CN103779479A - 一种led封装结构 - Google Patents

一种led封装结构 Download PDF

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Publication number
CN103779479A
CN103779479A CN201310245973.7A CN201310245973A CN103779479A CN 103779479 A CN103779479 A CN 103779479A CN 201310245973 A CN201310245973 A CN 201310245973A CN 103779479 A CN103779479 A CN 103779479A
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fluorescent material
layer
line
material glue
granularity
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刘万庆
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SUZHOU HENGRONG ENERGY-SAVING TECHNOLOGY INSTALLATION ENGINEERING Co Ltd
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SUZHOU HENGRONG ENERGY-SAVING TECHNOLOGY INSTALLATION ENGINEERING Co Ltd
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Priority to CN201310245973.7A priority Critical patent/CN103779479A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

本发明的技术方案是：LED封装结构，包括LED芯片、杯碗、外层封胶，其特征在于杯碗中部有一个半圆形的凹槽，LED芯片安装在凹槽当中，所述荧光粉胶层包括颗粒度不同的上下两层，下层荧光粉胶层涂满凹槽。上层荧光粉胶层位于下层荧光粉胶层之上，所述外层封胶位于荧光粉胶层外部，LED芯片的正负极连接导线，所述上层荧光粉胶层包括有内外两层。LED芯片为蓝光芯片，凹槽内表面涂有反射层。作为优化，下层荧光粉胶层的颗粒度为25-22微米，上层荧光粉胶层内层颗粒度为23-20微米，外层颗粒度为20-15微米。作为优化，所述下层荧光粉胶层厚度为上层荧光粉胶层厚度的三倍。

Description

一种LED封装结构
技术领域
本发明涉及LED照明领域，特别涉及一种LED封装结构。
背景技术
LED（ Light Emitting Diode ；发光二极管）是一种能够将电能转化为可见光的固态的半导体器件，具有寿命长、能耗低等优点，随着LED 技术的发展，LED 光源的性能也越来越好。现有的LED 封装结构中主流的LED 封装为蓝光LED 芯片加入黄色荧光粉形成白光，这种方式封装的白光LED 会因为黄色荧光粉颗粒度大小的影响而出现光斑和光效，若颗粒度偏小则光效偏低，无法达到现有的照明要求；若颗粒度偏大则光斑很差，易出黄蓝圈现象，这两者情况都严重影响到LED 的应用范围和实际使用效果。
发明内容
本发明的目的是针对现有技术的不足，提供一种可实现高光效且出光光线均匀的LED封装结构。
为达到上述目的，本发明的技术方案是：LED封装结构，包括LED芯片、杯碗、外层封胶，其特征在于杯碗中部有一个半圆形的凹槽，LED芯片安装在凹槽当中，所述荧光粉胶层包括颗粒度不同的上下两层，下层荧光粉胶层涂满凹槽。上层荧光粉胶层位于下层荧光粉胶层之上，所述外层封胶位于荧光粉胶层外部，LED芯片的正负极连接导线，所述上层荧光粉胶层包括有内外两层。LED芯片为蓝光芯片，凹槽内表面涂有反射层。
作为优化，下层荧光粉胶层的颗粒度为25-22微米，上层荧光粉胶层内层颗粒度为23-20微米，外层颗粒度为20-15微米。
作为优化，所述下层荧光粉胶层厚度为上层荧光粉胶层厚度的三倍。
本发明LED封装结构采用不同颗粒度上下层分布以及半圆形的凹槽设计，根据蓝光对不同颗粒度荧光粉的激发不同效果的道理，以及凹槽的反射，实现了可达到高光效而且出光光线均匀的白光LED。
附图说明
图1为本发明LED封装结构结构示意图。
具体实施方式
下面给出的实施例拟对本发明作进一步说明，但不能理解为是对本发明保护范围的限制，本领域技术人员根据本发明内容对本发明的一些非本质的改进和调整，仍属于本发明的保护范围。
如图1所示，LED封装结构，包括LED芯片1、杯碗2、外层封胶3，杯碗2中部有一个半圆形的凹槽7，LED芯片1安装在凹槽7当中，荧光粉胶层包括颗粒度不同的上下两层，下层荧光粉胶层4涂满凹槽。上层荧光粉胶层位于下层荧光粉胶层4之上，外层封胶3位于荧光粉胶层外部，LED芯片1的正负极连接导线6。上层荧光粉胶层包括有内层荧光粉胶5，外层荧光粉胶8。下层荧光粉胶层4的颗粒度为25-22微米，上层荧光粉胶层的内层荧光粉胶5颗粒度为23-20微米，外层荧光粉胶8颗粒度为20-15微米。
本发明LED封装结构采用不同颗粒度上下层分布以及半圆形的凹槽设计，根据蓝光对不同颗粒度荧光粉的激发不同效果的道理，以及凹槽的反射，实现了可达到高光效而且出光光线均匀的白光LED。
本发明，LED芯片为蓝光芯片。凹槽内表面涂有反射层。下层荧光粉胶层厚度为上层荧光粉胶层厚度的三倍。

Claims (5)

1.一种LED封装结构，包括LED芯片、杯碗、外层封胶，其特征在于杯碗中部有一个半圆形的凹槽，LED芯片安装在凹槽当中，所述荧光粉胶层包括颗粒度不同的上下两层，下层荧光粉胶层涂满凹槽,上层荧光粉胶层位于下层荧光粉胶层之上，所述外层封胶位于荧光粉胶层外部，LED芯片的正负极连接导线，所述上层荧光粉胶层包括有内外两层。
2.根据权利要求1 所述的LED封装结构，其特征在于所述下层荧光粉胶层的颗粒度为25-22微米，上层荧光粉胶层内层颗粒度为23-20微米，外层颗粒度为20-15微米。
3.根据权利要求1 所述的LED封装结构，其特征在于所述下层荧光粉胶层厚度为上层荧光粉胶层厚度的三倍。
4.根据权利要求1 所述的LED封装结构，其特征在于所述LED芯片为蓝光芯片。
5.根据权利要求1 所述的LED封装结构，其特征在于所述凹槽内表面涂有反射层。
CN201310245973.7A 2013-06-20 2013-06-20 一种led封装结构 Pending CN103779479A (zh)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007134656A (ja) * 2005-11-14 2007-05-31 Toyoda Gosei Co Ltd 蛍光体板及びこれを備えた発光装置
JP2009044137A (ja) * 2008-07-07 2009-02-26 Sharp Corp 発光装置及び蛍光体
CN202454609U (zh) * 2012-01-19 2012-09-26 福州瑞晟电子有限公司 一种分层式led封装结构
KR20120124186A (ko) * 2011-05-03 2012-11-13 엘지이노텍 주식회사 발광소자 패키지 및 이를 포함하는 조명 시스템
CN203398158U (zh) * 2013-06-20 2014-01-15 苏州恒荣节能科技安装工程有限公司 一种led封装结构

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007134656A (ja) * 2005-11-14 2007-05-31 Toyoda Gosei Co Ltd 蛍光体板及びこれを備えた発光装置
JP2009044137A (ja) * 2008-07-07 2009-02-26 Sharp Corp 発光装置及び蛍光体
KR20120124186A (ko) * 2011-05-03 2012-11-13 엘지이노텍 주식회사 발광소자 패키지 및 이를 포함하는 조명 시스템
CN202454609U (zh) * 2012-01-19 2012-09-26 福州瑞晟电子有限公司 一种分层式led封装结构
CN203398158U (zh) * 2013-06-20 2014-01-15 苏州恒荣节能科技安装工程有限公司 一种led封装结构

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Application publication date: 20140507