CN106891094A - Laser cutting machine workbench for covering copper ceramic substrate - Google Patents

Laser cutting machine workbench for covering copper ceramic substrate Download PDF

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Publication number
CN106891094A
CN106891094A CN201510934137.9A CN201510934137A CN106891094A CN 106891094 A CN106891094 A CN 106891094A CN 201510934137 A CN201510934137 A CN 201510934137A CN 106891094 A CN106891094 A CN 106891094A
Authority
CN
China
Prior art keywords
workbench
base plate
cover plate
ceramic substrate
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510934137.9A
Other languages
Chinese (zh)
Inventor
柴田健
柴田健一
贺贤汉
戴洪兴
李德善
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Shenhe Thermo Magnetics Electronics Co Ltd
Original Assignee
Shanghai Shenhe Thermo Magnetics Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Shenhe Thermo Magnetics Electronics Co Ltd filed Critical Shanghai Shenhe Thermo Magnetics Electronics Co Ltd
Priority to CN201510934137.9A priority Critical patent/CN106891094A/en
Publication of CN106891094A publication Critical patent/CN106891094A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices

Abstract

Cutting technique field the invention belongs to cover copper ceramic substrate, discloses a kind of laser cutting machine workbench for covering copper ceramic substrate, including:Workbench and workbench base plate, the workbench are provided with workbench base plate, and the workbench base plate is provided with base plate suction hole;Also include cover plate, the cover plate is provided with base plate counterbore located at the surface of the workbench base plate, the workbench base plate, and the cover plate is provided with the cover plate counterbore being connected with the cover plate suction hole of the base plate suction hole identical set and with the base plate counterbore.The present invention sets one layer of cover plate by the workbench backplate surface in lightweight, aluminium oxide ceramics is only contacted with cover plate, not easy to wear because cover plate hardness is high, it is ensured that workbench base plate plane degree does not change, and improves the yield of cutting products.

Description

Laser cutting machine workbench for covering copper ceramic substrate
Technical field
Cutting technique field the invention belongs to cover copper ceramic substrate, it is more particularly to a kind of for covering copper pottery The laser cutting machine workbench of porcelain substrate.
Background technology
Covering copper ceramic substrate (DBC substrates) is incited somebody to action using DBC (Direct Bond Copper) technology A kind of basic electronic material that Copper Foil direct sintering is made in ceramic surface.Covering copper ceramic substrate has Fabulous thermal cycle, dimensionally stable, the good, thermal conductivity of rigidity are high, reliability is high, and covering copper face can be with The characteristics of etching various figures, and it is a kind of pollution-free, non-harmful green product, is used Temperature is quite extensive, can from -55 DEG C~850 DEG C, thermal coefficient of expansion close to silicon, its application field It is quite varied:Can be used for semiconductor cooler, electronic heater, high-power electric semiconductor module, Power control circuit, power hybrid circuit, intelligent power component, high frequency switch power, solid-state relay Device, automotive electronics, space flight and aviation and military electronic component, solar cell panel assembly, telecommunication is special The multinomial industrial electronic field such as interchanger, reception system, laser.
Copper ceramic substrate (DBC substrates) is covered in preparation process, it is necessary to the product that will etch figure is carried out Laser cutting, is divided into single piece of product.In order to mitigate equipment workload and reduces cost, on laser machine The workbench base plate for placing product to be cut is typically, with lightweight metal material (such as aluminum metal), to see Fig. 1.Lightweight metal material is although lightweight, but hardness is low, not wear-resisting.And DBC substrate matrix materials It is aluminium oxide ceramics, hardness is high.When DBC substrates are put into workbench base plate and remove during cutting, oxidation Aluminium ceramics can contact generation friction with base plate.After long-time rubs, the workbench base plate table of lightweight Face produces abrasion:Surface irregularity.After product is put into workbench base plate, also present it is concavo-convex not Level state so that laser focal is inconsistent during cutting.The product deep mixed cause of joint-cutting depth is caused, is broken Damage bad increase.
The content of the invention
It is an object of the invention to overcome the deficiencies in the prior art, there is provided one kind is for covering copper ceramic substrate Laser cutting machine workbench.The present invention sets one layer of lid by the workbench backplate surface of lightweight Plate (hard, wear-resistant thin plate), makes aluminium oxide ceramics only be contacted with cover plate, because cover plate hardness is high, is difficult Abrasion, it is ensured that workbench base plate plane degree does not change, and improves the yield of cutting products.
In order to achieve the above object, the invention provides a kind of laser cutting for covering copper ceramic substrate Machine worktable, including:Workbench and workbench base plate, the workbench are provided with workbench base plate, The workbench base plate is provided with base plate suction hole;Also include cover plate, the cover plate is located at the work The surface of platform base plate, the workbench base plate is provided with base plate counterbore, the cover plate be provided with it is described The cover plate suction hole of base plate suction hole identical set and the cover plate counterbore being connected with the base plate counterbore.
The workbench base plate is identical with the length and width size of cover plate.
Screw thread is provided with the base plate counterbore.
The thickness of the cover plate is 1.0mm-5.0mm, and preferred thickness is 1.0mm~3.0mm.
The material of the cover plate is stainless steel, tantalum, molybdenum or aluminium oxide ceramics.
The beneficial effects of the invention are as follows:
(1) one layer of hard, wear-resistant thin plate is set by the workbench backplate surface in lightweight, is improve Workbench base plate wearability, keeps its flatness so that laser focal does not change during cutting. Maintain the lightweight feature of lightweight workbench again simultaneously;
(2) hard book plate is connected by screw with the workbench base plate of lightweight, can easily be determined Phase is changed, and keeps workbench base plate smooth for a long time;
(3) to ensure in cutting process, reduce aluminium oxide ceramics and worn and torn with workbench backplate surface, By the uniformity for keeping the flatness of workbench base plate and product to be cut to ensure laser focal, Make the product joint-cutting depth depth consistent, improve the yield of cutting products.
Brief description of the drawings
Fig. 1 is existing laser cutting machine workbench structural representation;
Fig. 2 is covering plate structure schematic diagram of the invention;
Fig. 3 is workbench of the invention and workbench base arrangement schematic diagram;
Fig. 4 is laser cutting machine workbench structural representation of the invention.
Wherein:
1- workbench 2- workbench base plate 21- base plate suction hole 22- base plate counterbores
3- cover plate 31- cover plate suction hole 32- cover plate counterbore 4- screws
Specific embodiment
Below in conjunction with the drawings and specific embodiments, the present invention will be further described.
Embodiment 1:
A kind of laser cutting machine workbench for covering copper ceramic substrate as in Figure 2-4, including:Work Make platform 1, workbench base plate 2 and cover plate 3.
Workbench 1 is provided with workbench base plate 2, and workbench base plate 2 is provided with base plate suction hole 21.
Cover plate 3 is provided with base plate counterbore 22 located at the surface of workbench base plate 2, workbench base plate 2, Cover plate 3 is provided with the cover plate suction hole 31 with the identical set of base plate suction hole 21, it is ensured that inspiratory capacity is not sent out Changing, and cover plate 3 is provided with the cover plate counterbore 32 being connected with base plate counterbore 22.
Workbench base plate 2 is identical with the length and width size of cover plate 3.
Screw thread is provided with base plate counterbore 22, cover plate 3 is connected with workbench base plate 2 by screw 4.
The thickness of cover plate 3 is 2.0mm.
The material of cover plate 3 is stainless steel, tantalum, molybdenum or aluminium oxide ceramics.
Below the preferred embodiment to the invention is illustrated, but the invention is simultaneously It is not limited to described embodiment, those of ordinary skill in the art are without prejudice to the invention spirit Under the premise of can also make a variety of equivalent modification or replacements, these equivalent modifications or replacement are included In the application claim limited range.

Claims (6)

1. a kind of laser cutting machine workbench for covering copper ceramic substrate, including:Workbench and workbench base plate, the workbench are provided with workbench base plate, and the workbench base plate is provided with base plate suction hole;It is characterized in that:Also include cover plate, the cover plate is provided with base plate counterbore located at the surface of the workbench base plate, the workbench base plate, and the cover plate is provided with the cover plate counterbore being connected with the cover plate suction hole of the base plate suction hole identical set and with the base plate counterbore.
2. a kind of laser cutting machine workbench for covering copper ceramic substrate according to claim 1, it is characterised in that:The workbench base plate is identical with the length and width size of cover plate.
3. a kind of laser cutting machine workbench for covering copper ceramic substrate according to claim 1, it is characterised in that:Screw thread is provided with the base plate counterbore.
4. a kind of laser cutting machine workbench for covering copper ceramic substrate according to claim 1, it is characterised in that:The thickness of the cover plate is 1.0mm-5.0mm.
5. a kind of laser cutting machine workbench for covering copper ceramic substrate according to claim 4, it is characterised in that:The thickness of the cover plate is 1.0mm~3.0mm.
6. a kind of laser cutting machine workbench for covering copper ceramic substrate according to claim 1, it is characterised in that:The material of the cover plate is stainless steel, tantalum, molybdenum or aluminium oxide ceramics.
CN201510934137.9A 2015-12-14 2015-12-14 Laser cutting machine workbench for covering copper ceramic substrate Pending CN106891094A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510934137.9A CN106891094A (en) 2015-12-14 2015-12-14 Laser cutting machine workbench for covering copper ceramic substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510934137.9A CN106891094A (en) 2015-12-14 2015-12-14 Laser cutting machine workbench for covering copper ceramic substrate

Publications (1)

Publication Number Publication Date
CN106891094A true CN106891094A (en) 2017-06-27

Family

ID=59188013

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510934137.9A Pending CN106891094A (en) 2015-12-14 2015-12-14 Laser cutting machine workbench for covering copper ceramic substrate

Country Status (1)

Country Link
CN (1) CN106891094A (en)

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101068666A (en) * 2004-10-13 2007-11-07 三星钻石工业株式会社 Method and apparatus for scribing brittle material board and system for breaking brittle material board
CN101214580A (en) * 2008-01-21 2008-07-09 山东大学 Ultra-thin sheet material pulsed laser micro rivet connection method and special-purpose device thereof
CN101554755A (en) * 2008-03-17 2009-10-14 三星钻石工业股份有限公司 A marking device and a marking method
CN101570040A (en) * 2009-04-30 2009-11-04 苏州德龙激光有限公司 X-Y-theta motion platform applied to LED laser cutting equipment
CN201346752Y (en) * 2009-01-22 2009-11-18 华中科技大学 Special vacuum chuck for flexible printed circuit (FPC) board
CN201931454U (en) * 2010-12-09 2011-08-17 北大方正集团有限公司 Vacuum absorption table top and vacuum absorption table provided with same
CN102653115A (en) * 2011-03-04 2012-09-05 三星钻石工业股份有限公司 Ruling device and ruling method
CN202963851U (en) * 2012-11-20 2013-06-05 惠州市金百泽电路科技有限公司 Jig for improving surface flatness of laser drilling
CN103143842A (en) * 2013-03-18 2013-06-12 武汉科技大学 Laser cutting system for soft material cutting and cutting method of laser cutting system
CN103433624A (en) * 2013-08-29 2013-12-11 武汉帝尔激光科技有限公司 Laser cutting processing method and system of ceramic substrate
CN103531516A (en) * 2012-07-03 2014-01-22 株式会社迪思科 Chuck table mechanism of cutting apparatus
CN103737184A (en) * 2013-12-25 2014-04-23 广州兴森快捷电路科技有限公司 Device and fixture for performing laser machining on through hole and fixture installation method
CN103769752A (en) * 2012-10-22 2014-05-07 三星泰科威株式会社 Workbench used for laser drilling treatment and method for laser drilling
CN104014940A (en) * 2014-05-29 2014-09-03 深圳市大族激光科技股份有限公司 Coating and drilling method of ceramic substrate, coating sol and coating device
CN104626376A (en) * 2013-11-11 2015-05-20 株式会社迪思科 Cutting device
CN204747780U (en) * 2015-04-23 2015-11-11 深圳光韵达激光应用技术有限公司 A ceramic suction table for laser cutting equipment

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101068666A (en) * 2004-10-13 2007-11-07 三星钻石工业株式会社 Method and apparatus for scribing brittle material board and system for breaking brittle material board
CN101214580A (en) * 2008-01-21 2008-07-09 山东大学 Ultra-thin sheet material pulsed laser micro rivet connection method and special-purpose device thereof
CN101554755A (en) * 2008-03-17 2009-10-14 三星钻石工业股份有限公司 A marking device and a marking method
CN201346752Y (en) * 2009-01-22 2009-11-18 华中科技大学 Special vacuum chuck for flexible printed circuit (FPC) board
CN101570040A (en) * 2009-04-30 2009-11-04 苏州德龙激光有限公司 X-Y-theta motion platform applied to LED laser cutting equipment
CN201931454U (en) * 2010-12-09 2011-08-17 北大方正集团有限公司 Vacuum absorption table top and vacuum absorption table provided with same
CN102653115A (en) * 2011-03-04 2012-09-05 三星钻石工业股份有限公司 Ruling device and ruling method
CN103531516A (en) * 2012-07-03 2014-01-22 株式会社迪思科 Chuck table mechanism of cutting apparatus
CN103769752A (en) * 2012-10-22 2014-05-07 三星泰科威株式会社 Workbench used for laser drilling treatment and method for laser drilling
CN202963851U (en) * 2012-11-20 2013-06-05 惠州市金百泽电路科技有限公司 Jig for improving surface flatness of laser drilling
CN103143842A (en) * 2013-03-18 2013-06-12 武汉科技大学 Laser cutting system for soft material cutting and cutting method of laser cutting system
CN103433624A (en) * 2013-08-29 2013-12-11 武汉帝尔激光科技有限公司 Laser cutting processing method and system of ceramic substrate
CN104626376A (en) * 2013-11-11 2015-05-20 株式会社迪思科 Cutting device
CN103737184A (en) * 2013-12-25 2014-04-23 广州兴森快捷电路科技有限公司 Device and fixture for performing laser machining on through hole and fixture installation method
CN104014940A (en) * 2014-05-29 2014-09-03 深圳市大族激光科技股份有限公司 Coating and drilling method of ceramic substrate, coating sol and coating device
CN204747780U (en) * 2015-04-23 2015-11-11 深圳光韵达激光应用技术有限公司 A ceramic suction table for laser cutting equipment

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SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20170627

RJ01 Rejection of invention patent application after publication