CN103731988A - Electronic component manufacturing method - Google Patents
Electronic component manufacturing method Download PDFInfo
- Publication number
- CN103731988A CN103731988A CN201310472960.3A CN201310472960A CN103731988A CN 103731988 A CN103731988 A CN 103731988A CN 201310472960 A CN201310472960 A CN 201310472960A CN 103731988 A CN103731988 A CN 103731988A
- Authority
- CN
- China
- Prior art keywords
- components
- electronic devices
- master component
- support membrane
- leading section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Packaging Frangible Articles (AREA)
- Details Of Cutting Devices (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention provides an electronic component manufacturing method with higher efficiency, which can take a plurality of stamping processed electronic components (each electronic component) from a main module in an arrangement order. In the electronic component manufacturing method, one side of a main surface of a tabulate main module (1) is bonded with a support membrane (20) with adhesion, wherein the main module (1) is configured with a plurality of electronic components in an integrated arrangement state; then, one side of the other main surface of the main module (1) forms notches (22) along the respective appearances of the electronic components (10) (a component area 10a); when the main module (1) is cut while the support membrane (20) is not, the electronic components (10) are respectively cut from the main module (1); later, one side of a main surface of the main module (1) is embedded with a plurality of pins (32), and the front part is used for pressing the electronic components (10); accordingly, the electronic components (10) are separated from the support membrane (20), thereby taking down the electronic components (10) in an arrangement state.
Description
Technical field
The present invention relates to the manufacture method of the various electronic devices and components such as a kind of multilager base plate, module components and parts, flat cable, be specifically related to the following operation of a kind of process and manufacture the manufacture method of electronic devices and components, in this operation, from the master component (aggregate) that comprises multiple electronic devices and components, take off each electronic devices and components.
Background technology
When manufacturing electronic devices and components, for example as an example of multilager base plate example, describe, the method in so-called multimode cave is just widely used, production efficiency is improved, in the method, first, the mother substrate that preparation set has multiple submounts, then takes off multiple submounts (each multilager base plate) from mother substrate.
Wherein, as the method that has the mother substrate of multiple electronic devices and components to take off each electronic devices and components from comprising alignment arrangements, known have: the line of cut along regulation cuts mother substrate, thereby be divided into the method for single electronic devices and components; Utilize the mould that punching press is used from mother substrate upper punch, to depress method of multiple electronic devices and components etc.
In addition, as the method for taking off each substrate by punch process, the for example known manufacture method that has in patent documentation 1 printed base plate of recording also, the manufacture method of this printed base plate comprises: mother substrate forms operation, at this mother substrate, form in operation, along punch line, every predetermined distance, resinous base material is formed to multiple via holes, and form electrode at this via hole inner peripheral surface, thereby obtain mother substrate; And mother substrate stamping procedure, thereby this mother substrate stamping procedure is by utilize mould to carry out to mother substrate the operation that punching press is cut apart this mother substrate along punch line, in this mother substrate stamping procedure, this punch line is set, make it have the width of regulation, and it is entered to the wiring direction of this inner edge portion obliquely at the line portion place through via hole inner edge portion.
But, in the situation that only carrying out above-mentioned punch process, through punching press electronic devices and components after treatment, be difficult for again returning to ordered state, thus the problem that causes production efficiency to decline.
Prior art document
Patent documentation
Patent documentation 1: Japanese patent laid-open 5-102638 communique
Summary of the invention
Invent technical problem to be solved
The present invention is accomplished in order to address the above problem, its object is, the manufacture method of the electronic devices and components that a kind of production efficiency is higher is provided, can takes off multiple electronic devices and components (each electronic devices and components) that will take off from master component with the state of arranging.
The technical scheme that technical solution problem adopts
In order to address the above problem, the manufacture method of electronic devices and components of the present invention is characterised in that, comprising:
The operation of pasting the support membrane with cementability in an interarea one side of flat master component, wherein, disposes multiple electronic devices and components that will take off with ordered state on described master component integratedly;
From another interarea one side of described master component along described electronic devices and components profile separately, form otch, at described master component, be cut off but the operation that the not cut state of described support membrane, respectively described multiple electronic devices and components cut down from described master component; And
Thereby enter multiple pins and utilize its leading section to press described electronic devices and components, make described multiple electronic devices and components strip down and keep ordered state and take off the operation of described multiple electronic devices and components from described support membrane thus from interarea one side pressure of described master component.
In addition, in the manufacture method of electronic devices and components of the present invention, preferably adopt following structure:, with the leading section of multiple described pins, each electronic devices and components of described electronic devices and components are pressed, described electronic devices and components are stripped down from described support membrane.
By the leading section that utilizes multiple pins, each electronic devices and components are pressed, the leading section of selling by utilization is pressed multiple positions of electronic devices and components, thereby can make reliably each electronic devices and components strip down from support membrane, can improve the reliability of the manufacture method of electronic devices and components of the present invention.
In addition, preferably adopt following structure:, in described supporting film, corresponding with the position of being pressed described electronic devices and components by the leading section of described pin region, be provided with peristome, the leading section of described pin, via described peristome, connects with described electronic devices and components.
By peristome being set in supporting film, corresponding with the position of being pressed described electronic devices and components by the leading section of described pin region, thereby the leading section that makes pin via described peristome directly and electronic devices and components connect, thus, can make reliably each electronic devices and components strip down from support membrane, can improve reliability.
In addition, preferably adopt following structure:, the leading section of described pin has the prominent shape of point, makes the leading section of described pin run through described support membrane and connect with described electronic devices and components.
The structure connecting with electronic devices and components in the case of the leading section that adopts the leading section of pin to have the prominent shape of point and pin runs through support membrane, without peristome is set on support membrane, thereby can simplify working process.
In addition, be preferably in a part interarea, that pressed by the leading section of described pin of described master component, be provided with the protection member for preventing that described electronic devices and components are impaired.
By a part interarea at master component, that pressed by the leading section of pin, protection member is set, thereby can prevents from becoming being partially damaged of electronic devices and components, thereby can obtain the electronic devices and components that a kind of reliability is higher.
In addition, in the manufacture method of electronic devices and components of the present invention, be preferably, keep ordered state take off in the operation of described multiple electronic devices and components, comprise the described ordered state of maintenance described multiple electronic devices and components are accommodated in to the operation in pallet, wherein, described pallet has the housing recess corresponding with the position of described electronic devices and components.
By adopting said structure, can keep ordered state and reliably the electronic devices and components that take off be processed, thereby can further give play to effect of the present invention.
Invention effect
In the manufacture method of electronic devices and components of the present invention, with ordered state one, disposing interarea one side of flat master component of multiple electronic devices and components that will take off, stickup has the support membrane of cementability, from another interarea one side, along electronic devices and components profile separately, form otch, at master component, be cut off but under the not cut state of support membrane, respectively multiple electronic devices and components are cut down from master component, afterwards, from an interarea side pressure of master component, enter multiple pins, and utilize its leading section to press electronic devices and components, thereby multiple electronic devices and components are stripped down from support membrane, therefore, can under ordered state, take off each electronic devices and components that will take off from master component.Therefore, by being suitable for the manufacture method of electronic devices and components of the present invention, thereby the operation through take off each electronic devices and components from master component under ordered state can produce electronic devices and components effectively.
In addition, in the present invention, thereby for the operation that enters multiple pins from interarea one side pressure of master component and take off respectively multiple electronic devices and components with ordered state, can carry out above-mentioned operation to regional master component being divided into behind multiple regions, in addition, also can adopt disposable structure of taking off each electronic devices and components from whole master component.
Accompanying drawing explanation
Fig. 1 is the figure that embodiments of the present invention 1 are related, represent to be provided with ordered state the structure of the master component (integrated substrate) of multiple electronic devices and components that will take off, Fig. 1 (a) is vertical view, Fig. 1 (b) is the A-A line cutaway view of Fig. 1 (a), and Fig. 1 (c) is the B-B line cutaway view of Fig. 1 (a).
Fig. 2 is the upward view of the master component shown in Fig. 1.
Fig. 3 is the figure that represents the structure of the related electronic devices and components of embodiments of the present invention 1 (flat cable), and Fig. 3 (a) is vertical view, and Fig. 3 (b) is front view.
Fig. 4 A is the figure that represents to be pasted with on an interarea of the related master component of embodiments of the present invention 1 state of support membrane, Fig. 4 A (a) is vertical view, Fig. 4 A (b) is the A-A line cutaway view of Fig. 4 A (a), and Fig. 4 A (c) is the B-B line cutaway view of Fig. 4 A (a).
Fig. 4 B is the upward view that is illustrated in embodiments of the present invention 1, is pasted with the state of support membrane on the interarea (lower surface) of master component.
Fig. 5 is illustrated in the figure that is formed with the state of otch (stamped groove) on the master component shown in Fig. 4 A, Fig. 4 B, Fig. 5 (a) is vertical view, Fig. 5 (b) is the A-A line cutaway view of Fig. 5 (a), and Fig. 5 (c) is the B-B line cutaway view of Fig. 5 (a).
Fig. 6 is the figure that the method for in embodiments of the present invention 1, each electronic devices and components (flat cable) being taken off from master component is described, Fig. 6 (a) is the pin that represents to make the to press fixture figure in the face of the state of an interarea of master component, and Fig. 6 (b) represents to be pressed into press the pin of fixture, from support membrane, peel off electronic devices and components (flat cable) and moved to the figure of the state of pallet.
Fig. 7 is the stereogram that represents the structure of pressing fixture of using in embodiments of the present invention 1.
Fig. 8 is the vertical view that is illustrated in embodiments of the present invention 1, with array body state, the electronic devices and components that take off from master component (flat cable) is moved to the state of pallet.
Fig. 9 is the upward view that is illustrated in the structure of an interarea (lower surface) of the master component forming in the manufacturing process of the related electronic devices and components of other execution mode of the present invention (execution mode 2).
Figure 10 is illustrated in the upward view that is pasted with the state of support membrane on an interarea of master component of Fig. 9.
Figure 11 is the figure that the method for in embodiments of the present invention 2, each electronic devices and components (flat cable) being taken off from master component is described, Figure 11 (a) is the pin that represents to make the to press fixture figure in the face of the state of an interarea of master component, and Figure 11 (b) represents to be pressed into press the pin of fixture, from support membrane, peel off electronic devices and components (flat cable) and moved to the figure of the state of pallet.
Figure 12 is the vertical view that is illustrated in embodiments of the present invention 2, with array body state, the electronic devices and components that take off from master component (flat cable) is moved to the state of pallet.
Figure 13 is the figure that the method for in embodiments of the present invention 3, each electronic devices and components (flat cable) being taken off from master component is described, Figure 13 (a) is the pin that represents to make to press fixture in the face of sticking on the figure of state of the support membrane on an interarea of master component, and Figure 13 (b) represents to be pressed into press the pin of fixture, from support membrane, peel off electronic devices and components (flat cable) and moved to the figure of the state of pallet.
Embodiment
, embodiments of the present invention are shown below, so that feature of the present invention is described in detail.
[execution mode 1]
Fig. 1 (a) is the vertical view that represents to include take ordered state the structure of the master component (integrated substrate) of multiple electronic devices and components (in present embodiment 1 as flat cable), in addition, Fig. 1 (b) is the A-A line cutaway view of Fig. 1 (a), and Fig. 1 (c) is the B-B line cutaway view of Fig. 1 (a).Fig. 2 is the upward view of master component.
In present embodiment 1, following methods is described:, with ordered state, from having, take off each flat cable (electronic devices and components) 10 as Fig. 1 (a)～(c) and the master component 1 of structure as shown in Fig. 2.
In present embodiment 1, the flat cable 10 taking off from master component 1 is used as high-frequency signal circuit, as shown in Fig. 3 (a), (b), described flat cable 10 has following structure:, in upper surface side and the lower face side of signal line, two interarea sides up and down of the cable main layer 15 forming grounding electrode being set across insulating properties substrate layer are provided with resist layer 16a, 16b.
In addition, flat cable 10 has following structure:, possess connector 11a, the 11b of a pair of surface installing type in the input/output section at two ends, compared with the central portion 12 of long side direction, the both ends 13a, the 13b that are provided with connector 11a, 11b are wider.
In addition, in the present invention, the concrete structure of flat cable 10 or shape are not limited to present embodiment 1, and the present invention goes for various shapes or structure.
And master component (the integrated substrate) 1 that can take off multiple flat cables 10 with said structure be with the limit along long side direction (long limit) adjacent state mutually, there are multiple flat cable 10 alignment arrangements and become the flat structure of row.In addition, the ordered state of multiple flat cables 10 is particularly limited, also can becomes rectangular by spread configuration.In addition, the quantity of the flat cable that is contained in single master component (integrated substrate) is not also limited.
This master component 1 is made as cell cube (cable main layer) by signal line and the duplexer with flexual thermoplastic resin sheet material as polyimides or liquid crystal polymer.On master component 1, the part (region) that becomes each flat cable 10 after taking off is made as to components and parts region 10a, using remainder, the region that surrounds each flat cable 10 be made as to each flat cable 10 (components and parts region 10a) carry out punching press and taken off rear as surplus material, stay stay white region 10b.
In addition, on each components and parts region 10a, upper at an interarea (lower surface) and another interarea (upper surface) of monomer (cable main layer) 15, be provided with resist layer 16a, 16b.
Above-mentioned master component 1 is made in the following way: in lower surface one side that is for example provided with the polyimides of signal cable conductor or the thermoplastic resin sheet material that liquid crystal polymer forms by the assigned position place surperficial, grounding electrode conductor is set, and also across other thermoplastic resin sheet material, be provided with grounding electrode conductor in upper surface one side, at obtained duplexer (cable main layer), become on the interarea in components and parts region of each electronic devices and components (flat cable) and another interarea and form resist layer, and, the connector of surface installing type is set in the input/output section of flat cable, so that itself and signal cable conductor conducting.
In addition, for the manufacture method of master component 1, conductor for signal cable, thermoplastic resin sheet material, for grounding electrode, the formation method or put in order etc. of conductor, resist layer etc. is not particularly limited, and can adopt the whole bag of tricks to obtain having as Fig. 1 (a)～(c) and the master component 1 of structure as shown in Fig. 2.
Next, to describing from this master component (integrated substrate) 1 method of taking off multiple flat cables 10.
First, as shown in Fig. 4 A (a), (b), (c) and Fig. 4 B, support membrane 20 is pasted on an interarea of master component 1.On this support membrane 20, in corresponding with each components and parts region 10a respectively region, be formed with multiple peristomes 21.In this execution mode 1, peristome 21 is formed at the region corresponding with both ends 13a, the 13b of the long side direction of taken off flat cable 10 (with reference to Fig. 3) and central portion 12.
In face one side support membrane 20, that be pasted on master component 1, be provided with the weak bonding agent of cementability.In addition, so-called " cementability is weak " refers to the cementability with following degree:, during stage before the peristome 21 of support membrane 20 inserts the leading section 32a of the pin 32 of pressing fixture 31 and presses flat cable 10, this caking property can be guaranteed can to the whole master component 1 that comprises multiple flat cables 10, support reliably as described later, and, can insert pin 32 (Fig. 6 (a), (b)) by the peristome 21 from support membrane 20, and flat cable 10 is pressed, each flat cable 10 is peeled off reliably.
Next, as shown in Fig. 5 (a), (b), (c), utilize laser or cutter etc. along the profile of each components and parts region 10a, to form otch (stamped groove) 22 from another interarea of master component 1.Form this otch 22, make on thickness direction, to pass through (cut-out) master component 1, reach support membrane 20, but not by (not cutting off) support membrane 20.That is, make each components and parts region 10a from staying white region 10b to separate, but not separation with support membrane 20.
In addition, otch 22 also can be formed to the centre position of the thickness direction of support membrane 20.
By forming this otch 22, thereby can, at each flat cable 10 (components and parts region 10a) in from staying white region 10b to cut from state out, form the state that support membrane 20 supports that is subject to.
Therefore, as shown in Fig. 6 (a), from being provided with the interarea of master component 1 of support membrane 20, make the leading section 32a of the pin 32 of pressing fixture 31 respectively in the face of multiple peristomes 21, push the leading section 32a of the pin 32 of pressing fixture 31 to master component 1, thereby connect with each flat cable 10 (components and parts region 10a), then, by pushpin 32, as shown in Fig. 6 (b), each flat cable 10 is peeled off from support membrane 20, and taken off respectively to the multiple housing recess 34 that are arranged on pallet 33.
In addition, as shown in Figure 7, here the used fixture 31 of pressing is the fixtures with following structure:, on surperficial, corresponding with the multiple peristomes 21 that are arranged at support membrane 20 places multiple positions of flat jig main body 31a, dispose pin (pushpin) 32.The height that forms each pin 32 of pressing fixture can be identical, but, if make to being arranged at pin 32 that the locational peristome 21 corresponding from the both ends of flat cable 10 press, with different to the height that is arranged at the pin 32 that the locational peristome 21 corresponding with the central portion of flat cable 10 press, can improve the fissility of peeling off from support membrane 21, therefore, comparatively desirable.
In addition, in present embodiment 1, as shown in Figure 8, the each flat cable 10 taking off is as described above accommodated in to alignment arrangements and has the pallet 33 of housing recess 34, described housing recess 34 is arranged and is disposed on multiple positions corresponding with the position of the each flat cable 10 on master component (integrated substrate) 1, therefore, the ordered state that can maintain on master component 1 strips down each flat cable 10 unchangeably from support membrane 20, and is moved to pallet 33.
Therefore, by being suitable for the manufacture method of electronic devices and components of the present invention, thereby through take off the operation of each electronic devices and components (being flat cable) in execution mode 1 from master component, can effectively produce electronic devices and components.
[execution mode 2]
Fig. 9 is the upward view that is illustrated in the structure of an interarea (lower surface) of the master component (integrated substrate) 1 forming in the manufacturing process of the related electronic devices and components of another embodiment of the invention (execution mode 2), Figure 10 is the upward view that is pasted with the state of support membrane 20 on the interarea (lower surface) of the master component (integrated substrate) 1 that is illustrated in Fig. 9, and Figure 11 (a), (b) are the figure that represents the operation that each flat cable 10 is peeled off and taken off from support membrane 20.
In present embodiment 2; master component 1, by press fixture 31 pin 32 leading section 32a institute butt part, on the both ends and central portion of the long side direction of each components and parts region 10a, dispose protection member 35 (being corrosion resistant plate in present embodiment 2).
In addition, other structure is identical with above-mentioned execution mode 1.In addition, in Fig. 9, Figure 10 and Figure 11 (a), (b), mark represents identical or suitable part with the part of Fig. 1～8 same numeral.
In present embodiment 2, by each flat cable 10 from support membrane 20 is peeled off and is taken off in the situation that, identical with the situation of above-mentioned execution mode 1, from another interarea that is subject to the master component 1 that support membrane 20 supports, along the profile of each components and parts region 10a, form otch (stamped groove) 22, make each flat cable 10 in the state (with reference to Fig. 5 (a), (b), (c)) from staying white region 10b to separate.
Therefore; as shown in Figure 11 (a); from being provided with the interarea of master component 1 of support membrane 20; make the leading section 32a of the pin 32 of pressing fixture 31 respectively in the face of multiple peristomes 21; push the leading section 32a of the pin 32 of pressing fixture 31 to master component 1; itself and the components and parts region 10a (each flat cable 10) that disposes protection member 35 on an interarea are connected; then; by pushpin 32; as shown in Figure 11 (b); each flat cable 10 is peeled off from support membrane 20, and it is taken off respectively to the multiple housing recess 34 that are arranged on pallet 33.
In present embodiment 2; master component 1, by the part of the leading section 32a institute butt of pin 32 (; both ends and the central portion of the long side direction of each components and parts region 10a) locate to be provided with protection member 35; even if therefore master component 1 is using the duplexer with flexual thermoplastic resin sheet material as polyimides or liquid crystal polymer as cell cube; also can from master component 1, take off each flat cable 10 with ordered state, and can not cause damage to the part of the leading section 32a institute butt of pin 32.
That is to say, according to the method for present embodiment 2, by the part of leading section institute butt at the pin of pressing fixture, for example set in advance protection member 35, even thereby at master component using the duplexer with flexual thermoplastic resin sheet material as polyimides or liquid crystal polymer as cell cube, and apply larger pressing force in part, also the circuit pattern etc. that can avoid producing depression at pressed part place and make to be configured in internal layer or top layer is damaged, and, as shown in figure 12, can also in the case of maintain ordered state on master component 1 constant, each flat cable 10 is stripped down from support membrane 20, and moved in multiple housing recess 34 of pallet 33.
[execution mode 3]
Figure 13 (a), (b) are the figure that is illustrated in the operation of peeling off and taking off from the support membrane 20 of master component 1 (integrated substrate) in another other execution mode of the present invention (execution mode 3), by each flat cable 10.
In present embodiment 3, as shown in Figure 13 (a), (b), as pressing fixture 31, use the fixture of pressing that possesses multiple pins 32 on the surface of jig main body 31a, the leading section 32a of the plurality of pin 32 has the prominent shape of point.
In addition, as support membrane 20, different from the situation of above-mentioned execution mode 1 and 2, use the support membrane that is not formed with peristome.
In addition; master component 1, by press fixture 31 pin 32 the leading section 32a institute butt that is the prominent shape of point part, on the both ends and central portion of the long side direction of each components and parts region 10a, dispose protection member 35 (being corrosion resistant plate in present embodiment 3).
In addition, other structure is identical with the situation of above-mentioned execution mode 1.In addition, in Figure 13 (a), (b), mark represents identical or suitable part with the part of Fig. 1～8 same numeral.
In addition, in present embodiment 3, utilization press fixture 31 by each flat cable 10 when the support membrane 20 of master component 1 is peeled off and is taken off, the leading section 32a that front end is to the pin 32 of the prominent shape of point from an interarea that is pasted with support membrane pushes the components and parts region 10a of master component to, and the leading section 32a of pin 32 is further pushed into run through support membrane 20 and connects with electronic devices and components.
Each flat cable 10 that can reliably master component 1 be comprised thus, is peeled off and is taken off from support membrane 20.
; according to the method for present embodiment 2; in the case of using, be not formed with the support membrane 20 of peristome; the leading section 32a that also can make front end be the pin 32 of the prominent shape of point runs through support membrane 20; thereby arrive the components and parts region 10a (flat cable 10) of master component 1; and directly the leading section 32a of pin 32 is pressed into components and parts region 10a; therefore; can in the case of maintain ordered state on master component 1 constant; each flat cable 10 is stripped down reliably from supporting film 20, and moved to pallet 33.
In addition; because the part of the leading section 32a institute butt at pin 32 is provided with protection member 35; even if therefore the duplexer with flexual thermoplastic resin sheet material as polyimides or liquid crystal polymer is made as cell cube at master component 1; also each flat cable 10 can be taken off from master component 10, and can not cause damage.
In addition, in the above-described embodiment, example take flat cable as electronic devices and components is illustrated, but the kind to electronic devices and components in the present invention is not particularly limited, can be widely used in the manufacture method of the electronic devices and components of making through following operation, in this operation, from the aggregate that comprises multiple electronic devices and components, take off each electronic devices and components such as multilager base plate, module components and parts.
In addition, the present invention also can't help above-mentioned execution mode in other side and limits, can be in scope of invention, the structure (configuration of each electronic devices and components etc.) to master component, concrete shape, the constituent material of support membrane or the configuration of peristome etc. that formation is pressed the pin of fixture are carried out various application, are increased various distortion.
Label declaration
1 master component
10 flat cables (electronic devices and components)
10a components and parts region
10b stays white region
15 cable main layers
16a, 16b resist layer
11a, 11b connector
The central portion of 12 flat cables
The both ends of 13a, 13b flat cable
20 support membranes
21 peristomes
22 otch (stamped groove)
31 press fixture
31a jig main body
32 pins
The leading section of 32a pin
33 pallets
34 housing recess
35 protection members
Claims (6)
1. a manufacture method for electronic devices and components, is characterized in that, comprising:
The operation of pasting the support membrane with cementability in an interarea one side of flat master component, wherein, disposes multiple electronic devices and components that will take off with ordered state on described master component integratedly;
From another interarea one side of described master component along described electronic devices and components profile separately, form otch, at described master component, be cut off but the operation that the not cut state of described support membrane, respectively described multiple electronic devices and components cut down from described master component; And
Thereby enter multiple pins and utilize its leading section to press described electronic devices and components, make described multiple electronic devices and components strip down and keep ordered state and take off the operation of described multiple electronic devices and components from described support membrane thus from interarea one side pressure of described master component.
2. the manufacture method of electronic devices and components as claimed in claim 1, is characterized in that,
With the leading section of multiple described pins, each electronic devices and components of described electronic devices and components are pressed, described electronic devices and components are stripped down from described support membrane.
3. the manufacture method of electronic devices and components as claimed in claim 1 or 2, is characterized in that,
In described supporting film, corresponding with the position of being pressed described electronic devices and components by the leading section of described pin region, be provided with peristome, the leading section of described pin, via described peristome, connects with described electronic devices and components.
4. the manufacture method of electronic devices and components as claimed in claim 1 or 2, is characterized in that,
The leading section of described pin has the prominent shape of point, makes the leading section of described pin run through described support membrane and connect with described electronic devices and components.
5. the manufacture method of the electronic devices and components as described in any one of claim 1 to 4, is characterized in that,
In a part interarea, that pressed by the leading section of described pin of described master component, be provided with the protection member for preventing that described electronic devices and components are impaired.
6. the manufacture method of the electronic devices and components as described in any one of claim 1 to 5, is characterized in that,
Keep ordered state take off in the operation of described multiple electronic devices and components, comprise the described ordered state of maintenance described multiple electronic devices and components are accommodated in to the operation in pallet, wherein, described pallet has the housing recess corresponding with the position of described electronic devices and components.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-226722 | 2012-10-12 | ||
| JP2012226722A JP2014076528A (en) | 2012-10-12 | 2012-10-12 | Manufacturing method of electronic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103731988A true CN103731988A (en) | 2014-04-16 |
| CN103731988B CN103731988B (en) | 2018-01-09 |
Family
ID=50455871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310472960.3A Active CN103731988B (en) | 2012-10-12 | 2013-10-11 | The manufacture method of electronic component |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2014076528A (en) |
| CN (1) | CN103731988B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7396789B2 (en) * | 2018-08-10 | 2023-12-12 | 日東電工株式会社 | Wired circuit board, its manufacturing method, and wired circuit board assembly sheet |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1534762A (en) * | 2003-03-31 | 2004-10-06 | ��ʽ���������Ƽ� | Method for mfg. semiconductor device |
| CN101686604A (en) * | 2008-09-24 | 2010-03-31 | 比亚迪股份有限公司 | Flexible printed circuit whole board punching method |
| CN201789688U (en) * | 2010-08-19 | 2011-04-06 | 西迪斯(中山)科技有限公司 | PCB (printed circuit board) separator |
-
2012
- 2012-10-12 JP JP2012226722A patent/JP2014076528A/en active Pending
-
2013
- 2013-10-11 CN CN201310472960.3A patent/CN103731988B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1534762A (en) * | 2003-03-31 | 2004-10-06 | ��ʽ���������Ƽ� | Method for mfg. semiconductor device |
| CN101686604A (en) * | 2008-09-24 | 2010-03-31 | 比亚迪股份有限公司 | Flexible printed circuit whole board punching method |
| CN201789688U (en) * | 2010-08-19 | 2011-04-06 | 西迪斯(中山)科技有限公司 | PCB (printed circuit board) separator |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103731988B (en) | 2018-01-09 |
| JP2014076528A (en) | 2014-05-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6648290B2 (en) | Signal module molding method | |
| CN100420553C (en) | Method for die cutting flexible circuit board | |
| CN101297610B (en) | Bending-type rigid printed wiring board and process for producing the same | |
| JP6639600B2 (en) | Caps for grooved and chipped devices, devices equipped with caps, assemblies of devices and wiring elements, and methods of manufacturing the same | |
| JP2001186725A (en) | Press-molded v-shape groove pancake type slip ring | |
| JP2005506690A5 (en) | ||
| CN101507375A (en) | Compliant pin control module and method for making the same | |
| CN105684561A (en) | Flexible circuit board for LED lighting fixtures | |
| TW201431446A (en) | Rigid-flexible printed circuit board and method for manufacturing same | |
| CN104380490A (en) | Film wiring board and light emitting apparatus | |
| CN100561267C (en) | Be used to make the method and the optical coupling part of optical coupling part | |
| US20190058174A1 (en) | Battery pack and method for producing a battery pack | |
| CN202651112U (en) | Semiconductor device and lamination | |
| CN103731988A (en) | Electronic component manufacturing method | |
| CN108601221A (en) | A kind of method of rubberizing on pcb board | |
| CN101488637B (en) | Production process for connector | |
| KR101391210B1 (en) | Method of manufacturing a connector having a narrow-pitch contact group and connector | |
| CN203868764U (en) | Light emitting diode (LED) identification module made from circuit board whole board continuous glue board | |
| TWI476885B (en) | Leadframe, assembly of leadframe and substrate and led module | |
| JP3156760U (en) | Universal serial bus connector | |
| KR101133583B1 (en) | Capacitor module and making methode thereof | |
| CN202697022U (en) | Light-emitting diode (LED) module with double-faced mixing circuit | |
| CN201387950Y (en) | Plane grid array electric connector | |
| KR20020022081A (en) | combination-type IC card | |
| TW201415965A (en) | Flexible printed circuit board and method for making the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |