CN103769752A - Workbench used for laser drilling treatment and method for laser drilling - Google Patents
Workbench used for laser drilling treatment and method for laser drilling Download PDFInfo
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- CN103769752A CN103769752A CN201310276529.1A CN201310276529A CN103769752A CN 103769752 A CN103769752 A CN 103769752A CN 201310276529 A CN201310276529 A CN 201310276529A CN 103769752 A CN103769752 A CN 103769752A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides a workbench used for laser drilling treatment and a method for laser drilling. The workbench comprises a plate and a first linear, wherein the first linear is arranged on the plate and comprises a graphite material.
Description
The application requires to be submitted on October 22nd, 2012 rights and interests of the 10-2012-0117507 korean patent application of Department of Intellectual Property of Korea S, and the whole of this application are openly incorporated herein by reference.
Technical field
The present invention relates to a kind of for supporting the workbench of the object of processing in laser drill.
Background technology
As a kind of method piercing in circuit substrate to manufacture through hole etc., use a kind of CO of use
2the method of laser.
Using CO
2laser pierces in the situation in circuit substrate, in order to make CO
2laser damages for the problem of the workbench of support circuit substrate with because of CO
2swash reflection of light and cause the problem of unfavorable boring to minimize to the lower surface of circuit substrate, can between workbench and circuit substrate, arrange porous cushion pad and.
Fig. 1 is the perspective schematic view that uses the traditional workbench 1 for laser drill processing of cushion pad 200.With reference to Fig. 1, traditional workbench 1 comprises adsorption plate 100 and cushion pad 200.
The cushion pad 200 of porous is arranged on adsorption plate 100.For cushion pad 200, can use Pacopad
tM.Because cushion pad 200 is formed by porous material, therefore, the absorption affinity that cushion pad 200 is adsorbed plate 100 is adsorbed in adsorption plate 100, and cushion pad 200 adsorbs the pending object of arranging above simultaneously.
Pending object (for example, circuit substrate C) is arranged on cushion pad 200, because pending object is adsorbed in cushion pad 200 by the absorption affinity being produced by adsorption plate 100, therefore fixes the position stability of pending object.
By circuit substrate C is stably being arranged under the state on adsorption plate 100 CO
2ear Mucosa Treated by He Ne Laser Irradiation, on circuit substrate C, can be holed and process to form hole (for example, through hole) circuit substrate C.Now, because cushion pad 200 is arranged between circuit substrate C and adsorption plate 100, therefore can prevent CO
2the laser straight middle adsorption plate 100 of returning.So, can effectively reduce by CO
2the damage to adsorption plate 100 and CO that laser causes
2the diffuse reflection of laser on adsorption plate 100.
But, in the time using cushion pad 200, although reduced damage and the CO to adsorption plate 100
2the diffuse reflection of laser, but because cushion pad 200 is according to the laser drill processing repeating and by CO
2laser damages, and therefore, should regularly replace cushion pad 200.The frequent replacing of cushion pad 200 can cause the decline of manufacturing speed and the increase of manufacturing cost.
In addition, cushion pad 200 may be due to the CO for circuit substrate C is holed
2the energy of laser and partly burning, thereby cause circuit substrate C adsorption hole 110 contaminated or workbench 1 to get clogged.
More than describing is the knowledge related to the present invention known to applicant based on the application, and can not infer that above description is corresponding to the known or common technical description to public's wide-scale distribution.
Summary of the invention
The invention provides a kind of for effectively reducing the workbench for laser drill processing and a kind of method for drilling holes of the damage causing because of boring laser.
According to an aspect of the present invention, provide a kind of workbench for laser drill processing, described workbench comprises: plate; With the first liner, arrange onboard and comprise graphite material.
Multiple adsorption holes can be formed on the upper surface of plate, and the multiple through holes that are connected to the described multiple adsorption holes on the upper surface that is formed on plate can be formed on the first liner.
Workbench can comprise the separating member being arranged between the first liner and pending object, thus when arrange pending object on the first liner time, keep the upper surface of the first liner and the lower surface of pending object separated from one another.
Separating member can be the second liner being formed by porous material and be arranged on the first liner.
Separating member can be the protuberance forming as one with the first liner, and can be formed as from the upper surface of the first liner outstanding.
According to a further aspect in the invention, provide a kind of method for drilling holes, comprising: the first liner being formed by graphite material (a) is set onboard; (b) pending object is set on the first liner; (c) in pending object, form through hole by irradiate laser on pending object.
Method for drilling holes also can be included in (a) and (b) between the second liner of being formed by porous material is set on the first liner, wherein, (b) be included in pending object be set on the second liner.
In the time pending object being set on the upper surface of the first liner, can on the upper surface of the first liner, form protuberance, so that the upper surface of the first liner and the lower surface of pending object keep separating.
Accompanying drawing explanation
By describe exemplary embodiment of the present invention in detail with reference to accompanying drawing, above and other feature & benefits of the present invention will become clearer, wherein:
Fig. 1 is the perspective schematic view for traditional workbench of laser drill processing;
Fig. 2 is the perspective schematic view for the workbench of laser drill processing according to an embodiment of the invention;
Fig. 3 is the schematic cross sectional views of the workbench of Fig. 2;
Fig. 4 A and Fig. 4 B are the photos illustrating according to the state of the part assembly of the workbench of use Fig. 2;
Fig. 5 A and Fig. 5 B illustrate respectively the upper surface of substrate and the photo of lower surface of on the workbench of Fig. 2, having carried out laser drill processing;
Fig. 6 is the perspective schematic view of the workbench for laser drill processing according to another embodiment of the present invention;
Fig. 7 is the schematic cross sectional views of the workbench of Fig. 6;
Fig. 8 is the perspective schematic view of the workbench for laser drill processing according to another embodiment of the present invention;
Fig. 9 is the schematic cross sectional views of the workbench of Fig. 8;
Figure 10 A and Figure 10 B illustrate respectively the upper surface of substrate and the photo of lower surface of on the workbench of Fig. 8, having carried out laser drill processing;
Figure 11 is the photo illustrating according to the state of the part assembly of the workbench of use Fig. 8;
Figure 12 illustrates the flow chart of method for drilling holes according to an embodiment of the invention.
The specific embodiment
Below, the existing workbench for laser drill processing according to an embodiment of the invention of describing with reference to the accompanying drawings.
Fig. 2 is the perspective schematic view for the workbench 2 of laser drill processing according to an embodiment of the invention.
With reference to Fig. 2, workbench 2 comprises adsorption plate 100 and the first liner 300.
The first liner 300 is formed by graphite material, and comprises multiple through holes 310 of aiming at multiple adsorption holes 110 of adsorption plate 100.As the method for manufacturing the first liner 300 being formed by graphite material, can use methods such as graphite compacting, thermoforming, cutting.
Be known that the graphite that forms the first liner 300 has following physical characteristic.
(1) mechanical property: although the mechanical performance of graphite changes according to raw material and manufacture method, graphite is at high temperature tending towards having high strength conventionally.For example, the intensity of graphite at 2,500 ℃ is about the twice of graphite intensity at normal temperatures.Between bending strength, hot strength and the compressive strength of graphite, set up following relationship.
Hot strength=0.6 × bending strength
Compressive strength=1.9 × bending strength
(2) thermal resistance: can use graphite up to 400 ℃ to the temperature of 450 ℃ (being 350 ℃ for carbon) under oxidizing condition, use the graphite after antioxidant specially treated to can be used for up to 650 ℃.Specifically, can, such as using under the reducing condition of vacuum drying oven, even under the high temperature of 3,000 ℃, use graphite.
(3) thermal conductivity and coefficient of thermal expansion: the thermal conductivity of graphite is very high, for example, at normal temperatures, it is about twice of the thermal conductivity of steel, be about 1/3 times of thermal conductivity of copper, and be about 2/3 times of thermal conductivity of aluminium, and the coefficient of thermal expansion of graphite is less than the coefficient of thermal expansion of metal.
As mentioned above, because graphite has good heat resistance characteristic and good heat-sinking capability, the laser machinability of the first liner 300 that therefore comprises graphite material is low, and therefore, the first liner 300 is damaged by laser hardly.
In addition,, because the laser absorption rate of graphite material is high, therefore, can effectively reduce the lip-deep diffuse reflection of laser at the first liner 300.
Fig. 3 is the schematic cross sectional views of the workbench 2 of Fig. 2 according to an embodiment of the invention, for describing by using workbench 2 to treat the method that handling object is holed.
In current embodiment, suppose that pending object is the substrate C for circuit, and by laser drill process formed logical.Substrate C can have panel-shaped or can supply with continuously with roller shape.
As shown in Figure 3, substrate C is stably arranged on workbench 2.Adsorption plate 100 produces absorption affinity according to the operation of the drawdown pump that is connected to adsorption plate 100 by aspirating air via multiple adsorption holes 110.Because the absorption affinity producing by adsorption plate 100 is delivered to the substrate C being stably arranged on the first liner 300 via multiple through holes 310 of the first liner 300, therefore substrate C is stably adsorbed and is fixed to workbench 2.
In the time that substrate C is fixed on workbench 2, at the laser oscillator LR above substrate C, laser L is radiated on substrate C by operation setting.Now, adjust the focal point F of laser L, make laser L focus on the inside of substrate C.
In the time laser L being radiated on substrate C, the energy of laser L is delivered to substrate C, thereby forms through hole in substrate C.
In this processing, a part of laser L arrives the upper surface 301 of the first liner 300 below substrate C in the situation that not absorbed by substrate C, therefore, damages the first liner 300.But, because there is low laser machinability according to the first liner 300 of current embodiment because of the good heat resistance characteristic of graphite material, so compared with the cushion pad 200 of traditional workbench 1, the first liner 300 has better durability, and more not fragile.
Fig. 4 A and Fig. 4 B illustrate on its of result of the durability test of the first liner 300 of having carried out as applicant the photo of the surface state of the first liner 300 of direct irradiation laser.More particularly, Fig. 4 A is the photo being illustrated in by Laser Focusing is repeated on the first liner 300 to the surface state of ten laser drill the first liners 300 after treatment to the first liner 300, and Fig. 4 B is illustrated in the photo that focus by making laser departs from the first liner 300 and repeat the surface state of 50 laser drill the first liners 300 after treatment.In the case, for laser, use CO
2laser forms through hole in substrate C.
As shown in Figure 4 A, although repeat ten laser drill processing, the first liner 300 is not perforated yet, and is only approximately 50 μ m according to the degree of depth of recessed T of the laser drill processing that repeats ten times.In addition in the test of Fig. 4 B, be only approximately 20 μ m to 25 μ m according to the degree of depth of recessed T of the laser drill processing that repeats 50 times.
According to applicant's experience, in the time using traditional workbench 1, after ten laser drill cycle for the treatment of, answer exchange buffering pad 200, but it is predicted, considering the durability of the first liner 300, is at least ten times of the stage of replacement of the cushion pad 200 of traditional workbench 1 according to the stage of replacement of the first liner 300 of current embodiment.
In addition, because the first liner 300 has better laser isolation performance compared with cushion pad 200, so the first liner 300 can more effectively suppress damaged surfaces adsorption plate 100 being caused by laser compared with traditional workbench 1.
In addition, traditional workbench 1 has the problem that is adsorbed the defect of the hole shape that the surface diffuse reflectance of plate 100 occurs on the lower surface of substrate C because of laser, or there is the problem of polluting the lower surface of substrate C because of the flue gas of adsorption plate 100 or cushion pad 200, but there is good optical absorption characteristics and good heat resistance characteristic according to the first liner 300 of current embodiment, thereby effectively reduced the pollution of the lower surface C1 of the substrate C being caused by diffuse reflection or the flue gas of laser.
Fig. 5 A and Fig. 5 B illustrate the surperficial photo of having carried out the test base of laser drill processing on the workbench 2 of Fig. 2, and wherein, Fig. 5 A is the photo that the upper surface of test base is shown, and Fig. 5 B is the photo that the lower surface of test base is shown.With reference to Fig. 5 A, in the time using workbench 2, the circularity of the hole TH forming on the upper surface of test base is very good.But, with reference to Fig. 5 B, the circularity of the hole TH forming on the lower surface of test base is slightly poor compared with the hole TH forming on the upper surface of test base, and finds a little the pollution being caused by flue gas, but the circularity of Fig. 5 B and pollution are better than using the situation of traditional workbench 1.
As mentioned above, compared with traditional workbench 1, can significantly reduce the cost relevant with the replacing that consumes part and shorten consuming the work dwell time that part more changes jobs required according to the workbench 2 of current embodiment.In addition also can effectively solve, the problem of traditional workbench 1 contingent faulty goods.
The workbench for laser drill processing is according to another embodiment of the present invention described with reference to the accompanying drawings below.
Fig. 6 is the perspective schematic view of the workbench 3 for laser drill processing according to another embodiment of the present invention.With reference to Fig. 6, comprise according to the workbench 3 of current embodiment: adsorption plate 100; The first liner 300, is arranged on adsorption plate 100; With the separating member being formed on the first liner 300, comprise outside 400 and inner 410.
Because the adsorption plate of Fig. 6 100 is identical with the adsorption plate 100 of the workbench 2 of Fig. 2, no longer repeat its description.
Be similar to the first liner 300 of the workbench 2 of Fig. 2, the first liner 300 of Fig. 6 is formed by graphite material, and comprises the multiple through holes 310 that are connected with multiple adsorption holes 110 of adsorption plate 100.
Separating member and the first liner 300 form as one continuously and are formed as protruding from the upper surface of the first liner 300., separating member is also formed on graphite material.Separating member is separated from one another with the lower surface that is arranged in the substrate C on the first liner 300 by the upper surface of the first liner 300, and can comprise outside 400 and inner 410.The edge part of outside 400 support substrate C, and the inside of inner 410 support substrate C.Like this, separating member is edge part and the inside of support substrate C equably, thereby suppress substrate because the absorption affinity of adsorption plate 100 is out of shape.But, preferably, not by inner 410 be arranged in substrate C boring part under.
Although described separating member and the first liner 300 is integrally formed separating member in current embodiment, separating member can be individually formed with the first liner 300, is then assembled together with the upper surface of the first liner 300.
Fig. 7 is the schematic cross sectional views of the workbench 3 of Fig. 6 according to an embodiment of the invention, forms the processing of through hole for being described in substrate C on workbench 3.
As shown in Figure 7, in the time substrate C being stably arranged on the first liner 300, by the drawdown pump that is operationally connected to adsorption plate 100, substrate C being adsorbed and is fixed on the first liner 300.
When under the fixing state in the position at the first liner 300, Ear Mucosa Treated by He Ne Laser Irradiation on substrate C time, being formed to through hole in substrate C.Now, the focus of laser is adjusted to the inside of substrate C.
According to current embodiment, because the outside of separating member 400 and inner 410 is arranged between the upper surface 301 of the first liner 300 and the lower surface C1 of substrate C, so form separated space 350 between the upper surface 301 of the first liner 300 and the lower surface C1 of substrate C.So the upper surface 301 that is formed on the first liner 300 on substrate C departs from the focal point F of laser L.
That is, compared with the workbench 2 of Fig. 2, between the focal point F of laser L and the upper surface 301 of the first liner 300, there is longer distance according to the workbench 3 of current embodiment, therefore, can more effectively suppress the damage of laser L to the first liner 300.
In addition, according to workbench 3, because the distance between the upper surface 301 of the focal point F of laser L and the first liner 300 is longer, so also reduced the diffuse reflection of laser L, therefore, also more effectively reduce defect on the lower surface C1 of substrate C or the appearance of flue gas, thereby further reduced the unfavorable boring to substrate C.
Below, the existing workbench for laser drill processing according to another embodiment of the present invention of describing with reference to the accompanying drawings.
Fig. 8 is the perspective schematic view of the workbench 4 for laser drill processing according to another embodiment of the present invention.
With reference to Fig. 8, comprise adsorption plate 100, the first liner 300 and the second liner 200 according to the workbench 4 of current embodiment.
The adsorption plate 100 of Fig. 8 and the first liner 300 are basic identical with adsorption plate 100 and first liner 300 of the workbench 2 of Fig. 2, so no longer repeat its description.
The second liner 200 is arranged on the cushion pad on the first liner 300 and has hole.For the cushion pad corresponding with the second liner 200, can use Pacopad
tM.Because the second liner 200 is set on the first liner 300, so in the time substrate C being set on the second liner 200, the thickness of lower surface interval the second liner 200 of the upper surface of the first liner 300 and substrate C., the second liner 200 is also as the separating member that the first liner 300 is separated with substrate C.
Fig. 9 is the schematic cross sectional views of the workbench 4 of Fig. 8 according to an embodiment of the invention, for being described in the processing to substrate C boring on workbench 4.
As shown in Figure 9, for the laser drill processing of substrate C, substrate C is stably arranged on the second liner 200 of workbench 4.Now, the absorption affinity of adsorption plate 100 is delivered to substrate C via multiple through holes 310 of the first liner 300 and the second liner 200 of porous.So substrate C is stably fixed on workbench 4.
In the time that the position of substrate C is fixed, by irradiate laser L on substrate C, can in substrate C, form through hole.
According to workbench 4, because the second liner 200 is arranged between the upper surface 301 of the first liner 300 and the lower surface C1 of substrate C, so the lower surface C1 of substrate C and the upper surface 301 of the first liner 300 separate.Therefore, the laser L being radiated on substrate C further defocuses at the first liner 300 places, thereby causes energy concentration to decline.Therefore, long according to the life-span of the first liner 300 of the workbench 2 of comparable Fig. 2 of life-span of the first liner 300 of the workbench 4 of current embodiment.
In addition, because the first liner 300 comprises graphite material, so the first liner 300 has low laser reflection intensity and low laser machinability, and because laser arrives the surface of the first liner 300 under the defocus condition of laser, so can further reduce the diffuse reflection of laser and the appearance of flue gas.
In addition, because the second liner 200 is arranged between the first liner 300 and substrate C, so even if the diffuse reflection of laser occurs on the upper surface 301 of the first liner 300 or occur flue gas, still can reduce significantly the effect of its lower surface C1 to substrate C.
Figure 10 A illustrates the photo of having carried out the upper surface of the test base of laser drill processing on the workbench 4 of Fig. 8, and Figure 10 B is the photo of the lower surface of test base.
With reference to Figure 10 A and Figure 10 B, be formed on the hole TH on the upper surface of the test base of having carried out laser drill processing on the workbench 4 of Fig. 8 and be formed on the circularity of the hole TH forming on the lower surface of test base good.In addition, do not find the pollution that flue gas causes the lower surface of test base.
Figure 11 is illustrated in workbench 4 by using Fig. 8 length is carried out to the photo of the state of laser drill the first liner 300 after treatment continuously for the baseplate material of approximately 87 meters.With reference to Figure 11, although be the continuous laser boring processing of the baseplate material of approximately 87 meters to length, the first liner 300 is almost not damaged yet.
In addition,, according to workbench 4, because the good laser energy absorption ability of the graphite material that forms the first liner 300 makes the second liner 200 less because laser damages, therefore can reduce the damage to the first liner 300 and the second liner 200 being caused by laser.Under actual conditions, although be the continuous laser boring processing of the baseplate material of approximately 87 meters to length, the state of the second liner 200 is still very good.
According to applicant's test result, the stage of replacement of inferring the second liner 200 that workbench 4 extends to about ten times to about 20 times of changer of traditional workbench 1.
Therefore, have advantages of like this according to the workbench 4 of current embodiment, that is, compared with traditional workbench 1, can significantly reduce the cost relevant to the replacing of cushion pad, and the cost that can effectively solve the replacing based on cushion pad increases and the problem of productive rate decline.
Method for drilling holes according to an embodiment of the invention is now described.
Figure 12 illustrates the flow chart of method for drilling holes according to an embodiment of the invention.With reference to Figure 12, method for drilling holes comprises: on adsorption plate, arrange the first liner operation S10, on the first liner, arrange the second liner operation S20, the operation S30 of substrate is set on the second liner and by using the operation S40 of laser to substrate boring.
The operation S10 that the first liner is set on adsorption plate is included in the first liner (, graphite backing) that on adsorption plate, setting comprises graphite material.The adsorption plate 100 of the adsorption plate of Figure 12 and the first liner and workbench 2, workbench 3 or workbench 4 and the first liner 300 are basic identical.
The operation S20 that the second liner is set on the first liner is included in the second liner (, cushion pad) that porous is set on the first liner.The second liner 200 of the second liner of porous and workbench 4 is basic identical.
The operation S30 that substrate is set on the second liner comprises by substrate is set on the second liner and keeps separating between substrate and the upper surface of the first liner.Although described in current embodiment by arranging that between the first liner and substrate the second liner is by separated from one another to the first liner and substrate, can form empty space between the first liner and substrate by the separating member of the workbench of Fig. 63 400 and separating member 410.
By use laser to the operation S40 of substrate boring comprise by by Laser Focusing on substrate and by Ear Mucosa Treated by He Ne Laser Irradiation on substrate for example, to form hole (, through hole) in substrate.
According to method for drilling holes, because by separated from one another to the first liner and substrate, so laser arrives the first liner under defocus condition, therefore, can effectively suppress the damage to the first liner.In addition, because separating between the first liner and substrate, so can effectively suppress due to the diffuse reflection of laser that can occur on the first liner and the appearance of flue gas and damage or pollution that the lower surface of substrate is caused.In addition, because the first liner has much better laser absorption performance than the second liner, thus also can effectively suppress the damage to the second liner, thus the stage of replacement of significant prolongation the second liner.
According to method for drilling holes, significant prolongation the life-span of parts, thereby contribute to very much cost savings and productive rate to improve, and contribute to very much effectively to reduce the unfavorable boring of product.
For workbench and the method for drilling holes of laser drill processing, even product is repeated to laser drill processing, still can effectively reduce the damage being caused by laser according to an embodiment of the invention.Therefore, extend the part replacement phase, thereby increased working time and productive rate, and effectively reduced the cost that part replacement is followed.
Although described according to an embodiment of the invention for workbench and the method for drilling holes of laser drill processing, the invention is not restricted to this, can modify to the present invention with various forms.
For example, although described by by substrate adsorption to the position that fixes substrate for the workbench of laser drill processing, can use mechanical clamp to fix the position of substrate.In the case, workbench needn't produce absorption affinity, and the first liner 300 needn't comprise multiple through holes 310.
In addition, between the first liner 300 and the second liner 200 and between the second liner 200 and substrate C, there is no separated space although described in the workbench 4 of Fig. 8, between the first liner 300 and the second liner 200 or between the second liner 200 and substrate C, can form separated space by separating member.In the case, because the first liner 300 further defocuses from the focus of laser, therefore can further reduce damage and irreflexive sharp light intensity to the first liner 300.
In addition, although described in an embodiment pending to liking the substrate for circuit, but any product can be all pending object, as long as can be by product is stably arranged on according to by laser, product being holed on the workbench of any one embodiment in embodiment.
The present invention can modify with various forms.
Claims (11)
1. for a workbench for laser drill processing, described workbench comprises:
Plate; With
The first liner, arranges onboard and comprises graphite material.
2. workbench as claimed in claim 1, wherein, multiple adsorption holes are formed on the upper surface of plate, and the multiple through holes that are connected to the described multiple adsorption holes on the upper surface that is formed on plate are formed on the first liner.
3. workbench as claimed in claim 1, wherein, separating member is arranged between the first liner and pending object, thereby in the time that pending object placement is on the first liner, keep the upper surface of the first liner and the lower surface of pending object separated from one another.
4. workbench as claimed in claim 3, wherein, separating member is the second liner being formed by porous material and is arranged on the first liner.
5. workbench as claimed in claim 3, wherein, separating member and the first liner form as one, and are formed as from the upper surface of the first liner outstanding.
6. a method for drilling holes, comprises the steps:
(a) the first liner being formed by graphite material is set onboard;
(b) pending object is set on the first liner; With
(c) by irradiating laser to form at least one through hole in pending object on pending object.
7. method for drilling holes as claimed in claim 6, is also included in the second liner that between step (a) and step (b), setting is formed by porous material on the first liner,
Wherein, step (b) is included on the second liner pending object is set, so that described object is arranged on the first liner together with the second liner.
8. method for drilling holes as claimed in claim 6, wherein, in the time pending object being set on the upper surface of the first liner, on the upper surface of the first liner, form at least one protuberance, so that the upper surface of the first liner and the lower surface of pending object keep separating.
9. method for drilling holes as claimed in claim 8, wherein, described at least one through hole of substrate is formed as flatly away from described at least one protuberance.
10. method for drilling holes as claimed in claim 8, wherein, described at least one protuberance and the first liner form as one.
11. method for drilling holes as claimed in claim 6, wherein, multiple adsorption holes are formed on the upper surface of plate, and the multiple through holes that are connected to the described multiple adsorption holes on the upper surface that is formed on plate are formed on the first liner.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020120117507A KR20140068276A (en) | 2012-10-22 | 2012-10-22 | Support table for laser drilling process and method for laser drilling |
| KR10-2012-0117507 | 2012-10-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103769752A true CN103769752A (en) | 2014-05-07 |
| CN103769752B CN103769752B (en) | 2016-12-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310276529.1A Active CN103769752B (en) | 2012-10-22 | 2013-07-03 | The workbench processed for laser drill and method for drilling holes |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6426334B2 (en) |
| KR (1) | KR20140068276A (en) |
| CN (1) | CN103769752B (en) |
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| CN106891094A (en) * | 2015-12-14 | 2017-06-27 | 上海申和热磁电子有限公司 | Laser cutting machine workbench for covering copper ceramic substrate |
| CN109732204A (en) * | 2019-02-01 | 2019-05-10 | 大族激光科技产业集团股份有限公司 | Laser soldering device and method for laser welding |
| CN110116268A (en) * | 2018-02-05 | 2019-08-13 | 三星显示有限公司 | Laser cutting device and sucking unit |
| CN113523587A (en) * | 2020-04-20 | 2021-10-22 | 无锡深南电路有限公司 | Plate placing machine, plate collecting machine and laser drilling system |
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| KR20180047145A (en) * | 2016-10-31 | 2018-05-10 | 삼성전기주식회사 | Jig for board fabrication, apparutus for forming through hole of board and system for forming through hole |
| RU2731492C1 (en) * | 2020-02-25 | 2020-09-03 | Алексей Николаевич Коруков | Coordinate table for a laser machine tool |
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| CN105057898A (en) * | 2015-08-04 | 2015-11-18 | 成都宏盛电子科技有限公司 | Method for machining step type holes in plastic uptake product |
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| CN106891094A (en) * | 2015-12-14 | 2017-06-27 | 上海申和热磁电子有限公司 | Laser cutting machine workbench for covering copper ceramic substrate |
| CN110116268A (en) * | 2018-02-05 | 2019-08-13 | 三星显示有限公司 | Laser cutting device and sucking unit |
| CN110116268B (en) * | 2018-02-05 | 2023-02-17 | 三星显示有限公司 | Laser cutting device and suction unit |
| CN109732204A (en) * | 2019-02-01 | 2019-05-10 | 大族激光科技产业集团股份有限公司 | Laser soldering device and method for laser welding |
| CN113523587A (en) * | 2020-04-20 | 2021-10-22 | 无锡深南电路有限公司 | Plate placing machine, plate collecting machine and laser drilling system |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6426334B2 (en) | 2018-11-21 |
| JP2014083595A (en) | 2014-05-12 |
| CN103769752B (en) | 2016-12-28 |
| KR20140068276A (en) | 2014-06-09 |
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