CN103746060A - Manufacturing method of wavelength conversion device and light-emitting device - Google Patents
Manufacturing method of wavelength conversion device and light-emitting device Download PDFInfo
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- CN103746060A CN103746060A CN201310486959.6A CN201310486959A CN103746060A CN 103746060 A CN103746060 A CN 103746060A CN 201310486959 A CN201310486959 A CN 201310486959A CN 103746060 A CN103746060 A CN 103746060A
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- wavelength conversion
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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Abstract
The invention brings forward a manufacturing method of a wavelength conversion device and a light-emitting device with the application of the wavelength conversion device. The wavelength conversion device comprises a substrate and a wavelength conversion layer positioned on the surface of the substrate. The wavelength conversion layer contains wavelength conversion grains. The manufacturing method comprises the following steps: A, the wavelength conversion grains are coated on the surface of the substrate to form the wavelength conversion granular layer; and B, an acceleration generator is utilized to endow the substrate and the wavelength conversion granular layer thereon with an acceleration a which is not less than 15m/s<2>, and the acceleration a at least has a component which is not equal to zero but is vertical to the plane of the wavelength conversion granular layer and the direction of the component is from the substrate pointing to the wavelength conversion granular layer. In the wavelength conversion layer manufactured by the manufacturing method, the acceleration a makes each wavelength conversion grain generate a force pointing to the substrate. Thus, the distance between the wavelength conversion grains is shortened, and heat conduction effect of the wavelength conversion layer is raised.
Description
Technical field
The present invention relates to luminescence technology field, particularly relate to a kind of manufacture method and light-emitting device of Wavelength converter.
Background technology
In luminescence technology field, use excitation wavelength conversion particle (for example fluorescent material) to become the generally technology of application at present.Yet along with the requirement to luminous power is more and more higher, the power of exciting light is more and more stronger, the heat dissipation problem of fluorescent material has more and more become the bottleneck of this luminescence technology of restriction.
In traditional method, wavelength is changed to particle (such as fluorescent material) and mix with transparent colloids such as silica gel or epoxy resin, after moulding, solidify to form wavelength conversion body or wavelength conversion layer.Like this, each fluorescent material is wrapped up by silica gel or epoxy resin isocolloid, the heat that fluorescent material sends is mainly by its colloid absorbing around, and the heat conductivility of these colloids is very poor, the heat that is not enough to fluorescent material to send conducts, and has so just formed the accumulation of heat in total inside.When excitation light power is very high, the temperature in wavelength conversion body or layer is very high, so not only causes the decline of fluorescent material efficiency, also can cause quick aging, the jaundice of colloid, affects performance and the life-span of whole luminescent device.
Summary of the invention
The present invention proposes a kind of manufacture method of Wavelength converter, and this Wavelength converter comprises substrate and is positioned at the wavelength conversion layer of substrate surface, comprises wavelength conversion particle in wavelength conversion layer, comprises the following steps:
A, at substrate surface, apply wavelength conversion particle, form wavelength conversion stratum granulosum;
B, utilize acceleration generating apparatus, make substrate and on wavelength conversion stratum granulosum there is acceleration a, acceleration a has at least one to be not less than 15m/s
2component perpendicular to the direction of wavelength conversion stratum granulosum plane and this component, be to point to wavelength conversion stratum granulosum from substrate.
The present invention also proposes a kind of light-emitting device, comprises the Wavelength converter that uses above-mentioned manufacture method to manufacture, and the light that the substrate surface of this Wavelength converter sends wavelength conversion layer has reflectivity.Also comprise excitation source, the exciting light of excitation source transmitting is incident in wavelength conversion layer.
Utilize in the wavelength conversion layer of manufacture method manufacture of the present invention, acceleration a has produced to referring to based power each wavelength conversion particle, thereby has made the Distance Shortened between wavelength conversion particle, and then has improved the heat-conducting effect of wavelength conversion layer.
Embodiment
Through the further investigation inventor of prior art is found, cause the too high essential reason of wavelength conversion particle temperature to be, although the thermal conductivity of wavelength conversion particle itself is not poor, some is even also higher, but the void ratio between wavelength conversion particle is larger, these spaces are mainly filled by athermanous colloid or air, so the heat that each wavelength conversion particle produces cannot be delivered on other adjacent wavelength conversion particle, more cannot be delivered to the surface of wavelength conversion layer.In order to address this problem, inventor attempts improving the ratio of wavelength conversion particle and colloid, and what make that the solid content of its mixture tries one's best is large, to reduce wavelength, changes the spacing between particle.Yet such problem is, when the ratio of colloid is very low, the mixture of wavelength conversion particle and colloid becomes the paste of thickness with regard to no longer having mobility, and the viscosity of shared higher this mixture of ratio of wavelength conversion particle is larger, is unfavorable for like this operations such as this mixture apply.When this mixture arrives manipulable viscosity pole in limited time, experiment showed, that the spacing between its wavelength conversion particle is still larger, the radiating effect of each wavelength conversion particle is very bad.
Inventor has also attempted other method.A kind of method is to utilize waterglass to form wavelength conversion stratum granulosum as binding agent.Specific practice is wavelength to be changed to particle pour water glass solution into and make its precipitation, the solution on upper strata is outwelled again, then dry to form wavelength conversion stratum granulosum after precipitation.Wavelength conversion particle can be naturally mutually close due to the reason of gravity in theory; yet in fact; the form of each wavelength conversion particle is not the spherical of standard, but some irregular shapes, these irregular shapes are interweaved and make the spacing of adjacent wavelength conversion particle larger.Rely on the natural packing of gravity can not make intergranular spacing reach minimum.
Another kind method is to utilize low-melting glass or pottery as wavelength, to change the supporting body of particle, but this technology difficulty is very high, and inventor makes repeated attempts and is difficult to obtain desirable effect.
Through above-mentioned trial and the summary of experience, the manufacture method that inventor proposes a kind of brand-new Wavelength converter can overcome the above problems, this Wavelength converter comprises substrate and is positioned at the wavelength conversion layer of substrate surface, comprises wavelength conversion particle (such as but not limited to fluorescent material) in wavelength conversion layer.This manufacture method comprises the following steps:
A, at substrate surface, apply wavelength conversion particle, form wavelength conversion stratum granulosum;
B, utilize acceleration generating apparatus, make substrate and on wavelength conversion stratum granulosum there is acceleration a, acceleration a has at least one to be not less than 15m/s
2component perpendicular to the direction of wavelength conversion stratum granulosum plane and this component, from substrate, point to wavelength conversion stratum granulosum.
First utilize steps A to form wavelength conversion stratum granulosum, now its inner wavelength is changed particle into loose distribution, and spacing is larger.In step B, wavelength conversion stratum granulosum has acceleration a, and each wavelength conversion particle has this acceleration a, and acceleration a has at least one to be not less than 15m/s
2component perpendicular to the direction of wavelength conversion stratum granulosum plane and this component, from substrate, point to wavelength conversion stratum granulosum, this makes to produce a power on each wavelength conversion particle, and it is to point to substrate from wavelength conversion stratum granulosum perpendicular to wavelength conversion stratum granulosum plane and its direction that this power has a component of 1.5 times that is not less than this particle weight at least.Therefore under the effect of acceleration a, each the wavelength conversion particle in wavelength conversion stratum granulosum has the trend of basad direction motion, and each wavelength conversion particle trends towards basad direction compression, the pitch smaller between particle under the effect of this trend.
Along with the increase of a, the spacing between particle can be further compressed; When a increases to a certain degree, thereby between particle, formed the mutual support of contact closely, the distance between particle no longer changes, and reaches state the most closely.Therefore, as long as acceleration a exists, will shorten the distance between particle, thereby reach the effect that improves heat-sinking capability.In practice, the numerical value of a can be determined according to experiment, as long as but be not less than 15m/s
2, with respect to the gravity acceleration g of wavelength conversion particle itself, (g approximates 10m/s
2) larger, will effectively shorten the distance between particle like this.
Easily understand, preferred, acceleration a itself is just to point to wavelength conversion stratum granulosum from substrate perpendicular to wavelength conversion stratum granulosum plane and its direction, and the active force now producing on each particle is maximum.For example, in experiment, inventor attempts adopting 100 m/s
2with 1000 m/s
2a, all significantly promoted the heat conductivility of wavelength conversion layer.
The acceleration generating apparatus of realizing acceleration a has a variety of, and most typical is exactly centrifugal device, this device make substrate and on wavelength conversion stratum granulosum around an axle center, rotate to produce centripetal acceleration a.In this centrifugal device, wavelength conversion stratum granulosum is with respect to more close the axle center of substrate, and the direction of the acceleration a of generation will meet above-mentioned requirement like this, and wavelength is changed the trend that effect that particle is subject to centrifugal force accordingly has basad motion.In addition, the acceleration generating apparatus of linear movement is also existing equipment.The present invention is not construed as limiting for the equipment and the principle that produce acceleration a.
For performing step A has several different methods, and all belong to existing particle coating technology, be explained respectively below.
For example, can use the organic binder bonds such as silica gel or epoxy resin.Now steps A comprises following two sub-steps:
A3, wavelength is changed to particle and binding agent be evenly mixed to get wavelength conversion slurry;
A4, wavelength is changed to slurry be coated in substrate.
In A4 step, wavelength is changed to slurry and be coated in substrate and have multiple way, such as but not limited to silk screen printing, or directly brush, in substrate, or is used spray gun that wavelength is changed to pulp spraying to be coated in substrate.After wavelength being changed to slurry and being coated in substrate, the wavelength conversion particle great majority in slurry are suspended in slurry.Foregoing, in order to realize coating processes, in wavelength conversion slurry, the ratio of binding agent can not be too low, and this has just caused the spacing between the wavelength conversion particle in slurry larger.Then carry out after step B, wavelength conversion particle can overcome the buoyancy of binding agent and basad drawing close, and grain spacing is greatly reduced.Next also need step C, cured binders.The means of cured binders are according to the difference of binding agent and difference may be to be heating and curing, and normal temperature is placed and solidified, and ultra-violet curing, may be also the mixing cured of ultraviolet and heating.
Organic binder bond may be also a kind of organic liquid that can decompose or degrade under certain conditions, for example silicone oil.Now, after step B, also comprise step C, remove binding agent.For silicone oil, can at high temperature make its oxidation become gas and fly away.It should be noted that this organic adhesive might not all divide and take off in step C, if remaining residue does not absorb and is fine light.Therefore the removal bonding agent in step C refers to its most of removal, be solid-state, and residue does not absorb light after removal.
Except organic binder bond, can also use inorganic binder, for example waterglass.From above-mentioned description, " binding agent " herein might not all have cementation, is more the effect of having played the carrier of wavelength conversion particle.
It is worth mentioning that, in the situation that using binding agent, another benefit of acceleration a is to impel the bubble in wavelength conversion slurry to discharge from slurry, reaches the object of deaeration herein.In practical operation, the numerical value that can reach the acceleration of deaeration object may be lower than the numerical value of the acceleration that grain spacing is shortened, therefore in this case, the acceleration a applying in above-mentioned step B may be a process increasing gradually from small to large, in this process, reach the object of deaeration, after reaching maximum, maintain a period of time to reach the effect of compressing grains spacing.Certainly may be to be also divided into two sections, first paragraph be to apply less acceleration, now for deaeration, and then applies a larger acceleration a, for compressing grains spacing.
In order further to improve the heat conductivility of wavelength conversion layer, in wavelength conversion layer, also comprise heat conduction particle.Heat conduction particle can be the materials such as aluminium oxide, aluminium nitride, diamond, these materials not extinction and thermal conductivity fine.Further, in wavelength conversion layer, also may comprise Graphene or carbon fiber.Graphene is the Heat Conduction Material of sheet, and it is very high along the horizontal thermal conductivity of lamella, and carbon fiber is wire Heat Conduction Material, very high along its thermal conductivity of direction of line.Graphene and carbon fiber are all flexible, easily under the effect of wavelength conversion particle or heat conduction particle, deformation occur, and this contributes to them that the particle of each solid shape is linked together, and reduces the interface resistance between particle.Be appreciated that and do not add heat conduction particle and directly add Graphene or the so flexible Heat Conduction Material of carbon fiber to be obviously also fine.
These heat conduction particles and/or flexible Heat Conduction Material can be changed after uniform particles is mixed and in substrate, applied and form wavelength conversion stratum granulosum with wavelength.Former like this steps A comprises following two sub-steps:
A1, heat conduction particle and/or flexible Heat Conduction Material and wavelength conversion uniform particles are mixed to form to hybrid particles;
A2, in substrate, apply hybrid particles, form wavelength conversion stratum granulosum.
After forming wavelength conversion stratum granulosum, carry out again step B, can arrive beneficial effect of the present invention and object.In addition, increasing after heat conduction particle and/or flexible Heat Conduction Material also can be in conjunction with the method for use binding agent above, and now former steps A comprises following two steps:
A5, wavelength is changed to particle, heat conduction particle and/or flexible Heat Conduction Material and binding agent be evenly mixed to get wavelength conversion slurry;
A4, wavelength is changed to slurry be coated in substrate.
Wherein steps A 5 is exactly in above-mentioned steps A 3, and heat conduction particle and/or flexible Heat Conduction Material are evenly mixed to the common wavelength conversion slurry that forms with wavelength conversion particle and binding agent.
In experiment, inventor finds, when the particle diameter of heat conduction particle is less than wavelength conversion particle diameter at least partly, the heat-conducting effect of wavelength conversion layer is better.Through research, find, this is that such heat-conducting effect is best because less heat conduction particle is filled in the space between wavelength conversion particle.In addition, the appropriate increase heat conduction particle close with wavelength conversion grain diameter also can improve the thermal conductivity of whole wavelength conversion layer.Further research is found, in step B, the accumulation effect that wavelength spherical or elliposoidal is changed particle is the finest and close, and its heat-conducting effect is also best, and this can be interpreted as easily contact more closely between spherical or ellipsoidal particle.
In experiment, inventor finds, if increase step D and step e after step B, the spacing between particle can be less, and radiating effect is better:
D, utilize acceleration generating apparatus, make substrate and on wavelength conversion stratum granulosum there is acceleration b, acceleration b has at least one to be not less than 5m/s
2component perpendicular to wavelength conversion stratum granulosum plane and its direction, be to point to substrate from wavelength conversion stratum granulosum; Or, utilize acceleration generating apparatus, make substrate and on wavelength conversion stratum granulosum there is acceleration d, acceleration d has at least one to be not less than 5m/s
2component be parallel to wavelength conversion stratum granulosum plane;
E, utilize acceleration generating apparatus, make substrate and on wavelength conversion stratum granulosum there is acceleration c, acceleration c has at least one to be not less than 15m/s
2component perpendicular to wavelength conversion stratum granulosum plane and its direction, be to point to wavelength conversion stratum granulosum from substrate.
This is because through after step B, it is compact that the particle in wavelength conversion stratum granulosum has been tending towards, but mutual friction and dislocation causes between particle not tightr between some local granule.Step D makes particle have one near the reverse acceleration b of acceleration a, so each particle can be subject to one and makes it away from the power of substrate.This power can make friction and the dislocation between local granule eliminate.Or step D makes particle have one to be close to the power be parallel to wavelength conversion stratum granulosum, this power can make to occur between local particle certain horizontal dislocation.And then through step e, wavelength conversion stratum granulosum is applied to acceleration c, the effect of acceleration c is identical with the effect of acceleration a, and the now friction between local granule and dislocation have been removed by step D, therefore after acceleration c, the spacing between particle is just less.
The present invention also proposes a kind of light-emitting device, comprises the Wavelength converter that uses above-mentioned manufacture method to manufacture, and the light that the substrate surface of this Wavelength converter sends wavelength conversion layer has reflectivity.Also comprise excitation source, the exciting light of excitation source transmitting is incident in wavelength conversion layer.The light of wavelength conversion layer stimulated emission is understood some towards substrate outgoing, and this part light can be reflected by substrate surface and the final opposite side outgoing from wavelength conversion layer.From whole light of wavelength conversion layer outgoing, be all able to the based side outgoing of the back of the body from wavelength conversion layer like this, this is very beneficial for the collection of light.These light comprise Stimulated Light, or the mixed light of Stimulated Light and remaining unabsorbed exciting light.
In another embodiment of the present invention, use LED chip as substrate, the light-emitting area of LED chip, as the surface of substrate, utilizes above-mentioned method that wavelength conversion layer is coated in the light-emitting area of LED chip.The benefit of doing is like this: first, LED chip itself is exactly a good heat carrier, and it can help wavelength conversion layer heat radiation.Simultaneously LED chip itself just can be launched exciting light, and for example LED chip is launched blue light, and this can excite the yellow wavelengths conversion layer being coated in LED chip light-emitting area with generation gold-tinted, this gold-tinted and remainingly do not have absorbed blue light will obtain white light.
At present, the luminous power of LED chip transmitting is about 1W ~ 2W, even if the not too little heat of spacing of its surperficial wavelength conversion particle is also not too large like this.But the development along with LED technology, the luminous power of LED transmitting may reach 5 ~ 10W in the near future, now just must come at LED surface-coated wavelength conversion layer by method of the present invention, a large amount of heat like this could be effectively wavelength conversion particle wherein being produced is transmitted to upper also final the leading away by LED chip of LED.
Be worth mentioning, if substrate adopts LED chip, need to adopt organic binder bond to carry wavelength conversion particle as carrier, so just can make the refractive index of wavelength conversion layer and the refractive index of LED chip match to improve brightness.Steps A 3 and the A4 that so just need to describe above carry out performing step A.Wherein, steps A 4 can be reduced to: wavelength is changed to slurry and drop in substrate surface.This be because, the light-emitting area of LED chip is very little, wavelength conversion slurry can form a drop on its surface, under the effect of this drop acceleration a in step B, can spread out and cover the light-emitting area of whole LED chip, and can rest on the edge of LED chip and can not flow down LED chip due to the effect of tension force after this drop spreads out and arrive LED chip edge.And even part wavelength conversion slurry has flowed down LED chip, because the wavelength conversion particle in slurry is deposited on fast in the light-emitting area of LED chip under the effect of acceleration a, the wavelength conversion particle that therefore flows to LED chip outside is also few.By controlling the wavelength conversion viscosity of slurry,, the technological parameters such as size of acceleration a can be controlled wavelength conversion slurry and cover uniformly in the light-emitting area of whole LED chip, can realize luminous high uniformity like this.
Therefore, because wavelength conversion slurry can oneself spread out and cover whole LED chip light-emitting area in LED chip light-emitting area in step B, so just not needing that wavelength is changed to slurry is coated in LED chip light-emitting area to form uniform one deck, and only appropriate slurry need to be dropped in to LED chip light-emitting area surface, this has simplified technique certainly greatly.
Be appreciated that; the technological means of mentioning in embodiment above and technical characterictic; can be applied to equally using the situation of LED chip as substrate; for example add heat conduction particle or flexible Heat Conduction Material; for example by step D and step e, further improve the density of wavelength conversion particle, more for example use the wavelength conversion particle of spherical or elliposoidal.
The foregoing is only embodiments of the invention; not thereby limit the scope of the claims of the present invention; every equivalent structure or conversion of equivalent flow process that utilizes description of the present invention to do; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (10)
1. a manufacture method for Wavelength converter, this Wavelength converter comprises substrate and is positioned at the wavelength conversion layer of substrate surface, comprises wavelength conversion particle in wavelength conversion layer, it is characterized in that, comprises the following steps:
A, at described substrate surface, apply wavelength conversion particle, form wavelength conversion stratum granulosum;
B, utilize acceleration generating apparatus, make substrate and on wavelength conversion stratum granulosum there is acceleration a, acceleration a has at least one to be not less than 15m/s
2component perpendicular to the direction of wavelength conversion stratum granulosum plane and this component, be to point to wavelength conversion stratum granulosum from substrate.
2. the manufacture method of Wavelength converter according to claim 1, is characterized in that, described acceleration a is to point to wavelength conversion stratum granulosum from substrate perpendicular to wavelength conversion stratum granulosum plane and its direction.
3. the manufacture method of Wavelength converter according to claim 1, is characterized in that, also comprises heat conduction particle and/or flexible Heat Conduction Material in wavelength conversion layer, and steps A comprises following two sub-steps:
A1, heat conduction particle and/or flexible Heat Conduction Material and wavelength conversion uniform particles are mixed to form to hybrid particles;
A2, in substrate, apply hybrid particles, form wavelength conversion stratum granulosum.
4. the manufacture method of Wavelength converter according to claim 3, is characterized in that, described heat conduction particle particle diameter is less than wavelength conversion grain diameter, and heat conduction particle is filled in the space between wavelength conversion particle at least partly.
5. the manufacture method of Wavelength converter according to claim 1, is characterized in that:
Steps A comprises following two sub-steps:
A3, wavelength is changed to particle and binding agent be evenly mixed to get wavelength conversion slurry;
A4, wavelength is changed to slurry be coated in substrate;
After step B, also comprise step C:
C, cured binders or removal binding agent.
6. the manufacture method of light-emitting device according to claim 5, it is characterized in that, in wavelength conversion layer, also comprise heat conduction particle and/or flexible Heat Conduction Material, in steps A 3, also heat conduction particle and/or flexible Heat Conduction Material, wavelength conversion particle and binding agent are evenly mixed to the common wavelength conversion slurry that forms.
7. the manufacture method of Wavelength converter according to claim 1, is characterized in that, also comprises step D and step e after step B:
D, utilize acceleration generating apparatus, make substrate and on wavelength conversion stratum granulosum there is acceleration b, acceleration b has at least one to be not less than 5m/s
2component perpendicular to wavelength conversion stratum granulosum plane and this component direction, be to point to substrate from wavelength conversion stratum granulosum; Or, utilize acceleration generating apparatus, make substrate and on wavelength conversion stratum granulosum there is acceleration d, acceleration d has at least one to be not less than 5m/s
2component be parallel to wavelength conversion stratum granulosum plane;
E, utilize acceleration generating apparatus, make substrate and on wavelength conversion stratum granulosum there is acceleration c, acceleration c has at least one to be not less than 15m/s
2component perpendicular to wavelength conversion stratum granulosum plane and this component direction, be to point to wavelength conversion stratum granulosum from substrate.
8. according to the manufacture method of the Wavelength converter described in any one in claim 1 to 7, it is characterized in that, wavelength is changed particle into spherical or elliposoidal.
9. according to the manufacture method of the Wavelength converter described in any one in claim 1 to 7, it is characterized in that, described acceleration generating apparatus make substrate and on wavelength conversion stratum granulosum around an axle center, rotate to produce centripetal acceleration a, wavelength conversion stratum granulosum is with respect to the more close described axle center of substrate.
10. a light-emitting device, is characterized in that:
Comprise the Wavelength converter that right to use requires the manufacture method described in 1 to 9 to manufacture, the light that the substrate surface of this Wavelength converter sends wavelength conversion layer has reflectivity;
Also comprise excitation source, the exciting light of excitation source transmitting is incident in described wavelength conversion layer.
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| CN201310427835.0 | 2013-09-21 | ||
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016078557A1 (en) * | 2014-11-21 | 2016-05-26 | 深圳市绎立锐光科技开发有限公司 | Method for fabricating wavelength conversion structure and related wavelength conversion structure |
| CN109564308A (en) * | 2016-08-05 | 2019-04-02 | 日本电气硝子株式会社 | Wavelength conversion member and its manufacturing method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100006880A1 (en) * | 2008-07-11 | 2010-01-14 | Bily Wang | Led chip package structure using sedimentation and method for making the same |
| CN102646761A (en) * | 2011-02-21 | 2012-08-22 | 展晶科技(深圳)有限公司 | LED (light-emitting diode) packaging process |
-
2013
- 2013-10-17 CN CN201310486959.6A patent/CN103746060A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100006880A1 (en) * | 2008-07-11 | 2010-01-14 | Bily Wang | Led chip package structure using sedimentation and method for making the same |
| CN102646761A (en) * | 2011-02-21 | 2012-08-22 | 展晶科技(深圳)有限公司 | LED (light-emitting diode) packaging process |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016078557A1 (en) * | 2014-11-21 | 2016-05-26 | 深圳市绎立锐光科技开发有限公司 | Method for fabricating wavelength conversion structure and related wavelength conversion structure |
| CN109564308A (en) * | 2016-08-05 | 2019-04-02 | 日本电气硝子株式会社 | Wavelength conversion member and its manufacturing method |
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