CN103775845A - LED light-emitting device and lamp - Google Patents
LED light-emitting device and lamp Download PDFInfo
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- CN103775845A CN103775845A CN201210395290.5A CN201210395290A CN103775845A CN 103775845 A CN103775845 A CN 103775845A CN 201210395290 A CN201210395290 A CN 201210395290A CN 103775845 A CN103775845 A CN 103775845A
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- led light
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10553—Component over metal, i.e. metal plate in between bottom of component and surface of PCB
Abstract
The invention discloses an LED light-emitting device and a lamp. The invention discloses an LED (Light-Emitting Diode) light-emitting device and a lamp. The LED light-emitting device comprises an LED light-emitting module (220) and a circuit board (210), wherein a heat-dissipating bonding pad (2243) and conductive bonding pads (2241 and 2242) are arranged at the side, facing the circuit board, of the LED light-emitting module, and the circuit board is provided with a heat conduction layer (211) and electrical conductors (212 and 213). The LED light-emitting device is characterized by further comprising a thermal diffusion component (230) which is located between the LED light-emitting module (220) and the circuit board (210), wherein the thermal diffusion component comprises electric connection parts (231 and 232) which are connected with the conductive bonding pads (2241 and 2242) and the electrical conductors (212 and 213), and a thermal diffusion part (233) which is connected with the heat-dissipating bonding pad (2243) and the heat conduction layer (211), and wherein the thermal diffusion part (233) is larger in area and/or greater in thickness than the heat-dissipating bonding pad (2243). The LED light-emitting device has the advantage that the thermal diffusion component is added between the LED light-emitting module and the circuit board so that the thermal resistance is greatly reduced.
Description
Technical field
The present invention relates to a kind of LED light-emitting device and light fixture.
Background technology
LED light fixture is as a kind of new light sources, due to its have efficiency high, photochromic pure, energy consumption is low, the life-span is long, reliability and durability, pollution-free, control the advantages such as flexible, thereby be widely applied.
In LED light fixture, LED luminescence component receives electric energy and luminous, thereby produces heat.Thereby LED luminescence component need to dispel the heat with retention.
With reference to Fig. 1, wherein show a kind of known LED light-emitting device 100, it comprises LED luminescence component and circuit board 110, wherein LED luminescence component comprises LED 121, lens 122 and radiator 123.In order to dispel the heat, also on the upper surface of circuit board 110, be covered with heat dissipating layer 111, LED luminescence component is electrically connected on lead-in wire on circuit board plate and thermally coupled in heat dissipating layer 111 by pad 124.But, in this known scheme, thermally coupled passage between LED luminescence component and circuit board 110 is pad 124, but the area S1 of pad 124 is conventionally less, thinner thickness, the heat that is difficult to LED luminescence component to produce is transmitted to heat dissipating layer 111 effectively, thereby the radiating effect of this known arrangement is poor.
Thereby, the LED light-emitting device of a kind of low thermal resistance of needs.
Summary of the invention
The object of the invention is to overcome the defect of prior art, thereby a kind of LED light-emitting device and light fixture are provided, to reduce the thermal resistance of LED light-emitting device and improve radiating efficiency.
According to an aspect of the present invention, a kind of LED light-emitting device is provided, it comprises LED luminescence component and circuit board, LED luminescence component has heat dissipation bonding pad and conductive welding disk towards a side of circuit board, circuit board has heat-conducting layer and electric lead, it is characterized in that, also comprises the heat diffusion member between LED luminescence component and circuit board, heat diffusion member comprises: electrical connection section, connects conductive welding disk and electric lead; And heat diffusion portion, connect heat dissipation bonding pad and heat-conducting layer, wherein heat diffusion portion has the area larger than heat dissipation bonding pad and/or larger thickness.
Further, the area of the contact area rate heat dissipation bonding pad of heat diffusion portion and heat-conducting layer is larger.
Further, the heat diffusion portion of heat diffusion member exceeds the extension of LED luminescence component.
Further, the area of the Area Ratio electrical connection section of heat diffusion portion (233) (231,232) is large.
Further, the area sum of electrical connection section and heat diffusion portion is formed as the area sum of the conductive welding disk and the heat dissipation bonding pad that are greater than LED luminescence component.
Further, heat diffusion portion is positioned at the central part of heat diffusion member, and electrical connection section is positioned at respectively the relative both sides of heat diffusion portion, and heat diffusion portion and electrical connection section electric insulation ground separates.
Further, heat diffusion member is formed as symmetric shape along the longitudinal centre line of heat diffusion portion.
Further, the opposite end of the heat diffusion portion of heat diffusion member is formed as laterally extending portion.
Further, the heat diffusion portion of heat diffusion member is formed as I-shaped.
Further, electrical connection section and heat diffusion portion are respectively independent metalwork, and utilize insulating materials to form as one by embedding and injection molding moulding process.
Further, insulating materials is plastics.
Further, insulating materials is made up of plastic and glass fiber.
Further, insulating materials is made up of polybutylene terephthalate (PBT) (PBT) and glass fibre.
Further, the weight content of glass fibre in insulating materials is 10%-40%.
Further, the thickness of heat diffusion member is greater than 3OZ.
Further, the thickness of heat diffusion member is 0.6mm-3mm.
Further, the area sum of electrical connection section and heat diffusion portion is formed as being greater than the conductive welding disk of LED luminescence component and the area sum of heat dissipation bonding pad 2 times.
Further, electrical connection section and heat diffusion portion form by copper.
Further, the heat-conducting layer on circuit board is the copper layer covering in circuit board surface.
Further, according to a further aspect in the invention, provide a kind of light fixture, this light fixture has aforementioned any LED luminescence component
By various embodiment of the present invention, at least can realize one or more in following effect:
1, indirectly increase the contact area between circuit board and LED luminescence component by heat diffusion member and/or increased the thickness of heat diffusion portion at heat concentrated part, thereby having increased area of dissipation, having reduced thermal resistance.
2, utilize heat diffusion member only to increase the thickness of heat diffusion portion at heat concentrated part, avoided the cost that the thickness of the radiating copper layer 211 on overall increase circuit board plate brings to increase and the thick and heavy property of structure.
3, heat diffusion member by laterally extending portion strengthened with circuit board on the connective stability of radiating copper layer;
4, heat diffusion member has the heat-resisting quantity of raising;
5, arrange by rational area, heat diffusion member 230 is realized good electrical connection and thermally coupled with simple structure and lower cost.
Accompanying drawing explanation
Accompanying drawing forms the part of this description, for helping further to understand the present invention.Accompanying drawing illustrates embodiments of the invention, and is used for illustrating principle of the present invention together with description.Identical parts represent with identical label in the accompanying drawings.Shown in figure:
Fig. 1 shows according to the cross-sectional view of a kind of LED light-emitting device of known technology;
Fig. 2 shows according to the cross-sectional view of a kind of LED light-emitting device of the embodiment of the present invention;
Fig. 3 shows according to the stereogram of a kind of LED light-emitting device of the embodiment of the present invention, has wherein for the sake of clarity removed LED luminescence component;
Fig. 4 shows according to the stereogram of the heat diffusion member of the embodiment of the present invention;
Fig. 5 (a) shows according to the schematic diagram of the method that is used to form LED light-emitting device of the embodiment of the present invention to Fig. 5 (e);
Fig. 6 shows the cross-sectional view of the contact area (bonding pad area) of LED luminescence component; And
Fig. 7 shows according to the cross-sectional view of the area of the electrical connection section of the heat diffusion member of the embodiment of the present invention and heat diffusion portion.
The specific embodiment
Hereinafter with reference to the accompanying drawing that shows exemplary embodiment of the present, the present invention is described more fully.But the present invention can, with multiple multi-form enforcement, construct and should not only limit to exemplary embodiment set forth herein.Certainly, it is in order to make this announcement more comprehensively with complete that these exemplary embodiments are provided, and can fully pass on scope of the present invention to those skilled in the art.
Explain in detail with reference to the accompanying drawings the present invention below.
With reference to Fig. 2 and 3, comprise LED luminescence component 220 and circuit board 210 according to the LED light-emitting device 200 of the embodiment of the present invention.LED luminescence component 220 has heat dissipation bonding pad 2243 and conductive welding disk 2241 and 2242 towards a side of circuit board.Circuit board 210 has heat-conducting layer 211 and electric lead 212,213.LED light-emitting device 200 also comprises the heat diffusion member 230 between LED luminescence component 220 and circuit board 210.
With reference to Fig. 4, heat diffusion member 230 comprises electrical connection section 231,232 and heat diffusion portion 233.Electrical connection section 231,232 connects conductive welding disk 2241,2242 and electric lead 212,213, and heat diffusion portion 233 connects heat dissipation bonding pad 2243 and heat-conducting layer 211.
The part with hatching identifying with further reference to the S1 in Fig. 6 and 7, Fig. 6 represents the conductive welding disk 2241 and 2242 and the area of heat dissipation bonding pad 2243 of LED luminescence component; And the part with hatching that S2 in Fig. 7 identifies represents the electrical connection section 231 and 232 and the area of heat diffusion portion 233 of heat diffusion member.Heat diffusion portion 233 can have the area larger than heat dissipation bonding pad 2243.Particularly, as shown in Figures 6 and 7, heat diffusion portion 233 is larger with the area of the contact area rate heat dissipation bonding pad 2243 of heat-conducting layer 211.Advantageously, (also can with reference to shown in S1 and S2 in Fig. 7) as shown in Figure 5 (e) shows, the heat diffusion portion 233 of heat diffusion member 230 can exceed LED luminescence component 220 and extend.Advantageously, the area of the Area Ratio electrical connection section 231,232 of heat diffusion portion 233 is large.More advantageously, the area sum S2 of electrical connection section 231,232 and heat diffusion portion 233 is formed as being greater than the conductive welding disk 2241,2242 of LED luminescence component and the area sum of heat dissipation bonding pad 2243.The favourable part of this layout is, can indirectly increase the effective contact area (this area is as the area of the part with hatching in the S2 in Fig. 7) between circuit board 210 and LED luminescence component by heat diffusion member 230, thereby increase area of dissipation, reduced thermal resistance.
Preferably, the area sum S2 of electrical connection section 231,232 and heat diffusion portion 233 can be formed as being greater than the conductive welding disk 2241,2242 of LED luminescence component and the area sum S1 of heat dissipation bonding pad 2243 2 times.The favourable part of this set is, can guarantee sufficient heat radiation on the one hand, can not make again on the other hand the size of heat diffusion member 230 form too much, and then whole LED light-emitting device 200 also can obviously not increase cost owing to setting up heat diffusion member 230.
In addition, shown in Fig. 2, heat diffusion portion 233 can have the thickness larger than heat dissipation bonding pad 2243.The favourable part of this layout is, with respect to the known technology of Fig. 1, increased the thickness T of copper at heat concentrated part, can strengthen on the one hand heat radiation,, avoided on the other hand the cost that the thickness of the radiating copper layer 211 on overall increase circuit board plate brings to increase and the thick and heavy property of structure.
Conventionally, the thickness of heat diffusion member can be selected according to the copper coin of standard, for example, can be 0.6mm-3mm, for example, can be 0.6mm or 1mm.But preferably, the thickness T of heat diffusion member 230 is only greater than 3OZ(ounce).Being greater than heat diffusion member that 3OZ is thick 230, can to avoid heat diffusion member to occur in the embedding and injection molding molding process shown in Fig. 5 (b) on the one hand curling, thereby guarantee the dimensional accuracy of the heat diffusion member 230 that forms of injection moulding, there is on the other hand the more effective diffusion that the thickness that is greater than 3OZ is conducive to heat.
Can the thermal resistance of LED light-emitting device unexpectedly be reduced by this simple structure and compared with low cost according to the heat diffusion member of this embodiment, experiment showed, according to the thermal resistance of the LED light-emitting device 200 of the embodiment of the present invention and only can be reduced to as 47.5% of the thermal resistance of known LED light-emitting device 100.
As shown in 4, heat diffusion portion 233 can be arranged to be positioned at the central part of heat diffusion member 230, and electrical connection section 231,232 lays respectively at the relative both sides of heat diffusion portion 233, and heat diffusion portion 233 separates with electrical connection section 231,232 electric insulation ground.Particularly, can be with further reference to Fig. 5 (a) and Fig. 5 (b), Fig. 5 (a) and Fig. 5 (b) show according to the formation method of the heat diffusion member 230 of the embodiment of the present invention, electrical connection section 231,232 and heat diffusion portion 233 are respectively independent metalwork, and utilize insulating materials 234 to form as one by embedding and injection molding moulding process.The favourable part of this layout is, the central part that heat diffusion portion 233 is positioned at heat diffusion member 230 is convenient to the heat of central part concentrated heat to derive.In addition, this layout is also beneficial to the heat diffusion portion 233 of the central part by being positioned at heat diffusion member 230 and the electrical connection section of relative both sides (a common electrical connection section be negative electrode and another electrical connection section is anode) is separated, and avoids producing electrical interference between the electrical connection section of relative both sides.The electricity arranging between further each metalwork that guarantees heat diffusion member 230 of insulating materials 234 is isolated.In addition, this layout also helps and makes the manufacturing process of heat diffusion member 230 simple, and cost is low, and easily controls the symmetry of the heat diffusion member 230 forming.
Preferably, the opposite end of the heat diffusion portion 233 of heat diffusion member 230 is formed as laterally extending portion 2331,2332.Laterally extending portion 2331,2332, for expanding and the contact area of radiating copper layer 211 to be connected, is beneficial to heat radiation, and can strengthen the connective stability of itself and radiating copper layer 211 by the larger area of laterally extending portion 2331,2332.
More preferably, heat diffusion member 230 is shown in Figure 7 with respect to this center line of longitudinal centre line X(of heat diffusion portion 233) be formed as axisymmetric shape, thus be beneficial to the enforcement of punching press and Shooting Technique.For example, as shown in Fig. 4-7, the heat diffusion portion 233 of heat diffusion member 230 can be formed as the shape of Chinese character " work " word,, oppositely stretch out towards two at the two ends place of heat diffusion portion 233 at the central part that is positioned at heat diffusion member 230, has more effectively expanded the contact area with copper layer 211 to be connected; And I-shaped symmetric shape is easy to processing (for example, can form by simple impact), and can form uniform heat conduction.
Electrical connection section 231,232 and heat diffusion portion 233 can form by copper.The electrical connection section 231,232 and the heat diffusion portion 233 that are formed by copper not only have good electric conductivity, and radiating effect is good.Accordingly, the heat-conducting layer 211 on circuit board 210 can be formed as covering the copper layer in circuit board surface, realizes good heat radiation thereby pass through copper.
The method that is used to form LED light-emitting device according to the embodiment of the present invention is described with reference to Fig. 5 (a) to Fig. 5 (e) below.
First,, with reference to Fig. 5 (a), first prepare to be used to form electrical connection section 231,232 and the heat diffusion portion 233 of heat diffusion member 230.Particularly, electrical connection section 231,232 and heat diffusion portion 233 can be respectively to independent metalwork.These metalworks for example can be formed by Sheet Metal Forming Technology;
Then,, with reference to Fig. 5 (b), the electrical connection section 231,232 and the heat diffusion portion 233 that form utilize insulating materials 234 to form as one by embedding and injection molding moulding process;
Then, with reference to Fig. 5 (c), prepare circuit board 210, wherein on circuit board 210, be formed with heat-conducting layer 211 and electric lead 212 and 213, and be formed with pad 214(for being connected with heat diffusion member 230, the part marking with circle in Fig. 5 (c)).From this Fig. 5 (c), can find out that pad 214 has the shape corresponding with the electrical connection section 231,232 shown in Fig. 7 and heat diffusion portion 233;
Then,, with reference to Fig. 5 (d), connect the electrical connection section 231,232 of heat diffusion member 230 and the pad 214 of heat diffusion portion 233 and circuit board 210, thereby heat diffusion member 230 is connected on circuit board 210;
Finally, with reference to Fig. 5 (e), the conductive welding disk of LED luminescence component 2241,2242 and heat dissipation bonding pad 2243 are connected to electrical connection section 231,232 and the heat diffusion portion 233 of heat diffusion member 230, thereby LED luminescence component is connected on heat diffusion member 230.
The present invention has increased a heat diffusion member between LED luminescence component and circuit board, thereby can greatly reduce thermal resistance.The thermal resistance of LED light-emitting device of the present invention be only known LED light-emitting device thermal resistance 47.5%.
These are only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.All any modifications of doing within the spirit and principles in the present invention, be equal to replacement, improvement etc., within protection scope of the present invention all should be included in.
Claims (20)
1. a LED light-emitting device, comprise LED luminescence component (220) and circuit board (210), described LED luminescence component has heat dissipation bonding pad (2243) and conductive welding disk (2241,2242) towards a side of described circuit board, described circuit board has heat-conducting layer (211) and electric lead (212,213), it is characterized in that, also comprise the heat diffusion member (230) being positioned between described LED luminescence component (220) and described circuit board (210), described heat diffusion member comprises:
Electrical connection section (231,232), connects described conductive welding disk (2241,2242) and described electric lead (212,213); And
Heat diffusion portion (233), connects described heat dissipation bonding pad (2243) and described heat-conducting layer (211), and wherein said heat diffusion portion (233) has the area larger than described heat dissipation bonding pad (2243) and/or larger thickness.
2. LED light-emitting device according to claim 1, is characterized in that, the area of heat dissipation bonding pad (2243) is larger described in the contact area rate between described heat diffusion portion (233) and described heat-conducting layer (211).
3. LED light-emitting device according to claim 2, is characterized in that, the heat diffusion portion (233) of described heat diffusion member (230) exceeds described LED luminescence component and extends.
4. LED light-emitting device according to claim 1, is characterized in that, the area of electrical connection section (231,232) is large described in the Area Ratio of described heat diffusion portion (233).
5. LED light-emitting device according to claim 1, it is characterized in that, the area sum (S2) of described electrical connection section (231,232) and described heat diffusion portion (233) is formed as being greater than the described conductive welding disk (2241,2242) of described LED luminescence component and the area sum (S1) of described heat dissipation bonding pad (2243).
6. according to the LED light-emitting device described in any one in claim 1-5, it is characterized in that, described heat diffusion portion (233) is positioned at the central part of described heat diffusion member (230), described electrical connection section (231,232) lays respectively at the relative both sides of described heat diffusion portion (233), and described heat diffusion portion (233) separates with described electrical connection section (231,232) electric insulation.
7. LED light-emitting device according to claim 6, is characterized in that, described heat diffusion member (230) is formed as axisymmetric shape with respect to the longitudinal centre line (X) of described heat diffusion portion (233).
8. LED light-emitting device according to claim 6, is characterized in that, the opposite end of the described heat diffusion portion (233) of described heat diffusion member (230) is formed as laterally extending portion (2331,2332).
9. LED light-emitting device according to claim 6, is characterized in that, the heat diffusion portion (233) of described heat diffusion member (230) is formed as I-shaped.
10. according to the LED light-emitting device described in any one in claim 1-5, it is characterized in that, described electrical connection section (231,232) and described heat diffusion portion (233) are respectively independent metalwork, and utilize insulating materials (234) to form as one by embedding and injection molding moulding process.
11. LED light-emitting devices according to claim 10, is characterized in that, described insulating materials is plastics.
12. LED light-emitting devices according to claim 10, is characterized in that, described insulating materials (234) is made up of plastic and glass fiber.
13. LED light-emitting devices according to claim 12, is characterized in that, described insulating materials (234) is made up of polybutylene terephthalate (PBT) and glass fibre.
14. according to the LED light-emitting device of claim 12, it is characterized in that, the weight content of described glass fibre in described insulating materials (234) is 10%-40%.
15. according to the LED light-emitting device described in any one in claim 1 to 5, it is characterized in that, the thickness (T) of described heat diffusion member (230) is greater than 3OZ.
16. according to the LED light-emitting device described in any one in claim 1 to 5, it is characterized in that, the thickness (T) of described heat diffusion member (230) is 0.6mm-3mm.
17. LED light-emitting devices according to claim 5, it is characterized in that, the area sum (S2) of described electrical connection section (231,232) and described heat diffusion portion (233) is formed as being greater than the described conductive welding disk (2241,2242) of described LED luminescence component and the area sum (S1) of described heat dissipation bonding pad (2243) 2 times.
18. according to the LED light-emitting device described in any one in claim 1 to 5, it is characterized in that, described electrical connection section (231,232) and described heat diffusion portion (233) form by copper.
19. according to the LED light-emitting device described in any one in claim 1 to 5, it is characterized in that, the described heat-conducting layer (211) on described circuit board (210) is for covering the copper layer in described circuit board surface.
20. 1 kinds of light fixtures, is characterized in that, have according to the LED luminescence component (200) described in any one in claim 1 to 19.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210395290.5A CN103775845A (en) | 2012-10-17 | 2012-10-17 | LED light-emitting device and lamp |
| PCT/EP2013/069883 WO2014060196A1 (en) | 2012-10-17 | 2013-09-24 | Led light emitting device and luminaire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210395290.5A CN103775845A (en) | 2012-10-17 | 2012-10-17 | LED light-emitting device and lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103775845A true CN103775845A (en) | 2014-05-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210395290.5A Pending CN103775845A (en) | 2012-10-17 | 2012-10-17 | LED light-emitting device and lamp |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103775845A (en) |
| WO (1) | WO2014060196A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021093657A1 (en) * | 2019-11-13 | 2021-05-20 | 深圳光峰科技股份有限公司 | Led display screen |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8310043B2 (en) * | 2008-03-25 | 2012-11-13 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader with ESD protection layer |
| US8368112B2 (en) * | 2009-01-14 | 2013-02-05 | Cree Huizhou Opto Limited | Aligned multiple emitter package |
| KR20120080366A (en) * | 2011-01-07 | 2012-07-17 | 삼성전자주식회사 | Light-emitting module, method of manufacturing the same and display apparatus havng the same and |
-
2012
- 2012-10-17 CN CN201210395290.5A patent/CN103775845A/en active Pending
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2013
- 2013-09-24 WO PCT/EP2013/069883 patent/WO2014060196A1/en active Application Filing
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021093657A1 (en) * | 2019-11-13 | 2021-05-20 | 深圳光峰科技股份有限公司 | Led display screen |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014060196A1 (en) | 2014-04-24 |
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Application publication date: 20140507 |