CN103731988B - The manufacture method of electronic component - Google Patents
The manufacture method of electronic component Download PDFInfo
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- CN103731988B CN103731988B CN201310472960.3A CN201310472960A CN103731988B CN 103731988 B CN103731988 B CN 103731988B CN 201310472960 A CN201310472960 A CN 201310472960A CN 103731988 B CN103731988 B CN 103731988B
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- electronic component
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Abstract
The preparation method that the present invention provides a kind of higher electronic component of production efficiency, can remove multiple electronic components after stamping process (each electronic component) with ordered state from master component.In the preparation method of the electronic component of the present invention,The support membrane (20) with cementability is pasted in an interarea side of flat master component (1),Wherein,The multiple electronic components to be removed integratedly are configured with ordered state on the master component (1),Then,Otch (22) is formed from another interarea side of master component (1) along the respective profile of electronic component (10) (component region 10a),In the state of master component (1) is cut off but support membrane (20) is not switched off,Multiple electronic components (10) are cut down from master component (1) respectively,Afterwards,Multiple pins (32) are pressed into from an interarea side of master component (1),And utilize its leading section pressing electronic component (10),Thus multiple electronic components (10) are made to be stripped down from support membrane (20),So as to remove multiple electronic components (10) with keeping ordered state.
Description
Technical field
The present invention relates to a kind of preparation method of the various electronic components such as multilager base plate, module component, flat cable,
More particularly to a kind of manufacture method that electronic component is manufactured by following process, in the process, from including multiple electronics member
Each electronic component is removed on the master component (aggregate) of device.
Background technology
When manufacturing electronic component, such as illustrated by taking multilager base plate as an example, the method for so-called more die cavitys is just wide
General use so that production efficiency is improved, and in the method, first, preparing set has the mother substrate of multiple submounts, so
Multiple submounts (each multilager base plate) are removed from mother substrate afterwards.
Wherein, each electronic component is removed as from comprising being arranged on the mother substrate of multiple electronic components
Method, it is known to：Mother substrate is cut along defined line of cut, so as to be divided into the side of single electronic component
Method；Using the mould of punching press from mother substrate method of multiple electronic components etc. under punching press.
In addition, as removing the method for each substrate by punch process, such as it is known that described in patent document 1
Printed base plate preparation method, the preparation method of the printed base plate includes：Mother substrate formation process, work is formed in the mother substrate
In sequence, multiple vias are formed to the base material of resin-made every predetermined distance along punch line, and electricity is formed in the via inner peripheral surface
Pole, so as to obtain mother substrate；And mother substrate stamping procedure, the mother substrate stamping procedure are by utilizing mould along punch line
Punching press is carried out to mother substrate so as to the process split to the mother substrate, in the mother substrate stamping procedure, to the punch line
Set, make it have defined width, and make it at the line portion through via inner edge portion to the wiring side of the inner edge portion
To obliquely entering.
However, in the case where only carrying out above-mentioned punch process, the electronic component after stamping process is not easy again
It is secondary to return to ordered state, the problem of so as to cause production efficiency to decline.
Prior art literature
Patent document
Patent document 1：Japanese Patent Laid-Open 5-102638 publications
The content of the invention
The technical problems to be solved by the invention
The present invention is accomplished to solve the above problems, its object is to, there is provided a kind of higher electricity of production efficiency
The preparation method of sub- component, it is (each the multiple electronic components to be removed from master component can be removed with the state of arrangement
Electronic component).
Technical scheme used by solution technical problem
In order to solve the above problems, the manufacture method of electronic component of the invention is characterised by, including：
The process of the support membrane with cementability is pasted in an interarea side of flat master component, wherein, it is described
The multiple electronic components to be removed integratedly are configured with master component with ordered state；
Otch is formed from another interarea side of the master component along the respective profile of the electronic component, described
Master component is cut off but the support membrane be not switched off in the state of, respectively by the multiple electronic component from the master component
On the process that cuts down；And
Multiple pins are pressed into from an interarea side of the master component and press the electronics member device using its leading section
Part, the multiple electronic component is stripped down from the support membrane, be described so as to remove with keeping ordered state
The process of multiple electronic components.
In addition, in the preparation method of the electronic component of the present invention, it is preferred to use following structure：That is, with multiple described
The leading section of pin is pressed each electronic component of the electronic component, makes the electronic component from the supporting
Stripped down on film.
Each electronic component is pressed by using the leading section of multiple pins, i.e., pressed by using the leading section of pin
Press multiple positions of an electronic component, so as to reliably make each electronic component be stripped down from support membrane, energy
Improve the reliability of the manufacture method of the electronic component of the present invention.
Additionally, it is preferred that using following structure：That is, in the support film and by the pin the leading section pressing electricity
The position of sub- component is provided with opening portion in corresponding region, and the leading section of the pin is via the opening portion, with the electricity
Sub- component abuts against.
By in region that support film, corresponding with pressing the position of the electronic component by the leading section of the pin
Interior setting opening portion, so that the leading section of pin directly abuts against via the opening portion with electronic component, thus, energy can
Each electronic component is set to be stripped down from support membrane by ground, it is possible to increase reliability.
Additionally, it is preferred that using following structure：That is, the leading section of described pin has jagged shape, makes the leading section of the pin
Abutted against through the support membrane with the electronic component.
Using pin leading section have jagged shape and sell leading section through support membrane and with electronic component phase
In the case of the structure of abutting, without setting opening portion on support membrane, so as to simplify process.
Additionally, it is preferred that on the master component a interarea, the part that is pressed by the leading section of the pin, if
It is equipped with for preventing the impaired protection component of the electronic component.
By setting protection component in a part interarea, being pressed by the leading section of pin of master component, so as to
Being partially damaged as electronic component is prevented, so as to obtain a kind of higher electronic component of reliability.
In addition, in the preparation method of the electronic component of the present invention, it is preferably, it is described removing with keeping ordered state
In the process of multiple electronic components, the multiple electronic component is accommodated in pallet comprising the holding ordered state
Process, wherein, the pallet has the housing recess corresponding with the position of the electronic component.
By using said structure, ordered state can be kept and reliably the electronic component removed is handled,
So as to further give play to the effect of the present invention.
Invention effect
In the preparation method of the electronic component of the present invention, the multiple electricity to be removed integrally are being configured with ordered state
One interarea side of the flat master component of sub- component, the support membrane with cementability is pasted, from another interarea one
Side forms otch along the respective profile of electronic component, in the state of master component is cut off but support membrane is not switched off, respectively
Multiple electronic components are cut down from master component, afterwards, enter multiple pins from an interarea side pressure of master component, and utilize
Its leading section presses electronic component, so that multiple electronic components strip down from support membrane, therefore, it is possible to arrange
The each electronic component to be removed from master component is removed under state.Therefore, by being applicable electronic component of the invention
Preparation method, so as to the process by removing each electronic component from master component under ordered state, can effectively it make
Produce electronic component.
In addition, in the present invention, for being pressed into multiple pins, from an interarea side of master component so as to ordered state point
Master component, can be to being divided into the regional behind multiple regions to carry out above-mentioned work by the process for not removing multiple electronic components
Sequence, alternatively, it is also possible to using the structure that each electronic component is disposably removed from whole master component.
Brief description of the drawings
Fig. 1 is involved by embodiments of the present invention 1, represents to be provided with the multiple electronics to be removed member with ordered state
The figure of the structure of the master component (integrated substrate) of device, Fig. 1 (a) are top views, and Fig. 1 (b) is Fig. 1 (a) line A-A sectional view,
Fig. 1 (c) is Fig. 1 (a) line B-B sectional view.
Fig. 2 is the upward view of the master component shown in Fig. 1.
Fig. 3 is the figure for the structure for representing the electronic component (flat cable) involved by embodiments of the present invention 1, Fig. 3
(a) it is top view, Fig. 3 (b) is front view.
Fig. 4 A are the shapes that support membrane is pasted with an interarea for represent the master component involved by embodiments of the present invention 1
The figure of state, Fig. 4 A (a) are top views, and Fig. 4 A (b) are Fig. 4 A (a) line A-A sectional views, and Fig. 4 A (c) are Fig. 4 A (a) line B-Bs
Sectional view.
Fig. 4 B are to represent to be pasted with supporting in embodiments of the present invention 1, on an interarea (lower surface) of master component
The upward view of the state of film.
Fig. 5 is the figure for representing the state formed with otch (stamped groove) on the master component shown in Fig. 4 A, Fig. 4 B, Fig. 5 (a)
It is top view, Fig. 5 (b) is Fig. 5 (a) line A-A sectional view, and Fig. 5 (c) is Fig. 5 (a) line B-B sectional view.
Fig. 6 is to illustrate to take each electronic component (flat cable) from master component in embodiments of the present invention 1
Under method figure, Fig. 6 (a) is to represent to make the pin of pressing fixture in face of the figure of the state of an interarea of master component, Fig. 6 (b)
It is to represent the pin of press-in pressing fixture, peel off electronic component (flat cable) from support membrane and move it to the shape of pallet
The figure of state.
Fig. 7 is to represent that what is used in embodiments of the present invention 1 presses the stereogram of the structure of fixture.
Fig. 8 is the electronics member device for representing to remove from master component in embodiments of the present invention 1, with array body state
Part (flat cable) moves to the top view of the state of pallet.
Fig. 9 is to represent the manufacture work in the electronic component involved by other embodiments of the present invention (embodiment 2)
The upward view of the structure of one interarea (lower surface) of the master component formed in sequence.
Figure 10 is the upward view for representing to be pasted with the state of support membrane on an interarea of Fig. 9 master component.
Figure 11 is to illustrate to take each electronic component (flat cable) from master component in embodiments of the present invention 2
Under method figure, Figure 11 (a) is to represent to make the pin of pressing fixture in face of the figure of the state of an interarea of master component, Figure 11
(b) it is to represent the pin of press-in pressing fixture, peel off electronic component (flat cable) from support membrane and move it to pallet
The figure of state.
Figure 12 be represent in embodiments of the present invention 2, with array body state by the electronics removed from master component member
Device (flat cable) moves to the top view of the state of pallet.
Figure 13 is to illustrate to take each electronic component (flat cable) from master component in embodiments of the present invention 3
Under method figure, Figure 13 (a) is to represent to make the pin of pressing fixture in face of the support membrane that is pasted onto on an interarea of master component
State figure, Figure 13 (b) be represent press-in pressing fixture pin, from support membrane peel off electronic component (flat cable),
And move it to the figure of the state of pallet.
Embodiment
Below, embodiments of the present invention are shown, are described in detail with the feature to the present invention.
[embodiment 1]
Fig. 1 (a) is to represent to include multiple electronic components with ordered state (for flat cable in present embodiment 1)
Master component (integrated substrate) structure top view, in addition, Fig. 1 (b) is Fig. 1 (a) line A-A sectional view, Fig. 1 (c) is Fig. 1
(a) line B-B sectional view.Fig. 2 is the upward view of master component.
In present embodiment 1, following methods are illustrated：That is, with ordered state from such as Fig. 1 (a)~(c) and
Each flat cable (electronic component) 10 is removed on the master component 1 of structure shown in Fig. 2.
In present embodiment 1, the flat cable 10 removed from master component 1 is used as high-frequency signal circuit, such as Fig. 3
(a), shown in (b), the flat cable 10 has following structure：That is, in the upper surface side and lower face side of signal line, every
The two interarea sides up and down for the cable main layer 15 that insulating properties base material layer sets grounding electrode and formed are provided with resist layer
16a、16b。
In addition, flat cable 10 has following structure：That is, the input/output section at both ends possesses a pair of surface installing types
Connector 11a, 11b, compared with the central portion 12 of long side direction, both ends 13a, 13b provided with connector 11a, 11b compared with
It is wide.
In addition, in the present invention, the concrete structure or shape of flat cable 10 are not limited to present embodiment 1, this hair
It is bright to go for variously-shaped or structure.
Also, the master components (integrated substrate) 1 of multiple flat cables 10 with said structure can be removed with along long side side
To side (long side) mutually adjacent state, there is the flat structure that multiple flat cables 10 are arranged into a row.In addition,
The ordered state of multiple flat cables 10 is not particularly limited to, can also spread configuration into rectangular.In addition, to being contained in list
The quantity of the flat cable of individual master component (integrated substrate) does not also limit.
The heat with pliability can by signal line and as polyimides or liquid crystal polymer for the master component 1
The layered product of plastic resin sheet material is set to cell cube (cable main layer).On master component 1, turn into each flat electricity after removing
The part (region) of cable 10 is set to component region 10a, by remainder, that is, surrounds the region of each flat cable 10 and is set to each
Flat cable 10 (component region 10a) carries out punching press and what is left after being removed as surplus material is left white region 10b.
In addition, on each component region 10a, in an interarea (lower surface) of monomer (cable main layer) 15 and another
On individual interarea (upper surface), provided with resist layer 16a, 16b.
Above-mentioned master component 1 is made in the following way：For example by being used in the assigned position on surface provided with signal cable
The lower surface side for the thermoplastic resin sheet material that the polyimides or liquid crystal polymer of conductor are formed sets grounding electrode to use
Conductor, and grounding electrode conductor also is provided with across other thermoplastic resin sheet materials in upper surface side, in resulting layer
Stack (cable main layer), to turn into the interarea in component region of each electronic component (flat cable) and another
Resist layer, also, the connector of the input/output section setting surface installing type in flat cable are formed on individual interarea, so that
It is turned on signal cable with conductor.
In addition, manufacture method, i.e. signal cable conductor, thermoplastic resin sheet material, grounding electrode for master component 1
It is not particularly limited, can be had using various methods with the forming method of conductor, resist layer etc. or put in order etc.
Just like the master component 1 of structure shown in Fig. 1 (a)~(c) and Fig. 2.
Next, the method that multiple flat cables 10 are removed from the master component (integrated substrate) 1 is illustrated.
First, as shown in Fig. 4 A (a), (b), (c) and Fig. 4 B, support membrane 20 is pasted on an interarea of master component 1.
On the support membrane 20, in region corresponding with each component region 10a respectively, formed with multiple opening portions 21.At this
In embodiment 1, the both ends 13a of the long side direction for the flat cable 10 (reference picture 3) that opening portion 21 is formed at and removed,
13b and the corresponding region of central portion 12.
In support membrane 20, the face side that is pasted on master component 1, the weaker bonding agent of cementability is provided with.It is in addition, so-called
" cementability is weaker " refer to the cementability with following degree：That is, pressing fixture is being inserted from the opening portion 21 of support membrane 20
The leading section 32a of 31 pin 32 is simultaneously pressed in the stage before flat cable 10, and the caking property may insure as described later
Reliably the whole master component 1 comprising multiple flat cables 10 is supported, further, it is possible to pass through the opening from support membrane 20
Portion 21 inserts pin 32 (Fig. 6 (a), (b)), and flat cable 10 is pressed, be reliably peeled each flat cable 10.
Next, as Fig. 5 (a), (b), shown in (c), using laser or cutter etc. from another interarea edge of master component 1
Each component region 10a profile forms otch (stamped groove) 22.Form the otch 22 so that in a thickness direction by (cutting
It is disconnected) master component 1, reach support membrane 20, but do not pass through (not cutting off) support membrane 20.That is, each component region 10a is made from being left white area
Domain 10b is separated, but is not separated with support membrane 20.
In addition, otch 22 can also form the centre position of the thickness direction to support membrane 20.
By forming the otch 22, so as to be in each flat cable 10 (component region 10a) from being left white region 10b
In the state of cutting off out, the state for being supported the supporting of film 20 is formed.
Therefore, as shown in Fig. 6 (a), from an interarea of the master component 1 provided with support membrane 20, the pin of pressing fixture 31 is made
32 leading section 32a faces multiple opening portions 21 respectively, pushes the leading section 32a for the pin 32 for pressing fixture 31 to master components 1, from
And abutted against with each flat cable 10 (component region 10a), then, by pushpin 32, as shown in Fig. 6 (b), make each flat
Cable 10 is peeled off from support membrane 20, and is removed respectively to being arranged in multiple housing recess 34 on pallet 33.
In addition, as shown in fig. 7, it is the fixture that has following structure used herein of pressing fixture 31：That is, flat
On jig main body 31a surface, corresponding with the multiple opening portions 21 being arranged at support membrane 20 multiple positions, it is configured with
Sell (pushpin) 32.The height for forming each pin 32 of pressing fixture can be identical, if however, making to being arranged at and flat electricity
Pin 32 that opening portion 21 on the corresponding position in the both ends of cable 10 is pressed, with to be arranged at in flat cable 10
The height for the pin 32 that opening portion 21 on the corresponding position in centre portion is pressed is different, then can improve what is peeled off from support membrane 21
Fissility, it is therefore, ideal.
In addition, in present embodiment 1, as shown in figure 8, each flat cable 10 removed as described above is accommodated in
Being arranged has the pallet 33 of housing recess 34, the housing recess 34 be arranged be configured at master component (integrated substrate) 1 on
Each flat cable 10 the corresponding multiple positions in position on, therefore, it is possible to maintain the ordered state on master component 1 unchangeably
Each flat cable 10 is stripped down from support membrane 20, and moves it to pallet 33.
Therefore, by the preparation method for the electronic component for being applicable the present invention, so as to each by being removed from master component
The process of electronic component (being flat cable in embodiment 1), can effectively produce electronic component.
[embodiment 2]
Fig. 9 is to represent the manufacture in the electronic component involved by another embodiment of the invention (embodiment 2)
The upward view of the structure of one interarea (lower surface) of the master component (integrated substrate) 1 formed in process, Figure 10 is represented in Fig. 9
Master component (integrated substrate) 1 an interarea (lower surface) on be pasted with support membrane 20 state upward view, Figure 11 (a),
(b) it is the figure of process that represents that each flat cable 10 is peeled off and removed from support membrane 20.
In present embodiment 2, part that master component 1, pin 32 by pressing fixture 31 leading section 32a is abutted,
On the both ends of i.e. each component region 10a long side direction and central portion, the protection (present embodiment 2 of component 35 is configured with
In be stainless steel plate).
In addition, other structures are identical with above-mentioned embodiment 1.In addition, in Fig. 9, Figure 10 and Figure 11 (a), (b), mark
The part of note label identical with Fig. 1~8 represents same or equivalent part.
It is and above-mentioned in the case where peeling off and removing each flat cable 10 from support membrane 20 in present embodiment 2
The situation of embodiment 1 is identical, from another interarea of the master component 1 for being supported the supporting of film 20 along each component region 10a
Profile form otch (stamped groove) 22, each flat cable 10 is in from the state (reference picture 5 for being left white region 10b separation
(a)、(b)、(c))。
Therefore, as shown in Figure 11 (a), from an interarea of the master component 1 provided with support membrane 20, the pin of pressing fixture 31 is made
32 leading section 32a faces multiple opening portions 21 respectively, pushes the leading section 32a for the pin 32 for pressing fixture 31 to master components 1, makes
It is abutted against with being configured with the component region 10a (each flat cable 10) of protection component 35 on an interarea, then, is passed through
Pushpin 32, as shown in Figure 11 (b), each flat cable 10 is peeled off from support membrane 20, and it is removed respectively to being arranged on support
In multiple housing recess 34 on disk 33.
In present embodiment 2, part (that is, each component in master component 1, the leading section 32a by pin 32 is abutted
The both ends of region 10a long side direction and central portion) place is provided with protection component 35, even if therefore master component 1 will be sub- as polyamides
The layered product of amine or the such thermoplastic resin sheet material with pliability of liquid crystal polymer, also can be with arrangement as cell cube
State removes each flat cable 10 from master component 1, and the part without being abutted to the leading section 32a of pin 32 causes to damage
It is bad.
That is, according to the method for present embodiment 2, the part abutted by the leading section of the pin in pressing fixture
Such as protection component 35 is pre-set, it is flexible so as to have even in master component as polyimides or liquid crystal polymer
Property thermoplastic resin sheet material layered product as cell cube, and in the case where locally applying larger pressing force, also can
Avoid producing depression at the part pressed and make it that configuration is damaged in the circuit pattern on internal layer or top layer etc., also,
As shown in figure 12, moreover it is possible in the case that ordered state on master component 1 is maintained is constant, by each flat cable 10 from support membrane
Strip down, and moved it in multiple housing recess 34 of pallet 33 on 20.
[embodiment 3]
Figure 13 (a), (b) are represented in another other embodiment (embodiment 3) of the present invention, by each flat cable
The figure of 10 processes peeled off and removed from the support membrane 20 of master component 1 (integrated substrate).
In present embodiment 3, as shown in Figure 13 (a), (b), as pressing fixture 31, using jig main body 31a's
Surface possesses the pressing fixture of multiple pins 32, and the leading section 32a of the plurality of pin 32 has jagged shape.
In addition, as support membrane 20, it is different from the situation of above-mentioned embodiment 1 and 2, use the branch for being formed without opening portion
Hold film.
In addition, in master component 1, the portion abutted in the leading section 32a of jagged shape of pin 32 by pressing fixture 31
Divide, on the both ends of i.e. each component region 10a long side direction and central portion, be configured with protection (this embodiment party of component 35
It is stainless steel plate in formula 3).
In addition, other structures are identical with the situation of above-mentioned embodiment 1.In addition, in Figure 13 (a), (b), mark and Fig. 1
The part of~8 identical labels represents same or equivalent part.
In addition, in present embodiment 3, support membrane of the fixture 31 by each flat cable 10 from master component 1 is pressed utilizing
When peeling off and remove on 20, front end is pushed away in the leading section 32a of the pin 32 of jagged shape from an interarea for being pasted with support membrane
To the component region 10a of master component, and make pin 32 leading section 32a be further pushed into through support membrane 20 and with electronics member device
Part abuts against.
Thus, each flat cable 10 that reliably can be included master component 1 is peeled off and removed from support membrane 20.
That is, according to the method for present embodiment 2, using in the case of being formed without the support membrane 20 of opening portion, also can
Front end is set to run through support membrane 20 in the leading section 32a of the pin 32 of jagged shape, so as to reach the component region 10a of master component 1
(flat cable 10), and the leading section 32a of pin 32 is directly pressed into component region 10a, therefore, it is possible to maintain main group
In the case that ordered state on part 1 is constant, by each flat cable 10 from supporting to be reliably peeled on film 20, and moved
To pallet 33.
Further, since protection component 35 is provided with the part that the leading section 32a of pin 32 is abutted, therefore even in master component
The layered product of the thermoplastic resin sheet material as polyimides or liquid crystal polymer with pliability is set to cell cube by 1
In the case of, each flat cable 10 can also be removed from master component 10, without causing to damage.
In addition, in the above-described embodiment, the example using flat cable as electronic component is illustrated, but the present invention
In the species of electronic component is not particularly limited, can be widely applied to by following process and manufactured electronic component
Preparation method in, in the process, multilager base plate, module component etc. are removed from the aggregate comprising multiple electronic components
Each electronic component.
In addition, the present invention is not also limited in other side by above-mentioned embodiment, can be in the range of invention, to master
The structure (configuration of each electronic component etc.) of component, concrete shape, the structure of support membrane for forming the pin for pressing fixture
Various applications, increase various modifications are carried out into configuration of material or opening portion etc..
Label declaration
1 master component
10 flat cables (electronic component)
10a components region
10b is left white region
15 cable main layers
16a, 16b resist layer
11a, 11b connector
The central portion of 12 flat cables
The both ends of 13a, 13b flat cable
20 support membranes
21 opening portions
22 otch (stamped groove)
31 pressing fixtures
31a jig main bodies
32 pins
The leading section of 32a pins
33 pallets
34 housing recess
35 protection components
Claims (6)
- A kind of 1. manufacture method of electronic component, it is characterised in that including：The process of the support membrane with cementability is pasted in an interarea side of flat master component, wherein, described main group The multiple electronic components to be removed integratedly are configured with part with ordered state；Otch is formed from another interarea side of the master component along the respective profile of the electronic component, at described main group Part is cut off but the support membrane be not switched off in the state of, the multiple electronic component is cut from the master component respectively The process cut off；AndFrom an interarea side of the master component be pressed into multiple pins and using its leading section press the electronic component, by This makes the multiple electronic component be stripped down from the support membrane, so as to removing the multiple electricity with keeping ordered state The process of sub- component,Sheet material with pliability is set to cell cube by the master component,Each electronic component of the electronic component is pressed with the leading section of multiple pins, makes the electronics member Device strips down from the support membrane,Multiple pins are corresponding with an electronic component,The both ends of the electronic component possess connector,On an interarea, overlapping with the connector position of the master component, pressing has the pin.
- 2. the manufacture method of electronic component as claimed in claim 1, it is characterised in thatThe electronic component has long side direction, and multiple pins are arranged side by side along the long side direction.
- 3. the manufacture method of electronic component as claimed in claim 1 or 2, it is characterised in thatIn the multiple pins pressed respectively the electronic component, the both ends with the electronic component are arranged on Pin on the corresponding position in portion, the height of pin on the position corresponding with being arranged on the central portion of the electronic component are mutual Differ.
- 4. the manufacture method of electronic component as claimed in claim 1 or 2, it is characterised in thatThe leading section of the pin has jagged shape, make the leading section of the pin through the support membrane and with the electronics member device Part abuts against.
- 5. the manufacture method of electronic component as claimed in claim 1 or 2, it is characterised in thatOn a part interarea, being pressed by the leading section of the pin of the master component, it is provided with for preventing institute State the impaired protection component of electronic component.
- 6. the manufacture method of electronic component as claimed in claim 1 or 2, it is characterised in thatIn the process of the multiple electronic component is removed with keeping ordered state, comprising with keeping the ordered state by institute The process that multiple electronic components are accommodated in pallet is stated, wherein, the pallet has the position phase with the electronic component Corresponding housing recess.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-226722 | 2012-10-12 | ||
| JP2012226722A JP2014076528A (en) | 2012-10-12 | 2012-10-12 | Manufacturing method of electronic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103731988A CN103731988A (en) | 2014-04-16 |
| CN103731988B true CN103731988B (en) | 2018-01-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310472960.3A Active CN103731988B (en) | 2012-10-12 | 2013-10-11 | The manufacture method of electronic component |
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| Country | Link |
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| JP (1) | JP2014076528A (en) |
| CN (1) | CN103731988B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7396789B2 (en) * | 2018-08-10 | 2023-12-12 | 日東電工株式会社 | Wired circuit board, its manufacturing method, and wired circuit board assembly sheet |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1534762A (en) * | 2003-03-31 | 2004-10-06 | ��ʽ���������Ƽ� | Method for mfg. semiconductor device |
| CN101686604A (en) * | 2008-09-24 | 2010-03-31 | 比亚迪股份有限公司 | Flexible printed circuit whole board punching method |
| CN201789688U (en) * | 2010-08-19 | 2011-04-06 | 西迪斯(中山)科技有限公司 | PCB (printed circuit board) separator |
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| CN103731988A (en) | 2014-04-16 |
| JP2014076528A (en) | 2014-05-01 |
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