CN103823529B - Electronic installation - Google Patents
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- CN103823529B CN103823529B CN201210462381.6A CN201210462381A CN103823529B CN 103823529 B CN103823529 B CN 103823529B CN 201210462381 A CN201210462381 A CN 201210462381A CN 103823529 B CN103823529 B CN 103823529B
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- central processor
- processor core
- module
- wind
- electronic installation
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- 238000009434 installation Methods 0.000 title claims abstract description 43
- 230000004308 accommodation Effects 0.000 claims description 7
- 238000012545 processing Methods 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
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Abstract
The present invention proposes a kind of electronic installation, is evenly distributed can air-flow, it is to avoid excessive air-flow flows away and the unbalance situation of system radiating through vacant central processor core adapter.The electronic installation includes that a motherboard, a blower module and keep out the wind module.Motherboard is provided with one first central processor core adapter and one second central processor core adapter, first central processor core adapter is configured with a central processor core and corresponding central processor core radiator, and the second central processor core adapter is not configured with central processor core and central processor core radiator.Blower module is configured at the side of the first central processor core adapter and the second central processor core adapter.Module of keeping out the wind is removable installed on the second central processor core adapter.
Description
Technical field
The invention relates to a kind of electronic installation, and can the equally distributed electronics of secondary air in particular to one kind
Device.
Background technology
The housing design of server is saved for cost and space and is considered now, and inside is difficult to reserved enough free convection
Space, and substantial amounts of electric energy can be consumed due to complicated IC design, and electric energy of these consumption will be converted into
Heat causes the rising of temperature, hence in so that the element of computer, such as central processor core and peripheral device control chip
Temperature rises more aobvious serious, the problem for causing whole system internal temperature too high.When heat is gathered in casing internal and cannot be i.e.
When dissipating, will result in electronic component cannot normal work.
It is general that when high-power central processor core is processed, blower module directly can blow to central processor core,
Heat is taken away.And have in the server of double central processor cores at present and be then provided with multiple blower modules, equably
Double central processor cores are radiated.Single central authorities can be only installed sometimes to process in the server of double central processor cores
Device chip, and central processor core radiator is installed on central processor core.
However, in this situation, due to being arranged on another central processor core slot of motherboard without element
On position, can be formed herein and almost not have resistant gas channel, the wind blown out from blower module by major part can pass through this gas
Circulation road, only a small amount of air-flow pass through central processor core radiator so that the more difficult quilt of the heat production of central processor core
Discharge, and allow system that overheated situation occurs.
Content of the invention
The present invention provides a kind of electronic installation, is evenly distributed can air-flow, it is to avoid excessive air-flow is through vacant central authorities
Processor chips adapter flows away and the unbalance situation of system radiating.
The present invention proposes a kind of electronic installation, keeps out the wind module including a motherboard, a blower module and one.Motherboard is provided with
One first central processor core adapter and one second central processor core adapter, the first central processor core connect
Device is configured with a central processor core and corresponding central processor core radiator, and the second central processor core connects
Connect device and be not configured with central processor core and central processor core radiator.Blower module is configured at the first central authorities and processes
Device chip connector and the side of the second central processor core adapter.Module of keeping out the wind is removable installed in the second centre
On reason device chip connector.
In one embodiment of this invention, above-mentioned module of keeping out the wind has one first contrary side and one second side, and first
Side is located between blower module and the second side, and module of keeping out the wind is provided with the groove of the first side of insertion and the second side.
In one embodiment of this invention, electronic installation also includes a wind scooper, module of keeping out the wind and the first central processing unit
The corresponding central processor core radiator of chip connector all be located between wind scooper and motherboard, groove be located at wind scooper with
Keep out the wind between module.
In one embodiment of this invention, above-mentioned groove and the second central processor core adapter are located at module of keeping out the wind
Two opposite sides.
In one embodiment of this invention, electronic installation also includes a thermal source, and module of keeping out the wind is located at thermal source and blower module
Between, air-flow a portion that blower module blows flows through groove and blows to thermal source.
In one embodiment of this invention, electronic installation also includes a wind scooper, is formed between wind scooper and motherboard
One first air channel arranged side by side and one second air channel, one end adjacent with blower module and the second air channel and fan in the first air channel
The adjacent one end of module communicates respectively, and in the first air channel, module of keeping out the wind is configured at central processor core heat sink arrangements
Second air channel.
In one embodiment of this invention, above-mentioned module of keeping out the wind is processed not less than central authorities in the windage that the second air channel is formed
The windage that device chip radiator is formed in the first air channel.
In one embodiment of this invention, above-mentioned module of keeping out the wind includes that a distributary division, distributary division face blower module,
Distributary division is in order to blower module to be blowed to the airflow diversion of module of keeping out the wind to the both sides of module of keeping out the wind.
In one embodiment of this invention, above-mentioned module of keeping out the wind is also formed with an accommodation space, the second central processing unit
Chip connector is contained in accommodation space.
In one embodiment of this invention, electronic installation also includes that a housing, housing include the bottom parallel to motherboard
Wall, it is located at diapire two opposite sides and parallel two side and is installed on two side and cover, motherboard is contained in the bottom of by
In the space that wall, two side and upper lid are surrounded, the first central processor core adapter is connected with the second central processor core
In being separated at intervals on the direction of two side between device.
Based on above-mentioned, of the invention electronic installation due to installing centre only on the first central processor core adapter
Reason device chip, for avoiding because of non-configuration element on the second central processor core adapter, and makes from the big of blower module blowout
Fraction passes through in this, and reduces by central processor core radiator or the throughput of other thermals source, causes system
Radiating is unbalance, and the electronic installation of the present invention is arranged on the second central processor core adapter by module of keeping out the wind, so that
Air-flow is effectively blocked at the second central processor core adapter, it is to avoid be here formed as almost not having resistant air-flow
Passage, so that be prevented effectively from the harmful effect radiated by system other parts.Also, module is formed in the second air channel due to keeping out the wind
The windage that formed in the first air channel not less than central processor core radiator of windage.Therefore, blown out from blower module
Air-flow by the throughput of central processor core radiator just can more than or the air-flow that blown out close to blower module pass through
The throughput of module of keeping out the wind, to lift the heat exchanger effectiveness amount of central processor core radiator, and then avoids system overheat
Situation occurs.Additionally, the second location division phase of first location division of the electronic installation of the present invention by module of keeping out the wind and motherboard
Mutually para-position, can avoid abat-vent from mistakenly being installed, it is ensured that distributary division faces blower module, to aid in the air-flow that will be flowed through
Branch to the both sides of module of keeping out the wind.
Description of the drawings
It is that the above objects, features and advantages of the present invention can be become apparent, below in conjunction with tool of the accompanying drawing to the present invention
Body embodiment elaborates, wherein：
Fig. 1 is a kind of schematic top plan view of the electronic installation according to one embodiment of the invention.
Fig. 2 is that the module of keeping out the wind of the electronic installation of Fig. 1 is arranged at the schematic diagram on motherboard.
Fig. 3 is the screw and second of the through hole of the module of keeping out the wind of the electronic installation of Fig. 1 and the first location division and motherboard
The schematic diagram of location division.
Fig. 4 is the schematic diagram that the electronic installation of Fig. 1 is configured with wind scooper.
Fig. 5 is the schematic diagram of the wind scooper of Fig. 4.
Main element symbol description：
100：Electronic installation
110：Motherboard
112：First central processor core adapter
113：Second central processor core adapter
114：Screw
116：Second location division
120：Central processor core
130：Central processor core radiator
140：Blower module
150：Keep out the wind module
150a：First side
150b：Second side
151：Groove
154：Through hole
156：Distributary division
157：Accommodation space
159：First location division
160：Wind scooper
162：First air channel
164：Second air channel
170：Thermal source
180：Fixing device
190：Housing
191：Diapire
192：Side wall
193：Upper lid
Specific embodiment
Fig. 1 is a kind of schematic top plan view of the electronic installation according to one embodiment of the invention.Refer to Fig. 1, this enforcement
The electronic installation 100 of example includes that a motherboard 110, a blower module 140 and keep out the wind module 150.In the present embodiment, electronics
Device 100 is server, but the species of electronic installation 100 is not limited system.
Motherboard 110 is provided with one first central processor core adapter 112 and the connection of one second central processor core
Device 113, the first central processor core adapter 112 is configured with a central processor core 120 and corresponding central authorities are processed
Device chip radiator 130, and the second central processor core adapter 113 is not configured with central processor core and centre
Device chip radiator is managed, and the second central processor core adapter 113 is vacant, systematic function extension after can giving over to makes
With.Blower module 140 is configured at the first central processor core adapter 112 and the second central processor core adapter 113
Side.Module of keeping out the wind 150 is removable installed on the second central processor core adapter 113.
In the case where amount of calculation is more huge, two central processor cores 120 can be separately mounted to lead by user
On the first central processor core adapter 112 and the second central processor core adapter 113 of machine plate 110, with provide compared with
For powerful operational capability.But in some cases, only may need a central processor core 120 is installed, now, can be by
Central processor core 120 is arranged on the first central processor core adapter 112, and by central processor core radiator
130 are arranged on central processor core 120, and heat production during post operating central processor core 120 takes away.At this
In embodiment, on the second central processor core adapter 113, corresponding chip and radiator is not configured.
The electronic installation 100 of the present embodiment is not in order to avoid because match somebody with somebody on the second central processor core adapter 113
Corresponding chip and radiator is equipped with, and the air-flow from the blowout of blower module 140 is passed through too much in the second centre
The position of reason device chip connector 113, and only a small amount of air-flow is particularly central processor core radiating by other thermals source
Device 130 so that the heat production of central processor core 120 is more difficult to be handed over the hot of air-flow via central processor core radiator 130
Change and be brought away from, and the constant temperature of central processor core 120 is raised, the situation for causing system overheat to damage.At this
In embodiment, module of keeping out the wind 150 is arranged on the second central processor core adapter 113, to avoid the second central authorities from processing
The position of device chip connector 113 is because of accessible and resistance, and the air-flow from blower module blowout is more inclined to toward second
The situation of the movement of central processor chip connector 113.
Fig. 2 is that the module of keeping out the wind of the electronic installation of Fig. 1 is arranged at the schematic diagram on motherboard.Fig. 2 is referred to, in this enforcement
In example, there is module of keeping out the wind 150 one first contrary side 150a and one second side 150b, the first side 150a to be located at blower module
140 and second between the 150b of side, and module of keeping out the wind 150 is provided with the groove 151 of insertion the first side 150a and the second side 150b.Groove
151 and second central processor core adapter 113 be located at the two opposite sides of module 150 of keeping out the wind.In the present embodiment, groove
151 are in " " type, but the shape of groove 151 is not limited system.Can groove 151 be passed through to flow from the air-flow of blower module blowout
Thermal source (e.g. hard disc module) to 150 rear of module of keeping out the wind.
Additionally, module 150 of keeping out the wind also includes that a distributary division 156, distributary division 156 face blower module 140, distributary division
156 in order to blower module 140 to be blowed to the airflow diversion of module 150 of keeping out the wind to the both sides of module 150 of keeping out the wind.As shown in figure 1, this
The distributary division 156 of embodiment is " " type groove, but in other embodiments, distributary division 156 can also be other configurations, as long as
The effect of the both sides of the airflow diversion to module 150 of keeping out the wind that will be flowed through can be reached.
Fig. 3 is the screw and second of the through hole of the module of keeping out the wind of the electronic installation of Fig. 1 and the first location division and motherboard
The schematic diagram of location division.Fig. 1 and Fig. 3 is referred to, in the present embodiment, module of keeping out the wind 150 is in the way of locking to be fixed on master
On machine plate 110.Motherboard 110 includes multiple screws 114.As shown in figure 1, electronic installation 100 also includes multiple fixing devices
180, these fixing devices 180 are distributed in the surrounding of the second central processor core adapter 113 and module 150 of keeping out the wind is fixed
In motherboard 110.Module of keeping out the wind 150 includes a through hole 154.The fixing device 180 of the present embodiment be screw, these fixing devices
180 by these screws 114 of these through holes 154 and the motherboard 110 that is spirally connected of module 150 of keeping out the wind, so that module 150 of keeping out the wind is solid
Schedule motherboard 110.But the mode that module of in other embodiments, keeping out the wind 150 can also engage is fixed on motherboard 110,
Fixed form between module of keeping out the wind 150 and motherboard 110 is not limited thereto system.
Additionally, being correctly mounted on motherboard 110 in order to ensure the body 152 of module 150 of keeping out the wind, and make the mould that keeps out the wind
The distributary division 156 of block 150 can face blower module 140.Module of keeping out the wind 150 also includes one first location division 159, motherboard
110 also include one second location division 116 corresponding to the first location division 159.In the present embodiment, the first of module of keeping out the wind 150
Location division 159 is a shrinkage pool, and the second location division 116 of motherboard 110 is a projection.But the first location division 159 and the second positioning
The species in portion 116 is not limited thereto system.User is when module 150 is kept out the wind in installation, as long as will first keep out the wind the first of module 150
After second location division, 116 para-position of location division 159 and motherboard 110, then by locking unit 158 through module 150 of keeping out the wind
Be spirally connected after through hole 154 screw 114 of motherboard 110, you can completes, module of keeping out the wind 150 quite facilitates in assembly and disassembly.
In addition, as shown in figure 3, module 150 of keeping out the wind is also formed with an accommodation space 157, when module 150 of keeping out the wind is arranged at
When on two central processor core adapters 113, the second central processor core adapter 113 is contained in accommodation space 157.
Fig. 4 is the schematic diagram that the electronic installation of Fig. 1 is configured with wind scooper.Fig. 5 is the schematic diagram of the wind scooper of Fig. 4.Please join
Fig. 4 to Fig. 5 is read, in the present embodiment, electronic installation 100 also includes a wind scooper 160.Module of keeping out the wind 150 and the first centre
112 corresponding central processor core radiator 130 of reason device chip connector is all located between wind scooper 160 and motherboard 110,
Groove 151 is located at wind scooper 160 and keeps out the wind between module 150.
In the present embodiment, electronic installation 100 also includes that a thermal source 170, module of keeping out the wind 150 are located at thermal source 170 and fan
Between module 140, air-flow a portion that blower module 140 blows flows through groove 151 and blows to thermal source 170.In this enforcement
In example, thermal source 170 is a hard disc module, but the species of thermal source 170 is not limited system.
In the present embodiment, one first air channel 162 and one arranged side by side is formed between wind scooper 160 and motherboard 110
Two air channels 164, the one end adjacent with blower module 140 in the first air channel 162 and the second air channel 164 with 140 phase of blower module
Adjacent one end communicates respectively, and central processor core radiator 130 is configured at the first air channel 162, and module of keeping out the wind 150 is configured
In the second air channel 164.Module of keeping out the wind 150 is not less than central processor core radiator 130 in the windage that the second air channel 164 is formed
In the windage that the first air channel 162 is formed, being beneficial to more air-flows can be processed above slot 112 by being located at the first central authorities
Central processor core radiator 130, the heat production of central processor core 120 is effectively excluded.
In the present embodiment, during the height of module of keeping out the wind 150 is more than the first central processor core adapter 112 accordingly
The half of 130 height of central processor chip radiator, the width of module of keeping out the wind 150 are more than the first central processor core adapter
The half of 112 corresponding 130 width of central processor core radiator.
In the present embodiment, electronic installation 100 also includes that a housing 190, housing 190 are included parallel to motherboard 110
One diapire 191, be located at 191 two opposite sides of diapire and parallel two side 192 and be installed on two side 192 one on cover
193, motherboard 110 is contained in the space surrounded by diapire 191, two side 192 and upper lid 193, the first central processing unit core
It is separated at intervals on the direction perpendicular to two side 192 between piece adapter 112 and the second central processor core adapter 113
's.That is, the first central processor core adapter 112 and the second central processor core adapter 113 are not in flat
Row is arranged in the direction of side wall 192.In the present embodiment, the first central processor core adapter 112 and the second central authorities are processed
Perpendicular direction arrangement (equidistant with blower module 140 respectively) in side wall 192 of device chip connector 113, but in other enforcements
In example, the first central processor core adapter 112 and the second central processor core adapter 113 can also be not orthogonal to side wall
192 direction.
In sum, electronic installation of the invention is due to installing centre only on the first central processor core adapter
Reason device chip, for avoiding because of non-configuration element on the second central processor core adapter, and makes the gas from blower module blowout
Stream passes through too much in this, and reduces the air-flow of the element especially central processor core radiator radiated by other needs
Amount.The electronic installation of the present invention is by abat-vent is arranged on the second central processor core adapter, so that motherboard
On two central authorities process slots on be equipped with element.Also, module is not less than in the windage that the second air channel is formed due to keeping out the wind
The windage that central processor core radiator is formed in the first air channel.Therefore, the air-flow for being blown out from blower module passes through central authorities
The throughput of processor chips radiator just can more than or the gas of the air-flow that blown out close to blower module by module of keeping out the wind
Flow, to lift the heat exchanger effectiveness amount of central processor core radiator, and then avoids the situation of system overheat from occurring.This
Outward, electronic installation of the invention can be kept away by the mutual para-position in the first location division of module of keeping out the wind and the second location division of motherboard
Exempt from abat-vent mistakenly to be installed, it is ensured that distributary division faces blower module, to aid in the airflow diversion for flowing through to keeping out the wind
The both sides of module.
Although the present invention is disclosed as above with preferred embodiment, so which is not limited to the present invention, any this area skill
Art personnel, without departing from the spirit and scope of the present invention, when a little modification and perfect can be made, therefore protection model of the invention
Enclose when by being defined that claims are defined.
Claims (9)
1. a kind of electronic installation, including：
One motherboard, which is provided with one first central processor core adapter and one second central processor core adapter,
The first central processor core adapter is configured with a central processor core and the radiating of a corresponding central processor core
Device, and the second central processor core adapter is not configured with central processor core and central processor core radiating
Device；
One blower module, is configured at the first central processor core adapter with the second central processor core adapter
Side；And
One keeps out the wind module, is removable installed on the second central processor core adapter, and the module of keeping out the wind includes one point
Stream portion, the distributary division face the blower module, and the distributary division divides in order to the air-flow that the blower module is blowed to the module of keeping out the wind
It flow to the both sides of the module of keeping out the wind.
2. electronic installation as claimed in claim 1, it is characterised in that the module of keeping out the wind has one first contrary side with one the
Two sides, first side be located between the blower module and second side, the module of keeping out the wind be provided with insertion first side with this second
One groove of side.
3. electronic installation as claimed in claim 2, also includes a wind scooper, keep out the wind module and the first central processing unit core
The corresponding central processor core radiator of piece adapter is all located between the wind scooper and the motherboard, and the groove is located at should
Wind scooper and this keep out the wind between module.
4. electronic installation as claimed in claim 2, it is characterised in that the groove and the second central processor core adapter
Two opposite sides positioned at the module of keeping out the wind.
5. electronic installation as claimed in claim 2, also includes a thermal source, and the module of keeping out the wind is positioned at the thermal source and the blower module
Between, air-flow a portion that the blower module blows flows through the groove and blows to the thermal source.
6. electronic installation as claimed in claim 1, also includes a wind scooper, is formed with simultaneously between the wind scooper and the motherboard
One first air channel and one second air channel of row, the one end adjacent with the blower module and second air channel in first air channel with
The adjacent one end of the blower module communicates respectively, and the central processor core heat sink arrangements are in first air channel, the gear
Wind module is configured at second air channel.
7. electronic installation as claimed in claim 6, it is characterised in that the windage that the module of keeping out the wind is formed in second air channel is not
Less than the windage that the central processor core radiator is formed in first air channel.
8. electronic installation as claimed in claim 1, it is characterised in that the module of keeping out the wind is also formed with an accommodation space, and this
Two central processor core adapters are contained in the accommodation space.
9. electronic installation as claimed in claim 1, also includes a housing, the housing include a diapire parallel to motherboard,
It is located at diapire two opposite sides and parallel two side and is installed on two side and cover, the motherboard is contained in the bottom of by
In the space that wall, two side and upper lid are surrounded, the first central processor core adapter and second central processor core
It is separated at intervals on the direction of vertical two side between adapter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210462381.6A CN103823529B (en) | 2012-11-16 | 2012-11-16 | Electronic installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210462381.6A CN103823529B (en) | 2012-11-16 | 2012-11-16 | Electronic installation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103823529A CN103823529A (en) | 2014-05-28 |
| CN103823529B true CN103823529B (en) | 2017-03-15 |
Family
ID=50758637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210462381.6A Expired - Fee Related CN103823529B (en) | 2012-11-16 | 2012-11-16 | Electronic installation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103823529B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112271153A (en) * | 2020-11-24 | 2021-01-26 | 成都中建材光电材料有限公司 | Device for uniformly cooling large-area cadmium telluride film chip |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2722320Y (en) * | 2004-08-12 | 2005-08-31 | 英业达股份有限公司 | Host computer radiating structure of server |
| EP1918801A1 (en) * | 2006-11-06 | 2008-05-07 | MAGNETI MARELLI SISTEMI ELETTRONICI S.p.A. | Integrated circuit electronic device comprising an improved cooling system |
| CN201119235Y (en) * | 2007-10-19 | 2008-09-17 | 英业达股份有限公司 | Wind guide cover device |
| CN201716655U (en) * | 2010-07-19 | 2011-01-19 | 英业达科技有限公司 | Computer system provided with wind shield |
-
2012
- 2012-11-16 CN CN201210462381.6A patent/CN103823529B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2722320Y (en) * | 2004-08-12 | 2005-08-31 | 英业达股份有限公司 | Host computer radiating structure of server |
| EP1918801A1 (en) * | 2006-11-06 | 2008-05-07 | MAGNETI MARELLI SISTEMI ELETTRONICI S.p.A. | Integrated circuit electronic device comprising an improved cooling system |
| CN201119235Y (en) * | 2007-10-19 | 2008-09-17 | 英业达股份有限公司 | Wind guide cover device |
| CN201716655U (en) * | 2010-07-19 | 2011-01-19 | 英业达科技有限公司 | Computer system provided with wind shield |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103823529A (en) | 2014-05-28 |
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Granted publication date: 20170315 |