CN103811634A - Packaging adhesive surface matted LED (light-emitting diode) device, packaging method thereof and LED display screen - Google Patents
Packaging adhesive surface matted LED (light-emitting diode) device, packaging method thereof and LED display screen Download PDFInfo
- Publication number
- CN103811634A CN103811634A CN201410039006.XA CN201410039006A CN103811634A CN 103811634 A CN103811634 A CN 103811634A CN 201410039006 A CN201410039006 A CN 201410039006A CN 103811634 A CN103811634 A CN 103811634A
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- packing colloid
- led device
- colloid
- packing
- microballoon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
The invention discloses a packaging adhesive surface matted LED (light-emitting diode) device which comprises an LED support, at least one LED chip and packaging adhesives. The LED chips are positioned on the LED support, the packaging adhesives cover the LED chips, a plurality of microspheres are arranged on the surfaces of the packaging adhesives, and the density of the microspheres is lower than that of the packaging adhesives. As the microspheres are arranged on the surfaces of the packaging adhesives, the surfaces of the packaging adhesives can be roughened and matted, diffuse reflection of the surface of the LED device can be realized when the packaging adhesives are applied to an LED display screen, light-emitting effects are fine, and the problem of poor light-emitting effects of a display screen in the prior art is avoided. The invention further discloses a packaging method and the LED display screen.
Description
Technical field
The present invention relates to a kind of LED device and method for packing thereof, particularly relate to a kind of LED device of packing colloid matte surface and method for packing and the LED display of matte surface.
Background technology
Traditional LED device, its colloid surface is smooth, and roughness is little, while being made into LED display, easily causes whole display screen surface reflective, affects the light effect that of whole LED display; On the other hand, the colloid surface of LED device is smooth, easily forms glare phenomenon.Therefore, if will solve the reflective problem of LED device surface, realize diffuse reflection, improve the light effect that of whole LED display, need to increase the roughness of LED device colloid surface.
As can be seen here, provide a kind of method for packing and LED device of LED device package colloid surface dumb light, can realize the diffuse reflection of LED device surface, solve the problems such as above-mentioned display screen bright dipping weak effect, this is the current technical issues that need to address in this area.
Summary of the invention
In order to overcome above-mentioned deficiency of the prior art, the object of the invention is to, a kind of LED device of packing colloid matte surface is provided, can realize packing colloid surface roughening, produce the effect of matte surface, realize the diffuse reflection of LED device surface.Based on this, the present invention also provides a kind of method for packing and LED display based on this kind of LED device.
For reaching this object, technical scheme of the present invention is as follows:
The LED device of a kind of packing colloid matte surface of the present invention, comprise LED support, at least one is positioned at the LED chip on described LED support, cover the packing colloid of described LED chip, surface at described packing colloid is also provided with multiple microballoons, and the density of described microballoon is less than the density of described packing colloid.
Preferably, the grain diameter of described microballoon is 3 μ m～10 μ m.
Preferably, the mass ratio of described microballoon and packing colloid is 5%-30%.
Preferably, the density of described microballoon is 0.21g/cm
3～0.22g/cm
3.
Preferably, described microballoon is silicon dioxide microsphere.
Preferably, the particle that described microballoon is boring or be less than the particle of outer wrap layer density for spongiform particle or for inner core volume density.
Preferably, described microballoon is that shape is spherical or erose particle.
Preferably, at least part of described microballoon is all or part of to be exposed on described packing colloid surface, and the surface roughness of described packing colloid is 0.1 μ m～10 μ m.
Preferably, from described packing colloid edge to center, described microballoon is uniformly distributed; Or, be positioned at described in the microballoon concentration ratio of described packing colloid fringe region the microballoon concentration of packing colloid central area large; Or, be positioned at described in the microballoon concentration ratio of described packing colloid fringe region the microballoon concentration of packing colloid central area little.
The invention provides a kind of method for packing of LED device of aforementioned packing colloid matte surface, comprise the step of assembling, encapsulation, sclerosis, in described encapsulation step, microballoon is added in the packing colloid preparing and stirred, then put glue.
Preferably, in described cure step, when sclerosis, furnace temperature is started to heat up from room temperature, until reach the hardening temperature of packing colloid, its viscosity from high to low, then raises until solidify.
Preferably, described packing colloid is any one in bisphenol type epoxy colloid, aromatic epoxies colloid, alicyclic epoxy colloid, remodeling epoxy colloid (being silicones).
Preferably, under normal temperature, the viscosity of described packing colloid is 1800～2200mPa.s, and the lasting time of described intensification is 15～20 minutes.
A kind of LED display of the present invention, comprise LED device, for installing and be electrically connected the PCB circuit board of described LED device and being placed in face shield, the LED device that described LED device is aforesaid packing colloid matte surface or the LED device making for aforesaid method for packing of described PCB circuit board top.
Compared with prior art, LED device of the present invention, owing to being less than the microballoon of packing colloid density at the surperficial density of setting of packing colloid, thereby, can make packing colloid surface roughening, realize the effect of matte surface, be applied in LED display, can realize the diffuse reflection of LED device surface, whole LED display display effect is good, has avoided the problem of display screen bright dipping weak effect in prior art.
Method for packing of the present invention, during due to encapsulation, at the inner doping of packing colloid microballoon, because the density of microballoon is less than packing colloid density, microballoon just floats up to the surface of LED device package colloid automatically, and after sclerosis, microballoon is fixed on packing colloid surface, thereby can realize packing colloid surface roughening, realize the effect of matte surface.And microballoon is added to packing colloid inside, do not need through other special processings, only utilize the density of microballoon to be less than the density of packing colloid, microballoon floating automatically in packing colloid hardening process, just can increase the roughness of LED device surface colloid, realize the dumb light effect of LED device surface colloid.Adopt method for packing of the present invention to encapsulate the LED device obtaining, not only realized the dumb light effect of LED device surface, and technique is simple, cost is low.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED device of packing colloid matte surface in the embodiment of the present invention one;
Fig. 2 is the profile of microballoon in Fig. 1;
Fig. 3 is the profile of microballoon in the embodiment of the present invention two;
Fig. 4 is the profile of three kinds of microballoons of the embodiment of the present invention;
Fig. 5 is the flow chart of the method for packing of LED device package colloid surface dumb light in the embodiment of the present invention four.
Embodiment
Basic conception of the present invention is, in the time of LED device package, in packing colloid, sneak into microballoon, the density of microballoon is less than the density of packing colloid, and microballoon automatic-ascending is to the surface of packing colloid, thereby after sclerosis, microballoon is fixed on packing colloid surface, makes packing colloid surface roughening, realizes the effect of matte surface, be applied in LED display, can realize the diffuse reflection of LED device surface.Wherein, the structure of microballoon and material can adopt various ways, as being the particle of hollow-core construction, or for entirety has the spongy particle of multiple micropores, or are less than the particle of outer wrap layer for inner core volume density.
For making technical scheme of the present invention clearer, come by specific embodiment below in conjunction with accompanying drawing that the present invention is described in detail.
Embodiment mono-
As shown in Figure 1, the LED device of the packing colloid matte surface of the present embodiment, comprise LED support 1, at least one is positioned at the LED chip 2 on LED support 1, connect the wire 3 of LED chip 2 and LED support 1 pin, the packing colloid 4 that covers LED chip 2 and wire 3, is also provided with multiple microballoons 5 in packing colloid 4 surfaces.In other embodiment, described LED chip 2 also can be flip-chip, and wire can be set, and packing colloid covers all LED chips.
As shown in Figure 2, microballoon 5 is the inner tiny balloon with cavity, and it is shaped as spherical, and in other embodiments, shape also can be the ellipsoid bodily form or other are irregularly shaped.
As the preferred technical scheme of one, the microballoon 5 in the present embodiment is SiO 2 hollow microsphere, and in other embodiments, those skilled in the art can select according to the technological know-how of its grasp the tiny balloon of other materials.
As can be seen from Figure 1, SiO 2 hollow microsphere 5 is multiple, be suspended in the surface of described packing colloid 4, at least part of SiO 2 hollow microsphere 5, its part is surrounded by described packing colloid 4, another part is exposed to packing colloid 4 outsides (being that the packed colloid of tiny balloon part floods), makes packing colloid 4 rough surface, forms the effect of packing colloid 4 matte surfaces.
In the present embodiment, the particle size range of SiO 2 hollow microsphere 5 is 3-10 μ m, because SiO 2 hollow microsphere 5 parts are exposed to packing colloid 4 outsides, form the shaggy effect of packing colloid 4, the packing colloid surface roughness forming is thus 0.1-10 μ m.
In the present embodiment, the density of SiO 2 hollow microsphere 5 is 0.21-0.22g/cm
3(gram/cc), this density, much smaller than the density of packing colloid, is convenient to the encapsulation of follow-up LED device.
Embodiment bis-
As shown in Figure 3, different from embodiment mono-, the microballoon 5 in the present embodiment is spongy microballoon, and entirety has multiple micropores 51, and microballoon be shaped as irregularly shaped.The miscellaneous part of the LED device of the packing colloid matte surface in the present embodiment and position relationship are all identical with embodiment mono-, repeat no more herein.
Embodiment tri-
As shown in Figure 4, different from embodiment mono-, the microballoon 5 in the present embodiment comprises inner core body 52 and is wrapped in the outer wrap layer 53 of inner core body 52 outsides, and the density of inner core body 52 is less than the density of outer wrap layer 53.The miscellaneous part of the LED device of the packing colloid matte surface in the present embodiment and position relationship are all identical with embodiment mono-, repeat no more herein.
Embodiment tetra-
LED device based in embodiment mono-, the present embodiment provides a kind of method for packing of LED device package colloid surface dumb light, and technique is simple, and cost is low.
As shown in Figure 5, the method specifically comprises the following steps:
S101, assembling: in this step, comprise and expand crystalline substance, die bond and these three little steps of kind line.This step is the routine techniques in this area, repeats no more herein.
S102, encapsulation: in this step, need configuration packages colloid according to actual industry, the SiO 2 hollow microsphere of getting ready is in advance added in the packing colloid preparing, the packing colloid that adds SiO 2 hollow microsphere is stirred with 600 revs/min, mixing time is 6 minutes, make SiO 2 hollow microsphere be distributed in equably packing colloid inside, after having stirred, carry out a glue.Wherein, in other embodiments, any value of stirring in can 450～750 revs/min carried out, and mixing time can be any value in 4～8 minutes.
Wherein, the SiO 2 hollow microsphere adding and the mass ratio of packing colloid are preferably 5%-30%, and in the time that the mass ratio of SiO 2 hollow microsphere and packing colloid is 5%, its dumb light effect is significantly increased, more dumb light effect is more obvious for mass ratio, but if mass ratio is greater than 30%, the viscosity of packing colloid is too large, cause the some glue process in later stage to be difficult to normally carry out, therefore in the present embodiment, the mass ratio of described SiO 2 hollow microsphere and packing colloid is preferably 5%-30%.
S103, sclerosis:
The LED device that a glue is completed hardens.For improving dumb light effect, increase particle floating probability, when sclerosis, furnace temperature starts to rise from room temperature, until reach the hardening temperature of packing colloid.In the time that under normal temperature, packing colloid viscosity is 1800～2200mPa.s, furnace temperature rises from room temperature, until reach the hardening temperature of packing colloid, required time is 15-20 minute.
Raise with temperature, the viscosity of packing colloid is by high step-down, raise until solidify gradually again, utilize this characteristic of packing colloid, in the time that packing colloid viscosity is lower, the density based on SiO 2 hollow microsphere is less than this characteristic of density of packing colloid, and SiO 2 hollow microsphere floats up to the speed on packing colloid surface to be accelerated, finally be frozen into after solid-state packing colloid at packing colloid, SiO 2 hollow microsphere is fixed on packing colloid surface.As the preferred technical scheme of one, described packing colloid is any one in bisphenol type epoxy colloid, aromatic epoxies colloid, alicyclic epoxy colloid, remodeling epoxy (silicones) colloid etc.
After sclerosis, SiO 2 hollow microsphere 5 is distributed in the surface of LED device equably.
In other embodiments, to be positioned at the concentration of concentration ratio packing colloid central area of packing colloid fringe region large for SiO 2 hollow microsphere; Or by by external force, also can make the concentration of SiO 2 hollow microsphere concentration ratio packing colloid central area of the fringe region that is positioned at packing colloid little.
In the present embodiment, the grain diameter of described SiO 2 hollow microsphere is 3-10 μ m, and part is exposed to the packing colloid surface of LED device, and the packed colloid of part surrounds, therefore the roughness of the LED device surface forming is thus 0.1-10 μ m.
Equally, the LED device of embodiment bis-, enforcement three also can encapsulate by the method for the present embodiment.
The method of the present embodiment has following beneficial effect:
In the method for the present embodiment, SiO 2 hollow microsphere is added to packing colloid inside, do not need through other special processings, because the density of SiO 2 hollow microsphere is less than the density of packing colloid, so SiO 2 hollow microsphere floating automatically in packing colloid hardening process, thereby increase the roughness of LED device package colloid surface, realize the dumb light effect of LED device package colloid surface, adopt the LED device of this method encapsulation, not only realize the dumb light effect of LED device surface, and technique is simple, cost is low.
Embodiment five
The present embodiment provides a kind of LED display of LED device of the surperficial colloid dumb light based on embodiment mono-, it comprises the LED device in embodiment mono-, for installing and be electrically connected the PCB circuit board of described LED device and being placed in the face shield of described PCB circuit board top.LED display in the present embodiment, due to the dumb light effect of LED device surface colloid, has reduced the reflecting effect of display screen surface LED device, has strengthened the contrast of LED display demonstration image.
Below be only the preferred embodiment of the present invention, it should be pointed out that above-mentioned preferred implementation should not be considered as limitation of the present invention, protection scope of the present invention should be as the criterion with claim limited range.For those skilled in the art, without departing from the spirit and scope of the present invention, can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (14)
1. the LED device of a packing colloid matte surface, comprise LED support, at least one is positioned at the LED chip on described LED support, cover the packing colloid of described LED chip, it is characterized in that, surface at described packing colloid is also provided with multiple microballoons, and the density of described microballoon is less than the density of described packing colloid.
2. the LED device of packing colloid matte surface as claimed in claim 1, is characterized in that, the grain diameter of described microballoon is 3 μ m～10 μ m.
3. the LED device of packing colloid matte surface as claimed in claim 1, is characterized in that, the mass ratio of described microballoon and packing colloid is 5%～30%.
4. the LED device of packing colloid matte surface as claimed in claim 1, is characterized in that, the density of described microballoon is 0.21g/cm
3～0.22g/cm
3.
5. the LED device of packing colloid matte surface as claimed in claim 1, is characterized in that, described microballoon is silicon dioxide microsphere.
6. the LED device of packing colloid matte surface as claimed in claim 1, is characterized in that, the particle that described microballoon is boring or for having the spongy particle of multiple micropores or being less than the particle of outer wrap layer density for inner core volume density.
7. the LED device of packing colloid matte surface as claimed in claim 1, is characterized in that, described microballoon is that shape is spherical or erose particle.
8. the LED device of packing colloid matte surface as claimed in claim 1, is characterized in that, at least part of described microballoon is all or part of to be exposed on described packing colloid surface, and the surface roughness of described packing colloid is 0.1 μ m～10 μ m.
9. the LED device of packing colloid matte surface as claimed in claim 1, is characterized in that, from described packing colloid edge to center, described microballoon is uniformly distributed; Or the microballoon concentration of microballoon concentration ratio packing colloid central area that is positioned at described packing colloid fringe region is large; Or, be positioned at described in the microballoon concentration ratio of described packing colloid fringe region the microballoon concentration of packing colloid central area little.
10. a method for packing for the LED device of the packing colloid matte surface as described in claim 1～9, comprises and it is characterized in that the step of assembling, encapsulation, sclerosis, in described encapsulation step, microballoon is added in the packing colloid preparing and is stirred, and then puts glue.
The method for packing of the LED device of 11. packing colloid matte surfaces as claimed in claim 10, is characterized in that, in described cure step, when sclerosis, furnace temperature is started to heat up from room temperature, until reach the hardening temperature of packing colloid, its viscosity from high to low, then raises until solidify.
The method for packing of the LED device of 12. packing colloid matte surfaces as claimed in claim 11, is characterized in that, described packing colloid is any one in bisphenol type epoxy colloid, aromatic epoxies colloid, alicyclic epoxy colloid, remodeling epoxy colloid.
13. method for packing of the LED device of packing colloid matte surface as claimed in claim 11, is characterized in that, under normal temperature, the viscosity of described packing colloid is 1800～2200mPa.s, and the lasting time of described intensification is 15～20 minutes.
14. 1 kinds of LED displays, comprise LED device, for installing and be electrically connected the PCB circuit board of described LED device and being placed in the face shield of described PCB circuit board top, it is characterized in that, described LED device is the LED device of the packing colloid matte surface described in claim 1～9 any one or the LED device that makes for the method for packing described in claim 10～13 any one.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410039006.XA CN103811634A (en) | 2014-01-26 | 2014-01-26 | Packaging adhesive surface matted LED (light-emitting diode) device, packaging method thereof and LED display screen |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410039006.XA CN103811634A (en) | 2014-01-26 | 2014-01-26 | Packaging adhesive surface matted LED (light-emitting diode) device, packaging method thereof and LED display screen |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104048235A (en) * | 2014-06-18 | 2014-09-17 | 无锡市崇安区科技创业服务中心 | Light distribution system and method of LED pluggable unit elliptic lamp |
| KR20170135689A (en) * | 2016-05-31 | 2017-12-08 | 니치아 카가쿠 고교 가부시키가이샤 | Light emitting device and method for manufacturing the same |
| JP2019004134A (en) * | 2017-06-12 | 2019-01-10 | 日亜化学工業株式会社 | Light-emitting device and method for manufacturing the same |
| CN109929136A (en) * | 2017-12-15 | 2019-06-25 | Tcl集团股份有限公司 | Modified hollow microsphere and its preparation method and application |
| CN113560154A (en) * | 2021-07-28 | 2021-10-29 | 盐城东山精密制造有限公司 | Method for realizing matte surface by surface coating |
| CN113903849A (en) * | 2021-08-24 | 2022-01-07 | 汇涌进光电(浙江)有限公司 | LED device with matte surface and packaging method thereof |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104048235A (en) * | 2014-06-18 | 2014-09-17 | 无锡市崇安区科技创业服务中心 | Light distribution system and method of LED pluggable unit elliptic lamp |
| CN104048235B (en) * | 2014-06-18 | 2016-05-04 | 无锡市崇安区科技创业服务中心 | A kind of light distributing system and light distributing method thereof of LED plug-in unit elliptical lamp |
| KR20170135689A (en) * | 2016-05-31 | 2017-12-08 | 니치아 카가쿠 고교 가부시키가이샤 | Light emitting device and method for manufacturing the same |
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| US11430928B2 (en) | 2016-05-31 | 2022-08-30 | Nichia Corporation | Light-emitting device with exposed filter particles |
| JP2019004134A (en) * | 2017-06-12 | 2019-01-10 | 日亜化学工業株式会社 | Light-emitting device and method for manufacturing the same |
| JP7137050B2 (en) | 2017-06-12 | 2022-09-14 | 日亜化学工業株式会社 | Light-emitting device and manufacturing method thereof |
| CN109929136A (en) * | 2017-12-15 | 2019-06-25 | Tcl集团股份有限公司 | Modified hollow microsphere and its preparation method and application |
| CN109929136B (en) * | 2017-12-15 | 2021-06-18 | Tcl科技集团股份有限公司 | Modified hollow microsphere and preparation method and application thereof |
| CN113560154A (en) * | 2021-07-28 | 2021-10-29 | 盐城东山精密制造有限公司 | Method for realizing matte surface by surface coating |
| CN113903849A (en) * | 2021-08-24 | 2022-01-07 | 汇涌进光电(浙江)有限公司 | LED device with matte surface and packaging method thereof |
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Application publication date: 20140521 |