CN103824743B - Deviation monitoring system and deviation monitoring method, plasma processing device - Google Patents
Deviation monitoring system and deviation monitoring method, plasma processing device Download PDFInfo
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- CN103824743B CN103824743B CN201210465432.0A CN201210465432A CN103824743B CN 103824743 B CN103824743 B CN 103824743B CN 201210465432 A CN201210465432 A CN 201210465432A CN 103824743 B CN103824743 B CN 103824743B
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Abstract
The present invention provides a kind of deviation monitoring system and deviation monitoring method, plasma processing device, whether deviation monitoring system is for monitoring when workpiece to be machined is placed in the top of support unit in standard operation region and standard operation face, and standard operation region is the region placing workpiece to be machined preset on the loading end of support unit；Standard operation face the is workpiece to be machined preset level face at its place when being lifted off the loading end of support unit；Deviation monitoring system includes centre deviation detector unit and levelness separate-blas estimation unit, wherein, centre deviation detector unit centre deviation between the center detecting workpiece to be machined and standard operation region；Levelness separate-blas estimation unit is for detecting the angular deviation between workpiece to be machined and standard operation face.The deviation monitoring system that the present invention provides, it just can detect centre deviation and the levelness deviation of workpiece to be machined, thus improve the working (machining) efficiency of plasma processing device without opening reaction chamber.
Description
Technical field
The present invention relates to microelectronic processing technique field, in particular it relates to a kind of deviation monitoring is
System and deviation monitoring method, plasma processing device.
Background technology
Plasma processing device be processing semiconductor device common equipment, implement wait from
Daughter etching (ETCH), physical vapour deposition (PVD) (PVD), chemical gaseous phase deposition (CVD)
Deng technical process in, plasma processing device is generally provided with electrostatic card in reaction chamber
Dish, in order to support, fixes and adds the workpieces to be machined such as thermal bimorph.And, in order to realize crystalline substance
The handling of the workpieces to be machined such as sheet, it is generally required to arrange push pin device in the lower section of electrostatic chuck,
With cooperative mechanical hands, the workpieces to be machined such as wafer are transferred to electrostatic chuck or from electrostatic chuck
Remove.
Fig. 1 is the structural representation of existing plasma processing device.Refer to Fig. 1, etc.
Plasma processing apparatus includes reaction chamber 10 and transmission chamber 11.Wherein, at transmission chamber
Mechanical hand 13 it is provided with, in order to transmit between reaction chamber 10 and transmission chamber 11 in 11
Wafer 14；Electrostatic chuck 15 it is provided with in reaction chamber 10, and at electrostatic chuck 15
Periphery wall set be shaped with dielectric ring 151, and the upper surface of dielectric ring 151 is higher than electrostatic chuck 15
Upper surface, or with the upper surface flush of electrostatic chuck 15.Dielectric ring 151 uses insulation
Material makes, in order to prevent electrostatic chuck 15 by the plasma etching in reaction chamber 10.
When implementing process, as in figure 2 it is shown, wafer 14 should be positioned on standard operation region.So-called
Standard operation region refers to the district placing wafer 14 preset on the upper surface of electrostatic chuck 15
Territory.Additionally, be additionally provided with push pin device in the lower section of electrostatic chuck 15, it includes at least three
Individual thimble 16 and the lifting being attached thereto drive motor 17, drive motor 17 in lifting
Under driving, thimble 16 can pass electrostatic chuck 15, so that its top is higher or lower than electrostatic
The upper surface of chuck 15.
The workflow that wafer 14 is loaded and unloaded by above-mentioned plasma processing device specifically includes
Following steps: refer to Fig. 3, for the flow chart element of plasma processing device loading and unloading wafer 14
Figure.Step 1, wafer 14 is transmitted to reaction chamber 10 by mechanical hand 13 from transmission chamber 11
The top of interior electrostatic chuck 15；Step 2, lifting drives motor 17 to drive on thimble 16
Rise, until the top of thimble 16 is higher than the upper surface of electrostatic chuck 15, thus by wafer 14
Jack-up；Step 3, unloaded mechanical hand 13 returns transmission chamber 11, and lifting simultaneously drives electricity
Machine 17 drives the thimble 16 being loaded with wafer 14 to decline, until its top is less than electrostatic chuck 15
Upper surface so that wafer 14 is placed in the upper surface of electrostatic chuck 15, i.e. complete wafer
The loading of 14；Step 4, starts wafer implementing process, and after technique completes, to reaction
Chamber 10 implements Electro-static Driven Comb technique；Step 5, lifting drives motor 17 to drive thimble 16
Rise, so that its top is higher than the upper surface of electrostatic chuck 15, thus by wafer 14 jack-up；
Step 6, mechanical hand 13 moves in reaction chamber 10, and is held in the palm from the lower section of wafer 14
Rise, and wafer 14 autoreaction chamber 10 is transmitted to transmission chamber 11, i.e. complete wafer
The unloading of 14.
Above-mentioned plasma processing device is inevitably present following asking in actual applications
Topic:
One, during mechanical hand 13 transferring wafer 14, mechanical hand 13 is old because of element
The factors such as change, loss often occur it to go out in the displacement in the radial direction of electrostatic chuck 15
The problem of existing deviation, as shown in fig. 4 a, this can cause wafer 14 being transmitted by mechanical hand 13
During to the upper surface of electrostatic chuck 15, it produces relative to the center in standard operation region
Centre deviation.This centre deviation can load the radio frequency of wafer 14 when excessive and heat radiation produces
Harmful effect, causes the yields of wafer 14 to reduce, wafer 14 even can be caused to scrap, from
And add the production cost of plasma processing device.
Its two, during loading and unloading wafer 14, thimble 16 is rotten because of abrasion, plasma
Often there is problem the most concordant between the top of each thimble 16 in the factors such as erosion, as
Shown in Fig. 4 b, this can cause the wafer 14 being placed on thimble 16 to produce levelness deviation, it may be assumed that
With standard operation face (that is, when wafer 14 is lifted off the upper surface of electrostatic chuck 15 by thimble 16
The preset level face at wafer 14 place) between angular deviation.This levelness deviation may
Make mechanical hand 13 to wafer 14 near during collide because wafer 14 tilts or
Scratch, thus cause wafer 14 to damage and even scrap, and then reduce the yields of wafer 14,
Add the production cost of plasma processing device.
From the foregoing, it will be observed that during loading and unloading wafer 14, the above-mentioned center that wafer 14 occurs
Deviation and levelness deviation are even reported in the damage reaching to will result in the most afterwards wafer 14
Useless, thus reduce the yields of wafer 14, add the production cost of equipment.To this end,
Know above-mentioned centre deviation and levelness deviation the most in time, to take correspondingly to correct or stop
The remedial measures such as machine maintenance, the equipment that is just avoided that continues wafer 14 causes damage or scraps.
But, owing to above-mentioned plasma processing device cannot the center of on-line monitoring wafer 14
Deviation or levelness deviation, thus operator cannot know above-mentioned deviation in time, and can only
Know by the way of opening reaction chamber 10 and using artificial observation, thus cannot be at crystalline substance
Sheet 14 is damaged or takes in time before scrapping correspondingly to correct or shutdown maintenance etc. is remedied and arranged
Execute.Additionally, know wafer by the way of opening reaction chamber 10 and using artificial observation
The center displacement deviation of 14 and levelness deviation, which increase begin to speak, close chamber and recover work
The links such as the cavity environment needed for skill, this link generally requires time-consuming more than 4 hours, thus
Add the process time of plasma processing device, reduce adding of plasma processing device
Work efficiency rate.
Summary of the invention
It is contemplated that at least solve one of technical problem present in prior art, it is proposed that one
Planting deviation monitoring system and deviation monitoring method, plasma processing device, it is anti-without opening
Answer chamber just can detect centre deviation and the levelness deviation of workpiece to be machined, thus improve
The working (machining) efficiency of plasma processing device.
A kind of deviation monitoring system is provided for realizing the purpose of the present invention, is used for monitoring processed
Whether workpiece is in standard operation region and standard operation face, and described standard operation region is described
The region placing described workpiece to be machined preset on the loading end of support unit；Described standard is made
Industry face is described workpiece to be machined when being lifted off the loading end of described support unit its place pre-
If horizontal plane, it is characterised in that described deviation monitoring system include centre deviation detector unit and
Levelness separate-blas estimation unit, wherein, described centre deviation detector unit is used for detecting described quilt
Centre deviation between processing workpiece and the center in described standard operation region；Described level
Degree separate-blas estimation unit is for detecting between described workpiece to be machined and described standard operation face
Angular deviation.
Wherein, described levelness separate-blas estimation unit include point source of light, the first detector and
First judging unit, wherein, described point source of light is perpendicular to towards described standard operation surface launching
The point-like light in described standard operation face；Described first detector is for receiving by described processed work
The point-shaped reflection light that part reflects described point-like light and formed；Described first judging unit is based on described
The angle of workpiece to be machined described in the position of point-shaped reflection light and default standard point position judgment
Deviation.
Wherein, described point source of light is the lasing light emitter of point-like；Described first detector is CCD
Receive device.
Wherein, in described first judging unit, if the position of described point-shaped reflection light and institute
State the distance between standard point position and be more than the secure threshold preset, then output level degree deviation is not
Normal signal；If the distance between the position of described point-shaped reflection light and described standard point position is little
In or equal to preset secure threshold, then output level degree deviation normal signal.
Wherein, also include the first alarm unit, in order to receive described first judging unit defeated
Alarm is sent during the abnormal signal of levelness deviation gone out.
Wherein, described centre deviation detector unit includes linear light source, the second detector and
Two judging units, wherein, described linear light source is perpendicular to towards described standard operation field emission
The Line of light in described standard operation region；Described second detector is for receiving by described processed
The linear reflection light that workpiece and/or described support unit reflect described Line of light and formed；Described
Second judging unit length based on described linear reflection light and the length of default standard line segment
Judge the centre deviation of described workpiece to be machined.
Wherein, described linear light source includes X-axis linear light source and Y-axis linear light source, described
Second detector includes and described X-axis linear light source and Y-axis linear light source X one to one
Axle detector and Y-axis detector, wherein, described X-axis linear light source is made towards described standard
Industry field emission is perpendicular to the X-axis Line of light in described standard operation region, described Y-axis wire
Light source is perpendicular to the Y-axis line in described standard operation region towards described standard operation field emission
Shape light, described X-axis Line of light sets along the radial direction in described standard operation region with Y-axis Line of light
Put, and be mutually perpendicular to, and one end of described X-axis Line of light is radiated at described standard operation
On region, the other end is radiated on described support unit；One end of described Y-axis Line of light is shone
Penetrating on described standard operation region, the other end is radiated on described support unit；Described X
Axle detector is reflected described X for receiving by described workpiece to be machined and/or described support unit
Axle Line of light and the X-axis linear reflection light that formed；Described Y-axis detector is for receiving by institute
The Y-axis stating workpiece to be machined and/or the described support unit described Y-axis Line of light of reflection and formed
Linear reflection light；Described second judging unit length based on described X-axis linear reflection light with
The length of the X-axis standard line segment preset judges described workpiece to be machined position in the X-axis direction
Move deviation, and length based on described Y-axis linear reflection light with preset Y-axis normal line
The length of section judges described workpiece to be machined offset deviation in the Y-axis direction.
Wherein, described X-axis Line of light is radiated at described support unit respectively and described standard is made
Length on industry region is each greater than equal to 5mm；Described Y-axis Line of light is radiated at institute respectively
State the length on support unit and described standard operation region each greater than equal to 5mm.
Wherein, described linear light source is the lasing light emitter of wire；Described second detector is CCD
Receive device.
Wherein, in described second judging unit, if the length of described linear reflection light and institute
The difference of the length stating standard line segment is more than the secure threshold preset, then output center deviation is abnormal
Signal；If the difference of the length of the length of described linear reflection light and described standard line segment less than or etc.
In default secure threshold, then output center deviation normal signal.
Wherein, also include the second alarm unit, in order to receive described second judging unit defeated
Alarm is sent during the abnormal signal of centre deviation gone out.
Wherein, described Line of light is radiated at described support unit and described standard operation district respectively
Length on territory is each greater than equal to 5mm.
As another technical scheme, the present invention also provides for a kind of deviation monitoring method, its based on
Whether the deviation monitoring system monitoring workpiece to be machined that the present invention provides is at standard operation face and mark
Quasi-operating area, it comprises the following steps:
Step S10, detects the center of described workpiece to be machined and described standard operation region
Between centre deviation；
Step S20, detects the angle between described workpiece to be machined and described standard operation face inclined
Difference；
Wherein, described standard operation region is to preset on the loading end of described support unit
Place the region of described workpiece to be machined；Described standard operation face is that described workpiece to be machined is pushed up
The preset level face at its place when the loading end of described support unit.
Wherein, step S10 is further comprising the steps of,
Step S11, is perpendicular to the point in described standard operation face towards described standard operation surface launching
Shape light；
Step S12, receives the point-like being reflected described point-like light by described workpiece to be machined and formed
Reflection light；
Step S13, position based on described point-shaped reflection light and the standard point position judgment preset
The angular deviation of described workpiece to be machined.
Wherein, after step s 13, also include step S14, in step S14, sentence
Whether the angular deviation of disconnected described workpiece to be machined more than the secure threshold preset, is the most then sent out
Go out alarm；If it is not, then send the normal signal of angular deviation.
Wherein, step S20 is further comprising the steps of,
Step S21, is perpendicular to described standard operation region towards described standard operation field emission
Line of light；
Step S22, receives and is reflected described by described workpiece to be machined and/or described support unit
Line of light and the linear reflection light that formed；
Step S23, length based on described linear reflection light and the length of default standard line segment
Judge the centre deviation of described workpiece to be machined.
Wherein, after step S23, also include step S24, in step s 24, sentence
Whether the centre deviation of disconnected described workpiece to be machined more than the secure threshold preset, is the most then sent out
Go out alarm, and termination process；If it is not, then send the normal signal of centre deviation.
Wherein, in the step s 21, described Line of light includes X-axis Line of light and Y-axis wire
Light, described X-axis Line of light and Y-axis Line of light being radially arranged along described standard operation face,
And be mutually perpendicular to, and one end of described X-axis Line of light is radiated at described standard operation region
On, the other end is radiated on described support unit；One end of described Y-axis Line of light is radiated at
On described standard operation region, the other end is radiated on described support unit；In step S22
In, receive respectively and reflected described X-axis line by described workpiece to be machined and/or described support unit
Shape light and the X-axis linear reflection light that formed, and reflect described Y-axis Line of light and formed
Y-axis linear reflection light；In step S23, length based on described X-axis linear reflection light
Judge that described workpiece to be machined is in the X-axis direction with the length of default X-axis standard line segment
Offset deviation, and length based on described Y-axis linear reflection light with preset Y-axis standard
The length of line segment judges described workpiece to be machined offset deviation in the Y-axis direction.
As another kind of technical scheme, the present invention also provides for a kind of plasma processing device,
It includes that reaction chamber, described reaction chamber include support unit and deviation monitoring system, wherein,
Described support unit is used for carrying workpiece to be machined；Described deviation monitoring system is added for monitoring
Whether in standard operation region and standard operation face when work workpiece is placed in the top of support unit,
Described standard operation region is the described quilt of placement preset on the loading end of described support unit
The region of processing workpiece；Described standard operation face is that described workpiece to be machined is lifted off described support
The preset level face at its place during the loading end of unit, described deviation monitoring system have employed this
The above-mentioned deviation monitoring system of bright offer.
Wherein, described support unit includes electrostatic chuck.
Wherein, on the periphery wall of described electrostatic chuck, set is shaped with dielectric ring, and is given an account of
The upper surface of matter ring higher than the upper surface of described electrostatic chuck, or with the upper table of described electrostatic chuck
Face is concordant.
Wherein, the top of described reaction chamber is provided with quartz window, and described levelness deviation is examined
Survey unit and/or described centre deviation detector unit are positioned at the top of described quartz window.
The method have the advantages that
The deviation monitoring system that the present invention provides, it detects quilt by centre deviation detector unit
Centre deviation between processing workpiece and the center in standard operation region, and by level
Degree separate-blas estimation unit detects the angular deviation between workpiece to be machined and standard operation face, can
So that operator just can know the centre deviation of workpiece to be machined without opening reaction chamber
With levelness deviation, begin to speak such that it is able to save, close chamber and recover the chamber ring needed for technique
The links such as border, and then the working (machining) efficiency of plasma processing device can be improved.
The deviation monitoring method that the present invention provides, it is by detection workpiece to be machined and standard operation
Between centre deviation between the center in region, and workpiece to be machined and standard operation face
Angular deviation, operator can be made just can to know processed work without opening reaction chamber
The centre deviation of part and levelness deviation, such that it is able to save begin to speak, close chamber and recover technique
The links such as required cavity environment, so can improve plasma processing device add work efficiency
Rate.
The plasma processing device that the present invention provides, it is upper by use the present invention to provide
State deviation monitoring system, operator can be made just can to know added without opening reaction chamber
The centre deviation of work workpiece and levelness deviation, begin to speak such that it is able to save, close chamber and recovery
The links such as the cavity environment needed for technique, and then the processing of plasma processing device can be improved
Efficiency.
Accompanying drawing explanation
Fig. 1 is the structural representation of existing plasma processing device；
Fig. 2 be wafer be positioned at electrostatic chuck upper surface standard operation face time position view；
Fig. 3 is the FB(flow block) of existing plasma processing device loading and unloading wafer；
Fig. 4 a is position view during wafer generation centre deviation；
Fig. 4 b is position view during wafer generation levelness deviation；
The structure of the levelness detector unit of the deviation monitoring system that Fig. 5 a provides for the present invention is shown
It is intended to；
Fig. 5 b is to there is levelness deviation in Fig. 5 a between workpiece to be machined and standard operation face
Time point-shaped reflection light position view；
The structure of the centre deviation detector unit of the deviation monitoring system that Fig. 6 a provides for the present invention
Schematic diagram；
Fig. 6 b is to there is centre deviation between workpiece to be machined and standard operation region in Fig. 6 a
Time position view；
Fig. 6 c is the workpiece to be machined linear reflection light when standard operation region in Fig. 6 a
Coordinate diagram；
Fig. 6 d is the seat of linear reflection light during workpiece to be machined generation centre deviation in Fig. 6 b
Mark on a map；And
The structural representation of the plasma processing device that Fig. 7 provides for the present invention.
Detailed description of the invention
For making those skilled in the art be more fully understood that technical scheme, knot below
Close the accompanying drawing deviation monitoring system that provides the present invention and deviation monitoring method, plasma adds
Construction equipment is described in detail.
The deviation monitoring system that the present embodiment provides is used for monitoring workpiece to be machined and is placed in support
Whether in standard operation region and standard operation face during the top of unit.So-called standard operation district
Territory, refers to the region placing workpiece to be machined preset on the loading end of support unit；So-called
Standard operation face refers to the pre-of its place when workpiece to be machined is lifted off the loading end of support unit
If horizontal plane.
Deviation monitoring system includes centre deviation detector unit and levelness separate-blas estimation unit.
Wherein, centre deviation detector unit is for detecting the center of workpiece to be machined and standard operation region
Centre deviation between position；Levelness separate-blas estimation unit is used for detecting workpiece to be machined and mark
Angular deviation between the quasi-scope of operation.By centre deviation detector unit and levelness separate-blas estimation
Unit, can make operator just can know in workpiece to be machined without opening reaction chamber
Heart deviation and levelness deviation, begin to speak such that it is able to save, close chamber and recover needed for technique
The links such as cavity environment, and then the working (machining) efficiency of plasma processing device can be improved.
Separately below center separate-blas estimation unit and levelness separate-blas estimation unit are carried out in detail
Ground describes.
Specifically, the levelness detector unit of the deviation monitoring system that Fig. 5 a provides for the present invention
Structural representation.Fig. 5 b is to there is water between workpiece to be machined and standard operation face in Fig. 5 a
The position view of point-shaped reflection light during Pingdu deviation.See also Fig. 5 a and Fig. 5 b, water
Pingdu separate-blas estimation unit includes point source of light the 22, first detector 23 and the first judging unit
(not shown).Wherein, point source of light 22 can be the point-like such as infrared light or ultraviolet light
Lasing light emitter, it is perpendicular to standard operation face 21 towards the emission center in standard operation face 21
Point-like light 221, and point source of light 22 is launched launch point 222 institute of this point-like light 221
Position be set as standard point position.It is easy to understand, if workpiece to be machined 26 is made in standard
On industry face 21, i.e. there is not angle between workpiece to be machined 26 and standard operation face 21 inclined
Difference, then reflected point-like light 221 by workpiece to be machined 26 and the point-shaped reflection light 231 that formed will
Overlap with launch point 222；If workpiece to be machined 26 produces levelness deviation, i.e. processed
Angular deviation is there is, as shown in Figure 5 b, by being added between workpiece 26 and standard operation face 21
The point-shaped reflection light 231 that work workpiece 26 reflects point-like light 221 and formed will deviate from launch point
222, and point-shaped reflection light 231 to deviate distance d of launch point 222 the biggest, then angle is inclined
Difference is the biggest, thus levelness deviation is the biggest.Therefore, it can deviate according to point-shaped reflection light 231
The size of distance d of launch point 222 and calculate workpiece to be machined 26 and standard operation face 21
Between angular deviation, the levelness deviation of workpiece to be machined 26 can be obtained.Additionally, also
Can be according to the point-shaped reflection light 231 position judgment quilt on the horizontal plane at launch point 222 place
Processing workpiece 26 is relative to the incline direction in standard operation face 21.
First detector 23 can be that CCD receives device, in order to receive by workpiece to be machined
26 reflection point-like light 221 and the point-shaped reflection light 231 that formed, and it is converted into the signal of telecommunication,
And send to the first judging unit.
First judging unit position based on point-shaped reflection light 231 and the standard point position preset
(that is, point source of light 22 launches the position at launch point 222 place of this point-like light 221) sentences
The angular deviation of disconnected workpiece to be machined 26.Specifically, if point-shaped reflection light 231 will be with transmitting
During point 222 coincidence, then judge not exist between workpiece to be machined 26 and standard operation face 21 angle
Degree deviation；If point-shaped reflection light 231 deviates launch point 222, then judge workpiece to be machined
Angular deviation is there is between 26 and standard operation face 21.
Further, it is also possible to be set in advance in the up-to-standard premise ensureing workpiece to be machined 26
Under, it is allowed to the maximum that the angular deviation between workpiece to be machined 26 and standard operation face 21 reaches
Value, i.e. allow point-shaped reflection light 231 to deviate the maximum that distance d of launch point 222 reaches
(hereinafter referred to as levelness deviation secure threshold).In this case, if point-shaped reflection light
Distance d of 231 deviation launch points 222 is more than levelness deviation secure threshold, then first judges
The unit output level abnormal signal of degree deviation.And, levelness separate-blas estimation unit is all right
Including the first alarm unit (not shown), in order to receive the first judging unit output
Sending alarm during the abnormal signal of levelness deviation, now operator can be according to warning
Take in time correspondingly to correct or the remedial measure such as shutdown maintenance, to avoid the occurrence of because of levelness
The problem that deviation is excessive and causes workpiece to be machined 26 to damage or scrap, thus improve and added
The yields of work workpiece 26.
If point-shaped reflection light 231 deviates distance d of launch point 222 less than or equal to levelness
Deviation secure threshold, then the first judging unit output level degree deviation normal signal, now operates
Personnel can select to continue workpiece to be machined 26 implementing process, such that it is able to improve plasma
The working (machining) efficiency of body process equipment.
It should be noted that in the present embodiment, point source of light 22 is towards standard operation face 21
Emission center be perpendicular to the point-like light 221 in standard operation face 21, but the present invention not office
Being limited to this, in actual applications, point source of light can be sent out towards the optional position in standard operation face
Penetrate the point-like light being perpendicular to standard operation face, and correspondingly point source of light is launched this point-like light
The position at launch point place is set as standard point position.This is equally inclined according to point-shaped reflection light
The angular deviation between workpiece to be machined and standard operation face is calculated, i.e. from the distance of launch point
The levelness deviation of workpiece to be machined can be obtained.
Although also, it should be noted in the present embodiment, only pre-setting a level
Degree deviation secure threshold, but the invention is not limited in this, in actual applications, it is also possible to
Arranging two or more and the levelness deviation secure threshold varied in size, this can be by processed work
The levelness deviation of part divides multiple grades, thus is possible not only to degree of improving the standard separate-blas estimation list
Unit accuracy of detection, it is also possible to make operator according to the levelness deviation of workpiece to be machined etc.
Level takes correspondingly remedial measure.
The structure of the centre deviation detector unit of the deviation monitoring system that Fig. 6 a provides for the present invention
Schematic diagram.Fig. 6 b is to there is center deviation between workpiece to be machined and standard operation region in Fig. 6 a
Position view during difference.See also Fig. 6 a and Fig. 6 b, centre deviation detector unit bag
Include linear light source, the second detector and the second judging unit.Wherein, linear light source can be red
The lasing light emitter of the wire such as outer light or ultraviolet light, in order to launch vertically towards standard operation region 30
Line of light in standard operation region 30.In the present embodiment, linear light source includes X-axis line
Shape light source 32 and Y-axis linear light source 31.X-axis linear light source 32 is for towards standard operation
The X-axis Line of light 321 being perpendicular to standard operation region 30, Y-axis Line of light are launched in region 30
Source 31 is perpendicular to the Y-axis in standard operation region 30 towards standard operation region 30 for launching
Line of light 311, and X-axis Line of light 321 and Y-axis Line of light 311 are along standard operation district
Being radially arranged of territory 30, and be mutually perpendicular to.And, one end of X-axis Line of light 321 is irradiated
On standard operation region 30, the other end is radiated on the loading end 201 of support unit 20；
One end of Y-axis Line of light 311 is radiated on standard operation region 30, and the other end is radiated at and props up
On the loading end 201 of support unit 20.
Second detector can be that CCD receives device, in order to receive by workpiece to be machined 26
And/or the linear reflection light that loading end 201 reflects Line of light and formed.In the present embodiment,
Second detector includes with X-axis linear light source 32 and Y-axis linear light source 31 one to one
X-axis detector (not shown) and Y-axis detector (not shown).Wherein, X
Axle detector is reflected X-axis Line of light for receiving by workpiece to be machined 26 and/or loading end 201
321 and the X-axis linear reflection light that formed；Y-axis detector is for receiving by workpiece to be machined
26 and/or the loading end 201 Y-axis linear reflection light that reflects Y-axis Line of light and formed.
Second judging unit length based on linear reflection light and the length of default standard line segment
Judge whether there is centre deviation between workpiece to be machined 26 and standard operation region 30.At this
In embodiment, the second judging unit length based on X-axis linear reflection light and the X-axis preset
The length of standard line segment judges workpiece to be machined 26 offset deviation in the X-axis direction, and
Length based on Y-axis linear reflection light judges to be added with the length of the Y-axis standard line segment preset
Work workpiece 26 offset deviation in the Y-axis direction.The length of so-called X-axis standard line segment and Y
The length of axle standard line segment, refers to when workpiece to be machined 26 is on standard operation region 30, i.e.
When there is not centre deviation between workpiece to be machined 26 and standard operation region 26, by processed
Workpiece 26 and loading end 201 reflect X-axis Line of light 321 and Y-axis Line of light 311 respectively and
The X-axis linear reflection light formed and the length of Y-axis linear reflection light.
Below to using centre deviation detector unit detection workpiece to be machined 26 and standard operation district
The principle of the centre deviation between territory 30 is described in detail.
Specifically, the linear reflection light formed owing to being reflected Line of light by workpiece to be machined 26
Light intensity reflect Line of light from carried face 201 and the light intensity of linear reflection light that formed is different,
Thus can judge that linear reflection light or one of them line segment in linear reflection light are with this
That reflected by workpiece to be machined 26 or reflected by loading end 201, Ji Keji
Calculate the length of the linear reflection light corresponding respectively to workpiece to be machined 26 and loading end 201.
When being additionally, since between workpiece to be machined 26 and standard operation region 30 generation centre deviation,
The length of the linear reflection light reflected by workpiece to be machined 26 will with corresponding to processed work
The length of the standard line segment of part 26 is different, and the wire reflected by loading end 201 is anti-
Penetrate the length of light by different from the length of the standard line segment corresponding to loading end 201, thereby through
It is anti-that second detector receives the wire reflected by workpiece to be machined 26 and/or loading end 201
Penetrate light, and send it to the second judging unit；And calculated respectively by the second judging unit
Corresponding to the length of the linear reflection light of workpiece to be machined 26 and/or loading end 201 and right
Should in the length of the linear reflection light of workpiece to be machined 26 and/or loading end 201 respectively with accordingly
Standard line segment length between difference, workpiece to be machined 26 and standard operation can be obtained
Centre deviation between region 30.
Such as, during Fig. 6 c is Fig. 6 a, the workpiece to be machined wire when standard operation region is anti-
Penetrate the coordinate diagram of light.See also Fig. 6 a and Fig. 6 c, when workpiece to be machined 26 is in standard
On operating area 30, i.e. do not exist between workpiece to be machined 26 and standard operation region 26
During centre deviation, it is assumed that the length of the X-axis Line of light 321 being radiated on workpiece to be machined 26
For X1；The a length of X2 of the X-axis Line of light 321 being radiated on loading end 201；And
X1+X2=X, X are the total length of X-axis Line of light 321；Further, it is radiated at processed work
The a length of Y1 of the Y-axis Line of light 311 on part 26；It is radiated at the Y on loading end 201
The a length of Y2 of axle Line of light 311；And Y1+Y2=Y, Y are Y-axis Line of light 311
Total length.In this case, what X-axis detector was received is reflected by workpiece to be machined 26
X-axis Line of light 321 and a length of X1 of X-axis linear reflection light that formed, and carried
The a length of X2 of the X-axis linear reflection light that face 201 is reflected X-axis Line of light 321 and formed,
And X1+X2=X, i.e. the total length of X-axis linear reflection light is equal to X-axis Line of light 321
Total length；What Y-axis detector was received is reflected Y-axis Line of light 311 by workpiece to be machined 26
And a length of Y1 of the Y-axis linear reflection light formed, and carried face 201 reflects Y-axis
Line of light 311 and a length of Y2 of Y-axis linear reflection light that formed, and Y1+Y2=Y,
That is, the total length of Y-axis linear reflection light is equal to the total length of Y-axis Line of light 311.Now
The length of X-axis standard line segment and the length of Y-axis standard line segment corresponding to workpiece to be machined 26
It is respectively X1 and Y1；The length of X-axis standard line segment and Y-axis corresponding to loading end 201
The length of standard line segment is respectively X2 and Y2.
Fig. 6 d is the seat of linear reflection light during workpiece to be machined generation centre deviation in Fig. 6 b
Mark on a map.See also Fig. 6 d and Fig. 6 b, when workpiece to be machined 26 and standard operation region
When there is centre deviation between 30, what X-axis detector was received is reflected by workpiece to be machined 26
X-axis Line of light 321 and a length of X1 ' of X-axis linear reflection light that formed, and carried
The a length of X2 ' of the X-axis linear reflection light that face 201 is reflected X-axis Line of light 321 and formed,
X1’≠X1、X2’≠X2；And X1 '+X2 '=X, i.e. X-axis linear reflection light total
Length is the most constant；What Y-axis detector was received is reflected Y-axis wire by workpiece to be machined 26
Light 311 and a length of Y1 ' of Y-axis linear reflection light that formed, and carried face 201
The a length of Y2 ', Y1 ' of the Y-axis linear reflection light reflecting Y-axis Line of light 311 and formed
≠Y1、Y2’≠Y2；And Y1 '+Y2 '=Y, i.e. the total length of Y-axis linear reflection light
The most constant.In this case, the second judging unit is by calculating by workpiece to be machined 26
Reflection X-axis Line of light 321 and the length of X-axis linear reflection light that formed with correspond to be added
Difference between the length of the X-axis standard line segment of work workpiece 26, i.e. X1-X1 '；Carried
The length of the X-axis linear reflection light that face 201 is reflected X-axis Line of light 321 and formed is with corresponding
Difference between the length of the X-axis standard line segment of loading end 201, i.e. X2-X2 '；By
The length of the Y-axis linear reflection light that workpiece to be machined 26 reflects Y-axis Line of light 311 and formed
And corresponding to the difference between the length of the Y-axis standard line segment of workpiece to be machined 26, i.e.
Y1-Y1’；And, the Y-axis line that carried face 201 is reflected Y-axis Line of light 311 and formed
Shape reflection light length and corresponding to loading end 201 Y-axis standard line segment length between
Difference, i.e. Y2-Y2 ', can obtain between workpiece to be machined 26 and standard operation region 30
Centre deviation.Furthermore, it is possible to the positive negative judgement workpiece to be machined 26 according to above-mentioned difference is relative
Direction of displacement in standard operation region 30.
Furthermore, it is possible to the center of maximum that empirically determined workpiece to be machined 26 can reach is inclined
Difference, and according to determined by center of maximum deviation select X-axis Line of light 321 and Y-axis wire
Light 311 is radiated at the length on loading end 201 and standard operation region 30 respectively, to ensure
When workpiece to be machined 26 is placed in the optional position being likely to be on loading end 201, X
The two ends of axle Line of light 321 are radiated on workpiece to be machined 26 and loading end 201 the most respectively；
The two ends of Y-axis Line of light 311 are radiated at workpiece to be machined 26 and loading end 201 the most respectively
On, hold because X-axis Line of light 321 and Y-axis Line of light 311 are radiated at respectively to avoid the occurrence of
Length on section 201 and standard operation region 30 falls short of, and causes X-axis Line of light 321
Two ends be only radiated on workpiece to be machined 26 or loading end 201, thus cause centre deviation
Detector unit cannot detect what workpiece to be machined 26 produced respectively in X-axis and Y direction
The problem of change in displacement, such that it is able to improve the accuracy of detection of centre deviation detector unit.Preferably
Ground, X-axis Line of light 321 is radiated on loading end 201 and standard operation region 30 respectively
Length is each greater than equal to 5mm；Y-axis Line of light 311 is radiated at loading end 201 He respectively
Length on standard operation region 30 is each greater than equal to 5mm.
Further, it is also possible to be set in advance in the up-to-standard premise ensureing workpiece to be machined 26
Under, it is allowed to the centre deviation between workpiece to be machined 26 and standard operation region 30 reaches
Big value (hereinafter referred to as centre deviation secure threshold).In the present embodiment, centre deviation safety
Threshold value includes X-axis secure threshold and Y-axis secure threshold.Wherein, if by workpiece to be machined 26
Reflection X-axis Line of light 321 and the length of X-axis linear reflection light that formed with correspond to be added
The absolute value of the difference between the length of the X-axis standard line segment of work workpiece 26, i.e. | X1-X1 ' |
More than X-axis secure threshold, and the Y that carried face 201 is reflected Y-axis Line of light 311 and formed
The length of axle linear reflection light with corresponding to loading end 201 Y-axis standard line segment length it
Between the absolute value of difference, i.e. | Y1-Y1 ' | more than Y-axis secure threshold, then the second judging unit
The abnormal signal of output center deviation.And, centre deviation detector unit also includes the second warning
Unit (not shown), in order to the most just to receive the centre deviation of the second judging unit output
Sending alarm during regular signal, now operator can take corresponding in time according to warning
Ground correction or the remedial measure such as shutdown maintenance, with avoid the occurrence of cause because centre deviation is excessive right
The radio frequency of workpiece to be machined 26 loads and heat radiation produces harmful effect, causes workpiece to be machined 26
Yields reduce, even can cause the problem that workpiece to be machined 26 is scrapped.
If | X1-X1 ' | is less than or equal to X-axis secure threshold, and | Y1-Y1 ' | is less than or equal to Y-axis safety
Threshold value, then the second judging unit output center deviation normal signal, now operator can select
Select and continue workpiece to be machined 26 implementing process, such that it is able to improve plasma processing device
Working (machining) efficiency.
Although it should be noted that in the present embodiment, only pre-setting a center deviation
Difference secure threshold, but the invention is not limited in this, in actual applications, it is also possible to arrange
Two or more and the centre deviation secure threshold varied in size, this can be by workpiece to be machined
Heart deviation divides multiple grades, thus is possible not only to improve the accuracy of detection of centre deviation, also may be used
So that operator take correspondingly to remedy to arrange according to the grade of the centre deviation of workpiece to be machined
Execute.
Also, it should be noted in the present embodiment, X-axis Line of light 321 and Y-axis wire
Light 311 is mutually perpendicular to.But the invention is not limited in this, in actual applications, X-axis line
Angle between shape light 321 and Y-axis Line of light 311 can also be acute angle or obtuse angle.
And, although in the present embodiment, one end of X-axis Line of light 321 is radiated at standard
On operating area 30, the other end is radiated on the loading end 201 of support unit 20；Y-axis line
One end of shape light 311 is radiated on standard operation region 30, and the other end is radiated at support unit
On the loading end 201 of 20.But the invention is not limited in this, in actual applications, X
Axle Line of light 321 and/or Y-axis Line of light 311 can also only be radiated at standard operation region 30
On.
Need further exist for explanation be, although in the present embodiment, linear light source includes two
Linear light source, it may be assumed that X-axis linear light source 32 and Y-axis linear light source 31, but the present invention is also
Being not limited to this, in actual applications, the quantity of linear light source can also be two or more, and
The Line of light that each linear light source is radiated on standard operation region 30 is misaligned.
As another technical scheme, the present invention also provides for a kind of deviation monitoring method, its based on
Whether the deviation monitoring system monitoring workpiece to be machined that the present embodiment provides is in standard operation region
With standard operation face, it comprises the following steps:
Step S10, in detecting between workpiece to be machined and the center in standard operation region
Heart deviation；
Step S20, the angular deviation between detection workpiece to be machined and standard operation face.
So-called standard operation region, refers to the placement quilt preset on the loading end of support unit
The region of processing workpiece；So-called standard operation face refers to that workpiece to be machined is lifted off support unit
The preset level face at its place during loading end.
Center by centre deviation detector unit detection workpiece to be machined with standard operation region
Centre deviation between position, and detect processed work by levelness separate-blas estimation unit
Angular deviation between part and standard operation face, can make operator without opening reaction chamber
Just can know centre deviation and the levelness deviation of workpiece to be machined, such that it is able to save out
The links such as the cavity environment needed for chamber, chamber, pass and recovery technique, and then plasma can be improved
The working (machining) efficiency of body process equipment.
In the present embodiment, step S10 is further comprising the steps of:
Step S11, is perpendicular to the point-like light in standard operation face towards standard operation surface launching；
Step S12, receives the point-shaped reflection light formed by workpiece to be machined reflection point-like light；
Step S13, position based on point-shaped reflection light is added with the standard point position judgment preset
The angular deviation of work workpiece.
Step S14, it is judged that the angular deviation of workpiece to be machined is the most inclined more than the levelness preset
Difference secure threshold, the most then send alarm；If it is not, it is normal then to send angular deviation
Signal.
In the present embodiment, step S20 is further comprising the steps of:
Step S21, is perpendicular to the wire in standard operation region towards standard operation field emission
Light.In the step s 21, Line of light includes X-axis Line of light and Y-axis Line of light, X-axis line
Shape light and Y-axis Line of light being radially arranged along standard operation face, and be mutually perpendicular to, and X
One end of axle Line of light is radiated on standard operation region, and the other end is radiated on support unit；
One end of Y-axis Line of light is radiated on standard operation region, and the other end is radiated at support unit
On.
Step S22, receives and is reflected Line of light by workpiece to be machined and/or support unit and formed
Linear reflection light.In step S22, receive respectively by workpiece to be machined and/or support single
The X-axis linear reflection light that unit reflects described X-axis Line of light and formed, and reflection Y-axis line
Shape light and the Y-axis linear reflection light that formed.
Step S23, length based on linear reflection light judges with the length of the standard line segment preset
The centre deviation of workpiece to be machined.In step S23, length based on X-axis linear reflection light
Degree judges workpiece to be machined position in the X-axis direction with the length of the X-axis standard line segment preset
Move deviation, and length of based on Y-axis linear reflection light and the Y-axis standard line segment preset
Length judges workpiece to be machined offset deviation in the Y-axis direction.
Step S24, it is judged that whether the centre deviation of workpiece to be machined is more than the centre deviation preset
Secure threshold, the most then send alarm, and termination process；If it is not, then send center
The normal signal of deviation.
In sum, the deviation monitoring method that the present embodiment provides, it is by detecting processed work
Centre deviation between the center in part and standard operation face, and workpiece to be machined and standard
Angular deviation between the scope of operation, can make operator just can obtain without opening reaction chamber
Know centre deviation and the levelness deviation of workpiece to be machined, such that it is able to save begin to speak, close chamber with
And the link such as the cavity environment needed for recovery technique, and then plasma processing device can be improved
Working (machining) efficiency.
As another technical scheme, the present invention also provides for a kind of plasma processing device,
As it is shown in fig. 7, the structural representation of the plasma processing device provided for the present invention.Deng from
Daughter process equipment includes that reaction chamber 40, reaction chamber 40 include that support unit 20 is with inclined
Difference monitoring system 47.Wherein, support unit 20 is used for carrying workpiece to be machined 26, in this reality
Executing in example, support unit 20 is electrostatic chuck, and set system on the periphery wall of electrostatic chuck
Having dielectric ring 46, it uses insulant to make, in order to prevent electrostatic chuck by reaction chamber
Plasma etching in 40.Further, the upper surface of dielectric ring 46 is higher than the upper of electrostatic chuck
Surface, or concordant with the upper surface of electricity chuck.
In actual applications, owing to standard operation region 30 is positioned at the inside of dielectric ring 46,
And the external diameter in standard operation region 30 is slightly less than the internal diameter of dielectric ring 46, thus wire can be made
The Line of light being perpendicular to standard operation region 30 that light source is launched towards standard operation region 30
One end is positioned on standard operation region 30, and the other end is positioned on dielectric ring 46, now second visits
Survey device can receive by workpiece to be machined 26, support unit 20 and/or dielectric ring 46 reflected ray
Shape light and the linear reflection light that formed.Due to by workpiece to be machined 26, support unit 20 and Jie
The light intensity of the linear reflection light that matter ring 46 reflects is the most different, and this equally makes second to sentence
Disconnected unit can reflect based on by workpiece to be machined 26, support unit 20 and/or dielectric ring 46
And the length of the linear reflection light come and the length of corresponding default standard line segment and judge quilt
Whether centre deviation is there is between processing workpiece 26 and standard operation region 30.
Additionally, be provided with quartz window 41, deviation monitoring system at the top of reaction chamber 40
47 tops being positioned at this quartz window 41, in order to through quartz window 41 towards workpiece to be machined 26
Launch laser, thus whether monitor when workpiece to be machined 26 is placed in the top of support unit 20
In standard operation region and standard operation face.During implementing process, owing to deviation is monitored
System 47 is positioned at the top of this quartz window 41, i.e. be positioned at the outside of reaction chamber 40, because of
And it is possible to prevent deviation monitoring system 47 rotten by the plasma processing device in reaction chamber 40
Erosion, thus improve the service life of deviation monitoring system 47, and then reduce plasma
The use cost of process equipment.
In the present embodiment, being provided with push pin device in the lower section of support unit 20, thimble fills
Put and include that at least three thimble 44 and the lifting being connected with thimble 44 drive source 45, in lifting
Under the driving in driving source 45, thimble 44 can pass support unit 20, so that its top is high
Go out or be less than the loading end of support unit 20, thus by workpiece to be machined 26 self-supporting unit
The loading end jack-up of 20, or it is positioned over the loading end of support unit 20.When workpiece to be machined 26
During by the loading end jack-up of thimble 44 self-supporting unit 20, can be by deviation monitoring system
The levelness separate-blas estimation unit detection workpiece to be machined 26 of 47 and the centre bit in standard operation face
Centre deviation between putting, this standard operation face is that workpiece to be machined 26 is lifted off support unit
20 loading end time its place preset level face.
In sum, the plasma processing device that the present embodiment provides, it is by using this
The above-mentioned deviation monitoring system that embodiment provides, can make operator without opening reaction chamber
Just can know centre deviation and the levelness deviation of workpiece to be machined, such that it is able to save out
The links such as the cavity environment needed for chamber, chamber, pass and recovery technique, and then plasma can be improved
The working (machining) efficiency of body process equipment.
It is understood that the principle that is intended to be merely illustrative of the present of embodiment of above and
The illustrative embodiments used, but the invention is not limited in this.For in this area
For those of ordinary skill, without departing from the spirit and substance in the present invention, can do
Going out various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.
Claims (21)
1. a deviation monitoring system, is used for whether monitoring workpiece to be machined in standard operation district
Territory and standard operation face, described standard operation region is to preset on the loading end of support unit
Place the region of described workpiece to be machined；Described standard operation face is that described workpiece to be machined is pushed up
The preset level face at its place when the loading end of described support unit, it is characterised in that described
Deviation monitoring system includes centre deviation detector unit and levelness separate-blas estimation unit, wherein,
Described centre deviation detector unit is used for detecting described workpiece to be machined and makees with described standard
Centre deviation between the center in industry region；
Described levelness separate-blas estimation unit is used for detecting described workpiece to be machined and described standard
Angular deviation between the scope of operation, described levelness separate-blas estimation unit include point source of light,
One detector and the first judging unit, wherein,
Described point source of light is perpendicular to described standard operation face towards described standard operation surface launching
Point-like light；
Described first detector is for receiving by the described workpiece to be machined described point-like light of reflection
The point-shaped reflection light formed；
Described first judging unit position based on described point-shaped reflection light and the standard point preset
The angular deviation of workpiece to be machined described in position judgment.
Deviation monitoring system the most according to claim 1, it is characterised in that described point
Shape light source is the lasing light emitter of point-like；Described first detector is that CCD receives device.
Deviation monitoring system the most according to claim 1, it is characterised in that described
In first judging unit, if between the position of described point-shaped reflection light and described standard point position
Distance is more than the secure threshold preset, the then abnormal signal of output level degree deviation；If described point
Distance between position and the described standard point position of shape reflection light is less than or equal to the peace preset
Full threshold value, then output level degree deviation normal signal.
Deviation monitoring system the most according to claim 3, it is characterised in that also include
First alarm unit, in order to the most just to receive the levelness deviation of described first judging unit output
Alarm is sent during regular signal.
Deviation monitoring system the most according to claim 1, it is characterised in that in described
Heart separate-blas estimation unit includes linear light source, the second detector and the second judging unit, wherein,
Described linear light source is perpendicular to described standard operation towards described standard operation field emission
The Line of light in region；
Described second detector is for receiving by described workpiece to be machined and/or described support unit
The linear reflection light reflecting described Line of light and formed；
Described second judging unit length based on described linear reflection light and the normal line preset
The length of section judges the centre deviation of described workpiece to be machined.
Deviation monitoring system the most according to claim 5, it is characterised in that described line
Shape light source include X-axis linear light source and Y-axis linear light source, described second detector include with
Described X-axis linear light source and Y-axis linear light source X-axis detector one to one and Y-axis are visited
Survey device, wherein,
Described X-axis linear light source is perpendicular to described standard towards described standard operation field emission
The X-axis Line of light of operating area, described Y-axis linear light source is towards described standard operation region
Launch the Y-axis Line of light being perpendicular to described standard operation region, described X-axis Line of light and Y
Axle Line of light is radially arranged along described standard operation region, and is mutually perpendicular to, and described X
One end of axle Line of light is radiated on described standard operation region, and the other end is radiated at described support
On unit；One end of described Y-axis Line of light is radiated on described standard operation region, another
End is radiated on described support unit；
Described X-axis detector is for receiving by described workpiece to be machined and/or described support unit
The X-axis linear reflection light reflecting described X-axis Line of light and formed；Described Y-axis detector is used
In receiving by described workpiece to be machined and/or the described support unit described Y-axis Line of light of reflection
The Y-axis linear reflection light formed；
Described second judging unit length based on described X-axis linear reflection light and the X preset
The length of axle standard line segment judges described workpiece to be machined offset deviation in the X-axis direction,
And the length of length of based on described Y-axis linear reflection light and the Y-axis standard line segment preset
Judge described workpiece to be machined offset deviation in the Y-axis direction.
Deviation monitoring system the most according to claim 6, it is characterised in that described X
The length that axle Line of light is radiated on described support unit and described standard operation region respectively is each
From more than or equal to 5mm；
Described Y-axis Line of light is radiated at described support unit and described standard operation region respectively
On length each greater than equal to 5mm.
Deviation monitoring system the most according to claim 5, it is characterised in that described line
Shape light source is the lasing light emitter of wire；Described second detector is that CCD receives device.
Deviation monitoring system the most according to claim 5, it is characterised in that described
In second judging unit, if the length of the length of described linear reflection light and described standard line segment it
Difference is more than the secure threshold preset, the then abnormal signal of output center deviation；If described wire is anti-
The difference penetrating the length of light and the length of described standard line segment is less than or equal to default secure threshold,
Then output center deviation normal signal.
Deviation monitoring system the most according to claim 9, it is characterised in that also include
Second alarm unit, in order to abnormal at the centre deviation receiving described second judging unit output
Alarm is sent during signal.
11. deviation monitoring systems according to claim 5, it is characterised in that described line
The length that shape light is radiated on described support unit and described standard operation region respectively is each arrogant
In equal to 5mm.
12. 1 kinds of deviation monitoring methods, it is characterised in that it is appointed based on claim 1-11
Whether anticipate a described deviation monitoring system monitoring workpiece to be machined at standard operation face and mark
Quasi-operating area, it comprises the following steps:
Step S10, detects the center of described workpiece to be machined and described standard operation region
Between centre deviation；
Step S20, detects the angle between described workpiece to be machined and described standard operation face inclined
Difference；
Wherein, described standard operation region is to preset on the loading end of described support unit
Place the region of described workpiece to be machined；Described standard operation face is that described workpiece to be machined is pushed up
The preset level face at its place when the loading end of described support unit.
13. deviation monitoring methods according to claim 12, it is characterised in that step
S10 is further comprising the steps of,
Step S11, is perpendicular to the point in described standard operation face towards described standard operation surface launching
Shape light；
Step S12, receives the point-like being reflected described point-like light by described workpiece to be machined and formed
Reflection light；
Step S13, position based on described point-shaped reflection light and the standard point position judgment preset
The angular deviation of described workpiece to be machined.
14. deviation monitoring methods according to claim 13, it is characterised in that in step
After rapid S13, also include step S14,
In step S14, it is judged that whether the angular deviation of described workpiece to be machined is more than presetting
Secure threshold, the most then send alarm；If it is not, it is normal then to send angular deviation
Signal.
15. deviation monitoring methods according to claim 12, it is characterised in that step
S20 is further comprising the steps of,
Step S21, is perpendicular to described standard operation region towards described standard operation field emission
Line of light；
Step S22, receives and is reflected described by described workpiece to be machined and/or described support unit
Line of light and the linear reflection light that formed；
Step S23, length based on described linear reflection light and the length of default standard line segment
Judge the centre deviation of described workpiece to be machined.
16. deviation monitoring methods according to claim 15, it is characterised in that in step
After rapid S23, also include step S24,
In step s 24, it is judged that whether the centre deviation of described workpiece to be machined is more than presetting
Secure threshold, the most then send alarm, and termination process；If it is not, in then sending
The normal signal of heart deviation.
17. deviation monitoring methods according to claim 15, it is characterised in that in step
In rapid S21, described Line of light includes X-axis Line of light and Y-axis Line of light, described X-axis line
Shape light and Y-axis Line of light being radially arranged along described standard operation face, and be mutually perpendicular to, and
And one end of described X-axis Line of light is radiated on described standard operation region, the other end irradiates
On described support unit；One end of described Y-axis Line of light is radiated at described standard operation district
On territory, the other end is radiated on described support unit；
In step S22, receive respectively by described workpiece to be machined and/or described support unit
The X-axis linear reflection light reflecting described X-axis Line of light and formed, and reflect described Y-axis
Line of light and the Y-axis linear reflection light that formed；
In step S23, length based on described X-axis linear reflection light and the X-axis preset
The length of standard line segment judges described workpiece to be machined offset deviation in the X-axis direction, with
And the length of length of based on described Y-axis linear reflection light and the Y-axis standard line segment preset sentences
Disconnected described workpiece to be machined offset deviation in the Y-axis direction.
18. 1 kinds of plasma processing devices, it includes reaction chamber, described reaction chamber bag
Including support unit and deviation monitoring system, wherein, described support unit is used for carrying processed work
Part；When described deviation monitoring system is for monitoring top that workpiece to be machined is placed in support unit
Whether in standard operation region and standard operation face, described standard operation region is in described support
The region placing described workpiece to be machined preset on the loading end of unit；Described standard operation face
The default water at its place when being lifted off the loading end of described support unit for described workpiece to be machined
Plane, it is characterised in that described deviation monitoring system uses claim 1-11 any one
Described deviation monitoring system.
19. plasma processing devices according to claim 18, it is characterised in that
Described support unit includes electrostatic chuck.
20. plasma processing devices according to claim 19, it is characterised in that
On the periphery wall of described electrostatic chuck, set is shaped with dielectric ring, and the upper surface of described dielectric ring
Higher than the upper surface of described electrostatic chuck or concordant with the upper surface of described electrostatic chuck.
21. plasma processing devices according to claim 18, it is characterised in that
The top of described reaction chamber is provided with quartz window, described levelness separate-blas estimation unit and/or
Described centre deviation detector unit is positioned at the top of described quartz window.
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| CN1934692A (en) * | 2004-03-18 | 2007-03-21 | 东京毅力科创株式会社 | Method for detecting transfer shift of transfer mechanism and semiconductor processing equipment |
| CN101461053A (en) * | 2006-09-05 | 2009-06-17 | 东京毅力科创株式会社 | Substrate position determining method, substrate position detecting method, and substrate collecting method |
| CN101911277A (en) * | 2007-12-27 | 2010-12-08 | 朗姆研究公司 | Arrangements and methods for determining positions and offsets |
| CN101740447A (en) * | 2008-11-19 | 2010-06-16 | 东京毅力科创株式会社 | Substrate position detection apparatus, substrate position detection method, film forming apparatus and film forming method |
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