CN103716514A - Image module and manufacturing method thereof - Google Patents
Image module and manufacturing method thereof Download PDFInfo
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- CN103716514A CN103716514A CN201210371634.9A CN201210371634A CN103716514A CN 103716514 A CN103716514 A CN 103716514A CN 201210371634 A CN201210371634 A CN 201210371634A CN 103716514 A CN103716514 A CN 103716514A
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- image sensing
- circuit board
- packaging part
- opening
- image
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Abstract
The invention discloses an image module and a manufacturing method thereof. The image module comprises a lens assembly, an image sensing package part and a circuit board. The circuit board is provided with an opening. The lens assembly is arranged on the circuit board and is arranged at the position corresponding to the opening. The image sensing package part is arranged on the circuit board, and the bottom of the image sensing package part is correspondingly inserted into the opening. The manufacturing method of the image module comprises the steps that the circuit board with the opening is provided and formed; a number of solder balls of an image sensing package part of a raw material are removed to form the image sensing package part whose solder balls are removed; the image sensing package part is corresponding to the opening; and by using a surface adhesion mode, the image sensing package part is fixedly connected with the circuit board, and the lens assembly is arranged on the circuit board.
Description
Technical field
The present invention relates to a kind of module and manufacture method thereof, particularly relate to a kind of image module and manufacture method thereof.
Background technology
The epoch of science and technology prosperity now, most portable electronic product, as mobile phone or panel computer, mostly dispose image module, and the trend of the development of portable electronic product is towards light, thin, short, little, therefore the image module of its configuration also needs corresponding slimming, to meet the demand of current product slimming.
Edge this, refer to Fig. 6 A and Fig. 6 B, once having dealer to develop a kind of encapsulating structure (dealer is called Neo Pac package) is mainly to form a raw-material image sensing packaging part 2 ' by a glass substrate 21 ' and an image sensing chip 22 ' encapsulation, it,, by image sensing chip 22 ' being packaged in to the bottom of glass substrate 21 ', can provide excellent small size package dimension.Yet, the bottom of the glass substrate 21 ' of raw-material image sensing packaging part 2 ' is formed around with a plurality of tin balls 25 ', if according to traditional surface mounting technology (SMT) mode, by its tin ball 25 ', be electrically engaged in the surface of circuit board 3 ', will produce the height 1H of tin ball, and camera lens 12 ' end face to the height H of circuit board 3 ' bottom surface is increased, be unfavorable for the demand of product slimming.
So the improving of the above-mentioned defect of inventor's thoughts, is that spy concentrates on studies and coordinates the utilization of scientific principle, finally propose a kind of reasonable in design and effectively improve the present invention of above-mentioned defect.
Summary of the invention
Main purpose of the present invention is for a kind of image module and manufacture method thereof are provided, and can effectively reduce the total height of image module, reaches the demand of slimming, and reduces the bad consume producing because of extra packaging technology.In order to reach above-mentioned object, the present invention discloses a kind of image module, and this image module comprises: a lens assembly; One image sensing packaging part; An and circuit board, this circuit board offers an opening, this lens assembly is installed in this circuit board and corresponding to this aperture position, this image sensing packaging part is arranged at this circuit board, and the bottom correspondence of this image sensing envelope ZH piece installing is placed in this opening, and this image sensing packaging part is between this lens assembly and this circuit board.
For reaching above-mentioned purpose, the present invention discloses a kind of manufacture method of image module, and this manufacture method comprises the following steps: a circuit board is provided, and forms one and be opened on this circuit board; Remove a plurality of tin balls of a raw-material image sensing packaging part, to form the image sensing packaging part removing after these tin balls; This image sensing packaging part, corresponding to this opening, and is utilized to surface mount mode, this image sensing packaging part is fixed in to this circuit board; And installing one lens assembly is on this circuit board.
Compared to prior art, the present invention utilizes raw-material image sensing packaging part (Neo Pac package), remove after its tin ball, engage by surface mount mode with the circuit board that is formed with an opening, make the mutual conducting of its metal gasket, reach lower module height, replace prior art and be all and stacking on circuit board raw-material image sensing packaging part and lens assembly are set, thereby produce stacking height.Therefore, the present invention can effectively reduce module total height, to meet the demand of slimming, and is engaged in circuit board after directly utilizing raw-material image sensing packaging part to remove its tin ball, can reduce the bad consume producing because of extra packaging technology.
In order further to understand the present invention, reach technology, method and the effect that set object is taked, refer to following relevant detailed description of the present invention, graphic, believe object of the present invention, feature and feature, when being goed deep into thus and concrete understanding, yet the appended graphic schematic diagram that is simplification only provide with reference to and explanation use, be not used for to the present invention's limitr in addition.
Accompanying drawing explanation
Fig. 1 is the schematic perspective view of image module of the present invention.
Fig. 2 is the perspective exploded view of image module of the present invention.
Fig. 3 is another perspective exploded view of image module of the present invention.
Fig. 4 A is the generalized section of image module of the present invention.
Fig. 4 B is the generalized section that amplify the part of the circle part shown in Fig. 4 A.
Fig. 5 is the manufacture method flow chart of image module of the present invention.
Fig. 6 A is the generalized section of prior art.
Fig. 6 B is the generalized section that amplify the part of the circle part shown in Fig. 6 A.
[main element symbol description]
(prior art)
Lens assembly 1 '
Shell 11 '
Camera lens 12 '
Raw-material image sensing packaging part 2 '
Glass substrate 21 '
Image sensing chip 22 '
The first metal gasket 23 '
Scolder 24 '
Tin ball 25 '
Circuit board 3 '
The second metal gasket 32 '
Height H
The height 1H of tin ball
(the present invention)
Shell 11
Image sensing packaging part 2
Image sensing chip 22
The first metal gasket 23
The second metal gasket 32
Tin cream 6
Height h
Embodiment
Refer to Fig. 1 to Fig. 5.The present invention is a kind of image module, and Fig. 1 is shown as the schematic perspective view of image module of the present invention.As shown in Figures 2 and 3, image module of the present invention includes a lens assembly 1, an image sensing packaging part 2, a circuit board 3, a passive device 4 and a control element 5.
Specifically, image sensing packaging part 2 includes a glass substrate 21 and an image sensing chip 22.Image sensing chip 22 is located at the bottom of this glass substrate 21 and is electrically connected at this glass substrate 21.Thin portion, the bottom of glass substrate 21 is provided with a plurality of the first metal gaskets 23, and these first metal gaskets 23 are surrounded on this image sensing chip 22.The surface of circuit board 3 is provided with a plurality of the second metal gaskets 32, and these second metal gaskets 32 are surrounded on opening 31 peripheries of this circuit board 3.These first metal gaskets 23 and the corresponding setting of these the second metal gaskets 32, be electrically connected with these second metal gaskets 32 for these first metal gaskets 23.Specifically, image sensing packaging part 2 removes its tin ball 25 ' by a raw-material image sensing packaging part 2 ' (Neo Pac package, as Fig. 6 A) and forms.
As shown in Fig. 4 A and Fig. 4 B, the bottom of glass substrate 21 is electrically connected at the surface of circuit board 3, and image sensing chip 22 is inserted the opening 31 of circuit board 3 downwards.In more detail, the surface area of glass substrate 21 is slightly larger than opening 31, the surface area of image sensing chip 22 is slightly less than opening 31, make glass substrate 21 be positioned at these second metal gaskets 32 of opening 31 peripheries by being positioned at these first metal gaskets, 23 electric connections of its bottom peripheral edge, and and then submerged in opening 31 in the bottom of image sensing chip 22.Therefore, camera lens 12 end faces can be less than the height H of prior art to the height h of circuit board 3 bottom surfaces.In other words, by removing the image sensing packaging part 2 of tin ball 25 ', and be engaged in the circuit board 3 of image sensing chip 22 position hollow outs, directly utilize surface mounting technology (SMT) to do the action engaging, make the mutual conducting of first, second metal gasket 23,32, can effectively reduce in prior art, the height 1H(of the tin ball that the surface that raw-material image sensing packaging part 2 ' is engaged in to circuit board 3 ' by its tin ball 25 ' produces is as Fig. 6 B).
Referring to Fig. 5, is the manufacture method of a kind of image module of the present invention, and this manufacture method comprises the following steps.
Step 1 a: circuit board is provided, and forms one and be opened on this circuit board.
As shown in Figures 2 and 3, circuit board 3 is formed with an opening 31, and circuit board 3 is a Rigid Flex.
Step 2: remove a plurality of tin balls of a raw-material image sensing packaging part (Neo Pac package), and form the image sensing packaging part removing after these tin balls.
As shown in Fig. 6 A and Fig. 6 B, raw-material image sensing packaging part 2 ' is encapsulated and is formed by a glass substrate 21 ' and an image sensing chip 22 '.Image sensing chip 22 ' is packaged in the bottom of glass substrate 21 ' and is electrically connected at this glass substrate 21 ' by scolder 24 '.And the bottom of glass substrate 21 ' is formed around with a plurality of tin balls 25.Therefore, before raw-material image sensing packaging part 2 ' carries out surface mount, first remove its tin ball 25 ', raw-material image sensing packaging part 2 is formed remove an image sensing packaging part 2(after these tin balls 25 ' as Fig. 4 A).
Step 3: this image sensing packaging part, corresponding to this opening, and is utilized to surface mount mode, this image sensing packaging part is fixed in to this circuit board.
As shown in Fig. 4 A and Fig. 4 B, the opening 31 of circuit board 3 is less than the surface area of glass substrate 21, and be greater than the surface area of image sensing chip 22, the bottom correspondence of the image sensing chip of image sensing packaging part 2 22 can be placed in the opening 31 of circuit board 3, and the bottom of glass substrate 21 is formed around with a plurality of the first metal gaskets 23, the surface of circuit board 3 is surrounded on opening 31 and is formed with a plurality of the second metal gaskets 32, utilize surface mount mode, make these first metal gaskets 23 and these the second metal gaskets 32 pass through tin cream 6 and form electric connection.
Step 4: installing one lens assembly is on this circuit board.
As shown in Figures 2 and 3, lens assembly 1 is installed on circuit board 3, and the corresponding image sensing packaging part 2 that is positioned at opening 31 places.Specifically, lens assembly 1 includes a shell 11 and a camera lens 12.Camera lens 12 is arranged in shell 11 and corresponding glass substrate 21, to allow light pass to the sensing area of image sensing chip 22 via camera lens 12 and glass substrate 21.
In sum, according to a kind of image module of the present invention and manufacture method thereof, utilize raw-material image sensing packaging part (Neo Pac package), and remove after its tin ball, with general existing process equipment and surface mounting technology directly with at the circuit board of image sensing chip position hollow out, do the action engaging, replacement tradition is stacking raw-material image sensing packaging part and the lens assembly of arranging on circuit board.Therefore, the present invention can effectively reduce the height of image module, to meet the demand of product slimming.And, only need to use existing process equipment, can save equipment investment cost.In addition, the Neo Pac package of directly usining produces as raw material, without encapsulation again, can reduce the bad consume producing because of extra packaging technology.
Yet the foregoing is only the preferred embodiments of the present invention, be non-ly intended to limit to scope of patent protection of the present invention, therefore such as use the equivalence techniques that specification of the present invention and graphic content are done to change, be all contained in scope of the present invention, close and give Chen Ming.
Claims (13)
1. an image module, is characterized in that, comprising:
One lens assembly;
One image sensing packaging part; And
One circuit board, described circuit board offers an opening, described lens assembly is installed in described circuit board and corresponding to described aperture position, described image sensing packaging part is arranged at described circuit board, and the bottom correspondence of described image sensing packaging part is placed in described opening, described image sensing packaging part is between described lens assembly and described circuit board.
2. image module according to claim 1, is characterized in that, described circuit board is a Rigid Flex.
3. image module according to claim 1, it is characterized in that, described image sensing packaging part includes a glass substrate and an image sensing chip, and described image sensing chip is arranged at the bottom of described glass substrate and is electrically connected at described glass substrate.
4. image module according to claim 3, is characterized in that, the bottom of described glass substrate is electrically connected at the surface of described circuit board, and the bottom of described image sensing chip is placed in the described opening of described circuit board.
5. image module according to claim 4, is characterized in that, the surface area of described glass substrate is greater than described opening, and the surface area of described image sensing chip is less than described opening.
6. image module according to claim 5, it is characterized in that, the bottom of described glass substrate is provided with a plurality of the first metal gaskets, described the first metal gasket is surrounded on described image sensing chip, the surface of described circuit board is provided with a plurality of the second metal gaskets, described the second metal gasket is surrounded on the periphery of described opening, described the first metal gasket and the corresponding setting of described the second metal gasket, and described the first metal gasket and described the second metal gasket are electrically connected.
7. a manufacture method for image module, is characterized in that, comprises the following steps:
One circuit board is provided, and forms an opening on described circuit board;
Remove a plurality of tin balls of a raw-material image sensing packaging part, to form, remove institute
State the image sensing packaging part after tin ball;
Described image sensing packaging part, corresponding to described opening, and is utilized to surface mount mode, described image sensing packaging part is fixed in to described circuit board; And
On described circuit board, install a lens assembly.
8. the manufacture method of image module according to claim 7, is characterized in that, described circuit board is a Rigid Flex.
9. the manufacture method of image module according to claim 7, it is characterized in that, described image sensing packaging part is encapsulated and is formed by a glass substrate and an image sensing chip, and described image sensing chip is packaged in the bottom of described glass substrate and is electrically connected at described glass substrate.
10. the manufacture method of image module according to claim 9, it is characterized in that, step by described image sensing packaging part corresponding to described opening, comprises the described opening that further the bottom correspondence of the described image sensing chip of described image sensing packaging part is placed in to described circuit board.
The manufacture method of 11. image modules according to claim 9, is characterized in that, described opening is less than the surface area of described glass substrate, and described opening is greater than the surface area of described image sensing chip.
The manufacture method of 12. image modules according to claim 9, it is characterized in that, the bottom part ring of described glass substrate is formed with a plurality of the first metal gaskets around described image sensing chip, the surface of described circuit board is formed with a plurality of the second metal gaskets around described opening, and described the first metal gasket and the corresponding formation of described the second metal gasket.
The manufacture method of 13. image modules according to claim 12, it is characterized in that, utilize surface mount mode, described image sensing packaging part is fixed in to the step of described circuit board, comprise further described the first metal gasket and described the second metal gasket are formed to electric connection by tin cream.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210371634.9A CN103716514A (en) | 2012-09-28 | 2012-09-28 | Image module and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210371634.9A CN103716514A (en) | 2012-09-28 | 2012-09-28 | Image module and manufacturing method thereof |
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|---|---|
| CN103716514A true CN103716514A (en) | 2014-04-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210371634.9A Pending CN103716514A (en) | 2012-09-28 | 2012-09-28 | Image module and manufacturing method thereof |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW447091B (en) * | 2000-01-10 | 2001-07-21 | King Yuan Electronics Co Ltd | Packaged image sensor die structure and method of packaging the same |
| TW566067B (en) * | 2003-04-16 | 2003-12-11 | Hung-Ren Wang | Package method of CMOS/CCD image sensor |
| TWM252217U (en) * | 2003-07-30 | 2004-12-01 | Kingpak Tech Inc | Multi-chip image sensor module |
| TW200635034A (en) * | 2005-03-18 | 2006-10-01 | Exquisite Optical Technology Co Ltd | Image sensor module |
| TW200742008A (en) * | 2006-04-28 | 2007-11-01 | Optronics Technology Inc A | A packaging structure of flip chip camera module and its packaging method |
| TW200812362A (en) * | 2006-08-25 | 2008-03-01 | Primax Electronics Ltd | Camera module and assembling method thereof |
-
2012
- 2012-09-28 CN CN201210371634.9A patent/CN103716514A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW447091B (en) * | 2000-01-10 | 2001-07-21 | King Yuan Electronics Co Ltd | Packaged image sensor die structure and method of packaging the same |
| TW566067B (en) * | 2003-04-16 | 2003-12-11 | Hung-Ren Wang | Package method of CMOS/CCD image sensor |
| TWM252217U (en) * | 2003-07-30 | 2004-12-01 | Kingpak Tech Inc | Multi-chip image sensor module |
| TW200635034A (en) * | 2005-03-18 | 2006-10-01 | Exquisite Optical Technology Co Ltd | Image sensor module |
| TW200742008A (en) * | 2006-04-28 | 2007-11-01 | Optronics Technology Inc A | A packaging structure of flip chip camera module and its packaging method |
| TW200812362A (en) * | 2006-08-25 | 2008-03-01 | Primax Electronics Ltd | Camera module and assembling method thereof |
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Application publication date: 20140409 |