CN101083894B - Electronic device and heat radiating module - Google Patents
Electronic device and heat radiating module Download PDFInfo
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- CN101083894B CN101083894B CN200610078472A CN200610078472A CN101083894B CN 101083894 B CN101083894 B CN 101083894B CN 200610078472 A CN200610078472 A CN 200610078472A CN 200610078472 A CN200610078472 A CN 200610078472A CN 101083894 B CN101083894 B CN 101083894B
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Abstract
The present invention is a heat-scattered module used for being assembled onto the several locking holes on circuit boards and distributing heats of heat sources on circuit boards. The heat-scattered module includes a bearing frame, a fan and a covering part. The bearing frame is composed of bearing base and several first footings extending downward from the bearing base. Every first footing has a elastic locking part for locking in the locking holes, and the elastic locking part has a containing space. In addition, the fan is assembled on the bearing base, and the covering part covers the fan and is assembled on the bearing base. The covering part is composed of a casing and several second footings, in which the casing is used for covering the fan, and the second footings extend downward from the casing relative to the first footings. The side away from the casing of every second footings has a tenon inserted in the containing space.
Description
Technical field
The present invention relates to a kind of radiating module, particularly a kind of electronic installation and radiating module thereof.
Background technology
Along with semiconductor technology is constantly broken through, and integrated circuit (Integral Circuit, IC) volume of element is more done forr a short time, and arithmetic speed is more and more fast.The circuit operation time can make the electronic component temperature raise, and especially heals when high when IC element arithmetic speed, and the situation of heating is more serious.In the employed IC element of computer hardware, often a plurality of IC elements are formed a chip module, to carry out some specific function (function), easily cause misoperation of IC element even breaking-up owing to working temperature is too high, therefore how to reduce the working temperature of IC element, just become considerable problem.
For instance, in server (server), can be inserted with a plurality of memory modules usually, to increase the execution usefulness of server.In known technology, the legacy memory module adopts the block form data transfer mode, and under this mode, each module in the memory transfer passage all has one group separately and leads to this passage and Memory Controller.Thus, under the more situation of memory chip number, will cause the overload of Memory Controller.That is to say, will cause the actuating force deficiency of Memory Controller, and then cause the wrong and delay of transfer of data.In addition, when adopting the block form transmission, data transmission bauds is fast more in transmission channel, and the probability of error in data is high more naturally.
Therefore, for the memory module in being inserted in server, adopted new solution at present, that is adopted the memory module of string type, for example: full buffer formula memory module (Fully-Buffered Dual Inline Memory Module, FB-DIMM).
FB-DIMM uses designed standard DDR2 memory change by a kind of server that aims at.This class of server is used, and collaborative and data correctness is basic demand between the memory under high capacity memory and the high-speed transfer.The FB-DIMM memory also utilizes the high-speed internal framework of DDR2 memory simultaneously, and a kind of brand-new point-to-point string type interface that each FB-DIMM module is chained together mutually combines, to obtain high-speed data transmission speed.
Yet the power dissipation of the Memory Controller of FB-DIMM is very high, that is its Memory Controller can produce very high temperature, for example: can produce the high temperature about 125 degree.Therefore, if FB-DIMM is not carried out suitable heat radiation, then the high temperature that FB-DIMM produced will have influence on and be arranged near its System on Chip/SoC, and then has influence on the usefulness of system.
In known heat radiation solution, generally be in main frame, to set up a plurality of system fan (systemfan) to produce active flow, to reduce system temperature.Perhaps, adopt the system fan of high gauge, the blast of palpus and air quantity come FB-DIMM is dispelled the heat to provide.Also having some ways, is to adopt wind scooper that the air-flow of fan generation is directed to the FB-DIMM place, to cool off these memory modules.
Yet, the many power lines or the integrated circuit board of a plurality of all cards of disk array in this way (RAID Card) are arranged usually in main frame inside, therefore the air-flow of system fan generation can be subjected to flow resistance influences such as power line or integrated circuit board, and can't be to flowing to FB-DIMM, so that might can't dispel the heat effectively to FB-DIMM.
In addition, because the main frame inner space is limited, so main frame inside is difficult for having enough spaces that wind scooper is set, and is directed to the heater element place with the air quantity with the fan generation.On the other hand, even if main frame inside has enough spaces that wind scooper is set, but the air-flow of system fan generation is after being directed to FB-DIMM via wind scooper, and current rate is significantly reduced, thereby can't dispel the heat to electronic component effectively.
Therefore, how to propose a kind of effective heat radiation solution, become the problem of needing solution badly.
Summary of the invention
The present invention's purpose provides a kind of electronic installation and radiating module thereof, to solve the problem in the known technology.
The claim scope one of according to the present invention discloses a kind of radiating module, and a connecting hole (lock hole) more than it is suitable for being assembled on the circuit board is to dispel the heat at least one pyrotoxin (heat source) that is inserted on this circuit board.This radiating module comprises carrier (carrier), fan, reaches lid (cover).Above-mentioned carrier also comprise load bearing seat (holder) with extending by this load bearing seat individual first socle more than forming, above-mentioned these first socles are snapped in above-mentioned these connecting holes on the foregoing circuit plate.Said fans is assembled on the load bearing seat, so that pyrotoxin is dispelled the heat.Above-mentioned lid also comprise the clamshell that covers this fan and more than those first socles are corresponding second socle, those second socles combine with those first socles respectively, make fan be assembled between carrier and the lid.
The claim scope one of according to the present invention discloses a kind of electronic installation.This electronic installation comprises circuit board and is mounted on radiating module on this circuit board, and wherein circuit board is inserted with a plurality of memory modules and circuit board and has a plurality of connecting holes that are positioned at around those memory modules.Above-mentioned radiating module is in order to be assembled on the circuit board, and so that those memory modules on the circuit board are dispelled the heat, this radiating module comprises: carrier, fan, and lid.Above-mentioned carrier also comprise load bearing seat with extending by this load bearing seat individual first socle more than forming, above-mentioned these first socles are snapped in above-mentioned these connecting holes on the foregoing circuit plate, this carrier is mounted on this circuit board by those first socles.Said fans is assembled on the load bearing seat, so that pyrotoxin is dispelled the heat.Above-mentioned lid also comprise the clamshell that covers this fan and more than those first socles are corresponding second socle, those second socles combine with those first socles respectively, make fan be assembled between carrier and the lid.
By this, by the radiating module that preferred embodiment of the present invention provided, (for example: memory module) overheated problem, and not changing under the existing systems radiating mode has preferable radiating effect can effectively to solve electronic component in the electronic installation.
In preferred embodiment of the present invention, electronic installation is server (server), and in other embodiments, electronic installation can be disk array (RAID) device or the computer installation main frame of 2U.
In preferred embodiment of the present invention, pyrotoxin is a plurality of memory modules, those memory modules are preferably full buffer formula memory module (FB-DIMM), in other embodiments, pyrotoxin can be north bridge chips, drawing chip, RAID card or other and is mounted on System on Chip/SoC in the server (or information processor).
In one of the present invention embodiment, wall driving fit within trip and the elasticity button.
In one of the present invention embodiment, the elasticity button has a plurality of groovings that communicate with accommodation space, makes the elasticity button form a plurality of fasteners, and each fastener has lug boss away from one of load bearing seat end, to be snapped in connecting hole.Wherein, lug boss for example has sliding surface (slide surface) and breasting face (support surface), and fastener is to wear in connecting hole via sliding surface, so that the bottom interference (interface) of breasting face and circuit board.
In one of the present invention embodiment, first socle has guidance part, and second socle in order to the guiding correspondence makes the trip of second socle be inserted in accommodation space.
In one of the present invention embodiment, fan has a plurality of first holding sections, and carrier also comprises second holding section of a plurality of corresponding first holding sections, and second holding section corresponding with institute, first holding section engages mutually.Wherein, first holding section for example is a locking hole, and second holding section for example is a trip.
In one of the present invention embodiment, lid comprises that also at least one is equipped on clamshell the 3rd holding section on every side, and carrier comprises that also at least one is equipped on load bearing seat the 4th holding section on every side, and the 3rd holding section engages (lock) mutually with the 4th holding section.Wherein, the 3rd holding section for example is a trip, and the 4th holding section for example is a draw-in groove.Certainly, the 3rd holding section can be a trip also, and the 4th holding section also can be a draw-in groove.
For above and other objects of the present invention, feature and advantage can be become apparent, the present invention's cited below particularly preferred embodiment, and conjunction with figs. are described in detail below.
Description of drawings
Fig. 1 is that a kind of radiating module of preferred embodiment of the present invention is assembled in the schematic diagram in the electronic installation.
Fig. 2 A is the enlarged drawing of the radiating module of Fig. 1.
Fig. 2 B is the three-dimensional exploded view of the radiating module of Fig. 2 A.
Fig. 3 A to Fig. 3 D is assembled to connecting hole for the elasticity button of Fig. 2 B, and trip is inserted in the schematic diagram of accommodation space.
The main element description of symbols
10: electronic installation
12: circuit board
14: pyrotoxin
16: connecting hole
100: radiating module
110: carrier
112: load bearing seat
112a: first ventilating opening
114: the first socles
116: the elasticity button
116 ': fastener
116a: accommodation space
116b: lug boss
116c: breasting face
116d: sliding surface
118: grooving
120: fan
130: lid
132: clamshell
132a: second ventilating opening
134: the second socles
136: trip
140: the first holding sections
150: the second holding sections
160: guidance part
170: the three holding sections
180: the four holding sections
Embodiment
Fig. 1 is that a kind of radiating module 100 of preferred embodiment of the present invention is assembled in the schematic diagram in the electronic installation 10.Please refer to Fig. 1, the radiating module 100 of present embodiment is suitable for being assembled on the circuit board 12 of electronic installation 10, so that the pyrotoxin on the circuit board 12 14 is dispelled the heat, wherein radiating module 100 be fastened in around the pyrotoxin 14 more than a connecting hole 16 to be assembled on the circuit board 12.
In present embodiment, electronic installation 10 is server (server), and in other embodiments, electronic installation 10 can be disk array (RAID) device or the computer installation main frame of 2U.In addition, in present embodiment, pyrotoxin 14 is a plurality of memory modules, those memory modules are preferably full buffer formula memory module (FB-DIMM), in other embodiments, pyrotoxin 14 also can be north bridge chips, drawing chip, RAID card or other and is mounted on System on Chip/SoC in the server.
In the present embodiment, radiating module 100 for example is to be arranged at the memory module top, so that FB-DIMM is dispelled the heat, makes electronic installation 10 can be in stable operating state.Certainly, in other embodiments, radiating module 100 also can dispel the heat to other pyrotoxin that is positioned at circuit board 12, and the present invention does not do any restriction at this.Hereinafter will introduce the present invention's radiating module 100 in detail.
Fig. 2 A is the enlarged drawing of the radiating module 100 of Fig. 1, and Fig. 2 B is the three-dimensional exploded view of the radiating module of Fig. 2 A.At this, please in the lump with reference to Fig. 2 A and Fig. 2 B.The radiating module 100 that present embodiment provided comprises carrier 110, fan 120, reaches lid 130.Carrier 110 comprises load bearing seat 112 and a plurality of first socles 114 that formed by load bearing seat 112 extensions, and in present embodiment, those first socles 114 are formed by load bearing seat 112 extensions downwards.
Above-mentioned load bearing seat 112 has a plurality of first ventilating opening 112a, and in other embodiments, the first ventilating opening 112a on the load bearing seat 112 can be one, perhaps can be a plurality of, but its opening shape may be different with the first ventilating opening 112a that present embodiment is provided.In addition, each first socle 114 on the load bearing seat 112 has elasticity button 116 respectively, and each elasticity button 116 also has accommodation space 116a, and those first socles 114 just can flexibly be snapped in the connecting hole 16 (please refer to Fig. 1) by its elasticity button 116 by this.How relevant elasticity button 116 is snapped in the detailed description of connecting hole 16, is detailed later.
Said fans 120 is to be assembled on the load bearing seat 112 of carrier 110, so that pyrotoxin 14 (please refer to Fig. 1) is dispelled the heat.In present embodiment, the fan 120 that present embodiment provided has a plurality of first holding sections 140, those first holding sections 140 are locking hole in this example, and can set on the load bearing seat 112 corresponding with those first holding sections 140 more than second holding section 150, those second holding sections 150 are trip in this example.By this, those first holding sections 140 just can engage second holding section 150 corresponding with its institute mutually, make fan 120 firmly be assembled on the load bearing seat 112.
In other embodiments, fan 120 can be mounted on the load bearing seat 112 of carrier 110, for example by alternate manner: can utilize screw, nut that fan 120 is fixed on the load bearing seat 112; Perhaps directly that fan 120 is cemented on load bearing seat 112; Perhaps the group that can expect easily of other those skilled in the art is established mode.
One of them function of above-mentioned lid 130 is to be used for fixing fan 120, makes fan 120 can not break away from radiating module 100 shaking under the state because of electronic installation 10.In addition, one of them function of lid 130 also is used for making entire heat dissipation module 100 can more firmly be mounted on the circuit board 12 of electronic installation 10, that is lid 130 is by combining with carrier 110, and make carrier 110 more firmly to be located at for 12 groups with circuit board, relevant its detailed description please be with reference to following explanation.
Above-mentioned lid 130 is to cover on the fan 120, and is assembled on the carrier 110.Lid 130 comprise the clamshell 132 that covers fan 120 and corresponding with those first socles 114 more than second socle 134, and those second socles 134 combine with those first socles 114 respectively, make fan 120 be assembled between carrier 110 and the lid 130.
That is to say that clamshell 132 is in order to covering fan 120, and clamshell 132 has the second ventilating opening 132a of the corresponding first ventilating opening 112a.Therefore, the active flow of fan 120 generations just can the flow through first ventilating opening 112a and the second ventilating opening 132a are to reduce the high temperature that pyrotoxin 14 is produced.134 of second socles are to be extended downwards by clamshell 132, and each second socle 134 is at the trip 136 that has away from one of clamshell 132 end among the accommodation space of the being inserted in 116a.
In the present embodiment, elasticity button 116 also has a plurality of groovings 118, make elasticity button 116 form a plurality of fasteners 116 ', and one of those fasteners 116 ' end has lug boss 116b respectively, each fastener 116 ' has lug boss 116b away from one of load bearing seat 112 end, those lug bosses 116b is then in order to be snapped in those connecting holes 16, and wherein the accommodation space 116a of those groovings 118 and elasticity button 116 itself communicates.
In present embodiment, lug boss 116b has sliding surface 116d and breasting face 116c.When elasticity button 116 is desired to be assembled to connecting hole 16, the sliding surface 116d of fastener 116 ' can be subjected to the spacing of connecting hole 16 and make fastener 116 ' produce elastic deformation (shown in Fig. 3 A to Fig. 3 B), and after elasticity button 116 is assembled to connecting hole 16, because sliding surface 116d no longer is subjected to the spacing of connecting hole 16, therefore fastener 116 ' can return back to initial condition (shown in Fig. 3 C), and then the breasting face of making 116c and the interference of circuit board 12 bottoms.
What deserves to be mentioned is, when the elasticity button 116 of carrier 110 flexibly is snapped in the connecting hole 16 of circuit board 12, the trip 136 of second socle 134 of lid 130 can be inserted among the accommodation space 116a of first socle 114 of carrier 110, the trip 136 of second socle 134 of lid 130 just can produce spacing (shown in Fig. 3 D) to the fastener 116 ' of first socle 114 of carrier 110 by this, makes the fastener 116 ' of first socle 114 of carrier 110 be difficult for being subjected to external force influence (generation deformation) again and breaks away from the connecting hole 116a of circuit board 12.In other words, radiating module 100 just can firmly be fastened on the connecting hole 16 of circuit board 12.
In a preferred embodiment, the trip 136 of second socle 134 of lid 130 for example is wall driving fit within the elasticity button 116 with first socle 114 of carrier 110, so that elasticity button 116 firmly is fastened on connecting hole 16.In addition, radiating module 100 is disassembled in connecting hole 16, only need lid 130 is separated (trip 136 is extracted out) with carrier 110 in accommodation space 116a, the carrier 110 that flexibly is arranged in the connecting hole 16 is dismantled on circuit board 12 as desire.
In addition, for the trip 136 of second socle 134 that can make lid 130 can successfully insert among the accommodation space 116a of elasticity button 116, present embodiment is provided with guidance part 160 on first socle 114, second socle 134 in order to the guiding correspondence can be inserted among the accommodation space 116a trip 136 of second socle 134 exactly.
In addition, for making lid 130 can firmly be assembled on the carrier 110, present embodiment can set the 3rd holding section 170 around lid 130 its clamshells 132, and set the 4th holding section 180 on every side at carrier 110 its load bearing seats 112, and by the 3rd holding section 170 and the 4th holding section 180 engage mutually lid 130 firmly is assembled on the carrier 110, not influenced by external force and come off to guarantee lid 130.In the present embodiment, the 3rd holding section 170 for example is a trip, and the 4th holding section 180 for example is a draw-in groove.Certainly, in other embodiments, the 3rd holding section 170 can be a trip also, and the 4th holding section 180 also can be a draw-in groove.
Certainly, in other embodiments, carrier 110 can firmly be mounted on by alternate manner on the circuit board 12, for example: the engaging mode that carrier 110 can be expected easily with other those skilled in the art is mounted on the circuit board 12, for example: the engaging guide groove is set on circuit board 12, and on carrier 110, form the holding section, and then utilize holding section and the engaging that engages guide groove to set firmly carrier 110 in circuit board 12; Carrier 110 can also directly be welded on the circuit board 12, perhaps otherwise is installed on the circuit board.
In addition, in other embodiments, if carrier 110 can directly firmly be mounted on the circuit board 12, then lid 130 can not be provided with those second socles 134, and this moment lid 130 as long as combine just passable with carrier 110.
In sum, the carrier of the radiating module that preferred embodiment of the present invention provided is flexibly to be snapped in the connecting hole of circuit board by a plurality of elasticity buttons, fan is to be assembled on the load bearing seat so that pyrotoxin is dispelled the heat, and lid then is to cover fan and be assembled on the carrier.In addition, the trip of its second socle of lid is to be inserted in the accommodation space of its elasticity button of first socle, makes the elasticity button that is arranged in the connecting hole be difficult for elastic deformation takes place, and then firmly is fastened on connecting hole.Be subjected to flow resistance (power line that electronic installation is interior or integrated circuit board) influence easily with the air-flow that system fan produced of known technology, or wind scooper is difficult for the space of setting is arranged and cause the not good situation of radiating efficiency of pyrotoxin to be compared, and the radiating module that preferred embodiment of the present invention provided has following advantage:
(1) radiating module that preferred embodiment of the present invention provided can directly be arranged at pyrotoxin top effectively pyrotoxin being dispelled the heat, and then allows the electronic installation with radiating module that preferred embodiment of the present invention provides be in stable operating state.
(2) in preferred embodiment of the present invention, radiating module only need can firmly be fastened in the connecting hole by the collocation of elasticity button and trip.In other words, the radiating module that preferred embodiment of the present invention provided can be assembled in the electronic installation easily, or dismantles in electronic installation, and then saves the manpower assembly cost.
(3) in the confined space of electronic installation inside, the radiating module that preferred embodiment of the present invention provided can be assembled in electronic installation by a connecting hole more than around the pyrotoxin.In other words, the radiating module that preferred embodiment of the present invention provided can be arranged in the confined space of electronic installation inside, that is the radiating module that preferred embodiment of the present invention provided can not must change present system radiating mode.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; any person of ordinary skill in the field; without departing from the spirit and scope of the present invention; when can doing a little change and improvement, so protection scope of the present invention is as the criterion when looking the claim person of defining.
Claims (18)
1. radiating module, be suitable for being assembled on the circuit board more than a connecting hole, so that at least one pyrotoxin that is inserted on this circuit board is dispelled the heat, it is characterized in that this radiating module comprises:
Carrier, also comprise load bearing seat with extending by above-mentioned load bearing seat individual first socle more than forming, above-mentioned these first socles are snapped in above-mentioned these connecting holes on the foregoing circuit plate;
Fan is assembled on the above-mentioned load bearing seat, so that above-mentioned pyrotoxin is dispelled the heat; And
Lid, also comprise the clamshell that covers said fans and second socle more than above-mentioned these first socles are corresponding, above-mentioned these second socles combine with above-mentioned these first socles respectively, make said fans be assembled between above-mentioned carrier and the above-mentioned lid.
2. the radiating module according to claim 1 it is characterized in that each first socle also includes the elasticity button, and above-mentioned these elasticity buttons is snapped in above-mentioned these connecting holes on the foregoing circuit plate.
3. the radiating module according to claim 2 is characterized in that each elasticity button has accommodation space, and each second socle has trip, and above-mentioned these trips lay respectively at above-mentioned these accommodation spaces.
4. the radiating module according to claim 3, it is characterized in that each elasticity button has a plurality of groovings, make above-mentioned elasticity button form a plurality of fasteners, and one of above-mentioned these fasteners end has lug boss respectively, above-mentioned these lug bosses are snapped in above-mentioned these connecting holes, and wherein above-mentioned these groovings communicate with the accommodation space of above-mentioned elasticity button itself.
5. the radiating module according to claim 4, it is characterized in that each lug boss has sliding surface and breasting face respectively, above-mentioned these fasteners are arranged in above-mentioned these connecting holes via above-mentioned these sliding surfaces, and above-mentioned these breasting faces are interfered with the bottom of foregoing circuit plate.
6. the radiating module according to claim 1 is characterized in that above-mentioned these first socles have the guidance part of second socle of guiding correspondence respectively.
7. the radiating module according to claim 1, it is characterized in that said fans has a plurality of first holding sections, above-mentioned carrier also comprises and the second corresponding holding section of above-mentioned these first holding sections, makes above-mentioned these first holding sections engage mutually with above-mentioned these second holding sections.
8. the radiating module according to claim 7 is characterized in that above-mentioned these first holding sections are locking hole, and above-mentioned these second holding sections are trip.
9. the radiating module according to claim 1, it is characterized in that above-mentioned lid also comprises a plurality of the 3rd holding sections that are equipped on above-mentioned clamshell, above-mentioned carrier also comprises a plurality of the 4th holding sections that are equipped on above-mentioned load bearing seat, and above-mentioned these the 3rd holding sections engage mutually with above-mentioned these the 4th holding sections.
10. electronic installation is characterized in that comprising:
Circuit board is inserted with a plurality of memory modules and has a plurality of above-mentioned these memory modules connecting holes on every side that are positioned at; And
Radiating module is assembled on the foregoing circuit plate, and to dispel the heat to stating these memory modules on the foregoing circuit plate, above-mentioned radiating module comprises:
Carrier, also comprise load bearing seat with extending by above-mentioned load bearing seat individual first socle more than forming, above-mentioned these first socles are snapped in above-mentioned these connecting holes on the foregoing circuit plate, and above-mentioned carrier is mounted on the foregoing circuit plate by above-mentioned these first socles;
Fan is assembled on the above-mentioned load bearing seat, so that above-mentioned pyrotoxin is dispelled the heat; And
Lid, also comprise the clamshell that covers said fans and second socle more than above-mentioned these first socles are corresponding, above-mentioned these second socles combine with above-mentioned these first socles respectively, make said fans be assembled between above-mentioned carrier and the above-mentioned lid.
11. the electronic installation according to claim 10 it is characterized in that each first socle also includes the elasticity button, and above-mentioned these elasticity buttons is snapped in above-mentioned these connecting holes on the foregoing circuit plate.
12. the electronic installation according to claim 11 is characterized in that each elasticity button has accommodation space, each second socle has trip, and above-mentioned these trips lay respectively at above-mentioned these accommodation spaces.
13. the electronic installation according to claim 12, it is characterized in that each elasticity button has a plurality of groovings, make above-mentioned elasticity button form a plurality of fasteners, and one of above-mentioned these fasteners end has lug boss respectively, above-mentioned these lug bosses are snapped in above-mentioned these connecting holes, and wherein above-mentioned these groovings communicate with the accommodation space of this elasticity button itself.
14. the electronic installation according to claim 13, it is characterized in that each lug boss has sliding surface and breasting face respectively, above-mentioned these fasteners are arranged in above-mentioned these connecting holes via above-mentioned these sliding surfaces, and above-mentioned these breasting faces are interfered with the bottom of foregoing circuit plate.
15. the electronic installation according to claim 10 is characterized in that above-mentioned these first socles have the guidance part of second socle of guiding correspondence respectively.
16. the electronic installation according to claim 10, it is characterized in that said fans has a plurality of first holding sections, above-mentioned carrier also comprises and the second corresponding holding section of above-mentioned these first holding sections, makes above-mentioned these first holding sections engage mutually with above-mentioned these second holding sections.
17. the electronic installation according to claim 16 is characterized in that above-mentioned these first holding sections are locking hole, above-mentioned these second holding sections are trip.
18. the electronic installation according to claim 10, it is characterized in that above-mentioned lid also comprises a plurality of the 3rd holding sections that are equipped on above-mentioned clamshell, above-mentioned carrier also comprises a plurality of the 4th holding sections that are equipped on above-mentioned load bearing seat, and above-mentioned these the 3rd holding sections engage mutually with above-mentioned these the 4th holding sections.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610078472A CN101083894B (en) | 2006-05-30 | 2006-05-30 | Electronic device and heat radiating module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610078472A CN101083894B (en) | 2006-05-30 | 2006-05-30 | Electronic device and heat radiating module |
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| CN101083894A CN101083894A (en) | 2007-12-05 |
| CN101083894B true CN101083894B (en) | 2010-05-26 |
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| CN200610078472A Active CN101083894B (en) | 2006-05-30 | 2006-05-30 | Electronic device and heat radiating module |
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Cited By (1)
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| CN102338142A (en) * | 2010-07-16 | 2012-02-01 | 深圳富泰宏精密工业有限公司 | Clamping structure and electronic device employing same |
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| JP4995959B2 (en) * | 2010-09-28 | 2012-08-08 | ファナック株式会社 | Enclosure with multiple paths for mounting electronic components |
| CN103092294A (en) * | 2011-10-31 | 2013-05-08 | 鸿富锦精密工业(武汉)有限公司 | Fan module |
| CN105283053B (en) * | 2015-11-30 | 2017-08-25 | 英业达科技有限公司 | Radiating module |
| TWI597427B (en) | 2015-12-28 | 2017-09-01 | 鴻海精密工業股份有限公司 | Fan module |
| CN108135109B (en) * | 2017-12-20 | 2024-03-29 | 珠海英搏尔电气股份有限公司 | Fan assembly, motor controller and electric vehicle |
| CN112901558A (en) * | 2019-11-19 | 2021-06-04 | 英业达科技有限公司 | Fan structure |
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| Publication number | Publication date |
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| CN101083894A (en) | 2007-12-05 |
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