CN103811377B - A kind of liquid coating trimming device - Google Patents
A kind of liquid coating trimming device Download PDFInfo
- Publication number
- CN103811377B CN103811377B CN201210445789.2A CN201210445789A CN103811377B CN 103811377 B CN103811377 B CN 103811377B CN 201210445789 A CN201210445789 A CN 201210445789A CN 103811377 B CN103811377 B CN 103811377B
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- Prior art keywords
- wafer
- cup
- processing
- chamber
- trimming
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C15/00—Enclosures for apparatus; Booths
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1039—Recovery of excess liquid or other fluent material; Controlling means therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/002—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the work consisting of separate articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to and on wafer, form coating liquid film and remove the equipment of part protecting film, specifically a kind of liquid coating trimming device, including base plate, processing cup, process chamber, ring gate, trimming nozzle, wafer-supporting platform, spindle motor and process cup, wherein processing cup is arranged on base plate, being provided with the spindle motor being arranged on base plate in processing cup, the outfan of spindle motor is connected to the wafer-supporting platform of bearing wafer; Between processing cup and wafer-supporting platform, ecto-entad is sequentially provided with liftable process chamber and liftable ring gate, the upper face processing chamber is provided with liftable trimming nozzle, the bottom processing chamber is connected to the process cup processing chamber lifting, and ring gate is processing chamber and processing between cup; Processing and have the otch by ring gate lift control switch on the chamber arm in chamber, wafer processes intracavity through this otch feeding and is placed on wafer-supporting platform. The processed cover of the liquid that wafer of the present invention throws away or process chamber are collected and are discharged, and will not splash down and on craft cup, wafer be polluted.
Description
Technical field
The present invention relates to and on wafer, form coating liquid film and remove the equipment of part protecting film, specifically a kind of liquid coating trimming device.
Background technology
At present, known liquid application device is mainly made up of nozzle arm, protection cup, discharge opeing room, centrifuge part etc. After forming protecting film on the semiconductor wafer or in its coating, the edge of wafer needs protecting film is removed a part, it is necessary to carry out trimming technology. When being coated technique and trimming technology, the liquid that wafer throws away can splash down on craft cup aside; If there being liquid to accumulate on craft cup, when wafer comes in and goes out process cavity, liquid can be dropped on wafer, causes the pollution of wafer.
Summary of the invention
The liquid thrown away to solve wafer splashes down the problem causing wafer contamination at craft cup, it is an object of the invention to provide a kind of wafer that can block and throws away the liquid coating trimming device of liquid.
It is an object of the invention to be achieved through the following technical solutions:
The present invention includes base plate, processing cup, process chamber, ring gate, trimming nozzle, wafer-supporting platform, spindle motor and processes cup, wherein processing cup is arranged on base plate, being provided with the spindle motor being arranged on base plate in processing cup, the outfan of spindle motor is connected to the wafer-supporting platform of bearing wafer; Between processing cup and wafer-supporting platform, ecto-entad is sequentially provided with liftable process chamber and liftable ring gate, the upper face in described process chamber is provided with liftable trimming nozzle, the bottom processing chamber is connected to the process cup processing chamber lifting, and ring gate is processing chamber and processing between cup;Having the otch by described ring gate lift control switch in the cavity wall in described process chamber, wafer processes intracavity through this otch feeding and is placed on wafer-supporting platform.
Wherein: described process chamber upper surface has nozzle bore and trimming hole, and trimming nozzle is penetrated process intracavity by trimming hole; The upper surface in described process chamber is provided with the trimming nozzle that at least two does not wait from nozzle bore spacing, and each trimming nozzle is arranged on the upper surface in process chamber each through telescopic cylinder, drives lifting by telescopic cylinder, all corresponding trimming hole of each trimming nozzle; Described process chamber drives lifting by the process chamber elevating mechanism being arranged on base plate, is provided with ring gate lift cylinder at the upper surface processing chamber, and the piston rod of this ring gate lift cylinder penetrates process intracavity, is connected with ring gate; Described processing cup is annular, and its bottom surface and base plate have waste discharge mouth; The bottom of described process cup is annular, is connected with process chamber, and the top processing cup is frustum; Described process chamber and the junction processing cup have waste discharge hole; Described processing cup, process chamber, ring gate and process cup are arranged concentrically with wafer.
Advantages of the present invention and good effect be:
1. the otch fetching and delivering wafer is sealed completely by the present invention by liftable ring gate, makes wafer completely in an environment closed, can efficiently reduce granule and drop on wafer.
2. the processed cover of the liquid that wafer of the present invention throws away or process chamber are collected and are discharged, and will not splash down and on craft cup, wafer be polluted.
3. the present invention placed, at process chamber upper surface, the trimming nozzle not waited from center distance, according to the size of wafer, can select different trimming nozzles when processing wafer, improve the integrated level of the present invention.
Accompanying drawing explanation
Fig. 1 is the outside overall structure schematic diagram of the present invention;
Fig. 2 is that the present invention is in the internal structure sectional view putting into wafer state;
Fig. 3 is the internal structure sectional view that the present invention is in coating trimming state;
Wherein: 1 is base plate, 2 is processing cup, and 3 for processing chamber, 4 for processing chamber elevating mechanism, and 5 is ring gate, and 6A is the first trimming nozzle, 7A is the first telescopic cylinder, and 6B is the second trimming nozzle, and 7B is the second telescopic cylinder, 8 is ring gate lift cylinder, and 9 is wafer-supporting platform, and 10 is wafer, 11 is spindle motor, and 12 for processing cup, and 13 is otch, 14 is waste discharge mouth, and 15 is trimming hole, and 16 is nozzle bore.
Detailed description of the invention
Below in conjunction with accompanying drawing, the invention will be further described.
As shown in Figures 1 to 3, the present invention includes base plate 1, processing cup 2, process chamber 3, processes chamber elevating mechanism 4, ring gate 5, trimming nozzle, telescopic cylinder, ring gate lift cylinder 8, wafer-supporting platform 9, spindle motor 11 and process cup 12, wherein processing cup 2 is annular, it is fixed on base plate 1, the bottom surface of processing cup 2 and base plate 1 have multiple waste discharge mouth 14. Being provided with the spindle motor 11 being arranged on base plate 1 in processing cup 2, the outfan of spindle motor 11 is connected to the wafer-supporting platform 9 of bearing wafer 10.
Between processing cup 2 and wafer-supporting platform 9, ecto-entad is sequentially provided with liftable process chamber 3, liftable ring gate 5 and the process cup 12 with the lifting of process chamber 3, and it is inverted barrel-shaped for processing chamber 3, and its top edge is connected with the outfan processing chamber elevating mechanism 4; Processing chamber elevating mechanism 4 can be lift cylinder, and the process chamber elevating mechanism 4 of the present embodiment is two, and the longitudinal center line to process chamber 3 is symmetrical arranged, and two process chamber elevating mechanism 4 and are each attached on base plate 1, are positioned at the outside of processing cup 2.The center processing chamber 3 upper surface has nozzle bore 16, nozzle by this nozzle bore 16 to wafer 10 spraying liquid; Have at least two trimming hole 15, all corresponding trimming nozzle in each trimming hole 15 in the periphery of nozzle bore 16, each trimming nozzle is all connected to be arranged on the outfan of the telescopic cylinder processing chamber 3 upper surface, is lifted by the driving of telescopic cylinder; The present embodiment be respectively set in the both sides of nozzle bore 16 all lateral opening 15, the two trimming hole 15 spacing from nozzle bore 16 is not etc., the upper surface processing chamber 3 fixes the first telescopic cylinder 7A and the second telescopic cylinder 7B respectively, the outfan of the first telescopic cylinder 7A and the second telescopic cylinder 7B connects the first trimming nozzle 6A and the second trimming nozzle 6B respectively, first trimming nozzle 6A and the second trimming nozzle 6B penetrates in process chamber 3 respectively through each self-corresponding trimming hole 15, operationally can select different trimming nozzles according to wafer size.
The bottom processing chamber 3 is connected to the process cup 12 processing chamber 3 lifting, and the bottom of this process cup 12 is annular, is connected with process chamber 3, and the top processing cup 12 is frustum, has waste discharge hole processing chamber 3 with the junction processing cup 12. Ring gate 5, processing chamber 3 and processing between cup 12, is provided with ring gate lift cylinder 8 at the upper surface processing chamber 3, and the piston rod of this ring gate lift cylinder 8 penetrates in process chamber 3, is connected with ring gate 5; The present embodiment is provided with two ring gate lift cylinders 8 on the upper surface of process chamber 3, and the piston rod of two ring gate lift cylinders 8 is connected to ring gate 5. Processing the otch 13 having the lift control switch by ring gate 5 in the top cavity wall in chamber 3, wafer 10 processes in chamber 3 through this otch 13 feeding and is placed on wafer-supporting platform 9. The processing cup 2 of the present invention, process chamber 3, ring gate 5 and process cup 12 are arranged concentrically with wafer 10.
The operation principle of the present invention is:
When wafer 10 is prepared to enter into processing chamber 3, processing chamber elevating mechanism 4 and decline, now ring gate lift cylinder 8 declines, ring gate lift cylinder 8 drives ring gate 5 to decline, and the otch 13 processing chamber 3 is opened, and it is internal that wafer 10 is admitted to process chamber 3, and it is placed on wafer-supporting platform 9, as shown in the state of Figure 2.
Ring gate lift cylinder 8 drives ring gate 5 to rise, and the otch 13 processing chamber 3 is closed, and processes elevating mechanism 4 drive process chamber 3, chamber and rises, as shown in the state of Fig. 3. Now carrying out liquid coating, the liquid that wafer 10 the throws away cup 12 that can be processed is collected, and along processing the inwall slip-stream of cup 12 to the inside of processing cup 2, is discharged by waste discharge mouth 14; The liquid now splashed may splash to the outside processing cup 12, at this moment the liquid sputtered can pass through to process chamber 3 and be collected, these liquid can be collected from the outer wall stream processing cup 12 to the waste discharge mouth processed cup 12 and process chamber 3, then treated cup 12 and the waste discharge mouth processed between chamber 3 flow in processing cup 2, the waste discharge mouth 14 in processing cup 2 liquid is recycled. Trimming technology is carried out after completing liquid coating process, the present embodiment size according to wafer 10, selecting the first trimming nozzle 6A to carry out hydrojet, now the first telescopic cylinder 7A drives the first trimming nozzle 6A to decline, and the first trimming nozzle 6A sprays trimming liquid and wafer 10 is carried out trimming technology. After completing series of processes, processing chamber elevating mechanism 4 and decline, now ring gate lift cylinder 8 declines, and ring gate lift cylinder 8 drives ring gate 5 to decline, and the otch 13 processing chamber 3 goes out to open, the now removable process chamber of wafer 10.
Claims (7)
1. a liquid coating trimming device, it is characterized in that: include base plate (1), processing cup (2), process chamber (3), ring gate (5), trimming nozzle, wafer-supporting platform (9), spindle motor (11) and process cup (12), wherein processing cup (2) is arranged on base plate (1), being provided with the spindle motor (11) being arranged on base plate (1) in processing cup (2), the outfan of spindle motor (11) is connected to the wafer-supporting platform (9) of bearing wafer (10); Between processing cup (2) and wafer-supporting platform (9), ecto-entad is sequentially provided with liftable process chamber (3) and liftable ring gate (5), the upper face of described process chamber (3) is provided with liftable trimming nozzle, the bottom processing chamber (3) is connected to processing the process cup (12) that chamber (3) lifts, and ring gate (5) is positioned at process chamber (3) and processes between cup (12); Having the otch (13) by described ring gate (5) lift control switch in the cavity wall of described process chamber (3), wafer (10) processes through this otch (13) feeding and is placed on wafer-supporting platform (9) in chamber (3);
Described process chamber (3) drives lifting by process chamber elevating mechanism (4) being arranged on base plate (1), at the upper surface processing chamber (3), ring gate lift cylinder (8) is installed, the piston rod of this ring gate lift cylinder (8) penetrates in process chamber (3), is connected with ring gate (5).
2. by the liquid coating trimming device described in claim 1, it is characterized in that: described process chamber (3) upper surface has nozzle bore (16) and trimming hole (15), trimming nozzle is penetrated in process chamber (3) by trimming hole (15).
3. by the liquid coating trimming device described in claim 2, it is characterized in that: the upper surface of described process chamber (3) is provided with the trimming nozzle that at least two does not wait from nozzle bore spacing, each trimming nozzle is arranged on the upper surface of process chamber (3) each through telescopic cylinder, drives lifting by telescopic cylinder, all corresponding trimming hole (15) of each trimming nozzle.
4. by the liquid coating trimming device described in claim 1, it is characterised in that: described processing cup (2) is annular, its bottom surface and have waste discharge mouth (14) on base plate (1).
5. by the liquid coating trimming device described in claim 1, it is characterised in that: the bottom of described process cup (12) is that annular is connected with processing chamber (3), and the top processing cup (12) is frustum.
6. by the liquid coating trimming device described in claim 1 or 5, it is characterised in that: described process chamber (3) and the junction processing cup (12) have waste discharge hole.
7. by the liquid coating trimming device described in claim 1, it is characterised in that: described processing cup (2), process chamber (3), ring gate (5) and process cup (12) are arranged concentrically with wafer (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210445789.2A CN103811377B (en) | 2012-11-09 | 2012-11-09 | A kind of liquid coating trimming device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210445789.2A CN103811377B (en) | 2012-11-09 | 2012-11-09 | A kind of liquid coating trimming device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103811377A CN103811377A (en) | 2014-05-21 |
| CN103811377B true CN103811377B (en) | 2016-06-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210445789.2A Active CN103811377B (en) | 2012-11-09 | 2012-11-09 | A kind of liquid coating trimming device |
Country Status (1)
| Country | Link |
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| CN (1) | CN103811377B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105097608B (en) * | 2014-05-22 | 2018-04-24 | 沈阳芯源微电子设备有限公司 | A kind of CUP structures for preventing high-pressure water mist splash |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1432440A (en) * | 2001-11-27 | 2003-07-30 | 东京毅力科创株式会社 | Solution processing unit and method |
| CN1923381A (en) * | 2005-08-30 | 2007-03-07 | 东京毅力科创株式会社 | Substrate cleaning device and substrate cleaning method |
| CN101015040A (en) * | 2004-09-09 | 2007-08-08 | 东京毅力科创株式会社 | Substrate cleaning method and developing apparatus |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003001177A (en) * | 2001-06-25 | 2003-01-07 | Tokyo Electron Ltd | Film forming device and method for forming film |
| JP3958539B2 (en) * | 2001-08-02 | 2007-08-15 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate processing method |
| KR100685175B1 (en) * | 2005-10-05 | 2007-02-22 | 삼성전자주식회사 | Photoresist coating apparatus and method for operating the apparatus |
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2012
- 2012-11-09 CN CN201210445789.2A patent/CN103811377B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1432440A (en) * | 2001-11-27 | 2003-07-30 | 东京毅力科创株式会社 | Solution processing unit and method |
| CN101015040A (en) * | 2004-09-09 | 2007-08-08 | 东京毅力科创株式会社 | Substrate cleaning method and developing apparatus |
| CN1923381A (en) * | 2005-08-30 | 2007-03-07 | 东京毅力科创株式会社 | Substrate cleaning device and substrate cleaning method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103811377A (en) | 2014-05-21 |
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Address after: 110168 No. 16 Feiyun Road, Hunnan District, Shenyang City, Liaoning Province Patentee after: Shenyang Core Source Microelectronic Equipment Co., Ltd. Address before: 110168 No. 16 Feiyun Road, Hunnan New District, Shenyang City, Liaoning Province Patentee before: Shenyang Siayuan Electronic Equipment Co., Ltd. |
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