CN103682034B - Light emitting module and lens structure thereof - Google Patents
Light emitting module and lens structure thereof Download PDFInfo
- Publication number
- CN103682034B CN103682034B CN201210384233.7A CN201210384233A CN103682034B CN 103682034 B CN103682034 B CN 103682034B CN 201210384233 A CN201210384233 A CN 201210384233A CN 103682034 B CN103682034 B CN 103682034B
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- China
- Prior art keywords
- substrate
- light emitting
- emitting diode
- lens
- lens body
- Prior art date
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- 239000000758 substrate Substances 0.000 claims abstract description 73
- 239000002184 metal Substances 0.000 claims abstract description 34
- 238000010438 heat treatment Methods 0.000 description 19
- 238000000034 method Methods 0.000 description 19
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 8
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000003466 welding Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 2
- 241001222009 Beamys Species 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a light-emitting module and a lens structure thereof. The light emitting module comprises a substrate, a light emitting diode and a lens structure. The light emitting diode is arranged on the substrate. The lens structure comprises a lens body and a pair of metal supports. The metal support is arranged on two opposite sides of the lens body, so that the lens structure can be fixed on the substrate, and the lens body is positioned above the light-emitting diode.
Description
Technical field
The invention relates to a kind of light emitting module, and in particular to a kind of light emitting module with lens arrangement.
Background technology
The lighting angle of general light emitting diode is fixing (such as: be approximately about 120 degree); in order to meet the various different light emitting module demand for optical characteristics; manufacturer would generally just cover a secondary optical lens (SecondaryOpticalLens) on a light emitting diode, in order to adjust the light shape (IlluminationDistribution) that light emitting diode radiates.
In general, when assembling, light emitting diode can be arranged on substrate surface first with surface adhering technical (SurfaceMountTechnology) by manufacturer, and fixes light emitting diode through first time heat treatment process (such as: back welding process).When, after fixing light emitting diode, manufacturer can utilize mode for dispensing glue be arranged on substrate by secondary optical lens and cover light emitting diode, and fix secondary optical lens through second time heat treatment process (such as baking).
Owing to light emitting diode must be adhered with the scolding tin that fusing point is higher, its required heat treatment temperature is higher than the heat treatment temperature needed for secondary optical lens, the lens that general plastics are made are made to be easily deformed at such temperatures or damage, therefore, current technology there is no method and fixes light emitting diode and secondary optical lens merely with a heat treatment process.
From the foregoing, in existing technology, if being intended to installing light emitting diode and secondary optical lens, then inevitably need through twice heat treatment process, production cost can be increased far and away, thereby increases and it is possible to affect the optical characteristics of light emitting diode.
Summary of the invention
In view of this, a technical scheme of the present invention is to provide a kind of lens arrangement, and it is the number of times reducing the light emitting module heat treatment process required when assembling.
According to one embodiment of the present invention, a kind of lens arrangement is the light shape adjusting a light emitting diode, and this light emitting diode is disposed on a substrate, and this lens arrangement comprises a lens body and pair of metal support.Metal rack is disposed on the opposite sides of lens body, and lens arrangement can be made to be fixed on substrate, and makes lens body be positioned at the top of this light emitting diode.
Another technical scheme of the present invention is to provide a kind of light emitting module, and it only needs can be completed through a heat treatment process.
According to another embodiment of the present invention, a kind of light emitting module comprises a substrate, a light emitting diode and a lens arrangement.Light emitting diode is disposed on substrate.Lens arrangement comprises a lens body and pair of metal support.Metal rack is disposed on the opposite sides of lens body, and lens arrangement can be made to be fixed on substrate, and makes lens body be positioned at the top of light emitting diode.
In one or more embodiment of the present invention, each metal rack respectively comprises a support portion and a weld part.Support portion supports lens body.The connection support portion, one end of weld part and be positioned on this substrate, in order to be welded in substrate.
In one or more embodiment of the present invention, lens arrangement can further include multiple soldering-tin layer, and it is to be located between the weld part of metal rack and substrate.
In one or more embodiment of the present invention, each metal rack respectively comprises a support portion and an elastic latch.Support portion supports lens body.Elastic latch connects support portion, in order to clasp the side of substrate.
In one or more embodiment of the present invention, the shape of the both sides of elastic latch and substrate is agreed with mutually.
In one or more embodiment of the present invention, substrate has a relative end face and a bottom surface, and has relative both ends of the surface and be adjacent between end face and bottom surface.
In one or more embodiment of the present invention, each elastic latch comprises a junction and a fixed part.Connecting portion is in the end face of substrate.Fixed part is connected in connecting portion, and extends on portion bottom surface along the end face of substrate, lives the side of substrate with hook.
In the above-mentioned embodiment of the present invention, the available metal rack of lens arrangement is to be fixed on substrate, owing to the fusing point of metal rack is higher, useful scolding tin is adhered, therefore heat treatment process can be carried out at the same temperature with light emitting diode, therefore can fix light emitting diode and lens arrangement under heat treatment process once.It addition, in some embodiments of the present invention, also direct for the metal rack of lens arrangement hook through heat treatment process, therefore need not can be reduced the number of times of heat treatment process on substrate.
The above is only effect setting forth the problem that the present invention is intended to be solved, the technological means solving problem and generation thereof etc., and the detail of the present invention will be discussed in detail in embodiment below and relevant drawings.
Accompanying drawing explanation
For the above and other purpose of the present invention, feature, advantage and embodiment can be become apparent, the explanation of appended accompanying drawing is as follows:
Fig. 1 illustrates the profile of the light emitting module according to an embodiment of the present invention；
Fig. 2 illustrates the profile of the light emitting module according to another embodiment of the present invention；
Fig. 3 illustrates the metal rack part sectioned view of the light emitting module of Fig. 2.
[main element symbol description]
10: lens arrangement
100: lens body
102: lens hat body
104: lens periphery
200,210: metal rack
202,212: support portion
204: weld part
214: elastic latch
2142: connecting portion
2144: fixed part
2146: base plate
2148: sidewall
300: substrate
302: end face
304: end face
306: bottom surface
400: light emitting diode
402: metab
500: soldering-tin layer
600: scolding tin body
Detailed description of the invention
To disclose multiple embodiments of the present invention with accompanying drawing below, as clearly stated, the details in many practices will be explained in the following description.But, those of ordinary skill in the art are it should be appreciated that in some embodiments of the present invention, and the details in these practices not necessarily, is not therefore applied to limit the present invention.Additionally, for simplifying for the purpose of accompanying drawing, some known usual structures and element will illustrate in the accompanying drawings in the way of simply illustrating.
Fig. 1 illustrates the profile of the light emitting module according to an embodiment of the present invention.As it can be seen, the light emitting module of present embodiment can comprise lens arrangement 10, substrate 300 and a light emitting diode 400.Light emitting diode 400 is disposed on a substrate 300.Lens arrangement 10 is the light shape adjusting light emitting diode 400, and wherein lens arrangement 10 comprises a lens body 100 and pair of metal support 200.Metal rack 200 is disposed on the opposite sides of lens body 100, and lens arrangement 10 can be made to be fixed on substrate 300, and makes lens body 100 be positioned at the top of this light emitting diode 400.
Specifically, support can the living the bottom surface of lens body 100 and be fixed on substrate 300 of metal rack 200.Owing to metal rack 200 is to be formed by metal, can adhere with scolding tin, therefore heat treatment process can be carried out with light emitting diode 400 at the same temperature, therefore can jointly fix light emitting diode 400 and lens arrangement 10 under heat treatment process once.
In some embodiments, each metal rack 200 respectively comprises support portion 202 and a weld part 204.Support portion 202 supports lens body 100.The connection support portion, one end 202 of weld part 204 and be positioned on substrate 300, it may be used to be welded on substrate 300.
Specifically, light emitting module can further include multiple soldering-tin layer 500, and it is to be located between the weld part 204 of metal rack 200 and substrate 300, in order to be fixed on substrate 300 by the weld part 204 of metal rack 200.It addition, light emitting module also can comprise multiple scolding tin body 600, it is to be located between the metab 402 of light emitting diode 400 and substrate 300.Owing to light emitting diode 400 and lens arrangement 10 comprise metab 402 and metal rack 200 respectively, therefore surface adhering technical (SurfaceMountTechnology, SMT) can be jointly utilized to be arranged on substrate 300.Stated differently, since the metal rack 200 of the metab 402 of light emitting diode 400 and lens arrangement 10 is formed by metal, therefore jointly can be welded on substrate 300 with in a heat treatment process, and need not through twice heat treatment process.Therefore, soldering-tin layer 500 can formed with in heat treatment process (such as: back welding process) with scolding tin body 600.
In the embodiment of Fig. 1, weld part 204 is to couch on substrate 300, and one end of support portion 202 is to stand on weld part 204, and the other end supports lens body 100.Specifically, support portion 202 and weld part 204 can be jointly L-shaped or be mutually perpendicular to.In some embodiments, the height of support portion 202 is the height being not less than light emitting diode 400, in order to avoid lens arrangement 10 touches light emitting diode 400.
In the embodiment of Fig. 1, lens body 100 can comprise lens hat body 102 and a lens periphery 104.Lens periphery 104 is connected to the one end on support portion 202 away from weld part 204, therefore can supported portion 202 be supported.Lens hat body 102 is disposed on above lens periphery 104, and is positioned in the beamy light path of light emitting diode 400 institute.In other words, lens hat body 102 is in above light emitting diode 400, and it may be used to change the light shape that light emitting diode 400 radiates.In some embodiments, the surface of lens hat body 102 can be arc surfaced, curved or other geometries, but is not limited.In some embodiments, soldering-tin layer 500 and scolding tin body 600 just can melt when low temperature.Furthermore, it is understood that the melting temperature of soldering-tin layer 500 and scolding tin body 600 all can lower than the melting temperature of lens body 100.In some embodiments, lens body 100 is a kind of resistant to elevated temperatures material, and its melting temperature is at least above the melting temperature of soldering-tin layer 500 with scolding tin body 600.
Fig. 2 illustrates the profile of the light emitting module according to another embodiment of the present invention.The Main Differences of present embodiment and Fig. 1 is the metal rack 200 that the metal rack 210 of the lens arrangement 10 being in that present embodiment is different from Fig. 1.Specifically, each metal rack 210 respectively comprises support portion 212 and an elastic latch 214.Support portion 212 supports lens body 100.Elastic latch 214 connects support portion 212, is the side clasping substrate 300.
In some embodiments, the shape of the both sides of elastic latch 214 and substrate 300 is agreed with mutually, clasps substrate 300 in order to elastic latch 214.Specifically, see shown in Fig. 3, it illustrates the part sectioned view of light emitting module of Fig. 2.In Fig. 3, substrate 300 has relative end face 302 and a bottom surface 306, and has relative both ends of the surface 304 and be adjacent between end face 302 and bottom surface 306.It will be understood that this figure only illustrates wherein end face 304, and other end 304 is in the opposite side that substrate 300 is not illustrated in this figure.
As it is shown on figure 3, elastic latch 214 can comprise a junction 2142 and a fixed part 2144.Connecting portion 2142 is in the end face 302 of substrate 300.Fixed part 2144 is connected in connecting portion 2142, and extends on portion bottom surface 306 along the end face 304 of substrate 300, lives the side of substrate 300 with hook.Whereby, elastic latch 214 can be coated with the portion top surface 302 of substrate 300, portion bottom surface 306 and end face 304, thus being fixed on the side of substrate 300.
Specifically, fixed part 2144 can comprise base plate 2146 and a sidewall 2148, and sidewall 2148 is connected between connecting portion 2142 and base plate 2146.The bottom surface 306 of substrate 300 is to be stacked and placed on base plate 2146, and connecting portion 2142 is to couch on the end face 302 of substrate 300.Therefore, connecting portion 2142 and base plate 2146 can bear against the end face 302 in substrate 300 and bottom surface 306, thus avoiding elastic latch 214 and substrate 300 to produce the relative motion in y direction.Additionally, the end face 304 of substrate 300 is against on sidewall 2148, whereby, the sidewall 2148 of two elastic latchs 214 can bear against on the end face 304 of substrate 300 opposite sides, thus avoiding elastic latch 214 and substrate 300 to produce the relative motion in x direction.
Therefore, the elastic latch 214 of present embodiment can pass through the mode of hook and is fixed on the both sides of substrate 300, without passing through welding or mode for dispensing glue fixes, therefore can directly reduce by a heat treatment process.In other words, in present embodiment, it is only necessary to carry out heat treatment when light emitting diode 400 being fixed on substrate 300, and during fixing lens arrangement 10, then directly can realize the function fixed in the way of hook.
In some embodiments, the shape of connecting portion 2142, sidewall 2148 and base plate 2146 is agreed with the end face 302 of substrate, end face 304 and bottom surface 306 phase.Specifically, the angle between connecting portion 2142 and sidewall 2148 approximates the angle between the end face 302 of substrate 300 and end face 304, and similarly, the angle between sidewall 2148 and base plate 2146 approximates the angle between the end face 304 of substrate 300 and bottom surface 306.Whereby, elastic latch 214 can closely hook on substrate 300, and and all seamless between the end face 302 of substrate 300, end face 304 and bottom surface 306.
In some embodiments, elastic latch 214 can be formed by having elastic material, and whereby, maker or user can be coated with two rear flank of substrate 300 at elasticity latch 214, pressing elasticity latch 214 so that its closely hook on substrate 300.
In some embodiments, light emitting diode 400 can be the package structure for LED after encapsulation or the light-emitting diode chip for backlight unit of bare crystal type, but is not limited.In some embodiments, light emitting diode 400 can be white light emitting diode, red light-emitting diode, green light LED or blue light-emitting diode, but is not limited.
Although the present invention is disclosed above with embodiment; so it is not limited to the present invention, any is familiar with this those skilled in the art, without departing from the spirit and scope of the present invention; when being used for a variety of modifications and variations, therefore protection scope of the present invention ought be as the criterion depending on the scope that appending claims defines.
Claims (4)
1. a lens arrangement, it is characterised in that in order to adjust the light shape of a light emitting diode, and this light emitting diode is disposed on a substrate, and this lens arrangement comprises:
One lens body；And
Pair of metal support, is arranged at the opposite sides of this lens body, and this lens arrangement can be made to be fixed on this substrate, and makes this lens body be positioned at the top of this light emitting diode, and this metal rack each comprises:
One support portion, supports this lens body；And
One weld part, its one end connects this support portion and is positioned on this substrate, and in order to be welded in this substrate, this weld part is partly to contact this substrate.
2. lens arrangement according to claim 1, it is characterised in that also comprise:
Multiple soldering-tin layers, are located in this between those weld parts and this substrate of metal rack.
3. a light emitting module, it is characterised in that comprise:
One substrate；
One light emitting diode, is arranged on this substrate；And
One lens arrangement, comprises:
One lens body；And
Pair of metal support, is arranged at the opposite sides of this lens body, and this lens arrangement can be made to be fixed on this substrate, and makes this lens body be positioned at the top of this light emitting diode, and this metal rack each comprises:
One support portion, supports this lens body；And
One weld part, its one end connects this support portion and is positioned on this substrate, and in order to be welded in this substrate, this weld part is partly to contact this substrate.
4. light emitting module according to claim 3, it is characterised in that also comprise:
Multiple soldering-tin layers, are located in this substrate and this are between those weld parts of metal rack.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101133751A TWI477716B (en) | 2012-09-14 | 2012-09-14 | Illumination module and lens structure thereof |
| TW101133751 | 2012-09-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103682034A CN103682034A (en) | 2014-03-26 |
| CN103682034B true CN103682034B (en) | 2016-07-06 |
Family
ID=50318927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210384233.7A Active CN103682034B (en) | 2012-09-14 | 2012-10-11 | Light emitting module and lens structure thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103682034B (en) |
| TW (1) | TWI477716B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1906773A (en) * | 2004-01-29 | 2007-01-31 | Acol技术公司 | Light emitting diode with integral heat dissipation means |
| CN102182954A (en) * | 2009-12-16 | 2011-09-14 | 株式会社日立高新技术 | Light source device, and backlight, exposure apparatus and exposure method using the same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8070329B1 (en) * | 2005-02-11 | 2011-12-06 | Gentex Corporation | Light emitting optical systems and assemblies and systems incorporating the same |
| US8493516B2 (en) * | 2009-06-15 | 2013-07-23 | Sharp Kabushiki Kaisha | Light-emitting module, illumination device, display device, and television receiver |
| US9158151B2 (en) * | 2009-11-17 | 2015-10-13 | Sharp Kabushiki Kaisha | Surface light-emitting unit and display device provided with the same |
-
2012
- 2012-09-14 TW TW101133751A patent/TWI477716B/en active
- 2012-10-11 CN CN201210384233.7A patent/CN103682034B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1906773A (en) * | 2004-01-29 | 2007-01-31 | Acol技术公司 | Light emitting diode with integral heat dissipation means |
| CN102182954A (en) * | 2009-12-16 | 2011-09-14 | 株式会社日立高新技术 | Light source device, and backlight, exposure apparatus and exposure method using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103682034A (en) | 2014-03-26 |
| TWI477716B (en) | 2015-03-21 |
| TW201411047A (en) | 2014-03-16 |
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| C14 | Grant of patent or utility model | ||
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