CN103779239B - The manufacture method of a kind of SPM and SPM - Google Patents
The manufacture method of a kind of SPM and SPM Download PDFInfo
- Publication number
- CN103779239B CN103779239B CN201210414053.9A CN201210414053A CN103779239B CN 103779239 B CN103779239 B CN 103779239B CN 201210414053 A CN201210414053 A CN 201210414053A CN 103779239 B CN103779239 B CN 103779239B
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- metal basal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Manufacturing & Machinery (AREA)
Abstract
The present invention is applicable to technical field of electronic devices, provide manufacture method and the SPM of a kind of SPM, the method comprises the steps: to choose metal basal board, set gradually insulating barrier thereon, surface has wiring and the component of layer gold, is connected by metal wire with wiring by component；Wiring is installed pin；Metal basal board is placed in encapsulating mould, and makes the press strip in the upper mold of encapsulating mould be pressed on metal basal board, the vertical position of metal basal board is positioned；By encapsulating mould matched moulds and inject encapsulating material, metal basal board is sealed；Metal wire includes parallel metal lines and vertical metal line, and at least a press strip is suppressed in vertical metal line near the side of gum-injecting port.Invention prevents the encapsulating material impact to vertical metal line, improve the safety of SPM；The surface of wiring cover layer gold, make steam cannot open circuit potential structure, further increase the safety of this module.
Description
Technical field
The invention belongs to technical field of electronic devices, particularly to manufacture method and the SPM of a kind of SPM.
Background technology
SPM (IntelligentPowerModule, IPM) is a kind of power drive series products power electronics and integrated circuit technique combined.Device for power switching and high-voltage driving circuit are integrated by IPM, and in be provided with overvoltage, overcurrent and the failure detector circuit such as overheated.IPM mono-aspect receives the control signal of MCU, drives subsequent conditioning circuit work, on the other hand sends the state detection signal of system back to MCU.Compared with traditional discrete scheme, IPM wins increasing market with its advantage such as high integration, high reliability, it is particularly suitable for driving the converter of motor and various inverter, is a kind of preferably power electronic devices of frequency control, metallurgical machinery, electric propulsion, servo-drive, frequency-conversion domestic electric appliances.
Chinese patent application CN02125143.6 discloses a kind of existing IPM structure, as Fig. 1,2, IPM includes circuit substrate 101, insulating barrier 102 and wiring 103, wiring 103 is provided with component 104, component 104 is connected to wiring 103 by metal wire 105, wiring 103 is also associated with some pins 106, and whole IPM is sealed by sealing structure 107.The method sealed includes using injecting mould molding and using the transmission mould molding of thermosetting resin of thermoplastic resin.For small-sized SPM, the form of transmission mould is generally used to be packaged.
Owing to SPM is higher to the requirement of thermal conductivity, thus extremely important to the position control of circuit substrate 101 when encapsulation.Such as Fig. 3, when encapsulation, mould is typically provided with pad 110, does not sets the part of wiring 103 and component 104 carry out the location of circuit substrate 101 by making pad 110 be pressed against circuit substrate 101.After packaging is accomplished, pad 110 inserts the region in encapsulating structure and can form hole 111.Staff can be by confirming the degree of depth and the location confirmation circuit substrate 101 position in encapsulating material in hole 111, and product underproof for package position gives to eliminate process.But the existence due to hole 111, the compactness of SPM encapsulation will necessarily be affected, in life-time service, steam can be by the exposed portion of hole 111 open circuit potential substrate 101, and other hermetic units of circuit substrate 101 are entered by the gap after being corroded between hole 111 and circuit substrate 101, it is easily destroyed wiring 103 and component 104, it also occur that short circuit or open circuit time serious, make SPM lose efficacy, thus cause the device damage using SPM.
Additionally, when circuit structure is more complicated, it is complicated for connecting the metal wire 105 of component 104 and wiring 103, its orientation is not only parallel to material feeding direction, also have perpendicular with material feeding direction, this metal wire being perpendicular to material feeding direction is easily breasted the tape when material feeding and is deformed, and the metal wire of this deformation easily ruptures in life-time service, causes SPM to lose efficacy.
Summary of the invention
It is an object of the invention to provide the manufacture method of a kind of SPM, it is intended to solve traditional intelligence power model corrosion-vulnerable and lost efficacy, and the problem of metal wire easy fracture.
The present invention is achieved in that the manufacture method of a kind of SPM, comprises the steps:
Choosing a metal basal board, on described metal basal board, lamination arranges insulating barrier and surface has the wiring of layer gold successively, and arranges component on described wiring, is connected by metal wire with wiring by described component；
Described wiring is installed pin；
Described metal basal board is positioned in encapsulating mould, and makes the press strip being arranged at the upper mold of described encapsulating mould be pressed on described metal basal board, the vertical position of described metal basal board is positioned；
By encapsulating mould matched moulds and inject encapsulating material, described metal basal board is sealed；
Wherein, described metal wire includes being parallel to the parallel metal lines in material feeding direction and being perpendicular to the vertical metal line in material feeding direction, and, at least a described press strip is suppressed in described vertical metal line near the side of the gum-injecting port of encapsulating mould, is used for preventing described encapsulating material from impacting described vertical metal line.
Another object of the present invention is to provide a kind of SPM, including metal basal board, on described metal basal board, lamination is provided with insulating barrier successively, surface has the wiring of layer gold, and component, described component is connected with described wiring by metal wire, and described wiring connects pin；
Described metal wire includes the parallel metal lines paralleled in material feeding direction when being packaged, and the vertical metal line perpendicular with described material feeding direction with described SPM；
Described metal basal board at least has the one side of described wiring and is sealed by encapsulating structure；
Having at least one perforate leading to described insulating barrier or layer gold on described encapsulating structure, described perforate is positioned at the side of described vertical metal line gum-injecting port when described SPM is packaged.
The present invention is suppressed in vertical metal line near the side of gum-injecting port by the press strip on encapsulating mould; effectively prevent the encapsulating material impact to vertical metal line; avoid vertical metal line generation bending; and then improve the safety of SPM; compared with carrying out, with by pad, the method for packing that positions, the most do not increase manufacture difficulty but also there is the effect of protection metal wire；
Additionally, layer gold is covered on the surface of wiring, the part exposing to hole after encapsulation is covered by layer gold, owing to layer gold has extremely strong antioxidation, corrosion resistance, even if therefore there being steam to enter from hole, also cannot corrode metal basal board and circuit structure thereof, further increase the safety of SPM.
The SPM that the present invention provides is made by said method, and then has higher safety, also improves the safety of the equipment using this SPM.
Accompanying drawing explanation
Fig. 1 is the axonometric chart of SPM in prior art；
Fig. 2 is the sectional view of SPM in prior art；
Fig. 3 is the method for packing schematic diagram of SPM in prior art；
Fig. 4 is the manufacturing flow chart of embodiment of the present invention SPM；
Fig. 5 a～5e is the structural reference figure corresponding with each step in Making programme figure shown in Fig. 4；
Fig. 6 is the axonometric chart of embodiment of the present invention SPM；
Fig. 7 is the cross-sectional view of embodiment of the present invention SPM；
Fig. 8 is the electrical block diagram of embodiment of the present invention SPM.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Below in conjunction with specific embodiment the present invention implemented and is described in detail:
Fig. 4 shows the manufacture method flow chart of the SPM that the embodiment of the present invention provides, and Fig. 5 a～5e shows the structure chart that step each with the method is corresponding, for convenience of description, illustrate only part related to the present embodiment.
With reference to Fig. 4,5, the method comprises the steps:
In step S101, choosing a metal basal board 1, on metal basal board 1, lamination arranges insulating barrier 2 and surface has the wiring 3 of layer gold 31 successively, and arranges component 4 on wiring 3, is connected by metal wire 5 with wiring 3 by component 4.Such as Fig. 5 a.
Preferably, this step specifically can be realized by the following method:
The first step, circuit layout as required prepares sizeable metal basal board 1, its two sides is carried out corrosion protection process.
This metal basal board 1 is preferably aluminium base, can choose the aluminium base of 64mm × 30mm size for conventional SPM.Here, sizeable aluminium base can be formed by modes such as the direct aluminium to 1m × 1m are punched out, it is possible to by first forming V groove on the aluminium of 1m × 1m, then shear along V groove and form sizeable aluminium base.
Second step, at least one surface of metal basal board 1 arranges insulating barrier 2, and at the surface mount of insulating barrier 2 for making the Copper Foil of wiring 3, then nickel plating, gold-plated, striping process are carried out at copper foil surface, form layer gold 31, then the Copper Foil after gold-plated is etched, removes Copper Foil partly, form wiring 3.
In the present embodiment, insulating barrier 2 can use the material such as epoxy resin to make, it is possible to the material such as the aluminium oxide of doped with high concentration in epoxide resin material, to improve its thermal conductivity.
3rd step, is arranged on the assigned position of wiring 3, and binds metal wire 5 between component 4 and wiring 3 by solders such as scolding tin by component 4.
In the present embodiment, owing to the surface of wiring 3 is provided with layer gold 31, layer gold 31 can effectively prevent Copper Foil from aoxidizing, and therefore the welding quality between metal wire 5 and wiring 3 can be better than the quality directly carrying out welding with the most gold-plated Copper Foil.It addition, in order to ensure corrosion resistance and manufacturing cost, within the thickness of layer gold 31 can be controlled in 100 μm, and the gross thickness covering the wiring 3 of layer gold 31 can be controlled in 45～150 μm.
It addition, metal wire 5 can select aluminum steel, gold thread or copper cash, because the surface of wiring 3 is coated with layer gold 31, so the preferred gold thread of metal wire 5.
Further, the metal wire of identical material can also be used while binding metal wire 5 metal basal board 1 and wiring 3 or component 4 to be coupled together, so that the current potential approximation of metal basal board 1 and wiring 3 or component 4, reduce the harmful effect that component is produced by circuit noise.
Further, it is also possible on wiring 3, form some pads 32, specifically can be at the pad 32 arranging multiple parallel arranged of metal basal board 1, for connecting the pin 6 being arranged side by side.Can be welded by conductive adhesives such as scolding tin between pin 6 and pad 32.
In the present embodiment, component 4 can use the active component such as transistor or diode or the passive element such as electric capacity or resistance.Alternatively, it is also possible to element big for the caloric values such as power component is fixed on metal basal board 1 by the radiator being made up of copper etc..
In step s 102, wiring 3 is installed pin 6.Such as Fig. 5 b.
A kind of preferably implementation as this step:
First, metal basal board 1 is placed in the plane of a heating, metal basal board 1 is preheated, the temperature of heating plane is unsuitable too low, does not otherwise have the effect of preheating, also unsuitable too high, in order to avoid the most welded good solder is melted, for tin cream solder, 95～105 DEG C can be set to, preferably 100 DEG C.
Then, the part that pin 6 contacts with wiring 3 in advance is stained with tin cream, in order to improve welding quality, it is also possible to be stained with scaling powder, and be placed on appropriate location.
Finally, by the way of pressure welding, the wiring 3 on metal basal board 1 and pin 6 are linked together.The welding temperature of pressure-welding head can be set to 280～320 DEG C, preferably 300 DEG C, it is ensured that tin cream fully melts, and the pressure welding time is less than 5 seconds, it is ensured that metal basal board 1 is to be locally heated.It should be noted that pin 6 need to be designed as being not parallel to the form of metal basal board 1, its surface moving towards opposing metallic substrate 1 is inclined upwardly.
In step s 103, metal basal board 1 is positioned in encapsulating mould 20, and makes the press strip 202 being arranged at the upper mold 201 of encapsulating mould 20 be pressed on metal basal board 1, the vertical position of metal basal board 1 is positioned.Such as Fig. 5 c.
Being appreciated that for more complicated circuit structure, metal wire 5 both includes the parallel metal lines 51 being parallel to material feeding direction, includes again the vertical metal line 52 being perpendicular to material feeding direction.And vertical metal line 52 is most susceptible to the impact of injected plastics material, this step is to solve vertical metal line 52 to breast the tape the committed step of problem.Specifically press strip 202 is suppressed in vertical metal line 52 near the side of gum-injecting port, to prevent the injection material impact to vertical metal line 52.Certainly, and not all vertical metal line 52 will be blocked by press strip, but at least a press strip 202 to be suppressed in a vertical metal line 52 near the side of gum-injecting port.Such as, the gum-injecting port of distance packaged mould 20 nearer, line footpath less, or the softer vertical metal line 52 of material is easier to breast the tape, need to be blocked by press strip 202, and other are not susceptible to the vertical metal line 52 breasted the tape, if line footpath is more than 400 μm, or distance gum-injecting port is more than 25mm, or material is very hard, as used the aluminum steel that hardness is the biggest, then need not arrange press strip 202.
Further; in order to preferably prevent from breasting the tape; the width of press strip 202 is more preferably greater than the length of metal wire 5; and width is the biggest, protected effect is the best, but press strip 202 is the widest; area occupied is the biggest; the perforate stayed after packaged is the biggest, and integrated protection effect and two kinds of factors of packaging effect, the width of the preferred press strip of the present embodiment 202 is 0.5 ± 0.1mm.
Further; the pressing position of press strip 202 can be to be pressed on insulating barrier 2; can also be pressed in layer gold 31; being uneven in order to avoid being pressed in the press strip of diverse location, the compacting end (suppressing the one end on metal basal board 1) of press strip 202 can have elasticity, specifically can install spring in press strip 202; make no matter press strip 202 is suppressed in where; can realize being in close contact, it is ensured that identical to the cushioning effect of injection material and then identical to the protected effect of each vertical metal line 52 to be blocked.
Further, since the pressing position of press strip 202 need not strictly limit to, the distance setting press strip 202 apart from vertical metal line 52 therefore can be unified.When the distance is excessively long, the cushioning effect of press strip 202 will reduce, and when too short, the hole that metal wire 5 stays after press strip 202 is extracted out can be the nearest, it is vulnerable to the impact of outside moisture, the most amid all these factors considering, this distance is preferably set to 0.5 ± 0.1mm by the present embodiment, to meet security requirement and solution is breasted the tape problem.
In the present embodiment, vertical metal line 52 can be protected to be not implanted material by press strip 202 and rush curved, and realize the location of the vertical direction of metal basal board 1, i.e. the metal basal board 1 height in encapsulating material be positioned.And before carrying out the location of vertical direction, the present embodiment can first carry out the location of horizontal direction, the specific part of pin 6 is clamped particular by the fixing device 204 in the lower mold 203 of encapsulating mould 20, the horizontal level of metal basal board 1 is positioned, the retaining part of pin 6 is to set according to the metal basal board 1 predeterminated position in encapsulating material, after having clamped pin 6 by fixing device 204, i.e. complete the horizontal location of metal basal board 1, simultaneously, owing to pin 6 opposing metallic substrate 1 is inclined upwardly, therefore the metal basal board 1 after clamping is good relative level can tilt certain angle.Carry out follow-up vertically oriented time, by the suppression of press strip 202, metal basal board 1 can be made to be in horizontal plane, and then complete the metal basal board 1 location at vertical direction.
In the present embodiment, pin 6 can use the metals such as aluminum to make, and the material of press strip 202 is the hardest like pin 6, and is unlikely to deform, in order to is flattened by metal basal board 1.
In step S104, by encapsulating mould matched moulds and inject encapsulating material, metal basal board 1 is sealed.Such as Fig. 5 d.
Being appreciated that after the sealing process completing metal basal board 1, can carry out the Trim Molding operation of routine, such as Fig. 5 e, SPM completes as goods after thus Trim Molding operation.
In the present embodiment, can first toast in oxygen-free environment before being inserted in mould 20 by metal basal board 1, baking time is no less than 2 hours, and baking temperature may select 120～130 DEG C, preferably 125 DEG C.By baking, metal basal board 1 and the steam of component 4 surface attachment can be removed, prevent vapour corrosion substrate and circuit.Using oxygen-free environment can avoid in a heated condition, oxygen makes metal basal board 1 and component 4 surface oxidation, improves the reliability of SPM further.
In the present embodiment, metal basal board 1 can carry out one side encapsulation or double-faced packaging, one side encapsulation only will be provided with the face seal of circuit structure, and be exposed at the back side of metal basal board 1, can improve radiating effect.Double-faced packaging is to be sealed by whole metal basal board 1, can improve the compactness of its encapsulation, prevent substrate from making moist, can select packaged type when actual fabrication according to actual needs.
The present invention is suppressed in vertical metal line near the side of gum-injecting port by the press strip on encapsulating mould; effectively prevent the encapsulating material impact to vertical metal line; avoid vertical metal line generation bending; and then improve the safety of SPM; compared with carrying out, with by pad, the method for packing that positions, the most do not increase manufacture difficulty but also there is the effect of protection metal wire；Additionally, layer gold is covered on the surface of wiring, even if hole can be left in the position of press strip after Feng Zhuan, the part exposing to hole is also covered by layer gold, owing to inert metal has extremely strong antioxidation, corrosion resistance, even if therefore have steam from hole enter, also due to the existence of layer gold and metal basal board and circuit structure thereof cannot be corroded, further increase the safety of SPM.And the method is easy to implement, it is suitable for being widely used.
Below with reference to accompanying drawing 6,7,8, the present invention further provides a kind of SPM, this SPM is made by above-mentioned manufacture method.This SPM includes metal basal board 1,1 lamination is provided with insulating barrier 2 successively, surface is provided with the wiring 3 of layer gold 31 on metallic substrates, and component 4, component 4 is connected with wiring 3 by metal wire 5, and wiring 3 connects pin 6.Wherein, metal wire 5 includes the parallel metal lines 51 paralleled in material feeding direction when being packaged, and the vertical metal line 52 perpendicular with material feeding direction with SPM.This metal basal board 1 at least has the one side of wiring 3 and is sealed by encapsulating structure 7, and there is on encapsulating structure 7 at least one perforate 8 leading to insulating barrier 2 or layer gold 31, it is positioned at the vertical metal line 52 side near the gum-injecting port of encapsulating mould, and this perforate 8 is taken out press strip 202 the most after packaging is accomplished and formed.
In the present embodiment, it is not necessary to the side of each vertical metal line 52 is respectively provided with perforate 8, perforate 8 is generally disposed at the side of the vertical metal line that distance gum-injecting port is relatively near, line footpath is less or material is softer.Specifically can be located at the side that the diameter distance less than 400 μm or with gum-injecting port is less than the vertical metal line of 25mm.
Further, the width of perforate 8 is more preferably greater than the length of vertical metal line 52, and the width of perforate 8 is identical with the width of press strip 202, preferably 0.5 ± 0.1mm.
Further, within the thickness of layer gold 31 can be controlled in 100 μm, and the gross thickness covering the wiring 3 of layer gold 31 can be controlled in 45～150 μm.
The design principle of said structure is with described in above-mentioned method for packing; here is omitted; it addition, this SPM can also have other structures formed by said method, every SPM made by said method is the most within the scope of the present invention.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all any amendment, equivalent and improvement etc. made within the spirit and principles in the present invention, should be included within the scope of the present invention.
Claims (10)
1. the manufacture method of a SPM, it is characterised in that comprise the steps:
Choosing a metal basal board, on described metal basal board, lamination arranges insulating barrier and surface has the wiring of layer gold successively, and arranges component on described wiring, is connected by metal wire with wiring by described component；
Described wiring is installed pin；
Described metal basal board is positioned in encapsulating mould, and makes the press strip being arranged at the upper mold of described encapsulating mould be pressed on described metal basal board, the vertical position of described metal basal board is positioned；
By encapsulating mould matched moulds and inject encapsulating material, described metal basal board is sealed；
Wherein, described metal wire includes being parallel to the parallel metal lines in material feeding direction and being perpendicular to the vertical metal line in material feeding direction, and, at least a described press strip is suppressed in described vertical metal line near the side of the gum-injecting port of encapsulating mould, is used for preventing described encapsulating material from impacting described vertical metal line.
2. manufacture method as claimed in claim 1, it is characterised in that the surface of the most described metal basal board of trend of described pin is gradually inclined upwardly.
3. manufacture method as claimed in claim 2, it is characterised in that before making the press strip being arranged at the upper mold of described encapsulating mould be pressed on described metal basal board, carries out following step:
Clamp described pin by the fixing device being arranged at the lower mold of described encapsulating mould, the horizontal level of described metal basal board is positioned, and make the surface relative level of described metal basal board tilt.
4. manufacture method as claimed in claim 3, it is characterised in that make the press strip being arranged at the upper mold of described encapsulating mould be pressed on described metal basal board, the step that the vertical position of described metal basal board is positioned particularly as follows:
Described press strip is pressed on described insulating barrier or layer gold, makes the surface of described metal basal board be parallel to horizontal plane, position with the vertical position to described metal basal board.
5. the manufacture method as described in any one of Claims 1-4, it is characterised in that described press strip is suppressed in diameter less than the side of vertical metal line of 400 μm, or suppress in the side of the vertical metal line less than 25mm of the distance with described gum-injecting port.
6. the manufacture method as described in any one of Claims 1-4, it is characterised in that one end that described press strip is suppressed on described metal basal board has elasticity.
7. the manufacture method as described in any one of Claims 1-4, it is characterised in that the width of described press strip is more than the length of described vertical metal line.
8. a SPM, it is characterized in that, including metal basal board, on described metal basal board, lamination is provided with insulating barrier successively, surface has the wiring of layer gold, and component, described component is connected with described wiring by metal wire, and described wiring connects pin；
Described metal wire includes the parallel metal lines paralleled in material feeding direction when being packaged, and the vertical metal line perpendicular with described material feeding direction with described SPM；
Described metal basal board at least has the one side of described wiring and is sealed by encapsulating structure；
There is on described encapsulating structure at least one perforate leading to described insulating barrier or layer gold, described perforate is formed after being departed from described encapsulating structure by the press strip on the mould manufacturing described SPM, and described perforate is positioned at the side of described vertical metal line gum-injecting port when described SPM is packaged.
9. SPM as claimed in claim 8, it is characterised in that the width of described perforate is more than the length of described vertical metal line.
10. SPM as claimed in claim 8 or 9, it is characterised in that described perforate is positioned at diameter and less than the side of the vertical metal line of 400 μm or is positioned at the side that the distance with described gum-injecting port is less than the vertical metal line of 25mm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210414053.9A CN103779239B (en) | 2012-10-25 | 2012-10-25 | The manufacture method of a kind of SPM and SPM |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210414053.9A CN103779239B (en) | 2012-10-25 | 2012-10-25 | The manufacture method of a kind of SPM and SPM |
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| CN103779239A CN103779239A (en) | 2014-05-07 |
| CN103779239B true CN103779239B (en) | 2016-08-03 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000058745A (en) * | 1998-08-07 | 2000-02-25 | Hitachi Ltd | Power semiconductor module |
| JP2001156252A (en) * | 1999-11-29 | 2001-06-08 | Hitachi Ltd | Driver for power device |
| CN2502404Y (en) * | 2001-08-30 | 2002-07-24 | 南茂科技股份有限公司 | Mould pressing tool for preventing glue-spilling semicondcutor encapsulating die press |
| CN1575090A (en) * | 2003-06-11 | 2005-02-02 | 三洋电机株式会社 | Hybrid integrated circuit device |
| JP2007157773A (en) * | 2005-11-30 | 2007-06-21 | Sanyo Electric Co Ltd | Circuit device |
-
2012
- 2012-10-25 CN CN201210414053.9A patent/CN103779239B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000058745A (en) * | 1998-08-07 | 2000-02-25 | Hitachi Ltd | Power semiconductor module |
| JP2001156252A (en) * | 1999-11-29 | 2001-06-08 | Hitachi Ltd | Driver for power device |
| CN2502404Y (en) * | 2001-08-30 | 2002-07-24 | 南茂科技股份有限公司 | Mould pressing tool for preventing glue-spilling semicondcutor encapsulating die press |
| CN1575090A (en) * | 2003-06-11 | 2005-02-02 | 三洋电机株式会社 | Hybrid integrated circuit device |
| JP2007157773A (en) * | 2005-11-30 | 2007-06-21 | Sanyo Electric Co Ltd | Circuit device |
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| CN103779239A (en) | 2014-05-07 |
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