CN103718323B - There is the light emitting module of the area requirements of reduction - Google Patents
There is the light emitting module of the area requirements of reduction Download PDFInfo
- Publication number
- CN103718323B CN103718323B CN201280034376.3A CN201280034376A CN103718323B CN 103718323 B CN103718323 B CN 103718323B CN 201280034376 A CN201280034376 A CN 201280034376A CN 103718323 B CN103718323 B CN 103718323B
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- Prior art keywords
- light emitting
- active component
- emitting module
- carrier element
- base material
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- 230000008901 benefit Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000004020 luminiscence type Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
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- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/82—Interconnections, e.g. terminals
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- Electroluminescent Light Sources (AREA)
Abstract
In there is the light emitting module (1) of tabular active component (11) and the plate-shaped support element (10) that includes being provided with the surface of this active component (11), carrier element (10) has raised zones relative to active component (11), is provided with the encasement medium (21) of this active component of flanked (11) in this raised zones.The power terminal in printed conductor form (30) for powering to active component (11) is positioned at encasement medium (21) outward, and described printed conductor is perpendicular to the plane of active component (11) and arranges and extend on the outer peripheral face of encasement medium (21) at least in part.
Description
The present invention relates to the light emitting module of preamble according to claim 1, it has and is arranged on carrier element
Tabular luminescence active component.This active component can be especially OLED (Organic Light Emitting Diode) structure or
QLED (light emitting diode with quantum dots) structure.
The research that can replace the new type light source of conventional light source (such as electric filament lamp or fluorescent lamp) because of its performance improved exists
Achieve far-reaching progress at no distant date.Here, except the classical light emitting diode (LED) of substantially point source of light
Outside, OLED or QLED especially focus of attention, because it is luminous to realize novel face based on such structure
Part.As having the planar luminous body of optical density moderate compared with classical LED, OLED or QLED is ideally
It is applicable to manufacture face diffusion light source.The application possibility that can be used for this kind of light source is the most diversified, thus leads at this
In territory, the past few years create significant progress.Because its structure, OLED or QLED has so-called lambert and sends out
The performance of beam, i.e. all has constant optical density under any reflection angle.Corresponding, it is very well fitted
For constituting large-area light source.
OLED or QLED is current driving element.Corresponding to this, the uniform current in light-emitting area is distributed for obtaining
Uniformly known light output it is critical that.It is arranged on the side of OLED structure or QLED structure
Required transparency electrode limit described uniformity.Transparency electrode be typically based on transparent conductive oxide (TCO) or
Very thin metal level is constituted.But because the conductive capability of these materials is not enough, therefore uniformity is restricted.
Above-mentioned restriction causes the maximum of OLED surface illuminator or QLED surface illuminator can obtain area being restricted.
It addition, in order to supply induced current for light-emitting area, need the electric conductor of cincture.In heretofore known embodiment, described
Electric conductor is made up of other printed conductor being mostly made up of opaque but that electric conductivity is strong metal foil film.They are constituted
Around the most luminous wide frame of light-emitting area, as shown in Figure 4.
Fig. 4 with top view show as known from the prior art, OLED or the QLED face luminescence unit of planar
The theory structure of part 100.Reference 110 indicates carrier substrate at this, its typically by glass, overlay or
Similar material is constituted.Being provided with active OLED structure or QLED structure 111 on carrier substrate 110, it is by sun
Extreme son 112 and cathode terminal 113 are for induced current.The terminal 112 and 113 connection on active surface 111 is led to
Crossing printed conductor 112a and 113a to realize, printed conductor bridge joint is 121 forms and encirclement active surface in edge wrap
The region of 111.The encapsulating 121 typically can being made up of glass, plastic foil or similar material is for protecting active structure
111 from ectocine.Dampness and oxygen is the most thus avoided to enter this structure 111.Bridge this encapsulating 121
Printed conductor 112a with 113a is now generally by ITO or alternatively by FTO, ZnO, PEDOT or similar material
Material is constituted.
Such as can see from the view of Fig. 4, carrier element 110 has protuberance in the neighboring of active face 111,
This protuberance is used for arranging the terminal 112 and 113 in planar printed conductor form.Now, protuberance needs have
One fixed width is to can guarantee that terminal 112,113 has enough conductive capabilities, and the such conductive capability of final needs comes
It is that active layer 111 is for induced current fully.But this causes again the active layer 111(i.e. actual luminous zone of device 100)
Surrounded by non-luminous frame.If multiple such light-emitting components 110 to be mutually combined into a large-area dress
Put, the most thus adversely affect the general impression of obtained light-emitting area.
Therefore, the present invention based on following task, proposes a kind of to be particularly based on sending out of OLED or QLED for realizing
The novel solution of optical module, here, described shortcoming is overcome.
This task will complete by having the light emitting module of claim 1 feature.The favourable improvement project of the present invention is
The theme of dependent claims.
The core conception of inventive solution is to arrange in a novel manner to power for the active component for light emitting module
Power terminal.As the past, these terminals are made up of printed conductor, but from now on, this printed conductor according to
The present invention is perpendicular to the plane of active component and arranges and surround in side at least in part the encapsulating of this active component
Extend on the outer peripheral face of medium.
According to the present invention, correspondingly proposing a kind of light emitting module, it has:
The active component of-tabular,
-there is the carrier element of tabular on surface, described active component is arranged on a surface, wherein this carrier element
There is the region protruded relative to this active component,
-it is positioned at region and the encasement medium of this active component of flanked of this protrusion,
-the power terminal in printed conductor form that is positioned at outside this encasement medium,
-it is conductively connected mechanism between this carrier element and encasement medium and by what this terminal and active component interconnected,
Wherein, according to the present invention, the described printed conductor constituting power terminal is arranged perpendicularly to the flat of this active component
Face and extension on the outer peripheral face of this encasement medium at least in part.
As describe in detail below with reference to multiple embodiment of the present invention, embodiments of the present invention can be passed through
And being reduced significantly of the marginal zone required for obtaining light emitting module particularly by novel power terminal arrangement form.And
And, in addition it is also necessary to which is provided with at least slightly protruding of the base material of OLED structure or QLED structure, to realize cincture
Encapsulating, i.e. adequately protect this active layer.But the permission compared with heretofore known solution of the solution of the present invention
Significantly reduced protrusion degree, thus non-luminous frame may finally be reduced as far as possible.Examine in single light-emitting component
Considering this advantage, but it the most also plays a role according in the device of multiple light emitting modules of the present invention having, this is
Because now the most light-emitting area proportion is not substantially reduced, thus can to the uniformly light-emitting on whole of this device in addition
Improve.
Preferably arranging the encapsulating base material of tabular on the active component side opposed with carrier element, this encapsulating base material is also protected
Protect the active component side opposed with this base material.The power terminal being made up of printed conductor is now preferably arranged in encapsulating
On the outer peripheral face of base material.Described terminal especially can extend on the whole height of encapsulating base material, and the most even having can
Printed conductor can be made not only to extend the altitude range of this encapsulating base material, and extend the height model of this carrier element
Enclose.That is, the most all ensure that enough width of the printed conductor constituting power terminal, this is the most required
The active component wanted is especially relevant for powering.
Side encasement medium such as can be made up of the encapsulating base material frame of cincture.Alternatively mode it is also contemplated that
, encasement medium is made up of the adhesive material of onset between carrier element and encapsulating base material.Encapsulating base material itself this
Time can be lighttight or also can be made up of light transmissive material, be such as made up of glass or plastics.Printing opacity embodiment party
In the case of formula, correspondingly can send light towards the both sides of this active component.Generally constitute the main of this device
The carrier element of light gasing surface is the most also made up of light transmissive material especially glass or plastics.
This active component is preferably made up of OLED structure or QLED structure as mentioned above.
One advantageous applications example of inventive solution is a kind of planar illuminating device, and it is by series or in parallel with each other
Multiple light emitting modules composition.Being conductively connected of light emitting module the most especially can also be by the power terminal of lateral arrangement
Realize.The simple interconnective advantage of light emitting module is obtained also by the terminal lateral arrangement according to the present invention.
Below with reference to accompanying drawing in detail the present invention is described in detail, wherein:
Fig. 1 a and Fig. 1 b is the view of the first embodiment of light emitting module of the present invention；
Fig. 2 a and Fig. 2 b is the view of the second embodiment of light emitting module of the present invention；
Fig. 3 a and Fig. 3 b is the view of the 3rd embodiment of light emitting module of the present invention；
Fig. 4 is the light emitting module according to known prior art.
Because conductive capability is limited, there is electricity at least one electrode of OLED structure or QLED structure as mentioned above
Pressure drop, and then uneven optical density distribution occurs.Equably will need to suppress this effect as effectively as possible
Electric current enters light-emitting area from margin guide.In order to improve CURRENT DISTRIBUTION, around active component, arrange allowable current supply
The printed conductor strengthened.But because terminal required for conductive capability, therefore use metal and thus opaque printing
Wire, it causes the non-luminous frame around light-emitting area.Also, it should protect this active structure from ectocine,
Thus encapsulating structure is set according to standard.Encapsulating structure is realized by edge wrap according to current prior art, because of
And define the region around active face and realize encapsulating base material and the encapsulating of carrier substrate.Such measure limits
The wiring of multiple light-emitting components is connected into the probability in bigger uniformly light-emitting face, this is because independent light-emitting area it
Between leave not light-emitting zone in principle, such not light-emitting zone weakens the general impression to light-emitting area.
But now, by making lead-in wire shift to the vertical edge of encasement medium according to the present invention, it is achieved that at OLED
Reducing of the cross section of the not light-emitting area of structure or QLED structure periphery.Meanwhile, achieve multiple by this measure
Independent light-emitting component simply directly connects up and connects into a bigger light-emitting area.Below will be in conjunction with Fig. 1 to Fig. 3
Embodiment the conception of the present invention is described in detail in detail.
Fig. 1 a and Fig. 1 b first illustrates the first embodiment of light emitting module 1 of the present invention with top view and sectional view,
Module 100 that it is also very similar to know from the prior art and as shown in Figure 4.That is, or excellent
Arrange on the carrier element of planar that choosing is made up of glass or overlay or carrier substrate 10 in OLED or
The active component 11 of the tabular of QLED form.The active face 11 side encapsulated base material opposed with carrier substrate 10
12 are covered, and encapsulating base material can be according to whether expectation be luminous to both sides or the most luminous and by thoroughly
Luminescent material (such as glass or plastics) or light-proof material are constituted.First the main task of encapsulating base material 20 is to protect
Protect the back side of active layer 11 from ectocine, especially stop dampness, oxygen or similar intrusion.
But also need to laterally encapsulate active face 11 to protect comprehensively.Here, it is made up of the frame 21 of cincture.Here,
Frame 21 is preferably connected with encapsulating base material 20 one, is the ingredient encapsulating base material 20, but or can also be by
Individually component is formed.Therefore, the base material 20 of encapsulating with frame 21 constitutes the recess of general square shape, active component
11 are placed in this recess.By the encapsulating base material 20 of carrier substrate 10 and band frame 21, active component 11 is by accordingly
Ground is encapsulated from four sides the most in other words.
In order to power to active component 11, in addition it is also necessary to cathode terminal and anode terminal, they must possess enough leading
Power and correspondingly being constituted with the form of planar printed conductor.In the embodiment shown, Fig. 1 b section view
Illustrating the anode terminal 30 of side, it is arranged on opposite each other two long side of light emitting module 1.Two
Individual cathode terminal is arranged on two other long side of module 1 and can't see the most in Figure 1b.End
Son 30 and active component 11 between connect through between the frame 21 that can be located at carrier substrate 10 and cincture and by
The lead-in wire 13a that ITO, FTO, ZnO, PDOT or similar material are constituted realizes.Terminal 30 and lead-in wire 13a it
Between connect through conducting resinl and/or realized by bonding method or method for brazing.
Now, the feature of the solution of the present invention is, terminal 30 still carrys out structure with the form of planar printed conductor
Become, but be presently not the plane being parallel to active component 11, but be orientated perpendicularly thereto and be arranged in encapsulating base
On the outer peripheral face of material 20 or frame 21.Although terminal 30 has essentially identical area compared with the solution of Fig. 4,
But correspondingly need not the region protruded further of carrier substrate 10, thus non-luminous thickness around frame
Substantially the size of edge wrap 21 it is confined to.Calculate from the outward flange of carrier substrate 10 because such frame typically has
The width of the about 1mm to 2mm risen, therefore the most not light-emitting zone can be obtained compared with the solution of Fig. 4
The substantially reducing of area requirements.
It should be noted that in shown figure, significantly increase and show the thickness of active component 11 to illustrate this
The conception of invention.And it practice, with carrier substrate 10 and/or encapsulating base material 20 compared with, OLED structure or QLED
The very thin thickness of structure 11.And, situations below be applicable to according to Fig. 1 a and the embodiment of Fig. 1 b and this
Other bright embodiment, i.e. the present invention is not limited to cuboid light emitting module.Instead, this luminescence mould
Block can have any shape, especially can also be in polygon-shaped or non-rotational symmetric shape or ellipse.But it is the most excellent
Choosing allows that multiple such light emitting module is jointly formed the structure of a gapless bigger light-emitting area with the form in face.
According to Fig. 2 a and the modification of Fig. 2 b, it is possible to obtain non-luminous further improvement around edge is reduced in other words,
Here, identical parts are with identical reference.In this second embodiment, in the first embodiment
The frame 21 utilizing cincture edge wrap by so-called whole bread envelope substitute.
In the case, the frame 21 of the cincture of the lateral circle surface of protection active component 11 is the most no longer set.Replace,
Encapsulating on active component 11 outer peripheral face is realized by adhesive material, and this adhesive material is primarily used for three
Planar structure, i.e. carrier substrate 10, active component 11 and encapsulating base material 20 are connected with each other.When these three unit
When part 10,11 and 20 assembles, in glue is pressed into side face region and in the case side seal closes this active component 11.
In this modification, encapsulating base material 20 has only to relative to the laterally protruding minimum degree of active component 11, to realize
Comprehensive encapsulating to active component 11.In the region of the glue of side encirclement, also it is provided with multiple lead-in wire 13a, in fact
Show being conductively connected between active component 11 and terminal 30.Terminal 30(is i.e. for anode and cathodal closing
Printed conductor) be also arranged on encapsulating on the outer peripheral face of base material 20, but here, be the most no longer provided with ring
Around frame 21.Fig. 1 a and Fig. 1 b and Fig. 2 a and Fig. 2 b is compareed and directly illustrates in this second embodiment
Non-luminous marginal area can be reduced further.Especially can be by the remaining width reduction of marginal area to about
The value of 1mm or the least.
Finally, in the 3rd modification of Fig. 3 a and Fig. 3 b, similarly it is additionally provided with Fig. 2 a and Fig. 2 b and encapsulates knot comprehensively
Structure, here, the outer peripheral face of light emitting module 1 is almost completely by terminal 30 or be positioned at the end on two other side
Son is constituted.These printed conductors 30 extend the whole altitude range of light emitting module 1 now, the most not only extend bag
The altitude range of envelope base material 20, and extend the altitude range of carrier substrate 10.Because printed conductor 30 has
The area increased, therefore thus can obtain the most preferably electric current supply.Furthermore it is possible to above-mentioned embodiment
Compare and reduce the thickness guiding wire.
Printed conductor 30 is slightly charged between carrier substrate 10 and encapsulating base material 20 in the marginal zone of active component 11
Gap in.In order to facilitate contact surface 30 and lead-in wire 13a between conducting and preferably specify, encapsulating base material 20 on limit
Edge is slightly cut sth. askew in district, reduces ground the most outwardly and constitutes.The area requirements obtained for the most luminous frame corresponds essentially to second
The area requirements of embodiment.The formation of side joint contacting surface can alternatively come also by print process or distribution method in the case of this
Realizing, this achieves the simple and flexible program of low cost that OLED or QLED surface illuminator manufactures.
The laterally horizontal layout of this terminal the most also facilitates and multiple corresponding light emitting modules is connected into a face
The process of shape luminous body.The most especially can facilitate multiple list by disposing corresponding contact pad at structural edge
Solely the direct wiring of element connects.This module is now possible not only to be series connection, it is also possible to be in parallel, here,
Especially obtain being substantially reduced not light-emitting area proportion and the advantage in gap.Correspondingly, it is possible to over a large area
Obtain the light output of uniformity.
Claims (10)
1. a light emitting module (1), it has:
● the active component (11) of tabular,
● having the carrier element (10) of the tabular on surface, this active component (11) is arranged on said surface, wherein
Described carrier element (10) has raised zones relative to described active component (11),
● it is positioned at the encasement medium (21) of active component (11) described in described raised zones and flanked,
● be positioned at described encasement medium (21) outward and be positioned at described raised zones for described active component (11)
Power supply and the power terminal (30) in printed conductor form,
● it is positioned between described carrier element (10) and described encasement medium (21) and described terminal (30) is active with described
What element (11) interconnected is conductively connected mechanism (12a, 13a), and
● it is arranged on the encapsulating base of the tabular of the side of the described active component (11) opposed with described carrier element (10)
Material (20),
It is characterized in that, the printed conductor constituting described power terminal (30) is arranged perpendicularly to described active component (11)
Plane and at least in part on the outer peripheral face of this encasement medium (21) extend, and
The encasement medium of side is made up of adhesive material, and described adhesive material is by described carrier element (10), described active
Element (11) and described encapsulating base material (20) are connected with each other.
Light emitting module the most according to claim 1, it is characterised in that constitute the described of described power terminal (30)
Printed conductor is arranged on the outer peripheral face of described encapsulating base material (20).
Light emitting module the most according to claim 2, it is characterised in that constitute the described of described power terminal (30)
Printed conductor extends on the whole height of described encapsulating base material (20).
Light emitting module the most according to claim 3, it is characterised in that constitute the printing of described power terminal (30)
Wire not only extends on the height of described encapsulating base material (20), and extends on the height of described carrier element (10).
5. according to the light emitting module according to any one of claim 2 to 4, it is characterised in that described encapsulating base material (20)
It is made up of light transmissive material.
Light emitting module the most according to claim 5, it is characterised in that described encapsulating base material (20) by glass or is moulded
Material is constituted.
7. according to the light emitting module according to any one of claim 2 to 4, it is characterised in that described active component (11)
It is made up of OLED structure or QLED structure.
8. according to the light emitting module according to any one of claim 2 to 4, it is characterised in that described carrier element (10)
It is made up of light transmissive material.
Light emitting module the most according to claim 8, it is characterised in that described carrier element (10) by glass or is moulded
Material is constituted.
10. a planar illuminating device, described planar illuminating device by multiple according to one of aforementioned claim Suo Shu
Light emitting module (1) forms, and wherein these light emitting modules (1) are in series or in parallel with each other by described power terminal.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102011079014.4 | 2011-07-12 | ||
| DE102011079014A DE102011079014A1 (en) | 2011-07-12 | 2011-07-12 | Light module with reduced space requirement |
| PCT/EP2012/063662 WO2013007781A1 (en) | 2011-07-12 | 2012-07-12 | Light module with reduced surface area requirements |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103718323A CN103718323A (en) | 2014-04-09 |
| CN103718323B true CN103718323B (en) | 2016-08-31 |
Family
ID=46598482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280034376.3A Expired - Fee Related CN103718323B (en) | 2011-07-12 | 2012-07-12 | There is the light emitting module of the area requirements of reduction |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP2732483A1 (en) |
| CN (1) | CN103718323B (en) |
| DE (1) | DE102011079014A1 (en) |
| WO (1) | WO2013007781A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015071454A1 (en) | 2013-11-18 | 2015-05-21 | Emdedesign Gmbh | Lamp comprising at least one oled lighting means |
| DE102014110969A1 (en) * | 2014-08-01 | 2016-02-04 | Osram Oled Gmbh | Organic component and method for producing an organic component |
| DE102014116740A1 (en) | 2014-11-17 | 2016-05-19 | Emdedesign Gmbh | Luminaire comprising at least two OLED bulbs |
| CN114727715A (en) | 2019-12-16 | 2022-07-08 | 雀巢产品有限公司 | Fluid line outside a housing of a lateral beverage machine |
| US20230036537A1 (en) | 2019-12-16 | 2023-02-02 | Societe Des Produits Nestle S.A. | Beverage machine with separable fluid module |
| WO2021122494A1 (en) | 2019-12-16 | 2021-06-24 | Société des Produits Nestlé SA | Beverage machine with simple water driving |
| US20230024311A1 (en) | 2019-12-16 | 2023-01-26 | Societe Des Produits Nestle S.A. | Beverage machine carriable single-handed |
| WO2021122495A1 (en) | 2019-12-16 | 2021-06-24 | Société des Produits Nestlé SA | Beverage machine with visible beverage management |
| US20230018649A1 (en) | 2019-12-16 | 2023-01-19 | Societe Des Produits Nestle S.A. | Thermally unconditioned beverage preparation machine |
| WO2021122493A1 (en) | 2019-12-16 | 2021-06-24 | Société des Produits Nestlé SA | Beverage machine with an off-set actuator |
| EP4076097A1 (en) | 2019-12-16 | 2022-10-26 | Société des Produits Nestlé S.A. | Beverage machine with beverage collector |
| EP4076107A1 (en) | 2019-12-16 | 2022-10-26 | Société des Produits Nestlé S.A. | Beverage machine with actuated water supply valve |
| US20230027842A1 (en) | 2019-12-16 | 2023-01-26 | Societe Des Produits Nestle S.A. | Beverage machine with separable beverage processing unit |
| WO2021191107A1 (en) | 2020-03-24 | 2021-09-30 | Société des Produits Nestlé SA | Beverage preparation machine with handy power management |
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| CN101517771A (en) * | 2006-07-28 | 2009-08-26 | 法国圣-戈班玻璃公司 | Encapsulated electroluminescent device |
| CN100568523C (en) * | 2005-12-08 | 2009-12-09 | 索尼株式会社 | Display unit |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6538375B1 (en) * | 2000-08-17 | 2003-03-25 | General Electric Company | Oled fiber light source |
| JP2002175877A (en) * | 2000-09-27 | 2002-06-21 | Seiko Epson Corp | Organic electroluminescence device, manufacturing method of the organic electroluminescence device, and electronic equipment |
| JP2003317940A (en) * | 2002-04-25 | 2003-11-07 | Harison Toshiba Lighting Corp | Organic electroluminescence device |
| DE10328140B4 (en) * | 2003-06-20 | 2006-12-07 | Schott Ag | Organic light-emitting device and method for its production |
| JP4784403B2 (en) * | 2006-06-08 | 2011-10-05 | パナソニック電工株式会社 | Luminescent panel system |
| JP4981371B2 (en) * | 2006-06-28 | 2012-07-18 | ハリソン東芝ライティング株式会社 | Organic EL device |
| DE102009046755A1 (en) * | 2009-11-17 | 2011-05-26 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Organic photoelectric device |
-
2011
- 2011-07-12 DE DE102011079014A patent/DE102011079014A1/en not_active Withdrawn
-
2012
- 2012-07-12 WO PCT/EP2012/063662 patent/WO2013007781A1/en active Application Filing
- 2012-07-12 CN CN201280034376.3A patent/CN103718323B/en not_active Expired - Fee Related
- 2012-07-12 EP EP12740925.8A patent/EP2732483A1/en not_active Ceased
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100568523C (en) * | 2005-12-08 | 2009-12-09 | 索尼株式会社 | Display unit |
| CN101517771A (en) * | 2006-07-28 | 2009-08-26 | 法国圣-戈班玻璃公司 | Encapsulated electroluminescent device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103718323A (en) | 2014-04-09 |
| WO2013007781A1 (en) | 2013-01-17 |
| EP2732483A1 (en) | 2014-05-21 |
| DE102011079014A1 (en) | 2013-01-17 |
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