CN103718323A - Light module with reduced surface area requirements - Google Patents
Light module with reduced surface area requirements Download PDFInfo
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- CN103718323A CN103718323A CN201280034376.3A CN201280034376A CN103718323A CN 103718323 A CN103718323 A CN 103718323A CN 201280034376 A CN201280034376 A CN 201280034376A CN 103718323 A CN103718323 A CN 103718323A
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- light emitting
- active element
- emitting module
- base material
- light
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- 239000004020 conductor Substances 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims description 48
- 238000007789 sealing Methods 0.000 claims description 18
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 239000011521 glass Substances 0.000 claims description 8
- 239000004033 plastic Substances 0.000 claims description 5
- 229920003023 plastic Polymers 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 230000007246 mechanism Effects 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 abstract 3
- 239000000758 substrate Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000000875 corresponding effect Effects 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 235000008429 bread Nutrition 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
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- 239000002096 quantum dot Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/82—Interconnections, e.g. terminals
Abstract
In a light module (1) with a planar active element (11) and a planar carrier element (10), with a surface on which the active element (11) is arranged, the carrier element (10) having a protruding area relative to the active element (11), encapsulation means (21) laterally enclosing the active element (11) are provided in the protruding area. Located outside of the encapsulation means (21) are electrical terminals (30), configured as conductors, for supplying power to the active element (11), said conductors being arranged perpendicularly to the plane of the active element (11) and extending at least partially on the outer periphery of the encapsulation means (21).
Description
The present invention relates to according to the light emitting module of the preamble of claim 1, it has the tabular luminous active element being arranged on carrier element.This active element can be especially OLED (Organic Light Emitting Diode) structure or QLED (light emitting diode with quantum dots) structure.
The research that can replace because of the performance of its improvement the new type light source of conventional light source (as incandescent lamp or fluorescent lamp) has obtained far-reaching progress in the near future.At this, except being the classical light-emitting diode (LED) of point source of light substantially, the focus that OLED or QLED especially pay close attention to, because can the structure based on such realize novel face illuminating part.As having the planar luminous body of comparing moderate optical density with classical LED, OLED or QLED are ideally suited for manufacturing face diffused light source.The application possibility that can be used for this class light source is very diversified, thereby in the past few years, has produced significant progress in this field.Because its structure, OLED or QLED have the performance of so-called Lambertian emitter, under any reflection angle, all have constant optical density.Correspondingly, it is very well applicable to form large-area light source.
OLED or QLED are current driving elements.Corresponding therewith, it is vital that the uniform current in light-emitting area distributes for obtaining evenly known light output.The needed transparency electrode being at least arranged in a side of OLED structure or QLED structure has limited described uniformity.Transparency electrode conventionally based on transparent conductive oxide (TCO) or as thin as a wafer metal level form.But because the conductive capability of these materials is not enough, therefore uniformity is restricted.
Above-mentioned restriction causes the maximum of OLED surface illuminator or QLED surface illuminator can obtain area being restricted.In addition, in order to be that light-emitting area is for induced current, need to around electric conductor.In execution mode known to so far, described electric conductor consists of other printed conductor mostly consisting of metal foil film opaque but that conductivity is strong.They form the not luminous wide frame around light-emitting area, as shown in Figure 4.
Fig. 4 shows the theory structure of OLED as known from the prior art, planar or QLED planar light emitting 100 with vertical view.Reference numeral 110 indicates carrier substrate at this, and it generally consists of glass, overlay or similar material.On carrier substrate 110, be provided with active OLED structure or QLED structure 111, it supplies induced current by anode terminal 112 and cathode terminal 113.The connection of terminal 112 and 113 on active surperficial 111 realizes by printed conductor 112a and 113a, and printed conductor bridge joint is edge and seals 121 forms and surround active surperficial 111 region.Sealing of generally can consisting of glass, plastic film or similar material 121 avoided ectocine for the protection of active structure 111.Especially thus avoid moisture and oxygen to enter this structure 111.This seals 121 printed conductor 112a and 113a now conventionally by ITO or alternatively consist of FTO, ZnO, PEDOT or similar material bridge joint.
As what can see from the view of Fig. 4, carrier element 110 has protuberance in the neighboring of active face 111, and this protuberance is used to arrange the terminal 112 and 113 that is planar printed conductor form.Now, protuberance need to have certain width to can guarantee that terminal 112,113 has enough conductive capabilities, finally needs such conductive capability to come fully for active layer 111 is for induced current.But this causes again active layer 111(to install 100 actual luminous zone) by non-luminous frame, surrounded.If a plurality of such light-emitting components 110 will be combined into a large-area device mutually, adversely have influence on thus the general impression of obtained light-emitting area.
Therefore, the present invention is based on following task, propose a kind ofly for realizing the especially novel solution of the light emitting module based on OLED or QLED, at this, described shortcoming is overcome.
This task will complete by having the light emitting module of claim 1 feature.Favourable improvement project of the present invention is the theme of dependent claims.
The core conception of solution of the present invention is with novel manner, to arrange the power terminal of the active element power supply that is used to light emitting module.The same with the past, these terminals consist of printed conductor, but from now on, and this printed conductor is arranged perpendicular to the plane of active element according to the present invention and on side surrounds the outer peripheral face of encasement medium of this active element, extended at least in part.
According to the present invention, a kind of light emitting module is correspondingly proposed, it has:
-tabular active element,
-thering is the tabular carrier element on surface, described active element is arranged on this surface, and wherein this carrier element has the region of protruding with respect to this active element,
-be positioned at the region of this protrusion and the encasement medium of this active element of flanked,
-be positioned at the power terminal that is printed conductor form outside this encasement medium,
-between this carrier element and encasement medium and by the conduction bindiny mechanism of this terminal and active element interconnection,
Wherein, according to the present invention, the described printed conductor that forms power terminal is arranged as perpendicular to the plane of this active element and on the outer peripheral face of this encasement medium, extends at least in part.
As described in detail below with reference to a plurality of execution mode of the present invention, can be by embodiments of the present invention and especially by novel power terminal arrangement form, obtain significantly dwindling of the needed marginal zone of light emitting module.And, also need to which is provided with at least slightly the protruding of base material of OLED structure or QLED structure, with realize around this active layer of sealing, adequately protect.But solution of the present invention is compared with the solution so far and is allowed significantly reduced protrusion degree, thereby finally can dwindle non-luminous frame as far as possible.In single light-emitting component, considered this advantage, yet it especially also has according to playing a role in the device of a plurality of light emitting modules of the present invention, this be because now not light-emitting area proportion significantly reduce, thereby can the uniformly light-emitting on whole of this device be improved.
Preferably with the opposed active element of carrier element side on arrange the tabular base material of sealing, this is sealed base material and also protects and the opposed active element of this base material side.The power terminal consisting of printed conductor is now preferably disposed on the outer peripheral face of sealing base material.Described terminal especially can extend on the whole height of sealing base material, even likely makes printed conductor not only extend the altitude range that this seals base material here, and extends the altitude range of this carrier element.In other words, under any circumstance all guaranteed to form enough width of the printed conductor of power terminal, this is especially correlated with regard to needed active element power supply.
Side encasement medium for example can by around the base material frame of sealing form.As its alternative, also can expect, encasement medium is by carrier element with seal the adhesive material of onset between base material and form.To seal base material itself can be now lighttight or also can consist of light transmissive material, for example, glass or plastics, consist of.The in the situation that of printing opacity execution mode, correspondingly can send light towards the both sides of this active element.The general carrier element that forms the main light gasing surface of this device preferably also consists of light transmissive material especially glass or plastics.
This active element preferably consists of OLED structure or QLED structure as mentioned above.
An advantageous applications example of solution of the present invention is a kind of planar illuminating device, and it is comprised of a plurality of light emitting modules in series or in parallel with each other.The conduction connection of light emitting module now especially also can realize by the power terminal of lateral arrangement.Also by terminal lateral arrangement according to the present invention, obtain the simple interconnective advantage of light emitting module.
Below with reference to accompanying drawing in detail the present invention is described in detail, wherein:
Fig. 1 a and Fig. 1 b are the views of the first execution mode of light emitting module of the present invention;
Fig. 2 a and Fig. 2 b are the views of the second execution mode of light emitting module of the present invention;
Fig. 3 a and Fig. 3 b are the views of the 3rd execution mode of light emitting module of the present invention;
Fig. 4 is according to the light emitting module of known prior art.
Because conductive capability is limited there is voltage drop at least one electrode of OLED structure or QLED structure as mentioned above, and then occur that inhomogeneous optical density distributes.In order effectively to suppress this effect as far as possible, need to equably electric current be entered to light-emitting area from margin guide.In order to improve CURRENT DISTRIBUTION, at active element, arrange the printed conductor of the reinforcement of allowable current supply around.But because the needed conductive capability of terminal, thus adopt metal and thereby opaque printed conductor, it causes the non-luminous frame around light-emitting area.And, should protect this active structure to avoid ectocine, thereby according to standard configuration encapsulating structure.Encapsulating structure is sealed to realize by edge according to current prior art, thereby has stipulated to realize sealing sealing of base material and carrier substrate around the region of active face.Such measure has limited the possibility that a plurality of light-emitting component wirings is connected into larger uniformly light-emitting face, and this is that so not light-emitting zone has weakened the general impression to light-emitting area because independently leaving in principle not light-emitting zone between light-emitting area.
But now,, by make lead-in wire displacement to the vertical edge of encasement medium according to the present invention, realized dwindling at the cross section of the not light-emitting area of OLED structure or QLED structure periphery.Meanwhile, by this measure, realize the simple directly wiring of a plurality of independently light-emitting components and connected into a larger light-emitting area.Below in detail conception of the present invention will be described in detail in conjunction with the execution mode of Fig. 1 to Fig. 3.
First Fig. 1 a and Fig. 1 b show the first execution mode of light emitting module 1 of the present invention with vertical view and cutaway view, it is still very similar to module 100 that know from prior art and as shown in Figure 4.In other words arrange the tabular active element 11 that is OLED or QLED form, or on the preferred planar carrier element being formed by glass or overlay or carrier substrate 10.Whether cover with the encapsulated base material 12 of opposed active face 11 1 side of carrier substrate 10, sealing base material can be luminous or only luminous and for example, consisted of light transmissive material (glass or plastics) or light-proof material in one direction to both sides according to expecting.First the main task of sealing base material 20 is that ectocine is avoided at the back side of protection active layer 11, especially stops moisture, oxygen or similarly invades.
But for also needing side direction, general protection seals active face 11.At this, its by around frame 21 form.At this, frame 21 preferably with seal base material 20 one and be connected, be the part of sealing base material 20, but or also can be formed by independent member.Therefore,, with the recess that base material 20 forms general square shape of sealing of frame 21, active element 11 is placed in this recess.By carrier substrate 10 and with frame 21 seal base material 20, active element 11 is correspondingly encapsulated from four sides completely in other words.
For to active element 11 power supply, also need cathode terminal and anode terminal, they must possess enough conductive capabilities and correspondingly with the form of planar printed conductor, form.In the embodiment shown, Fig. 1 b cutaway view shows the anode terminal 30 of side, and it is arranged on two long sides opposite each other of light emitting module 1.Two cathode terminals are arranged on two other long side of module 1 and correspondingly in Fig. 1 b, can't see.Connection between terminal 30 and active element 11 by can be located at carrier substrate 10 and around frame 21 between and the lead-in wire 13a that formed by ITO, FTO, ZnO, PDOT or similar material realize.Connection between terminal 30 and lead-in wire 13a realizes by conducting resinl and/or by bonding method or method for brazing.
Now, the feature of solution of the present invention is, terminal 30 or form with the form of planar printed conductor, but be not the plane that is parallel to active element 11 now, but be vertically orientated with it and be arranged on the outer peripheral face of sealing base material 20 or frame 21.Although compare terminal 30 with the solution of Fig. 4, there is essentially identical area, correspondingly do not need the region of the further protrusion of carrier substrate 10, thereby non-luminous thickness around frame is substantially confined to edge and seals 21 size.Because such frame generally has the width of about 1mm to 2mm of counting from the outward flange of carrier substrate 10, therefore compare with the solution of Fig. 4, can obtain the especially not remarkable minimizing of the area requirements of light-emitting zone.
It should be noted that shown in figure in, enlarge markedly and show the thickness of active element 11 to conception of the present invention is shown.And in fact, with carrier substrate 10 and/or seal base material 20 and compare, the thickness of OLED structure or QLED structure 11 as thin as a wafer.And following situation is applicable to according to the execution mode of Fig. 1 a and Fig. 1 b and other execution mode of the present invention, that is, the present invention is not limited to cuboid light emitting module.Instead, this light emitting module can have any shape, especially also can be polygon-shaped or Rotational Symmetry shape or ellipse.But especially preferably allow that a plurality of such light emitting modules combine the structure that forms a gapless larger light-emitting area with the form of face.
According to the modification of Fig. 2 a and Fig. 2 b, can obtain non-luminous further improvement around edge and dwindle in other words, here, identical parts are with identical Reference numeral.In the second execution mode, utilization in the first embodiment around the edge of frame 21 seal by so-called whole bread envelope and substitute.
In the case, no longer arrange now protection active element 11 lateral circle surface around frame 21.Replace, sealing by adhesive material on active element 11 outer peripheral faces realizes, and first this adhesive material is used to three planar structures, is carrier substrate 10, active element 11 and seals base material 20 and be connected with each other.When these three elements 10,11 and 20 whens assembling, glue is pressed into also side seal in the case in side face the region in and closes this active element 11.
In this modification, seal 20 needs of base material and protrude minimum degree with respect to active element 11 side direction, to realize sealing active element 11 comprehensively.In the region of the glue surrounding in side, be still provided with a plurality of lead-in wire 13a, its conduction having realized between active element 11 and terminal 30 connects.Terminal 30(is for giving the printed conductor of anode and cathodal closing) be still arranged in the outer peripheral face of sealing base material 20, but here, be no longer provided with from now on around frame 21.Fig. 1 a and Fig. 1 b are contrasted with Fig. 2 a and Fig. 2 b and directly shown in this second execution mode and can further dwindle non-luminous fringe region.Especially can be by the remaining width reduction of fringe region to about 1mm or even less value.
Finally, in the 3rd modification of Fig. 3 a and Fig. 3 b, be similarly also provided with comprehensive encapsulating structure with Fig. 2 a and Fig. 2 b, here, the outer peripheral face of light emitting module 1 almost consists of terminal 30 or the terminal that is positioned on two other side completely.These printed conductors 30 extend the whole altitude range of light emitting module 1 now, not only extend the altitude range of sealing base material 20, and extend the altitude range of carrier substrate 10.Because printed conductor 30 has the area of increase, therefore can obtain thus further better electric current supply.In addition, can compare the thickness that reduces lead wire with above-mentioned execution mode.
Printed conductor 30 is slightly charged into carrier substrate 10 and is sealed in the gap between base material 20 in the marginal zone of active element 11.For the conducting between convenient contact-making surface 30 and lead-in wire 13a, preferably stipulate, seal base material 20 slightly to cut sth. askew in marginal zone, reduce ground outwardly and form.The area requirements obtaining for not luminous frame corresponds essentially to the area requirements of the second execution mode.The formation of side contacts face can alternatively also realize by print process or apportion design in the case, the simply and cheaply flexible program that this has realized that OLED or QLED surface illuminator manufacture.
The side direction of this terminal is arranged vertically and also facilitates as mentioned above the process that a plurality of corresponding light emitting modules is connected into a planar luminous element.Now especially can be by settle corresponding contact pad to come the direct wiring of convenient a plurality of individual components to connect at structural edge place.This module now not only can be connected, and can be also in parallel,, especially obtains significantly reducing the not advantage of light-emitting area proportion and gap here.Correspondingly, also can in large area, obtain the light output of uniformity.
Claims (11)
1. a light emitting module (1), it has:
Tabular active element (11),
The tabular carrier element (10) with surface, this active element (11) is disposed on described surface, and wherein said carrier element (10) has raised zones with respect to described active element (11),
Be positioned at the encasement medium (21) of active element (11) described in described raised zones and flanked,
Be positioned at the outer power supply for described active element (11) of described encasement medium (21) and be the power terminal (30) of printed conductor form, and
Be positioned at the conduction bindiny mechanism (12a, 13a) with described active element (11) interconnection between described carrier element (10) and described encasement medium (21) and by described terminal (30),
It is characterized in that, the printed conductor that forms described power terminal (30) is arranged as perpendicular to the plane of described active element (11) and on the outer peripheral face of this encasement medium (21), extends at least in part.
2. light emitting module according to claim 1, is characterized in that, in the side with the opposed described active element of described carrier element (10) (11), is provided with the tabular base material (20) of sealing.
3. light emitting module according to claim 2, is characterized in that, described in the described printed conductor that forms described power terminal (30) is arranged in, seals on the outer peripheral face of base material (20).
4. light emitting module according to claim 3, is characterized in that, described in the described printed conductor that forms described power terminal (30) extends, seals on the whole height of base material (20).
5. light emitting module according to claim 4, is characterized in that, seals on the height of base material (20), and extend on the height of described carrier element (10) described in the printed conductor that forms described power terminal (30) not only extends.
6. according to the light emitting module described in any one in claim 2 to 5, it is characterized in that, the encasement medium of side (21) by described seal base material (20) around frame form.
7. according to the light emitting module described in any one in claim 2 to 5, it is characterized in that, the encasement medium of side by described carrier element (10) and described in seal the adhesive material that works between base material (20) and form.
8. according to the light emitting module described in any one in claim 2 to 7, it is characterized in that, described in seal base material (20) and formed by light transmissive material especially glass or plastics.
9. according to the light emitting module one of aforementioned claim Suo Shu, it is characterized in that, described active element (11) consists of OLED structure or QLED structure.
10. according to the light emitting module one of aforementioned claim Suo Shu, it is characterized in that, described carrier element (10) consists of light transmissive material especially glass or plastics.
11. 1 kinds of planar illuminating devices, described planar illuminating device is comprised of according to the light emitting module one of aforementioned claim Suo Shu (1) a plurality of, and wherein these light emitting modules (1) are in series or in parallel with each other by described power terminal.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102011079014.4 | 2011-07-12 | ||
| DE102011079014A DE102011079014A1 (en) | 2011-07-12 | 2011-07-12 | Light module with reduced space requirement |
| PCT/EP2012/063662 WO2013007781A1 (en) | 2011-07-12 | 2012-07-12 | Light module with reduced surface area requirements |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103718323A true CN103718323A (en) | 2014-04-09 |
| CN103718323B CN103718323B (en) | 2016-08-31 |
Family
ID=46598482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280034376.3A Expired - Fee Related CN103718323B (en) | 2011-07-12 | 2012-07-12 | There is the light emitting module of the area requirements of reduction |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP2732483A1 (en) |
| CN (1) | CN103718323B (en) |
| DE (1) | DE102011079014A1 (en) |
| WO (1) | WO2013007781A1 (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3071877B1 (en) | 2013-11-18 | 2018-03-07 | emdedesign GmbH | Lamp comprising at least one oled lighting means |
| DE102014110969A1 (en) * | 2014-08-01 | 2016-02-04 | Osram Oled Gmbh | Organic component and method for producing an organic component |
| DE102014116740A1 (en) | 2014-11-17 | 2016-05-19 | Emdedesign Gmbh | Luminaire comprising at least two OLED bulbs |
| WO2021122495A1 (en) | 2019-12-16 | 2021-06-24 | Société des Produits Nestlé SA | Beverage machine with visible beverage management |
| WO2021122492A1 (en) | 2019-12-16 | 2021-06-24 | Société des Produits Nestlé SA | Fluid line external to outside beverage machine housing |
| CN114745993A (en) | 2019-12-16 | 2022-07-12 | 雀巢产品有限公司 | Beverage machine with simple water drive |
| WO2021122497A1 (en) | 2019-12-16 | 2021-06-24 | Société des Produits Nestlé SA | Beverage machine with separable beverage processing unit |
| CN114845608A (en) | 2019-12-16 | 2022-08-02 | 雀巢产品有限公司 | Single hand accessible beverage machine |
| JP2023505260A (en) | 2019-12-16 | 2023-02-08 | ソシエテ・デ・プロデュイ・ネスレ・エス・アー | Beverage machine with offset actuator |
| US20230027124A1 (en) | 2019-12-16 | 2023-01-26 | Societe Des Produits Nestle S.A. | Beverage machine with beverage collector |
| CA3163643A1 (en) | 2019-12-16 | 2021-06-24 | Societe Des Produits Nestle Sa | Beverage machine with actuated water supply valve |
| US20230036537A1 (en) | 2019-12-16 | 2023-02-02 | Societe Des Produits Nestle S.A. | Beverage machine with separable fluid module |
| WO2021122498A1 (en) | 2019-12-16 | 2021-06-24 | Société des Produits Nestlé SA | Thermally unconditionned beverage preparation machine |
| CN115209770A (en) | 2020-03-24 | 2022-10-18 | 雀巢产品有限公司 | Beverage preparation machine with convenient power management |
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| JP2003317940A (en) * | 2002-04-25 | 2003-11-07 | Harison Toshiba Lighting Corp | Organic electroluminescence device |
| CN1864282A (en) * | 2003-06-20 | 2006-11-15 | 肖特股份公司 | Organic light emitting diode |
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| JP2008010244A (en) * | 2006-06-28 | 2008-01-17 | Harison Toshiba Lighting Corp | Organic el element |
| CN101517771A (en) * | 2006-07-28 | 2009-08-26 | 法国圣-戈班玻璃公司 | Encapsulated electroluminescent device |
| CN100568523C (en) * | 2005-12-08 | 2009-12-09 | 索尼株式会社 | Display unit |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6538375B1 (en) * | 2000-08-17 | 2003-03-25 | General Electric Company | Oled fiber light source |
| JP2002175877A (en) * | 2000-09-27 | 2002-06-21 | Seiko Epson Corp | Organic electroluminescence device, manufacturing method of the organic electroluminescence device, and electronic equipment |
| DE102009046755A1 (en) * | 2009-11-17 | 2011-05-26 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Organic photoelectric device |
-
2011
- 2011-07-12 DE DE102011079014A patent/DE102011079014A1/en not_active Withdrawn
-
2012
- 2012-07-12 CN CN201280034376.3A patent/CN103718323B/en not_active Expired - Fee Related
- 2012-07-12 WO PCT/EP2012/063662 patent/WO2013007781A1/en active Application Filing
- 2012-07-12 EP EP12740925.8A patent/EP2732483A1/en not_active Ceased
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003317940A (en) * | 2002-04-25 | 2003-11-07 | Harison Toshiba Lighting Corp | Organic electroluminescence device |
| CN1864282A (en) * | 2003-06-20 | 2006-11-15 | 肖特股份公司 | Organic light emitting diode |
| CN100568523C (en) * | 2005-12-08 | 2009-12-09 | 索尼株式会社 | Display unit |
| JP2007329313A (en) * | 2006-06-08 | 2007-12-20 | Matsushita Electric Works Ltd | Luminous panel system |
| JP2008010244A (en) * | 2006-06-28 | 2008-01-17 | Harison Toshiba Lighting Corp | Organic el element |
| CN101517771A (en) * | 2006-07-28 | 2009-08-26 | 法国圣-戈班玻璃公司 | Encapsulated electroluminescent device |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102011079014A1 (en) | 2013-01-17 |
| CN103718323B (en) | 2016-08-31 |
| WO2013007781A1 (en) | 2013-01-17 |
| EP2732483A1 (en) | 2014-05-21 |
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