring to Fig. 3, is the FB(flow block) of plasma processing device loading and unloading wafer 14.Step 1, the top of manipulator 13 electrostatic chuck 15 in transmission chamber 11 transfers to reaction chamber 10 by wafer 14; Step 2, lifting drive motors 17 drives thimble 16 to rise, until the top of thimble 16 is higher than the upper surface of electrostatic chuck 15, thereby by wafer 14 jack-up; Step 3, unloaded manipulator 13 returns to transmission chamber 11, and the drive motors of lifting simultaneously 17 drives the thimble 16 that is loaded with wafer 14 to decline, until its top is lower than the upper surface of electrostatic chuck 15, thereby make wafer 14 be placed in the upper surface of electrostatic chuck 15, complete the loading of wafer 14; Step 4, starts wafer implementing process, and after technique completes, reaction chamber 10 is implemented to static release process; Step 5, lifting drive motors 17 drives thimble 16 to rise, so that its top is higher than the upper surface of electrostatic chuck 15, thereby by wafer 14 jack-up; Step 6, manipulator 13 moves in reaction chamber 10, and is held up from the below of wafer 14, and wafer 14 autoreaction chambers 10 are transferred in transmission chamber 11, completes the unloading of wafer 14.
Inevitably there is in actual applications following problem in above-mentioned plasma processing device:
One, in the process of manipulator 13 transferring wafers 14, manipulator 13 tends to occur it occurs deviation problem in the displacement in the radial direction of electrostatic chuck 15 because of the factor such as component ageing, loss, as shown in Fig. 4 a, this can cause wafer 14 in the time being passed to the upper surface of electrostatic chuck 15 by manipulator 13, and its center with respect to standard operation region produces centre deviation.This centre deviation can load and heat radiation generation harmful effect the radio frequency of wafer 14 when excessive, causes the yields of wafer 14 to reduce, and even can cause wafer 14 to scrap, thereby increase the production cost of plasma processing device.
They are two years old, in the process of loading and unloading wafer 14, thimble 16 tends to occur between the top of each thimble 16 not concordant problem mutually because of factors such as wearing and tearing, plasma etchings, as shown in Figure 4 b, this wafer 14 that can cause being placed on thimble 16 produces levelness deviation, that is: with standard operation face (the preset level face at wafer 14 places when, wafer 14 is pushed up the upper surface from electrostatic chuck 15 by thimble 16) between angular deviation.This levelness deviation may make manipulator 13 in the close process of wafer 14 because wafer 14 tilts to bump or scratches, thereby causing wafer 14 to damage even scraps, and then reduced the yields of wafer 14, increase the production cost of plasma processing device.
As from the foregoing, in the process of loading and unloading wafer 14, above-mentioned centre deviation and levelness deviation that wafer 14 occurs are even scrapped the damage that causes wafer 14 after acquiring a certain degree, thereby have reduced the yields of wafer 14, have increased the production cost of equipment.For this reason, only have and know in time above-mentioned centre deviation and levelness deviation, to take correspondingly to proofread and correct or the remedial measure such as shutdown maintenance, just can avoid equipment to continue wafer 14 to cause and damage or scrap.
But; due to above-mentioned plasma processing device cannot on-line monitoring wafer 14 centre deviation or levelness deviation; thereby operating personnel cannot be known above-mentioned deviation in time; and can only be by opening reaction chamber 10 and adopting the mode of artificial observation to know, thereby cannot be at wafer 14 damaged or scrap before take in time correspondingly to proofread and correct or the remedial measure such as shutdown maintenance.In addition, by opening reaction chamber 10 and adopting the mode of artificial observation to know the center displacement deviation and the levelness deviation of wafer 14, this has increased begins to speak, closes chamber and recover the links such as the required cavity environment of technique, this link often needs consuming time more than 4 hours, thereby increase the process time of plasma processing device, reduced the working (machining) efficiency of plasma processing device.
Summary of the invention
The present invention is intended at least solve one of technical problem existing in prior art, a kind of deviation monitoring system and deviation monitoring method, plasma processing device have been proposed, it just can detect centre deviation and the levelness deviation of workpiece to be machined without opening reaction chamber, thereby has improved the working (machining) efficiency of plasma processing device.
Provide a kind of deviation monitoring system for realizing object of the present invention, whether be used for monitoring workpiece to be machined at standard operation region and standard operation face, described standard operation region is the region of the described workpiece to be machined of placement default on the loading end of described support unit; The preset level face at described standard operation face its place when to be described workpiece to be machined pushed up the loading end from described support unit, it is characterized in that, described deviation monitoring system comprises centre deviation detecting unit and levelness deviation detecting unit, wherein, described centre deviation detecting unit is for detection of the centre deviation between described workpiece to be machined and the center in described standard operation region; Described levelness deviation detecting unit is for detection of the angular deviation between described workpiece to be machined and described standard operation face.
Wherein, described levelness deviation detecting unit comprises point source of light, the first detector and the first judging unit, and wherein, described point source of light is the point-like light perpendicular to described standard operation face towards described standard operation surface launching; Described the first detector is for receiving the point-like reverberation that is reflected described point-like light by described workpiece to be machined and form; The angular deviation of described the first judging unit based on workpiece to be machined described in the catoptrical position of described point-like and default standard point position judgment.
Wherein, the lasing light emitter that described point source of light is point-like; Described the first detector is CCD receiving system.
Wherein, in described the first judging unit, if the distance between the catoptrical position of described point-like and described standard point position is greater than default secure threshold, export the undesired signal of levelness deviation; If the distance between the catoptrical position of described point-like and described standard point position is less than or equal to default secure threshold, export levelness deviation normal signal.
Wherein, also comprise the first alarm unit, in order to send alarm in the time receiving the undesired signal of levelness deviation of described the first judging unit output.
Wherein, described centre deviation detecting unit comprises linear light source, the second detector and the second judging unit, and wherein, described linear light source is the Line of light perpendicular to described standard operation region towards the transmitting of described standard operation region; Described the second detector is for receiving the linear reflection light that is reflected described Line of light by described workpiece to be machined and/or described support unit and form; The length of the length of described the second judging unit based on described linear reflection light and default standard line segment judges the centre deviation of described workpiece to be machined.
Wherein, described linear light source comprises X-axis linear light source and Y-axis linear light source, described the second detector comprises and described X-axis linear light source and Y-axis linear light source X-axis detector and Y-axis detector one to one, wherein, described X-axis linear light source is the X-axis Line of light perpendicular to described standard operation region towards the transmitting of described standard operation region, described Y-axis linear light source is the Y-axis Line of light perpendicular to described standard operation region towards the transmitting of described standard operation region, described X-axis Line of light and Y-axis Line of light are along the radially setting in described standard operation region, and mutually vertical, and one end of described X-axis Line of light is radiated on described standard operation region, the other end is radiated on described support unit, one end of described Y-axis Line of light is radiated on described standard operation region, and the other end is radiated on described support unit, described X-axis detector is for receiving the X-axis linear reflection light that is reflected described X-axis Line of light by described workpiece to be machined and/or described support unit and form, described Y-axis detector is for receiving the Y-axis linear reflection light that is reflected described Y-axis Line of light by described workpiece to be machined and/or described support unit and form, the length of the length of described the second judging unit based on described X-axis linear reflection light and default X-axis standard line segment judges the offset deviation of described workpiece to be machined in X-direction, and the length of length based on described Y-axis linear reflection light and default Y-axis standard line segment judges the offset deviation of described workpiece to be machined in Y direction.
Wherein, the length that described X-axis Line of light is radiated at respectively on described support unit and described standard operation region is more than or equal to 5mm separately; The length that described Y-axis Line of light is radiated at respectively on described support unit and described standard operation region is more than or equal to 5mm separately.
Wherein, the lasing light emitter that described linear light source is wire; Described the second detector is CCD receiving system.
Wherein, in described the second judging unit, if the difference of the length of the length of described linear reflection light and described standard line segment is greater than default secure threshold, the undesired signal of output center deviation; If the difference of the length of the length of described linear reflection light and described standard line segment is less than or equal to default secure threshold, output center deviation normal signal.
Wherein, also comprise the second alarm unit, in order to send alarm in the time receiving the undesired signal of centre deviation of described the second judging unit output.
Wherein, the length that described Line of light is radiated at respectively on described support unit and described standard operation region is more than or equal to 5mm separately.
As another technical scheme, the present invention also provides a kind of deviation monitoring method, and whether it is based on deviation monitoring system monitoring workpiece to be machined provided by the invention in standard operation face and standard operation region, and it comprises the following steps:
Step S10, detects the centre deviation between described workpiece to be machined and the center in described standard operation region;
Step S20, detects the angular deviation between described workpiece to be machined and described standard operation face;
Wherein, described standard operation region is the region of the described workpiece to be machined of placement default on the loading end of described support unit; The preset level face at described standard operation face its place when to be described workpiece to be machined pushed up the loading end from described support unit.
Wherein, step S10 is further comprising the steps of,
Step S11, the point-like light towards described standard operation surface launching perpendicular to described standard operation face;
Step S12, receives the point-like reverberation that is reflected described point-like light by described workpiece to be machined and form;
Step S13, based on the angular deviation of workpiece to be machined described in the catoptrical position of described point-like and default standard point position judgment.
Wherein, after step S13, also comprise step S14, in step S14, judge whether the angular deviation of described workpiece to be machined is greater than default secure threshold, if so, send alarm; If not, send the normal signal of angular deviation.
Wherein, step S20 is further comprising the steps of,
Step S21, the Line of light towards the transmitting of described standard operation region perpendicular to described standard operation region;
Step S22, receives the linear reflection light that is reflected described Line of light by described workpiece to be machined and/or described support unit and form;
Step S23, the length of the length based on described linear reflection light and default standard line segment judges the centre deviation of described workpiece to be machined.
Wherein, after step S23, also comprise step S24, in step S24, judge whether the centre deviation of described workpiece to be machined is greater than default secure threshold, if so, send alarm, and termination process; If not, send the normal signal of centre deviation.
Wherein, in step S21, described Line of light comprises X-axis Line of light and Y-axis Line of light, described X-axis Line of light and Y-axis Line of light are along the radially setting of described standard operation face, and mutually vertical, and one end of described X-axis Line of light is radiated on described standard operation region, and the other end is radiated on described support unit; One end of described Y-axis Line of light is radiated on described standard operation region, and the other end is radiated on described support unit; In step S22, receive respectively the X-axis linear reflection light that is reflected described X-axis Line of light by described workpiece to be machined and/or described support unit and form, and reflect described Y-axis Line of light and the Y-axis linear reflection light that forms; In step S23, the length of the length based on described X-axis linear reflection light and default X-axis standard line segment judges the offset deviation of described workpiece to be machined in X-direction, and the length of length based on described Y-axis linear reflection light and default Y-axis standard line segment judges the offset deviation of described workpiece to be machined in Y direction.
As another kind of technical scheme, the present invention also provides a kind of plasma processing device, and it comprises reaction chamber, and described reaction chamber comprises support unit and deviation monitoring system, and wherein, described support unit is used for carrying workpiece to be machined; When described deviation monitoring system is placed in the top of support unit for monitoring workpiece to be machined, whether at standard operation region and standard operation face, described standard operation region is the region of the described workpiece to be machined of placement default on the loading end of described support unit; The preset level face at described standard operation face its place when to be described workpiece to be machined pushed up the loading end from described support unit, described deviation monitoring system has adopted above-mentioned deviation monitoring system provided by the invention.
Wherein, described support unit comprises electrostatic chuck.
Wherein, on the periphery wall of described electrostatic chuck, cover is shaped with dielectric ring, and the upper surface of described dielectric ring is higher than the upper surface of described electrostatic chuck, or concordant with the upper surface of described electrostatic chuck.
Wherein, the top of described reaction chamber is provided with quartz window, and described levelness deviation detecting unit and/or described centre deviation detecting unit are positioned at the top of described quartz window.
The present invention has following beneficial effect:
Deviation monitoring system provided by the invention, it detects the centre deviation between workpiece to be machined and the center in standard operation region by centre deviation detecting unit, and detect the angular deviation between workpiece to be machined and standard operation face by levelness deviation detecting unit, can make operating personnel without centre deviation and the levelness deviation of opening reaction chamber and just can know workpiece to be machined, begin to speak, close chamber and recover the links such as the required cavity environment of technique thereby can save, and then can improve the working (machining) efficiency of plasma processing device.
Deviation monitoring method provided by the invention, it is by detecting the centre deviation between workpiece to be machined and the center in standard operation region, and angular deviation between workpiece to be machined and standard operation face, can make operating personnel without centre deviation and the levelness deviation of opening reaction chamber and just can know workpiece to be machined, begin to speak, close chamber and recover the links such as the required cavity environment of technique thereby can save, and then can improve the working (machining) efficiency of plasma processing device.
Plasma processing device provided by the invention, it is by adopting above-mentioned deviation monitoring system provided by the invention, can make operating personnel without centre deviation and the levelness deviation of opening reaction chamber and just can know workpiece to be machined, begin to speak, close chamber and recover the links such as the required cavity environment of technique thereby can save, and then can improve the working (machining) efficiency of plasma processing device.
Accompanying drawing explanation
Fig. 1 is the structural representation of existing plasma processing device;
Fig. 2 is the position view of wafer while being positioned at the standard operation face of electrostatic chuck upper surface;
Fig. 3 is the FB(flow block) of existing plasma processing device loading and unloading wafer;
Position view when Fig. 4 a is wafer generation centre deviation;
Position view when Fig. 4 b is wafer generation levelness deviation;
Fig. 5 a is the structural representation of the levelness detecting unit of deviation monitoring system provided by the invention;
Fig. 5 b is the catoptrical position view of point-like while there is levelness deviation between workpiece to be machined and standard operation face in Fig. 5 a;
Fig. 6 a is the structural representation of the centre deviation detecting unit of deviation monitoring system provided by the invention;
Fig. 6 b is the position view while there is centre deviation between workpiece to be machined and standard operation region in Fig. 6 a;
Fig. 6 c is the coordinate diagram of the linear reflection light of workpiece to be machined in the time of standard operation region in Fig. 6 a;
Fig. 6 d is the coordinate diagram of linear reflection light when workpiece to be machined produces centre deviation in Fig. 6 b; And
Fig. 7 is the structural representation of plasma processing device provided by the invention.
Embodiment
For making those skilled in the art understand better technical scheme of the present invention, below in conjunction with accompanying drawing, deviation monitoring system provided by the invention and deviation monitoring method, plasma processing device are described in detail.
When the deviation monitoring system that the present embodiment provides is placed in the top of support unit for monitoring workpiece to be machined whether at standard operation region and standard operation face.So-called standard operation region, refers to the region of placement workpiece to be machined default on the loading end of support unit; So-called standard operation face refers to the preset level face at its place when workpiece to be machined is pushed up the loading end from support unit.
Deviation monitoring system comprises centre deviation detecting unit and levelness deviation detecting unit.Wherein, centre deviation detecting unit is for detection of the centre deviation between workpiece to be machined and the center in standard operation region; Levelness deviation detecting unit is for detection of the angular deviation between workpiece to be machined and standard operation face.By centre deviation detecting unit and levelness deviation detecting unit, can make operating personnel without centre deviation and the levelness deviation of opening reaction chamber and just can know workpiece to be machined, begin to speak, close chamber and recover the links such as the required cavity environment of technique thereby can save, and then can improve the working (machining) efficiency of plasma processing device.
Respectively centre deviation detecting unit and levelness deviation detecting unit are described in detail below.
The structural representation of the levelness detecting unit that particularly, Fig. 5 a is deviation monitoring system provided by the invention.Fig. 5 b is the catoptrical position view of point-like while there is levelness deviation between workpiece to be machined and standard operation face in Fig. 5 a.See also Fig. 5 a and Fig. 5 b, levelness deviation detecting unit comprises point source of light 22, the first detector 23 and the first judging unit (not shown).Wherein, point source of light 22 can be the lasing light emitter of the point-like such as infrared light or ultraviolet light, it is the point-like light 221 perpendicular to standard operation face 21 towards standard operation Mian21 center transmitting, and be standard point position by the set positions that point source of light 22 is launched launch point 222 places of this point-like light 221.Easily understand, if workpiece to be machined 26 on standard operation face 21, that is, does not exist angular deviation between workpiece to be machined 26 and standard operation face 21, reflect point-like light 221 by workpiece to be machined 26 and the point-like reverberation 231 that forms will overlap with launch point 222; If workpiece to be machined 26 produces levelness deviation,, between workpiece to be machined 26 and standard operation face 21, there is angular deviation, as shown in Figure 5 b, reflect point-like light 221 and the point-like reverberation 231 that forms will depart from launch point 222 by workpiece to be machined 26, and the distance d that point-like reverberation 231 departs from launch point 222 is larger, angular deviation is larger, thereby levelness deviation is larger.Therefore, the size that can depart from the distance d of launch point 222 according to point-like reverberation 231 is calculated the angular deviation between workpiece to be machined 26 and standard operation face 21, can obtain the levelness deviation of workpiece to be machined 26.In addition, can also be according to point-like reverberation 231 the position judgment workpiece to be machined 26 on the horizontal plane at launch point 222 places with respect to the incline direction of standard operation face 21.
The first detector 23 can be CCD receiving system, reflects point-like light 221 and the point-like reverberation 231 that forms, and is converted into the signal of telecommunication, and be sent to the first judging unit in order to receive by workpiece to be machined 26.
The position of the first judging unit based on point-like reverberation 231 and default standard point position (, the position at launch point 222 places of point source of light 22 these point-like light 221 of transmitting) judge the angular deviation of workpiece to be machined 26.Particularly, if when point-like reverberation 231 will overlap with launch point 222, judge between workpiece to be machined 26 and standard operation face 21 and do not have angular deviation; If when point-like reverberation 231 departs from launch point 222, judge between workpiece to be machined 26 and standard operation face 21 and have angular deviation.
In addition, can also set in advance and guarantee under the up-to-standard prerequisite of workpiece to be machined 26, the maximum that allows the angular deviation between workpiece to be machined 26 and standard operation face 21 to reach, the maximum (hereinafter to be referred as levelness deviation secure threshold) that the distance d that, allows point-like reverberation 231 to depart from launch point 222 reaches.In this case, if departing from the distance d of launch point 222, point-like reverberation 231 is greater than levelness deviation secure threshold, the undesired signal of the first judging unit output levelness deviation.And; levelness deviation detecting unit can also comprise the first alarm unit (not shown); in order to send alarm in the time receiving the undesired signal of levelness deviation of the first judging unit output; now operating personnel can take correspondingly to proofread and correct or the remedial measure such as shutdown maintenance according to warning in time; to avoid appearance because of the excessive problem that causes workpiece to be machined 26 to damage or scrap of levelness deviation, thereby improve the yields of workpiece to be machined 26.
If point-like reverberation 231 departs from the distance d of launch point 222 and is less than or equal to levelness deviation secure threshold, the first judging unit output levelness deviation normal signal, now operating personnel can select to continue workpiece to be machined 26 implementing process, thereby can improve the working (machining) efficiency of plasma processing device.
It should be noted that, in the present embodiment, point source of light 22 is the point-like light 221 perpendicular to standard operation face 21 towards the transmitting of standard operation Mian21 center, but the present invention is not limited thereto, in actual applications, point source of light can be towards the optional position transmitting of standard operation face the point-like light perpendicular to standard operation face, and the set positions of correspondingly point source of light being launched to the launch point place of this point-like light is standard point position.This distance that can depart from launch point according to point-like reverberation is equally calculated the angular deviation between workpiece to be machined and standard operation face, can obtain the levelness deviation of workpiece to be machined.
Also it should be noted that, although in the present embodiment, only set in advance a levelness deviation secure threshold, but the present invention is not limited thereto, in actual applications, two above and vary in size levelness deviation secure thresholds can also be set, this can divide multiple grades by the levelness deviation of workpiece to be machined, thereby accuracy of detection that not only can degree of improving the standard deviation detecting unit, can also make operating personnel take correspondingly remedial measure according to the grade of the levelness deviation of workpiece to be machined.
Fig. 6 a is the structural representation of the centre deviation detecting unit of deviation monitoring system provided by the invention.Fig. 6 b is the position view while there is centre deviation between workpiece to be machined and standard operation region in Fig. 6 a.See also Fig. 6 a and Fig. 6 b, centre deviation detecting unit comprises linear light source, the second detector and the second judging unit.Wherein, linear light source can be the lasing light emitter of the wire such as infrared light or ultraviolet light, in order to launch the Line of light perpendicular to standard operation region 30 towards standard operation region 30.In the present embodiment, linear light source comprises X-axis linear light source 32 and Y-axis linear light source 31.X-axis linear light source 32 is for launching the X-axis Line of light 321 perpendicular to standard operation region 30 towards standard operation region 30, Y-axis linear light source 31 is for launching the Y-axis Line of light 311 perpendicular to standard operation region 30 towards standard operation region 30, and X-axis Line of light 321 and the radially setting of Y-axis Line of light 311 along standard operation region 30, and mutually vertical.And one end of X-axis Line of light 321 is radiated on standard operation region 30, the other end is radiated on the loading end 201 of support unit 20; One end of Y-axis Line of light 311 is radiated on standard operation region 30, and the other end is radiated on the loading end 201 of support unit 20.
The second detector can be CCD receiving system, reflects Line of light and the linear reflection light that forms in order to receive by workpiece to be machined 26 and/or loading end 201.In the present embodiment, the second detector comprises and X-axis linear light source 32 and Y-axis linear light source 31 X-axis detector (not shown) and Y-axis detector (not shown) one to one.Wherein, X-axis detector reflects X-axis Line of light 321 and the X-axis linear reflection light that forms for receiving by workpiece to be machined 26 and/or loading end 201; Y-axis detector reflects Y-axis Line of light and the Y-axis linear reflection light that forms for receiving by workpiece to be machined 26 and/or loading end 201.
The length of the length of the second judging unit based on linear reflection light and default standard line segment judges between workpiece to be machined 26 and standard operation region 30 whether have centre deviation.In the present embodiment, the length of the length of the second judging unit based on X-axis linear reflection light and default X-axis standard line segment judges the offset deviation of workpiece to be machined 26 in X-direction, and the length of length based on Y-axis linear reflection light and default Y-axis standard line segment judges the offset deviation of workpiece to be machined 26 in Y direction.The length of so-called X-axis standard line segment and the length of Y-axis standard line segment, refer to when workpiece to be machined 26 is on standard operation region 30,, while there is not centre deviation between workpiece to be machined 26 and standard operation region 26, reflect respectively X-axis Line of light 321 and Y-axis Line of light 311 and the X-axis linear reflection light that forms and the length of Y-axis linear reflection light by workpiece to be machined 26 and loading end 201.
Below the principle that adopts centre deviation detecting unit to detect the centre deviation between workpiece to be machined 26 and standard operation region 30 is described in detail.
Particularly, the light intensity that reflects the linear reflection light that Line of light forms due to the light intensity that is reflected the linear reflection light that Line of light forms by workpiece to be machined 26 and carried face 201 is different, thereby can with this judge linear reflection light or one of them line segment in wire reverberation be by workpiece to be machined 26 reflect and come or reflect and come by loading end 201, can calculate the length of the linear reflection light that corresponds respectively to workpiece to be machined 26 and loading end 201.And, due in the time producing centre deviation between workpiece to be machined 26 and standard operation region 30, by workpiece to be machined 26 reflect and the length of linear reflection light come by different from the length of the standard line segment corresponding to workpiece to be machined 26, and by loading end 201 reflect and the length of linear reflection light come by different from the length of the standard line segment corresponding to loading end 201, thereby receive and reflect by workpiece to be machined 26 and/or loading end 201 the linear reflection light coming by the second detector, and send it to the second judging unit; And calculate the length of the linear reflection light that corresponds respectively to workpiece to be machined 26 and/or loading end 201 by the second judging unit, and corresponding to the length of the linear reflection light of workpiece to be machined 26 and/or loading end 201 difference respectively and between the length of corresponding standard line segment, can obtain the centre deviation between workpiece to be machined 26 and standard operation region 30.
For example, Fig. 6 c is the coordinate diagram of the linear reflection light of workpiece to be machined in the time of standard operation region in Fig. 6 a.See also Fig. 6 a and Fig. 6 c, when workpiece to be machined 26 is on standard operation region 30, that is, while there is not centre deviation between workpiece to be machined 26 and standard operation region 26, the length of supposing to be radiated at the X-axis Line of light 321 on workpiece to be machined 26 is X1; The length that is radiated at the X-axis Line of light 321 on loading end 201 is X2; And X1+X2=X, X is the total length of X-axis Line of light 321; And the length that is radiated at the Y-axis Line of light 311 on workpiece to be machined 26 is Y1; The length that is radiated at the Y-axis Line of light 311 on loading end 201 is Y2; And Y1+Y2=Y, Y is the total length of Y-axis Line of light 311.In this case, what X-axis detector received reflects X-axis Line of light 321 and the length of the X-axis linear reflection light that forms is X1 by workpiece to be machined 26, and carried face 201 reflects X-axis Line of light 321 and the length of X-axis linear reflection light that forms is X2, and X1+X2=X,, the total length of X-axis linear reflection light equals the total length of X-axis Line of light 321; What Y-axis detector received reflects Y-axis Line of light 311 and the length of the Y-axis linear reflection light that forms is Y1 by workpiece to be machined 26, and carried face 201 reflects Y-axis Line of light 311 and the length of Y-axis linear reflection light that forms is Y2, and Y1+Y2=Y,, the total length of Y-axis linear reflection light equals the total length of Y-axis Line of light 311.Now be respectively X1 and Y1 corresponding to the length of X-axis standard line segment and the length of Y-axis standard line segment of workpiece to be machined 26; The length of X-axis standard line segment and the length of Y-axis standard line segment corresponding to loading end 201 are respectively X2 and Y2.
Fig. 6 d is the coordinate diagram of linear reflection light when workpiece to be machined produces centre deviation in Fig. 6 b.See also Fig. 6 d and Fig. 6 b, in the time there is centre deviation between workpiece to be machined 26 and standard operation region 30, what X-axis detector received reflects X-axis Line of light 321 and the length of the X-axis linear reflection light that forms is X1 ' by workpiece to be machined 26, and carried face 201 reflects X-axis Line of light 321 and the length of X-axis linear reflection light that forms is X2 ', X1 ' ≠ X1, X2 ' ≠ X2; And X1 '+X2 '=X, that is, the total length of X-axis linear reflection light is constant all the time; What Y-axis detector received reflects Y-axis Line of light 311 and the length of the Y-axis linear reflection light that forms is Y1 ' by workpiece to be machined 26, and carried face 201 reflects Y-axis Line of light 311 and the length of Y-axis linear reflection light that forms is Y2 ', Y1 ' ≠ Y1, Y2 ' ≠ Y2; And Y1 '+Y2 '=Y, that is, the total length of Y-axis linear reflection light is constant all the time.In this case, the second judging unit reflects the length of the X-axis linear reflection light that X-axis Line of light 321 forms and corresponding to the difference between the length of the X-axis standard line segment of workpiece to be machined 26 by calculating by workpiece to be machined 26, that is, and and X1-X1 '; Carried face 201 reflects X-axis Line of light 321 and the length of the X-axis linear reflection light that forms and corresponding to the difference between the length of the X-axis standard line segment of loading end 201, that is, and and X2-X2 '; Reflect Y-axis Line of light 311 and the length of the Y-axis linear reflection light that forms and corresponding to the difference between the length of the Y-axis standard line segment of workpiece to be machined 26 by workpiece to be machined 26, that is, and Y1-Y1 '; And, carried face 201 reflects Y-axis Line of light 311 and the length of the Y-axis linear reflection light that forms and corresponding to the difference between the length of the Y-axis standard line segment of loading end 201,, Y2-Y2 ', can obtain the centre deviation between workpiece to be machined 26 and standard operation region 30.And, can be according to the positive negative judgement workpiece to be machined 26 of above-mentioned difference the direction of displacement with respect to standard operation region 30.
In addition, can rule of thumb determine the center of maximum deviation that 26 of workpieces to be machined can reach, and select X-axis Line of light 321 and Y-axis Line of light 311 to be radiated at respectively the length on loading end 201 and standard operation region 30 according to determined center of maximum deviation, with guarantee when workpiece to be machined 26 be placed on loading end 201 may in optional position time, the two ends of X-axis Line of light 321 are radiated at respectively on workpiece to be machined 26 and loading end 201 all the time; The two ends of Y-axis Line of light 311 are radiated at respectively on workpiece to be machined 26 and loading end 201 all the time, to avoid occurring that the length because X-axis Line of light 321 and Y-axis Line of light 311 are radiated at respectively on loading end 201 and standard operation region 30 falls short of, and the two ends that cause X-axis Line of light 321 are only radiated on workpiece to be machined 26 or loading end 201, thereby cause centre deviation detecting unit the problem of the change in displacement that workpiece to be machined 26 produces respectively in X-axis and Y direction cannot be detected, thereby can improve the accuracy of detection of centre deviation detecting unit.Preferably, the length that X-axis Line of light 321 is radiated at respectively on loading end 201 and standard operation region 30 is more than or equal to 5mm separately; The length that Y-axis Line of light 311 is radiated at respectively on loading end 201 and standard operation region 30 is more than or equal to 5mm separately.
In addition, can also set in advance and guarantee under the up-to-standard prerequisite of workpiece to be machined 26, the maximum (hereinafter to be referred as centre deviation secure threshold) that allows the centre deviation between workpiece to be machined 26 and standard operation region 30 to reach.In the present embodiment, centre deviation secure threshold comprises X-axis secure threshold and Y-axis secure threshold.Wherein, if reflect X-axis Line of light 321 and the length of the X-axis linear reflection light that forms and corresponding to the absolute value of the difference between the length of the X-axis standard line segment of workpiece to be machined 26 by workpiece to be machined 26,, | X1-X1 ' | be greater than X-axis secure threshold, and carried face 201 reflects Y-axis Line of light 311 and the length of the Y-axis linear reflection light that forms and corresponding to the absolute value of the difference between the length of the Y-axis standard line segment of loading end 201,, | Y1-Y1 ' | be greater than Y-axis secure threshold, the undesired signal of the second judging unit output center deviation.And; centre deviation detecting unit also comprises the second alarm unit (not shown); in order to send alarm in the time receiving the undesired signal of centre deviation of the second judging unit output; now operating personnel can take correspondingly to proofread and correct or the remedial measure such as shutdown maintenance according to warning in time; to avoid occurring causing because centre deviation is excessive, the radio frequency of workpiece to be machined 26 is loaded and heat radiation generation harmful effect; cause the yields of workpiece to be machined 26 to reduce, the problem that even can cause workpiece to be machined 26 to scrap.
If | X1-X1 ' | be less than or equal to X-axis secure threshold, and | Y1-Y1 ' | be less than or equal to Y-axis secure threshold, the second judging unit output center deviation normal signal, now operating personnel can select to continue workpiece to be machined 26 implementing process, thereby can improve the working (machining) efficiency of plasma processing device.
It should be noted that, although in the present embodiment, only set in advance a centre deviation secure threshold, but the present invention is not limited thereto, in actual applications, two above and vary in size centre deviation secure thresholds can also be set, this can divide multiple grades by the centre deviation of workpiece to be machined, thereby not only can improve the accuracy of detection of centre deviation, can also make operating personnel take correspondingly remedial measure according to the grade of the centre deviation of workpiece to be machined.
Also it should be noted that, in the present embodiment, X-axis Line of light 321 is mutually vertical with Y-axis Line of light 311.But the present invention is not limited thereto, in actual applications, the angle between X-axis Line of light 321 and Y-axis Line of light 311 can be also acute angle or obtuse angle.
And although in the present embodiment, one end of X-axis Line of light 321 is radiated on standard operation region 30, the other end is radiated on the loading end 201 of support unit 20; One end of Y-axis Line of light 311 is radiated on standard operation region 30, and the other end is radiated on the loading end 201 of support unit 20.But the present invention is not limited thereto, in actual applications, X-axis Line of light 321 and/or Y-axis Line of light 311 also can only be radiated on standard operation region 30.
Further it should be noted that, although in the present embodiment, linear light source comprises two linear light sources, that is: X-axis linear light source 32 and Y-axis linear light source 31, but the present invention is not limited thereto, in actual applications, the quantity of linear light source can also be more than two, and the Line of light that each linear light source is radiated on standard operation region 30 does not overlap.
As another technical scheme, the present invention also provides a kind of deviation monitoring method, and whether the deviation monitoring system monitoring workpiece to be machined that it provides based on the present embodiment is at standard operation region and standard operation face, and it comprises the following steps:
Step S10, detects the centre deviation between workpiece to be machined and the center in standard operation region;
Step S20, detects the angular deviation between workpiece to be machined and standard operation face.
So-called standard operation region, refers to the region of placement workpiece to be machined default on the loading end of support unit; So-called standard operation face refers to the preset level face at its place when workpiece to be machined is pushed up the loading end from support unit.
Detect the centre deviation between workpiece to be machined and the center in standard operation region by centre deviation detecting unit, and detect the angular deviation between workpiece to be machined and standard operation face by levelness deviation detecting unit, can make operating personnel without centre deviation and the levelness deviation of opening reaction chamber and just can know workpiece to be machined, begin to speak, close chamber and recover the links such as the required cavity environment of technique thereby can save, and then can improve the working (machining) efficiency of plasma processing device.
In the present embodiment, step S10 is further comprising the steps of:
Step S11, the point-like light towards standard operation surface launching perpendicular to standard operation face;
Step S12, receives the point-like reverberation being formed by workpiece to be machined reflection point-like light;
Step S13, based on the angular deviation of the catoptrical position of point-like and default standard point position judgment workpiece to be machined.
Step S14, judges whether the angular deviation of workpiece to be machined is greater than default levelness deviation secure threshold, if so, sends alarm; If not, send the normal signal of angular deviation.
In the present embodiment, step S20 is further comprising the steps of:
Step S21, the Line of light towards the transmitting of standard operation region perpendicular to standard operation region.In step S21, Line of light comprises X-axis Line of light and Y-axis Line of light, and X-axis Line of light and Y-axis Line of light be along the radially setting of standard operation face, and mutually vertical, and one end of X-axis Line of light is radiated on standard operation region, and the other end is radiated on support unit; One end of Y-axis Line of light is radiated on standard operation region, and the other end is radiated on support unit.
Step S22, receives the linear reflection light being formed by workpiece to be machined and/or support unit reflection Line of light.In step S22, receive respectively by workpiece to be machined and/or support unit and reflect described X-axis Line of light and the X-axis linear reflection light that forms, and reflection Y-axis Line of light and the Y-axis linear reflection light that forms.
Step S23, the length of the length based on linear reflection light and default standard line segment judges the centre deviation of workpiece to be machined.In step S23, the length of the length based on X-axis linear reflection light and default X-axis standard line segment judges the offset deviation of workpiece to be machined in X-direction, and the length of length based on Y-axis linear reflection light and default Y-axis standard line segment judges the offset deviation of workpiece to be machined in Y direction.
Step S24, judges whether the centre deviation of workpiece to be machined is greater than default centre deviation secure threshold, if so, sends alarm termination process; If not, send the normal signal of centre deviation.
In sum, the deviation monitoring method that the present embodiment provides, it is by detecting the centre deviation between workpiece to be machined and the center of standard operation face, and angular deviation between workpiece to be machined and standard operation face, can make operating personnel without centre deviation and the levelness deviation of opening reaction chamber and just can know workpiece to be machined, begin to speak, close chamber and recover the links such as the required cavity environment of technique thereby can save, and then can improve the working (machining) efficiency of plasma processing device.
As another technical scheme, the present invention also provides a kind of plasma processing device, as shown in Figure 7, is the structural representation of plasma processing device provided by the invention.Plasma processing device comprises reaction chamber 40, and reaction chamber 40 comprises support unit 20 and deviation monitoring system 47.Wherein, support unit 20 is for carrying workpiece to be machined 26, in the present embodiment, support unit 20 is electrostatic chuck, and cover is shaped with dielectric ring 46 on the periphery wall of electrostatic chuck, it adopts insulating material to make, in order to prevent that electrostatic chuck is by the plasma etching in reaction chamber 40.And the upper surface of dielectric ring 46 is higher than the upper surface of electrostatic chuck, or concordant with the upper surface of electric chuck.
In actual applications, because standard operation region 30 is positioned at the inside of dielectric ring 46, and the external diameter in standard operation region 30 is slightly less than the internal diameter of dielectric ring 46, thereby can make one end of the Line of light perpendicular to standard operation region 30 that linear light source launches towards standard operation region 30 be positioned on standard operation region 30, the other end is positioned on dielectric ring 46, and now the second detector can receive by workpiece to be machined 26, support unit 20 and/or dielectric ring 46 and reflect Line of light and the linear reflection light that forms.Because the light intensity that is reflected the linear reflection light coming by workpiece to be machined 26, support unit 20 and dielectric ring 46 is all different, this length that can make equally the linear reflection light that the second judging unit can come based on being reflected by workpiece to be machined 26, support unit 20 and/or dielectric ring 46 judges between workpiece to be machined 26 and standard operation region 30 whether have centre deviation with the length of accordingly default standard line segment.
In addition, be provided with quartz window 41 at the top of reaction chamber 40, deviation monitoring system 47 is positioned at the top of this quartz window 41, in order to see through quartz window 41 towards workpiece to be machined 26 Emission Lasers, thus when monitoring workpiece to be machined 26 is placed in the top of support unit 20 whether at standard operation region and standard operation face.In the process of implementing process, because deviation monitoring system 47 is positioned at the top of this quartz window 41,, be positioned at the outside of reaction chamber 40, thereby the monitoring system 47 of can guarding against deviations is corroded by the plasma processing device in reaction chamber 40, thereby improve the useful life of deviation monitoring system 47, and then reduced the use cost of plasma processing device.
In the present embodiment, below support unit 20, be provided with push pin device, push pin device comprises at least three thimbles 44 and the lifting drive source 45 being connected with thimble 44, under the driving of lifting drive source 45, thimble 44 can pass support unit 20, so that its top is higher or lower than the loading end of support unit 20, thereby by the loading end jack-up of workpiece to be machined 26 self-supporting unit 20, or be positioned over the loading end of support unit 20.When workpiece to be machined 26 is during by the loading end jack-up of thimble 44 self-supporting unit 20, can detect the centre deviation between workpiece to be machined 26 and the center of standard operation face by the levelness deviation detecting unit of deviation monitoring system 47, the preset level face at this standard operation face its place when to be workpiece to be machined 26 pushed up the loading end from support unit 20.
In sum, the plasma processing device that the present embodiment provides, it is by the above-mentioned deviation monitoring system that adopts the present embodiment to provide, can make operating personnel without centre deviation and the levelness deviation of opening reaction chamber and just can know workpiece to be machined, begin to speak, close chamber and recover the links such as the required cavity environment of technique thereby can save, and then can improve the working (machining) efficiency of plasma processing device.
Be understandable that, above execution mode is only used to principle of the present invention is described and the illustrative embodiments that adopts, but the present invention is not limited thereto.For those skilled in the art, without departing from the spirit and substance in the present invention, can make various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.
Claims (22)
1. a deviation monitoring system, for whether monitoring workpiece to be machined at standard operation region and standard operation face, described standard operation region is the region of the described workpiece to be machined of placement default on the loading end of described support unit; The preset level face at described standard operation face its place when to be described workpiece to be machined pushed up the loading end from described support unit, is characterized in that, described deviation monitoring system comprises centre deviation detecting unit and levelness deviation detecting unit, wherein,
Described centre deviation detecting unit is for detection of the centre deviation between described workpiece to be machined and the center in described standard operation region;
Described levelness deviation detecting unit is for detection of the angular deviation between described workpiece to be machined and described standard operation face.
2. deviation monitoring system according to claim 1, is characterized in that, described levelness deviation detecting unit comprises point source of light, the first detector and the first judging unit, wherein,
Described point source of light is the point-like light perpendicular to described standard operation face towards described standard operation surface launching;
Described the first detector is for receiving the point-like reverberation that is reflected described point-like light by described workpiece to be machined and form;
The angular deviation of described the first judging unit based on workpiece to be machined described in the catoptrical position of described point-like and default standard point position judgment.
3. deviation monitoring system according to claim 2, is characterized in that, the lasing light emitter that described point source of light is point-like; Described the first detector is CCD receiving system.
4. deviation monitoring system according to claim 2, it is characterized in that, in described the first judging unit, if the distance between the catoptrical position of described point-like and described standard point position is greater than default secure threshold, export the undesired signal of levelness deviation; If the distance between the catoptrical position of described point-like and described standard point position is less than or equal to default secure threshold, export levelness deviation normal signal.
5. deviation monitoring system according to claim 4, is characterized in that, also comprises the first alarm unit, in order to send alarm in the time receiving the undesired signal of levelness deviation of described the first judging unit output.
6. deviation monitoring system according to claim 1, is characterized in that, described centre deviation detecting unit comprises linear light source, the second detector and the second judging unit, wherein,
Described linear light source is the Line of light perpendicular to described standard operation region towards the transmitting of described standard operation region;
Described the second detector is for receiving the linear reflection light that is reflected described Line of light by described workpiece to be machined and/or described support unit and form;
The length of the length of described the second judging unit based on described linear reflection light and default standard line segment judges the centre deviation of described workpiece to be machined.
7. deviation monitoring system according to claim 6, it is characterized in that, described linear light source comprises X-axis linear light source and Y-axis linear light source, and described the second detector comprises and described X-axis linear light source and Y-axis linear light source X-axis detector and Y-axis detector one to one, wherein
Described X-axis linear light source is the X-axis Line of light perpendicular to described standard operation region towards the transmitting of described standard operation region, described Y-axis linear light source is the Y-axis Line of light perpendicular to described standard operation region towards the transmitting of described standard operation region, described X-axis Line of light and Y-axis Line of light are along the radially setting in described standard operation region, and mutually vertical, and one end of described X-axis Line of light is radiated on described standard operation region, and the other end is radiated on described support unit; One end of described Y-axis Line of light is radiated on described standard operation region, and the other end is radiated on described support unit;
Described X-axis detector is for receiving the X-axis linear reflection light that is reflected described X-axis Line of light by described workpiece to be machined and/or described support unit and form; Described Y-axis detector is for receiving the Y-axis linear reflection light that is reflected described Y-axis Line of light by described workpiece to be machined and/or described support unit and form;
The length of the length of described the second judging unit based on described X-axis linear reflection light and default X-axis standard line segment judges the offset deviation of described workpiece to be machined in X-direction, and the length of length based on described Y-axis linear reflection light and default Y-axis standard line segment judges the offset deviation of described workpiece to be machined in Y direction.
8. deviation monitoring system according to claim 7, is characterized in that, the length that described X-axis Line of light is radiated at respectively on described support unit and described standard operation region is more than or equal to 5mm separately;
The length that described Y-axis Line of light is radiated at respectively on described support unit and described standard operation region is more than or equal to 5mm separately.
9. deviation monitoring system according to claim 6, is characterized in that, the lasing light emitter that described linear light source is wire; Described the second detector is CCD receiving system.
10. deviation monitoring system according to claim 6, is characterized in that, in described the second judging unit, if the difference of the length of the length of described linear reflection light and described standard line segment is greater than default secure threshold, and the undesired signal of output center deviation; If the difference of the length of the length of described linear reflection light and described standard line segment is less than or equal to default secure threshold, output center deviation normal signal.
11. deviation monitoring systems according to claim 10, is characterized in that, also comprise the second alarm unit, in order to send alarm in the time receiving the undesired signal of centre deviation of described the second judging unit output.
12. deviation monitoring systems according to claim 6, is characterized in that, the length that described Line of light is radiated at respectively on described support unit and described standard operation region is more than or equal to 5mm separately.
13. 1 kinds of deviation monitoring methods, is characterized in that, whether its deviation monitoring system monitoring workpiece to be machined based on described in claim 1-12 any one is in standard operation face and standard operation region, and it comprises the following steps:
Step S10, detects the centre deviation between described workpiece to be machined and the center in described standard operation region;
Step S20, detects the angular deviation between described workpiece to be machined and described standard operation face;
Wherein, described standard operation region is the region of the described workpiece to be machined of placement default on the loading end of described support unit; The preset level face at described standard operation face its place when to be described workpiece to be machined pushed up the loading end from described support unit.
14. deviation monitoring methods according to claim 13, is characterized in that, step S10 is further comprising the steps of,
Step S11, the point-like light towards described standard operation surface launching perpendicular to described standard operation face;
Step S12, receives the point-like reverberation that is reflected described point-like light by described workpiece to be machined and form;
Step S13, based on the angular deviation of workpiece to be machined described in the catoptrical position of described point-like and default standard point position judgment.
15. deviation monitoring methods according to claim 14, is characterized in that, after step S13, also comprise step S14,
In step S14, judge whether the angular deviation of described workpiece to be machined is greater than default secure threshold, if so, send alarm; If not, send the normal signal of angular deviation.
16. deviation monitoring methods according to claim 13, is characterized in that, step S20 is further comprising the steps of,
Step S21, the Line of light towards the transmitting of described standard operation region perpendicular to described standard operation region;
Step S22, receives the linear reflection light that is reflected described Line of light by described workpiece to be machined and/or described support unit and form;
Step S23, the length of the length based on described linear reflection light and default standard line segment judges the centre deviation of described workpiece to be machined.
17. deviation monitoring methods according to claim 16, is characterized in that, after step S23, also comprise step S24,
In step S24, judge whether the centre deviation of described workpiece to be machined is greater than default secure threshold, if so, send alarm, and termination process; If not, send the normal signal of centre deviation.
18. deviation monitoring methods according to claim 16, it is characterized in that, in step S21, described Line of light comprises X-axis Line of light and Y-axis Line of light, described X-axis Line of light and Y-axis Line of light are along the radially setting of described standard operation face, and mutually vertical, and one end of described X-axis Line of light is radiated on described standard operation region, and the other end is radiated on described support unit; One end of described Y-axis Line of light is radiated on described standard operation region, and the other end is radiated on described support unit;
In step S22, receive respectively the X-axis linear reflection light that is reflected described X-axis Line of light by described workpiece to be machined and/or described support unit and form, and reflect described Y-axis Line of light and the Y-axis linear reflection light that forms;
In step S23, the length of the length based on described X-axis linear reflection light and default X-axis standard line segment judges the offset deviation of described workpiece to be machined in X-direction, and the length of length based on described Y-axis linear reflection light and default Y-axis standard line segment judges the offset deviation of described workpiece to be machined in Y direction.
19. 1 kinds of plasma processing devices, it comprises reaction chamber, and described reaction chamber comprises support unit and deviation monitoring system, and wherein, described support unit is used for carrying workpiece to be machined; When described deviation monitoring system is placed in the top of support unit for monitoring workpiece to be machined, whether at standard operation region and standard operation face, described standard operation region is the region of the described workpiece to be machined of placement default on the loading end of described support unit; The preset level face at described standard operation face its place when to be described workpiece to be machined pushed up the loading end from described support unit, is characterized in that, described deviation monitoring system adopts the deviation monitoring system described in claim 1-12 any one.
20. plasma processing devices according to claim 19, is characterized in that, described support unit comprises electrostatic chuck.
21. plasma processing devices according to claim 20, it is characterized in that, on the periphery wall of described electrostatic chuck, cover is shaped with dielectric ring, and the upper surface of described dielectric ring is higher than the upper surface of described electrostatic chuck, or concordant with the upper surface of described electrostatic chuck.
22. plasma processing devices according to claim 19, is characterized in that, the top of described reaction chamber is provided with quartz window, and described levelness deviation detecting unit and/or described centre deviation detecting unit are positioned at the top of described quartz window.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108511377A (en) * | 2018-06-06 | 2018-09-07 | 广东工业大学 | A kind of detecting system of more equipment room cooperation deviations |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1934692A (en) * | 2004-03-18 | 2007-03-21 | 东京毅力科创株式会社 | Method for detecting transfer shift of transfer mechanism and semiconductor processing equipment |
| US20090027657A1 (en) * | 2007-07-27 | 2009-01-29 | Applied Materials, Inc. | Method and apparatus for verifying proper substrate positioning |
| CN101461053A (en) * | 2006-09-05 | 2009-06-17 | 东京毅力科创株式会社 | Substrate position determining method, substrate position detecting method, and substrate collecting method |
| CN101740447A (en) * | 2008-11-19 | 2010-06-16 | 东京毅力科创株式会社 | Substrate position detection apparatus, substrate position detection method, film forming apparatus and film forming method |
| US20100158644A1 (en) * | 2008-12-22 | 2010-06-24 | Asm Japan K.K. | Semiconductor-processing apparatus equipped with robot diagnostic module |
| CN101911277A (en) * | 2007-12-27 | 2010-12-08 | 朗姆研究公司 | Arrangements and methods for determining positions and offsets |
-
2012
- 2012-11-16 CN CN201210465432.0A patent/CN103824743B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1934692A (en) * | 2004-03-18 | 2007-03-21 | 东京毅力科创株式会社 | Method for detecting transfer shift of transfer mechanism and semiconductor processing equipment |
| CN101461053A (en) * | 2006-09-05 | 2009-06-17 | 东京毅力科创株式会社 | Substrate position determining method, substrate position detecting method, and substrate collecting method |
| US20090027657A1 (en) * | 2007-07-27 | 2009-01-29 | Applied Materials, Inc. | Method and apparatus for verifying proper substrate positioning |
| CN101911277A (en) * | 2007-12-27 | 2010-12-08 | 朗姆研究公司 | Arrangements and methods for determining positions and offsets |
| CN101740447A (en) * | 2008-11-19 | 2010-06-16 | 东京毅力科创株式会社 | Substrate position detection apparatus, substrate position detection method, film forming apparatus and film forming method |
| US20100158644A1 (en) * | 2008-12-22 | 2010-06-24 | Asm Japan K.K. | Semiconductor-processing apparatus equipped with robot diagnostic module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108511377A (en) * | 2018-06-06 | 2018-09-07 | 广东工业大学 | A kind of detecting system of more equipment room cooperation deviations |
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|---|---|
| CN103824743B (en) | 2016-08-31 |
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