CN103676494B - For the Field by field focusing and leveling method of scanning photoetching machine - Google Patents
For the Field by field focusing and leveling method of scanning photoetching machine Download PDFInfo
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Abstract
The present invention discloses a kind of Field by field focusing and leveling method for scanning photoetching machine, the focusing and leveling sensor system of multiple measurement hot spot is adopted to provide complete vertical position information at each exposure position of plane of exposure, thus eliminate the risk affecting focusing and leveling precision, even cause focusing and leveling failure, scanning photoetching machine overall exposing technique can be more concrete, effective, be conducive to the yield rate improving product, increase production capacity.
Description
Technical field
The present invention relates to a kind of integrated circuit equipment manufacturing field, particularly relate to a kind of Field by field focusing and leveling method for scanning photoetching machine.
Background technology
Lithographic equipment is the major equipment manufacturing integrated circuit, and its effect is the position making different mask patterns be imaged onto the accurate aligning in substrate (as semi-conductor silicon chip or LCD plate) successively.But this aligned position but changes because of the physical and chemical changes that experiences of row graph, therefore needs an alignment system, to ensure that the aligned position of the corresponding mask of silicon chip can both be aimed at accurately at every turn.Along with the growth of the number of electronic components on substrate per unit surface area and the size of electronic component are synthesized more and more less, the accuracy requirement of integrated circuit is improved day by day, therefore mask is imaged on suprabasil position and must fixes more and more accurately successively, also more and more higher to the requirement of alignment precision during photoetching.
In scanning photoetching machine system, mask pattern clearly can be projected on workpiece to make projection objective, need measuring workpieces plane of exposure whether to overlap with projection objective focal plane, thus need the vertical position using focusing and leveling sensor system measuring workpieces plane of exposure.
Publication date be October 4 calendar year 2001, the patent No. is in the patent of US6327025, focusing and leveling sensor system adopts multiple measurement hot spot and based on the method for the measurement hot spot being positioned at center to detect workpiece plane of exposure vertical position information, realizes automatic focusing leveling object.
Publication date be on February 11st, 1997, the patent No. is in the patent of US5602400, focusing and leveling sensor system adopts multiple measurement hot spot and based on the method for the measurement hot spot being positioned at center to detect workpiece plane of exposure vertical position information, realizes automatic focusing leveling object.On different scanning patterns, not exclusively effective if there is multiple measurement hot spot, then carry out least square fitting with current several facula measurement information effective, draw workpiece plane of exposure vertical position information.
Publication date be on July 18th, 2000, the patent No. is in the patent of US6090510, focusing and leveling sensor system adopts multiple measurement hot spot to detect workpiece plane of exposure vertical position information, realizes automatic focusing leveling object.Before scanning starts, each exposure field vertical position information roughly need be pre-determined out according to scanning pattern, sweep velocity, as the reference by location of actual scanning process, and then adjust the actual vertical position of each exposure field.
In above patent, US6327025 and US5602400 does not consider to measure in the process of plane of exposure vertical position at focusing and leveling sensor system, multiple measurement hot spot is always all not effective in each exposure field of plane of exposure, particularly indivedual measurement hot spot even can only be had effective at the marginal position of plane of exposure, thus can not provide complete exposed surface vertical position information, affect focusing and leveling precision, even cause focusing and leveling failure, reduce the yield rate of product, affect user's capacity efficiency.US6090510 needs predefined each exposure field vertical position information roughly, workpiece plane of exposure vertical position information is obtained respectively with actual exposure process with pre-determining, introduce the position cumulative errors of work stage Long Distances motion, be unfavorable for that focusing and leveling precision keeps, be also unfavorable for the raising of user's production capacity.
In view of this, be badly in need of in prior art wanting a kind of Field by field focusing and leveling method for scanning photoetching machine newly.
Summary of the invention
In order to overcome the defect existed in prior art, the invention provides a kind of Field by field focusing and leveling method for scanning photoetching machine, the method can improve the yield rate of product, adding users production capacity.
In order to realize foregoing invention object, the present invention discloses a kind of Field by field focusing and leveling method for scanning photoetching machine, comprising:
Step one, utilize multiple measurement hot spots of a focusing and leveling sensor system to measure a workpiece, measure the effective vertical comprehensive pattern value (Z of workpiece in the front i measuring period
fS, Rx
fS, Ry
fS), obtain work stage vertical pattern value (Z from workpiece table system
pS, Rx
pS, Ry
pS) and work stage Current Scan direction of motion on coordinate information; Step 2, judge the plurality of measurement hot spot quantity on the same line, when at least three measure hot spots effectively and not on the same line time, according to the vertical comprehensive pattern value (Z of this workpiece
fS, Rx
fS, Ry
fS) and the vertical pattern value of work stage (Z
pS, Rx
pS, Ry
pS) obtain the true vertical pattern value (Z, Rx, Ry) of this workpiece; Step 3, when only one or two measure hot spot effective, or two or more effectively measure hot spot on the same line time, according to the true vertical pattern value (Z of described workpiece, Rx, Ry) obtain with the coordinate information on work stage scanning motion direction one calculate after the true vertical pattern value of workpiece (Z ', Rx ', Ry '), the true vertical pattern value of workpiece after described reckoning (Z ', Rx ', Ry '), the true vertical pattern value (Z with work stage respectively
pS, Rx
pS, Ry
pS) be added obtain this workpiece vertical comprehensive pattern extrapolated value (Z '
fS, Rx '
fS, Ry '
fS).
Further, the plurality of measurement hot spot is four, and this workpiece is silicon chip.Or the plurality of measurement hot spot is nine, and this workpiece is substrate.
This step 2 is according to the vertical comprehensive pattern value (Z of this workpiece
fS, Rx
fS, Ry
fS) and the vertical pattern value of work stage (Z
pS, Rx
pS, Ry
pSobtain a real topography value (Z, Rx, Ry) to comprise further: step 2.1 is by vertical for this workpiece comprehensive pattern value (Z
fS, Rx
fS, Ry
fS) deduct the vertical pattern value of this work stage (Z
pS, Rx
pS, Ry
pS); Step 2.2 obtains workpiece real topography value (Z, Rx, Ry), wherein,
.
Obtain in this step 3 (Z '
fS, Rx '
fS, Ry '
fS) step comprise further: step 3.1, to go out with least square fitting the true vertical pattern variation tendency coefficient of workpiece in front 1,2 ..., the i measuring period (a, b), fitting formula is:
, wherein, Y
1, Y
2..., Y
ifor the Y-coordinate of work stage in front 1,2 ..., the i measuring period; Z
1, Z
2..., Z
ifor the true vertical height value of workpiece in front 1,2 ..., the i measuring period; Step 3.2, according to formula Z '=aY+b, calculate the extrapolated value Z ' of current workpiece true altitude; Step 3.3, calculating Z '
fS, wherein
; Step 3.4, calculate Rx ' as stated above
fS, Ry '
fS., Rx '
fS, Ry '
fSthe vertical comprehensive pattern X of workpiece, Y-direction extrapolated value respectively.
Compared with prior art, the present invention can ensure to adopt the focusing and leveling sensor system of multiple measurement hot spot can provide complete vertical position information at each exposure position of plane of exposure, improve focusing and leveling precision, for the service of scanning photoetching machine overall exposing technique, and then improve the yield rate of product, adding users production capacity; Focusing and leveling sensor system must make from the beginning to have at least more than 3 not the effective position of measurement hot spot on the same line start to scan workpiece, measure, such as: carry out from the centre position of workpiece along single direction to two ends scanning, measuring.
The present invention to focusing and leveling sensor system the enterprising line scanning of workpiece, measure time path requirement do not increase the complicacy of litho machine entire scan, measuring route, on the contrary, complete vertical position information can be provided at each exposure position of plane of exposure owing to adopting the focusing and leveling sensor system of multiple measurement hot spot, eliminate the risk affecting focusing and leveling precision, even cause focusing and leveling failure, scanning photoetching machine overall exposing technique can be more concrete, effective, be conducive to the yield rate improving product, increase production capacity.
Accompanying drawing explanation
Can be further understood by following detailed Description Of The Invention and institute's accompanying drawings about the advantages and spirit of the present invention.
Fig. 1 is the primary structure schematic diagram of the focusing and leveling system of comparatively typical scanning photoetching machine in prior art;
Fig. 2 is the primary structure schematic diagram of the first embodiment;
Fig. 3 is the focusing and leveling process schematic of the first embodiment;
Fig. 4 is the primary structure schematic diagram of the second embodiment;
Fig. 5 is the focusing and leveling process schematic of the second embodiment;
Fig. 6 is prior art complete machine, focusing and leveling sensor system, workpiece table system three Organization Chart in focusing and leveling process;
Fig. 7 is the processing flow chart of prior art hot spot validity in focusing and leveling process;
Fig. 8 is the present invention's complete machine, focusing and leveling sensor system, workpiece table system three Organization Chart in focusing and leveling process;
Fig. 9 is the processing flow chart of the present invention's hot spot validity in focusing and leveling process;
Figure 10 is the hot spot validity processing flow chart at sweep phase;
Figure 11 is the hot spot validity processing flow chart in the Non-scanning mode stage.
Embodiment
The Field by field focusing and leveling method for scanning photoetching machine of a kind of specific embodiment of the present invention is described in detail below in conjunction with accompanying drawing.But, the present invention should be understood as and be not limited to this embodiment described below, and technical concept of the present invention can combine with other known technologies or function other technologies identical with those known technologies and implements.
In the following description, in order to clear displaying structure of the present invention and working method, to be described by many Directional words, but should by "front", "rear", "left", "right", " outward ", " interior ", " outwards ", " inwardly ", " on ", the Word Understanding such as D score for convenience of term, and not should be understood to word of limitation.In addition, used " X to " word mainly refers to level to parallel direction in the following description; " Y-direction " one word mainly refer to level to parallel, and with X to vertical direction; " Z-direction " one word mainly refer to level to vertical, and the direction all vertical with X, Y-direction; " Rx " refers to around X to rotation, and " Ry " refers to rotate around Y-direction, and " Rz " refers to rotate around Z-direction.
In order to make to adopt the focusing and leveling sensor system of multiple measurement hot spot can provide complete vertical position information at each exposure position of plane of exposure, present invention employs a kind of Field by field focusing and leveling method referred to as " extrapolation of losing efficacy ", that is: occur to measure hot spot " inefficacy " (when namely effectively measurement hot spot is not enough to provide complete exposure field vertical position information) at focusing and leveling sensor system, record at focusing and leveling sensor system, on complete exposed surface vertical position Information base, coordinate information on self the vertical position information recorded in conjunction with current work stage and scanning motion direction, through rational arithmetic, supply complete exposure field vertical position information, thus improve the focusing and leveling precision of edge exposure field, for the service of scanning photoetching machine overall exposing technique, and then improve the yield rate of product, adding users production capacity.
Below with reference to accompanying drawing, describe Field by field focusing and leveling method of the present invention in detail.
Fig. 1 is the primary structure schematic diagram of the focusing and leveling system of comparatively typical scanning photoetching machine in prior art.As shown in fig. 1,1 is mask, and 2 is projection objective, and 3 is work stage, 4 is workpiece, 5 and 6 form focusing and leveling sensor, and wherein, 5 is the projected branch of focusing and leveling sensor, 6 is the detection branches of focusing and leveling sensor, 8 is laser interferometer, and 7 is the best focal plane position of workpiece 4 upper surface, and 9 is datum plate.The present invention will provide two kinds of embodiments to illustrate that this is used for the method for the Field by field focusing and leveling of scanning photoetching machine, and wherein in the first embodiment, workpiece 4 will use silicon chip, and the workpiece 4 in the second embodiment is the substrate of glass or similar glass thing.
Projection objective 2 is for projecting to the upper surface of the workpiece 4 in work stage 3 by the pattern of mask 1, focusing and leveling sensor is used for detecting the vertical Three Degree Of Freedom of the workpiece 4 in work stage 3.Work stage 3 can carry out (X, Y, Z, Rx, Ry, Rz) six degree of freedom precise motion, the projected branch 5 of focusing and leveling sensor can produce multiple measurement hot spot at workpiece 4 upper surface, after workpiece 4 reflects, after being detected by the detection branches 6 of focusing and leveling sensor, draw the vertical position of workpiece 4 upper surface.Laser interferometer 8, datum plate 9 realize carrying out high precision test to work stage 3 upper surface vertical position (Z, Rx, Ry).
It is workpiece and measurement hot spot that focusing and leveling process mainly participates in object.Fig. 2 is the primary structure schematic diagram of the first embodiment.Fig. 2 is the main participation object schematic diagram measuring hot spot 10, silicon chip 4 for four, and in figure, R is silicon chip radius, and FEC is the invalid edge of silicon chip, and X, Y are work stage horizontal axis.
Focusing and leveling process as shown in Figure 3.Fig. 3 illustrates four measurement hot spots 10 from left to right and scans in silicon chip 4 process along Y-axis forward (the equal default scan direction of motion of following description is Y direction) from silicon chip interior zone, effectively measures the situation that hot spot is respectively 4,3,2,1,0.Effective light spot refers to and is positioned in silicon chip scope and is not positioned at the hot spot at the invalid edge of silicon chip.
Fig. 6 is prior art complete machine, focusing and leveling sensor system, workpiece table system three Organization Chart in focusing and leveling process.As shown in Figure 6, in conventional architectures, complete machine scanning obtains vertical comprehensive pattern value (Z_fs, Rx_fs, Ry_fs) S12 of workpiece with spectrum assignment algorithm S11 from focusing and leveling sensor system, (X, Y, Z are carried out to workpiece table system, Rx, Ry, Rz) six degree of freedom precise motion control S13, without contacting directly between focusing and leveling sensor system and workpiece table system.This means that the scanning of this complete machine assume responsibility for huge task with spectrum assignment algorithm.
Fig. 7 is the processing flow chart of prior art hot spot validity in focusing and leveling process.As shown in Figure 7, the treatment scheme of traditional hot spot validity is: S701 judges the number of effective light spot in current exposure field; S702 judges whether to have 3 effective light spots at least not on same straight line, if judged result is "No" enter step S704, if judged result is "Yes" enter step S703; Each effective light spot of surface of the work vertical pattern value that s703 is obtained by measurement is carried out least square fitting and is drawn the vertical comprehensive pattern value (Z_fs, Rx_fs, Ry_fs) of workpiece in current exposure field, and (Z_fs, Rx_fs, Ry_fs) also can be recited as (Z respectively
fS, Rx
fS, Ry
fS) other roughly the same; S704 judges whether only have 1 or 2 effective light spots, or more than 2 effective on same straight line, if judged result is "No" enter step S707, if judged result is "Yes" enter step S705; The average of s705 single-point height or multiple effective single-point height is as comprehensive Z_fs value; S706 comprehensive Rx_fs, Ry_fs are invalid value; S707 comprehensive Z_fs, Rx_fs, Ry_fs are invalid value.
In hot spot validity process traditional process in focusing and leveling process, have at least 3 not measurement hot spot on the same line just can provide all comprehensive (Z_fs of workpiece focusing and leveling in current exposure field, Rx_fs, Ry_fs) value, the i.e. vertical comprehensive pattern value (Z_fs of workpiece in current exposure field, Rx_fs, Ry_fs), otherwise, at only 1, during more than 2 or 2 effective measurement hot spots on the same line, the comprehensive Z_fs value of workpiece focusing and leveling in current exposure field can only be provided, and the comprehensive (Rx_fs of workpiece in current exposure field, Ry_fs) be all invalid value, when effectively measuring hot spot for 0, comprehensive (Z_fs, Rx_fs, Ry_fs) is all invalid value.
For the hot spot validity process traditional process in Field by field focusing and leveling process in process as between " ╋ " the shape wire frame in Fig. 3 and dotted line frame during region, the problem that can not provide comprehensive Rx_fs, Ry_fs may be met with, the Organization Chart of this focusing and leveling method as shown in Figure 8, hot spot validity treatment scheme is as shown in Fig. 9,10,11, wherein, Fig. 9 is that flow process is always schemed, Figure 10 is complete machine scanning mode when being SCAN and the hot spot validity treatment scheme of sweep phase, and Figure 11 is the hot spot validity treatment scheme under non-SCAN state.
In scanning photoetching machine system, multiple measurement hot spots of focusing and leveling sensor system are generally relative to the line scanning as enterprising in Y direction of work stage single direction, exposure.If when having in exposure field that on the same line 3 or more hot spots are ineffective, then focusing and leveling sensor system can calculate the vertical comprehensive pattern value (Z of workpiece in this exposure field according to the single-point of each effective light spot vertical pattern value
fS, Rx
fS, Ry
fS); If there is 3 on the same line or more hot spot effective in exposure field, or only have 2 or 1 hot spot effective, now can only calculate the vertical height Z of workpiece in this exposure field by the vertical height value of the single-point of all effective light spot
fSvalue, and directly cannot calculate the vertical comprehensive pattern value (Z of workpiece in this exposure field
fS, Rx
fS, Ry
fS) in Rx
fSor Ry
fS(Rx
fS, Ry
fSbe respectively workpiece X, Y-direction rotational value that focusing and leveling subsystem survey calculation obtains), thus the present invention introduces the processing procedure (it is Y direction that following description all gives tacit consent to work stage scanning motion direction) of following abbreviation " extrapolation of losing efficacy ".
First, in level in Field by field focusing and leveling process, focusing and leveling sensor system is measured, the vertical comprehensive pattern value (Z of workpiece in each exposure field of calculating
fS, Rx
fS, Ry
fS), the not true vertical pattern (Z, Rx, Ry) of workpiece in this measuring position, but contain the vertical pattern value of work stage (Z simultaneously
pS, Rx
pS, Ry
pS).Following relation is there is between this three:
formula 1-1
Because of the vertical pattern of workpiece consecutive variations among a small circle, therefore (be assumed to be the i-th+1 measuring position place) when needs are extrapolated, can extrapolate according to the comprehensive vertical pattern variation tendency of true vertical pattern value (Zi, Rxi, Ryi) matching workpiece of front i measuring position place workpiece.For height, Extrapolation method is shown in formula 1-2, wherein (a, b) is the true vertical pattern variation tendency coefficient of workpiece, can be obtained by formula 1-3.
formula 1-2
formula 1-3
In formula 1-3, Y
1, Y
2..., Y
ifor the Y-coordinate of work stage in front 1,2 ..., the i measuring period; Z
1, Z
2..., Z
ifor the true vertical height value of workpiece in front 1,2 ..., the i measuring period.The methods such as least square method can be adopted to calculate (a, b) of the true vertical pattern variation tendency coefficient of workpiece in front 1,2 ..., the i measuring period.
Draw variation tendency coefficient (a, b) after, then the Y-coordinate of current work stage measuring position to be substituted in formula 1-2, the true vertical height extrapolated value Z of current measurement position place workpiece can be obtained
i+1, be designated as Z '.Same method, also can rotate extrapolated value Rx ' and Ry ' in the hope of the X of the true vertical pattern of workpiece, Y-direction.
Finally, through type 1-4 can obtain focusing and leveling sensor system measure extrapolated value (Z '
fS, Rx '
fS, Ry '
fS), wherein, Z '
fSfor the vertical extrapolated height value of the comprehensive vertical pattern of workpiece, Rx '
fS, Ry '
fSbe respectively the X of the comprehensive vertical pattern of workpiece, Y-direction extrapolation rotational value.
formula 1-4
Secondly, for ensureing the smooth enforcement of this Field by field focusing and leveling method, before this Field by field focusing and leveling of enforcement method, focusing and leveling sensor system need measure each effectively vertical comprehensive pattern value (Z of workpiece in the front i measuring period
fS, Rx
fS, Ry
fS).Like this, when implementing this Field by field focusing and leveling method, multiple measurement hot spots of focusing and leveling sensor system need from workpiece, make focusing and leveling sensor system have more than 3 not effective positions of measurement hot spot on the same line from the beginning at least, start to scan workpiece, measure, such as: from the centre position of workpiece along single direction, carry out to two ends scanning, measuring.
In Fig. 8, complete machine scanning obtains workpiece vertical comprehensive pattern (Z_fs, Rx_fs, Ry_fs) value S22 with spectrum assignment algorithm S21 from focusing and leveling sensor system, (X is carried out to workpiece table system S23, Y, Z, Rx, Ry, Rz) six degree of freedom precise motion controls, and issues complete machine scanning mode to workpiece table system.Focusing and leveling sensor system obtains the coordinate figure of the vertical pattern of work stage (Z_ps, Rx_ps, Ry_ps) value that complete machine scanning mode and work stage calculate, current work stage Y-direction and direction of scanning from workpiece table system.
In Fig. 9, introduce before focusing levelling light spot validity process traditional process complete machine scanning mode judge, current complete machine scanning mode be SCAN and sweep phase time, carry out the hot spot validity treatment scheme of Figure 10; When current complete machine state is non-SCAN, carry out the hot spot validity treatment scheme of Figure 11, finally carry out focusing levelling light spot validity process traditional process.As shown in Figure 9, S901 judges complete machine scanning mode; S902 judges whether current complete machine is in scanning mode, if judged result is "No" enter step S904, if judged result is "Yes" enter step S903; S903 enters the hot spot validity treatment scheme under scanning mode; S904 enters the hot spot validity treatment scheme under Non-scanning mode state; S905 enters focusing and leveling validity conventional process flow (flow process namely shown in Fig. 7).
In Figure 10, have at least 3 effectively measure hot spots not on the same line time, carry out the methods such as least square method calculate the vertical comprehensive pattern (Z_fs, Rx_fs, Ry_fs) of workpiece in current exposure field value by measuring the vertical pattern value of each effective light spot of surface of the work obtained; Again these values are deducted respectively the vertical pattern of current work stage (Z_ps, Rx_ps, Ry_ps) value calculated, be the true vertical pattern value (Z, Rx, Ry) of current workpiece; Then these values are saved, in addition, also preserve current work stage Y-direction coordinate figure.When effectively measuring hot spot for 0, the vertical comprehensive pattern (Z_fs, Rx_fs, Ry_fs) of workpiece is all invalid value.
In Figure 10, measure hot spots at only 1,2 effective, or 2 more than effectively measure hot spots on the same line time, respectively inefficacy extrapolation process is carried out to comprehensive (Z_fs, Rx_fs, Ry_fs) value, provides the extrapolated value postponed outside losing efficacy.Particularly, for the extrapolation process of comprehensive Z_fs value, with method process such as least square fittings, the true vertical pattern variation tendency coefficient of workpiece (a, b) is drawn from the Z preserved, Y value, press Z=aY+b formula again, calculate the extrapolated value Z ' of the true vertical height of current workpiece and preserve, Z ' value is added with the vertical height Z_ps value of current work stage with value as the vertical comprehensive height value Z_fs of workpiece in the current exposure field postponed outward.Can draw the comprehensive X in the outer current exposure field postponed, Y-direction rotational value Rx_fs, Ry_fs, that is: Rx_fs=aY+b, Rx_fs=aY+b by similar method, (a, implication b) are same as described above.
In this second embodiment, focusing and leveling process mainly participates in object be substrate 4 is the main participation object schematic diagram measuring hot spot 10, substrate 4 for nine with measuring hot spot 10, Fig. 4.
Focusing and leveling process as shown in Figure 5.Fig. 5 (a) illustrates nine from left to right and measures hot spots and start to scan in silicon chip process along Y-axis forward (following describe equal default scan direction of motion be Y direction) from silicon chip inside, effectively measures hot spot and is respectively 9,6 (two row respectively on the same line), 3 (on the same line), the situation of 0; Fig. 5 (b) illustrates nine from left to right and measures hot spots and start along in Y-axis forward scan silicon chip process from silicon chip inside, effectively measures hot spot and is respectively 6 (two row respectively on the same line), the situation of 4,2,0; Fig. 5 (c) illustrates nine from left to right and measures hot spots and start along in Y-axis forward scan silicon chip process from silicon chip inside, and effectively measurement hot spot is respectively 3 (on the same line), the situation of 2,1,0.In Fig. 5, basic inner " " shape wire frame is for having two row or the two row above measurement effective region of hot spot.
Compared with prior art, the present invention can ensure to adopt the focusing and leveling sensor system of multiple measurement hot spot can provide complete vertical position information at each exposure position of plane of exposure, improve focusing and leveling precision, for the service of scanning photoetching machine overall exposing technique, and then improve the yield rate of product, adding users production capacity; Focusing and leveling sensor system must make from the beginning to have at least more than 3 not the effective position of measurement hot spot on the same line start to scan workpiece, measure, such as: carry out from the centre position of workpiece along single direction to two ends scanning, measuring.
The present invention to focusing and leveling sensor system the enterprising line scanning of workpiece, measure time path requirement do not increase the complicacy of litho machine entire scan, measuring route, on the contrary, complete vertical position information can be provided at each exposure position of plane of exposure owing to adopting the focusing and leveling sensor system of multiple measurement hot spot, eliminate the risk affecting focusing and leveling precision, even cause focusing and leveling failure, scanning photoetching machine overall exposing technique can be more concrete, effective, be conducive to the yield rate improving product, increase production capacity.
Just preferred embodiment of the present invention described in this instructions, above embodiment is only in order to illustrate technical scheme of the present invention but not limitation of the present invention.All those skilled in the art, all should be within the scope of the present invention under this invention's idea by the available technical scheme of logical analysis, reasoning, or a limited experiment.
Claims (3)
1., for a Field by field focusing and leveling method for scanning photoetching machine, it is characterized in that, comprising:
Step one, utilize multiple measurement hot spots of a focusing and leveling sensor system to measure a workpiece, measure the effective vertical comprehensive pattern value (Z of workpiece in the front i measuring period
fS, Rx
fS, Ry
fS), obtain work stage vertical pattern value (Z from workpiece table system
pS, Rx
pS, Ry
pS) and current work stage scanning motion direction on coordinate information;
Step 2, judge described multiple measurement hot spots quantity on the same line, when at least three measure hot spots effectively and not with
Time on one straight line, according to the vertical comprehensive pattern value (Z of described workpiece
fS, Rx
fS, Ry
fS) and the vertical pattern value of work stage (Z
pS, Rx
pS, Ry
pS) obtain the true vertical pattern value (Z, Rx, Ry) of this workpiece, comprise further:
Step 2.1 is by vertical for described workpiece comprehensive pattern value (Z
fS, Rx
fS, Ry
fS) deduct the vertical pattern value of described work stage (Z
pS, Rx
pS, Ry
pS);
Step 2.2 obtains workpiece real topography value (Z, Rx, Ry),
Wherein,
;
Step 3, when only one or two to measure hot spot effective, or two or more effectively measure hot spot on the same line time, root
According to the coordinate information on the true vertical pattern value (Z, Rx, Ry) of described workpiece and work stage scanning motion direction obtain one calculate after the true vertical pattern value (Z of workpiece
', Rx
', Ry
'), by true for the workpiece after described reckoning vertical pattern value (Z
', Rx
', Ry
') the vertical pattern value (Z with work stage respectively
pS, Rx
pS, Ry
pS) be added the vertical comprehensive pattern extrapolated value (Z obtaining this workpiece
' fS, Rx
' fS, Ry
' fS), comprise further:
Step 3.1, to go out with least square fitting the true vertical pattern variation tendency coefficient of workpiece in front 1,2 ..., the i measuring period (a, b), fitting formula is:
, wherein, Y
1, Y
2..., Y
ifor the Y-coordinate of work stage in front 1,2 ..., the i measuring period; Z
1, Z
2..., Z
ifor the true vertical height value of workpiece in front 1,2 ..., the i measuring period;
Step 3.2, according to extrapolation formula Z=aY+b, calculate current measurement position place workpiece true vertical height extrapolated value Z
i+1, be designated as Z
', Y is the coordinate information on current work stage scanning motion direction;
Step 3.3, calculating Z
' fS, wherein
, Z
' fSfor the extrapolated value of the vertical comprehensive height of workpiece, Z
pSfor the vertical height value of work stage;
Step 3.4, calculate Rx as stated above
' fS, Ry
' fS,rx
' fS, Ry
' fSbe respectively the vertical comprehensive pattern X of workpiece, Y-direction rotates extrapolated value.
2., as claimed in claim 1 for the Field by field focusing and leveling method of scanning photoetching machine, it is characterized in that, described multiple measurement hot spot is four, and described workpiece is silicon chip.
3., as claimed in claim 1 for the Field by field focusing and leveling method of scanning photoetching machine, it is characterized in that, described multiple measurement hot spot is nine, and described workpiece is substrate.
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