CN103817391A - Manufacturing method of bayonet-tube type fluid heat exchanger - Google Patents
Manufacturing method of bayonet-tube type fluid heat exchanger Download PDFInfo
- Publication number
- CN103817391A CN103817391A CN201410082807.4A CN201410082807A CN103817391A CN 103817391 A CN103817391 A CN 103817391A CN 201410082807 A CN201410082807 A CN 201410082807A CN 103817391 A CN103817391 A CN 103817391A
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- CN
- China
- Prior art keywords
- radiating fin
- modification
- heat exchange
- welded
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012530 fluid Substances 0.000 title claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 230000004048 modification Effects 0.000 claims abstract description 30
- 238000012986 modification Methods 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 19
- 239000011248 coating agent Substances 0.000 claims abstract description 13
- 238000000576 coating method Methods 0.000 claims abstract description 13
- 239000004065 semiconductor Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 23
- 229910052782 aluminium Inorganic materials 0.000 claims description 19
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 19
- 230000008020 evaporation Effects 0.000 claims description 15
- 238000001704 evaporation Methods 0.000 claims description 15
- 239000004411 aluminium Substances 0.000 claims description 14
- 229910045601 alloy Inorganic materials 0.000 claims description 12
- 239000000956 alloy Substances 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 9
- 238000003466 welding Methods 0.000 claims description 9
- 230000010354 integration Effects 0.000 claims description 8
- 241000208340 Araliaceae Species 0.000 claims description 7
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 claims description 7
- 235000003140 Panax quinquefolius Nutrition 0.000 claims description 7
- 235000008434 ginseng Nutrition 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 7
- 239000007921 spray Substances 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- UIFOTCALDQIDTI-UHFFFAOYSA-N arsanylidynenickel Chemical compound [As]#[Ni] UIFOTCALDQIDTI-UHFFFAOYSA-N 0.000 claims description 3
- 238000006479 redox reaction Methods 0.000 claims description 3
- 239000003054 catalyst Substances 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims description 2
- 239000008199 coating composition Substances 0.000 claims description 2
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 239000007800 oxidant agent Substances 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 14
- 229910052759 nickel Inorganic materials 0.000 abstract description 7
- 238000009713 electroplating Methods 0.000 abstract description 4
- 239000007788 liquid Substances 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract description 4
- 230000008569 process Effects 0.000 abstract description 3
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 abstract 1
- 239000010970 precious metal Substances 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 4
- 238000010992 reflux Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/04—Tubular or hollow articles
- B23K2101/14—Heat exchangers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
Abstract
The invention provides a manufacturing method of a bayonet-tube type fluid heat exchanger which is different from a heat pipe radiator in mechanism and is capable of pushing a working medium for phase-change heat transfer in a circulating pipeline by utilizing working heat of a semiconductor integrated module. A laser modification process of only coating on welded parts on the surface of an aluminum part is adopted for replacing an electroplating modification process of immersing the part in chemical nickel liquid so as to achieve the goals of environment protection in the whole course and saving precious metal, and the manufacturing method is suitable for manufacturing heat exchangers with large working heat and high heat density, such as high-power semiconductor temperature difference devices, power supplies, power amplifiers, infrared generators, laser generators and radar generators.
Description
Affiliated technical field
The present invention relates to a kind of fluid heat exchanger manufacture method, especially pipeline and intert the work calories that can utilize semiconductor integration module in the radiating fin manufacture method as the blade inserting fluid heat exchanger of power source propelling fluid phase-change circulation of working medium heat exchange.
Background technology
At present, utilize the work calories of semiconductor integration module to originate from heat-pipe radiator as power source promotion blade inserting fluid heat transferring, every heat pipe vertically interts in radiating fin as heat transfer element, hot intraductal working medium is to accept heat by axial evaporation heat transfer by hot junction, become after heat pipe cold junction through radiating fin heat exchange condensation, by radially absorbing liquid, utilize siphon power and gravity to reflux by incoming road, form working medium and in pipe, carry out diameter of axle circulation, because this endless form refluxes slow, working medium amount is few, substantially be to utilize fluid heat transferring, phase variable is little, several without exchange capability of heat, heat is main or the radiating fin of making by good heat conduction solid exchanges, therefore replaced by genuine fluid heat exchanger afterwards, in fluid heat exchanger, working medium is to accept heat by axially realizing evaporation at heat exchange source place by evaporation tube, enter the condenser pipe being inserted in radiating fin and carry out heat exchange, after condensation, assemble and conflux into liquid by tube wall, enter evaporation tube heat exchange source place by return duct by choke valve and accept again heat, form circulation line, working medium is carried out one-way circulation in circulation line, pipeline route is long to reflux soon, can connection in series-parallel, several times improve working medium amount, fill a prescription by working medium, increase the ratio that working medium undergoes phase transition, fluid phase change heat exchange is mated with radiating fin heat exchange ability, several times improve exchange capability of heat, the effect that improves high power semi-conductor integration module is played to irreplaceable effect, but, wherein radiating fin employing thickness is 0.1-0.4mm aluminium matter thin plate, in order to possess the ability of flash heat transfer, heat pipe vertically or at a certain angle tilts to intert and is welded to each other in the assembling circular hole of radiating fin side, the folded bottom of radiating fin and heat exchange base plate radiating surface are welded to each other, it is the above pure aluminum plate of 2.5mm that heat exchange base plate adopts thickness, so the surface of aluminium matter radiating fin and heat exchange base plate does not possess group's weldering property, need first aluminium matter part to be immersed in chemical nickel liquid, make it all surfaces and carry out material modification by 8 one 16 millimicrons of nickel dams of the general plating of strong ion, then could in Reflow Soldering, realize welding grows up to be a useful person, the surface of actual participation welding only accounts for 58% of all surfaces, more than 90% modification is not necessary, with few take many, heat is by surface exchange, nickel is slower than aluminium heat exchange rate, seemingly cover one deck heat resistance film tool barrier, what is more important chemical nickel electroplating technology does not meet environmental requirement, must progressively abandon.
Summary of the invention
There is electroplating technology and the large drawback of noble metal wastage for fear of existing fluid heat exchanger manufacture, the present invention is a kind of only applies laser modified technique in aluminium matter piece surface welding position, be about to need welding position to be designed to pattern, adopt the method for printing material spray, make surface, welding position according to layout coated alloy scolder, coating can divide once or twice, by laser scanning and hot reflux scan mode, only make within the scope of layout coating, accepting in laser and backflow pyroprocess, there is redox reaction, destroy the firm oxide layer formation alloy ginseng in aluminium surface and ooze the partial modification causing with alloy pellicle, alloy pellicle is electroplated and is had more good conductive welding basis than chemical nickel, reach the object that more easily welding is grown up to be a useful person.
The technical solution adopted for the present invention to solve the technical problems is: a kind of manufacture method of combining closely with semiconductor integration module thermal conductive surface and utilizing phase-change circulation of working medium fluid heat exchanger in its work calories driving pipeline, the radiating fin made from aluminum material, heat exchange base plate is as part, first need the position being welded to each other to be designed to pattern, adopt the method for numerical control spraying, make surface, aluminium matter welding position apply congee sample solder according to layout, the solder formula applying is different, can divide once or twice, disposable coating material is taken into account ginseng and is oozed and pellicle, secondary coating material is divided into once lays particular stress on ginseng and oozes secondary and lay particular stress on film forming, then thickness is less than to the thin plate of 0.5mm by the mode of laser scanning, pulsewidth regulation and control laser energy intensity, laser only scans coat, through coat and aluminium surface oxide layer, make within the scope of layout coating, accepting in laser pyroprocess, the redox reaction formation alloy ginseng occurring is sharply oozed the partial modification causing with alloy pellicle, moment completes material modification and realizes thus solderability, thickness is greater than to the heat exchange base plate that 2.5mm pure aluminum plate is made, except adopting laser, also can adopt the modification of backflow high temeperature chemistry, part assembles according to structural requirement after getting ready, by radiating fin parallel arrangement, condenser pipe axially vertically or at a certain angle tilts to intert in the assembling circular hole of radiating fin, evaporation pipeline axially vertically or at a certain angle tilts to be placed in the arcuate channels of radiating fin, the radiating fin folded bottom of modification is aimed at heat exchange base plate radiating surface modification position, and in the gap of above-mentioned assembling between two or apply the congee sample cored solder that contains scaling powder in the hopper of gap, completing assembling applies after cored solder, put into shape-setting clamp, by Reflow Soldering, evaporation tube outer surface and arcuate channels medial surface are welded to each other, condenser pipe outer surface is welded to each other with assembling circular hole medial surface, the folded bottom of radiating fin and heat exchange base plate radiating surface are welded to each other, make the fluid heat exchanger that can utilize semiconductor integration module work calories to carry out heat exchange, complete thus the manufacture method of blade inserting fluid heat exchanger.
The invention has the beneficial effects as follows and make the thorough electroplating technology that departs from fluid heat exchanger manufacture process, omnidistance technique realizes environmental protection, a large amount of noble metals of saving, after product rejection, be convenient to each composition in product and separate, re-use, be beneficial to non-ferrous metal and form recycling economy, significantly reduce product cost, be particularly useful for the work calorieses such as high power semi-conductor temperature difference device, power supply, power amplifier, infrared, laser, radar generator large, the manufacture of the heat exchanger that heat density is high.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described:
Fig. 1 is the signal of embodiment of the present invention part.
Fig. 2 is embodiment of the present invention assembling signal.
In figure: 1. circular hole 5. circumferential band 6. bucket material nest 7. arcuate channels 8. open stirrups 9. folded bottom 10. condenser pipe 11. evaporation tubes are assembled at radiating fin 2. heat exchange base plate 3. modification positions 4.
The specific embodiment
Figure 1 shows that the part of the embodiment of the present invention, launch aluminium matter radiating fin 1 fitting surface on heat exchange base plate 2 radiating surfaces on, first need the position being welded to each other to be designed to pattern, and programming is input in NC Spraying Machine, using congee sample nickel scolder as material spray, mix up material spray amount, spray to according to layout the upper coat that forms in 3 surfaces, modification position that aluminium matter need to be welded, in figure to be coated with shown in ash, the scolder applying is by reductant-oxidant and intensity thereof, catalyst, nickeline particle order number is by certain formula modulation, different coating formula is different, disposable coating material formula is taken into account and is joined the formation of oozing with pellicle, be called mixture, be generally used for the modification of heat exchange base plate backflow high temeperature chemistry, secondary coating material is divided into once formula and biases toward alloy and join the formation of oozing, secondary formula biases toward the formation of alloy film, being called layer joins, be generally used for radiating fin laser high temperature modified, cleaning is exposed after modified surface, radiating fin carries out machined, to assemble the stretched circumferential band 5 of circular hole 4, modification is towards interior, above circumferential band, stamp out the bucket material nest 6 that outer imperial palace is little, by stretched arcuate channels 7 open stirrups 8, modification is towards interior, radiating fin bottom folds wide 3mm right angle folded bottom 9, modification towards outside, part is got ready and is assembled, complete thus the preparation of part.
Figure 2 shows that the assembling of the embodiment of the present invention, according to structural requirement by radiating fin 1 parallel arrangement, condenser pipe 10 tunnels axially vertically or at a certain angle tilt to intert in the assembling circular hole 4 of radiating fin, and apply the congee sample cored solder that contains scaling powder in bucket material nest 6, evaporation tube 11 tunnels axially vertically or at a certain angle tilt to be placed in the arcuate channels 7 of radiating fin, put into radiating fin shape-setting clamp, evaporation tube and arcuate channels gap, the radiating fin folded bottom 9 of modification, heat exchange base plate radiating surface modification position 3, apply scolder by wave-soldering, finally, radiating fin fixture and heat exchange base plate 2 elastic couplings, by Reflow Soldering, condenser pipe outer surface and component location guide hole circumferential band 5 inner surfaces are welded to each other, evaporation tube outer surface and arcuate channels open stirrups 8 inner surfaces are welded to each other, the folded bottom of radiating fin and heat exchange base plate radiating surface are welded to each other, the thermal resistance of avoiding various gaps to cause, form the assembling of integrated good heat conduction, be applicable to batch production, make thus and can utilize semiconductor integration module work calories to carry out the manufacture method of the blade inserting fluid heat exchanger of heat exchange.
Claims (3)
1. the manufacture method of the blade inserting fluid heat exchanger of phase-change circulation of working medium in its work calories driving pipeline of combining closely with semiconductor integration module thermal conductive surface and utilize, it is characterized in that the radiating fin made from aluminum material, heat exchange base plate is as part, first need the position being welded to each other to be designed to pattern, adopt the method for numerical control spraying, make surface, aluminium matter welding position apply congee sample solder according to layout, the solder formula applying is different, can divide once or twice, disposable coating material is taken into account ginseng and is oozed and pellicle, secondary coating material is divided into once lays particular stress on ginseng and oozes secondary and lay particular stress on film forming, then thickness is less than to the thin plate of 0.5mm by the mode of laser scanning, pulsewidth regulation and control laser energy intensity, laser only scans coat, through coat and aluminium surface oxide layer, make within the scope of layout coating, accepting in laser pyroprocess, the redox reaction formation alloy ginseng occurring is sharply oozed the partial modification causing with alloy pellicle, moment completes material modification and realizes thus solderability, thickness is greater than to the heat exchange base plate that 2.5mm pure aluminum plate is made, except adopting laser, also can adopt the modification of backflow high temeperature chemistry, part assembles according to structural requirement after getting ready, by radiating fin parallel arrangement, condenser pipe axially vertically or at a certain angle tilts to intert in the assembling circular hole of radiating fin, evaporation pipeline axially vertically or at a certain angle tilts to be placed in the arcuate channels of radiating fin, the radiating fin folded bottom of modification is aimed at heat exchange base plate radiating surface modification position, and in the gap of above-mentioned assembling between two or apply the congee sample cored solder that contains scaling powder in the hopper of gap, completing assembling applies after cored solder, put into shape-setting clamp, by Reflow Soldering, evaporation tube outer surface and arcuate channels medial surface are welded to each other, condenser pipe outer surface is welded to each other with assembling circular hole medial surface, the folded bottom of radiating fin and heat exchange base plate radiating surface are welded to each other, complete thus the manufacture method of blade inserting fluid heat exchanger.
2. the manufacture method of blade inserting fluid heat exchanger according to claim 1, it is characterized in that: launch aluminium matter radiating fin 1 fitting surface on heat exchange base plate 2 radiating surfaces on, first need the position being welded to each other to be designed to pattern, and programming is input in NC Spraying Machine, using congee sample nickeline scolder as material spray, mix up material spray amount, spray to according to layout the upper coat that forms in 3 surfaces, modification position that aluminium matter need to be welded, in figure to be coated with shown in ash, the scolder applying is by reductant-oxidant and intensity thereof, catalyst, nickeline particle order number is by certain formula modulation, different coating formula is different, disposable coating material formula is taken into account and is joined the formation of oozing with pellicle, be called mixture, be generally used for the modification of heat exchange base plate backflow high temeperature chemistry, secondary coating material is divided into once formula and biases toward alloy and join the formation of oozing, secondary formula biases toward the formation of alloy film, being called layer joins, be generally used for radiating fin laser high temperature modified, cleaning is exposed after modified surface, radiating fin carries out machined, to assemble the stretched circumferential band 5 of circular hole 4, modification is towards interior, above circumferential band, stamp out the bucket material nest 6 that outer imperial palace is little, by stretched arcuate channels 7 open stirrups 8, modification is towards interior, radiating fin bottom folds wide 3mm right angle folded bottom 9, modification towards outside, complete thus the preparation of part.
3. the manufacture method of blade inserting fluid heat exchanger according to claim 1, it is characterized in that: according to structural requirement by radiating fin 1 parallel arrangement, condenser pipe 10 tunnels axially vertically or at a certain angle tilt to intert in the assembling circular hole 4 of radiating fin, and apply the congee sample cored solder that contains scaling powder in bucket material nest 6, evaporation tube 11 tunnels axially vertically or at a certain angle tilt to be placed in the arcuate channels 7 of radiating fin, put into radiating fin shape-setting clamp, evaporation tube and arcuate channels gap, the radiating fin folded bottom 9 of modification, heat exchange base plate radiating surface modification position 3, apply scolder by wave-soldering, finally, radiating fin fixture and heat exchange base plate 2 elastic couplings, by Reflow Soldering, condenser pipe outer surface and component location guide hole circumferential band 5 inner surfaces are welded to each other, evaporation tube outer surface and arcuate channels open stirrups 8 inner surfaces are welded to each other, the folded bottom of radiating fin and heat exchange base plate radiating surface are welded to each other, form the assembling of integrated good heat conduction, make thus and can utilize semiconductor integration module work calories to carry out the manufacture method of the blade inserting fluid heat exchanger of heat exchange.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410082807.4A CN103817391B (en) | 2014-03-10 | 2014-03-10 | The manufacture method of blade inserting fluid heat exchanger |
Applications Claiming Priority (1)
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CN201410082807.4A CN103817391B (en) | 2014-03-10 | 2014-03-10 | The manufacture method of blade inserting fluid heat exchanger |
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CN103817391A true CN103817391A (en) | 2014-05-28 |
CN103817391B CN103817391B (en) | 2016-08-17 |
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CN201410082807.4A Expired - Fee Related CN103817391B (en) | 2014-03-10 | 2014-03-10 | The manufacture method of blade inserting fluid heat exchanger |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105261596A (en) * | 2015-09-23 | 2016-01-20 | 吴鸿平 | Lighting LED integrated thermal movement device |
CN108150854A (en) * | 2017-12-27 | 2018-06-12 | 深圳市科太科技有限公司 | LED integrates the manufacturing method that heat moves chip and its lamps and lanterns |
CN112935440A (en) * | 2021-01-28 | 2021-06-11 | 山东奇威特太阳能科技有限公司 | Welding method of carbon steel tube finned heat exchanger |
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CN1962941A (en) * | 2006-11-22 | 2007-05-16 | 哈尔滨工业大学 | Cold spray-coating method for composite solder of conduit and fin of aluminium alloy heat exchanger |
JP2010065916A (en) * | 2008-09-10 | 2010-03-25 | Hitachi Cable Ltd | Heat exchanger and method of manufacturing the same |
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2014
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Patent Citations (6)
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JP2002188894A (en) * | 2000-12-19 | 2002-07-05 | Fujine Sangyo:Kk | Heat pipe type heat exchanger and its manufacturing method |
CN1520343A (en) * | 2001-06-28 | 2004-08-11 | ���п�ķ�����Ϲɷݹ�˾ | Method of mfg. heat transfer tubes |
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CN1962941A (en) * | 2006-11-22 | 2007-05-16 | 哈尔滨工业大学 | Cold spray-coating method for composite solder of conduit and fin of aluminium alloy heat exchanger |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN105261596A (en) * | 2015-09-23 | 2016-01-20 | 吴鸿平 | Lighting LED integrated thermal movement device |
CN108150854A (en) * | 2017-12-27 | 2018-06-12 | 深圳市科太科技有限公司 | LED integrates the manufacturing method that heat moves chip and its lamps and lanterns |
CN112935440A (en) * | 2021-01-28 | 2021-06-11 | 山东奇威特太阳能科技有限公司 | Welding method of carbon steel tube finned heat exchanger |
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Effective date of registration: 20161206 Address after: Shenzhen Nanshan District City, Guangdong province 518067 merchants street seven Industrial Road No. 40 South Garden Court 13D CLS Patentee after: SHENZHEN KETAI TECHNOLOGY CO.,LTD. Address before: 518067 Guangdong seven Shenzhen road Nanshan District Shekou Industrial Garden Court 13D Nanhai Cadenza Patentee before: Wu Hongping Patentee before: Lu Honglong |
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Granted publication date: 20160817 |