CN103674265A - Method for detecting high-density packaging electronic assembly emissivity - Google Patents
Method for detecting high-density packaging electronic assembly emissivity Download PDFInfo
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- 238000000034 method Methods 0.000 title abstract description 21
- 238000004806 packaging method and process Methods 0.000 title abstract description 13
- 238000001514 detection method Methods 0.000 claims abstract description 53
- 238000005259 measurement Methods 0.000 claims description 34
- 239000012776 electronic material Substances 0.000 claims description 24
- 239000000523 sample Substances 0.000 claims description 19
- 238000012360 testing method Methods 0.000 claims description 19
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- 238000007789 sealing Methods 0.000 claims description 7
- 230000006641 stabilisation Effects 0.000 claims description 6
- 238000011105 stabilization Methods 0.000 claims description 6
- 239000005030 aluminium foil Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 238000010301 surface-oxidation reaction Methods 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 229910001335 Galvanized steel Inorganic materials 0.000 claims description 3
- 239000008397 galvanized steel Substances 0.000 claims description 3
- 239000011491 glass wool Substances 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 10
- 238000012937 correction Methods 0.000 abstract description 4
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- 238000005507 spraying Methods 0.000 description 2
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
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Abstract
本发明公开了高密度封装电子组件发射率检测方法，包括：对控温箱体进行温度控制，使所述电子组件温度稳定于预设值；获取各个被测元器件的反射表观温度；将获取的各个被测元器件的反射表观温度，作为对各个被测元器件的环境反射温度补偿；分别调整各个被测元器件的发射率，探测所述各个被测元器件的温度；将各个被测元器件的温度等于所述预设值时发射率的调整值作为各个被测元器件发射率的检测值。本发明采用红外热像探测方式和反射温度补偿控制技术，对电子组件内部各个被测元器件的表观温度和实际温度进行有效探测，通过被测元器件反射温度补偿，实现所有被测元器件发射率的检测和修正，解决高密度组装和复杂封装结构的电子组件发射率检测难题。
The invention discloses a method for detecting the emissivity of a high-density packaged electronic component, which includes: controlling the temperature of a temperature control box to stabilize the temperature of the electronic component at a preset value; obtaining the reflected apparent temperature of each component to be tested; The obtained reflected apparent temperature of each tested component is used as the environmental reflection temperature compensation for each tested component; the emissivity of each tested component is adjusted respectively, and the temperature of each tested component is detected; The adjusted value of the emissivity when the temperature of the measured component is equal to the preset value is used as the detection value of the emissivity of each measured component. The invention adopts the infrared thermal image detection method and the reflection temperature compensation control technology to effectively detect the apparent temperature and the actual temperature of each tested component inside the electronic component, and realizes all the tested components through the reflection temperature compensation of the tested components. The detection and correction of emissivity solves the problem of emissivity detection of electronic components with high-density assembly and complex packaging structure.
Description
Technical field
The present invention relates to electronic package emissivity detection technique field, relate in particular to a kind of high-density packages electronic package emissivity detection method.
Background technology
High-density packages electronic package emissivity refers to the infrared emittance (emissivity e=0～1.0) on component internal components and parts surface, the object of revising electronic package emissivity is in order to coordinate infrared thermal imagery method accurate detection high-density packages electronic package internal component working temperature, and then supports its thermal behavior evaluation and reliability evaluation.While therefore adopting infrared thermal imagery method to survey electronic package infrared energy accounting temperature, must obtain its true emissivity e.How the emissivity of the inner High Density Integration components and parts of Measurement accuracy high-density packages electronic package, meets high-resolution temperature survey requirement, is the key point of accurate detection high-density packages electronic package working temperature.
The method of influence factor is measured in the emissivity measurement method providing at present and correction, it is mainly the emissivity measurement for single uniform solid, liquids and gases, and need to support the use black matrix contrasts as standard signal source, or use thermopair directly to measure testee and obtain actual temperature, these methods are not all suitable for the electronic package emissivity being comprised of various materials and components and parts and detect.In GJB standard, given emissivity is determined method, is the coating (about e=0.98) that adopts spraying Proximate blackbody, unified to guarantee electron device slin emissivity, for electronic package, adopt spraying method, depollution sample also can cause the difficulty of subsequent failure location outward; And in JEDEC standard, given heat conduction temperature control detects emissivity method, to the electronic package of irregular packing forms, cannot realize.Therefore, to the high-density packages electronic package being formed by multiple material and various components and parts High Density Packaging, because its encapsulating structure is complicated, the requirement of measurement temperature accuracy is high, how to detect effectively easily its emissivity, realize temperature Measurement accuracy, become a difficult problem.Current common way is not suitable for the electronic package by various materials and various components and parts High Density Packaging and high-density packages.
Summary of the invention
Based on this, the invention provides a kind of high-density packages electronic package emissivity detection method.
A high-density packages electronic package emissivity detection method, comprises the following steps:
The electronic package that cavity sealing cap is opened is placed in temperature control casing, and wherein, the tested components and parts in described electronic package expose by the described cavity sealing cap of opening; Keeping described electronic package is off working state; Temperature control casing is carried out to temperature control, make described electronic package temperature stabilization in preset value;
According to the material behavior of each tested components and parts in described electronic package, select corresponding electronic material reflection measurement plate, and be placed in the surface of described electronic package; Utilize infrared probe to aim at the infrared window on described temperature control casing, described electronic material reflection measurement plate is focused on; Described electronic material reflection measurement plate is carried out to temperature sensing, obtain the reflection apparent temperature of each tested components and parts;
By the reflection apparent temperature of each tested components and parts that obtain, as the Ambient temperature compensation to each tested components and parts;
After described Ambient temperature compensation is set, remove described electronic material reflection measurement plate; Adjust respectively the emissivity of each tested components and parts, survey the temperature of described each tested components and parts;
When the temperature of each tested components and parts that detect equals described preset value, stop described adjustment, and the detected value using the adjusted value of current each tested components and parts emissivity as each tested components and parts emissivity.
Compare with general technology, electronic package emissivity detection method of the present invention has provided a kind of for the electronic package emissivity detection method based on air thermal convection temperature control technique and the compensation of multidrop environment reflected temperature, by adopting high precision air thermal convection temperature control technique, High Density Packaging and complicated encapsulating structure electronic package are carried out to bulk temperature control under off working state, realize tested electronic package temperature controlled known with cordless.On this basis, adopt infrared thermal imagery detection mode and reflected temperature Compensating Control, apparent temperature and actual temperature to each tested components and parts of electronic package inside are effectively surveyed, by tested components and parts reflected temperature, compensate, realize detection and the correction of all tested components and parts emissivity, the electronic package emissivity that solves High Density Packaging and complicated encapsulating structure detects a difficult problem.The emissivity measurement that the inventive method appropriate products scope is wide, can solve various products.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of high-density packages electronic package emissivity detection method of the present invention.
Embodiment
For further setting forth the technological means that the present invention takes and the effect obtaining, below in conjunction with accompanying drawing and preferred embodiment, to technical scheme of the present invention, know and complete description.
Referring to Fig. 1, is the schematic flow sheet of high-density packages electronic package emissivity detection method of the present invention.
High-density packages electronic package emissivity detection method of the present invention, comprises the following steps:
The electronic package that S101 opens cavity sealing cap is placed in temperature control casing, and wherein, the tested components and parts in described electronic package expose by the described cavity sealing cap of opening; Keeping described electronic package is off working state; Temperature control casing is carried out to temperature control, make described electronic package temperature stabilization in preset value;
S102, according to the material behavior of each tested components and parts in described electronic package, selects corresponding electronic material reflection measurement plate, and is placed in the surface of described electronic package; Utilize infrared probe to aim at the infrared window on described temperature control casing, described electronic material reflection measurement plate is focused on; Described electronic material reflection measurement plate is carried out to temperature sensing, obtain the reflection apparent temperature of each tested components and parts;
S103 is by the reflection apparent temperature of each tested components and parts that obtain, as the Ambient temperature compensation to each tested components and parts;
After S104 arranges described Ambient temperature compensation, remove described electronic material reflection measurement plate; Adjust respectively the emissivity of each tested components and parts, survey the temperature of described each tested components and parts;
S105, when the temperature of each tested components and parts that detect equals described preset value, stops described adjustment, and the detected value using the adjusted value of current each tested components and parts emissivity as each tested components and parts emissivity.
According to Stefan-Boltzmann law, the law model while considering non-black-body is R=e σ T
4if external radiation energy R and temperature T that known non-black-body is red, can calculate according to this formula the infrared emittance e of non-black-body.The present invention adopts IR thermal imaging inspection method, and the electronic package of known temperature is carried out to infrared energy R
oand temperature T
osurvey, according to formula (1), calculate each emissivity of electronic package e
oas thermal imaging system emissivity input parameter, as thermal imaging system detecting temperature T
requal electronic package actual temperature T
otime (T
r=T
o), the emissivity value e of corresponding calculating
oequivalent emissivity for electronic package.
Due to thermal imaging system, surveying the effective radiant energy R receiving is three parts of formula (2): electronic package self radiation energy R
obj, the radiation energy R of electronic package to Ambient
ref, atmosphere radiation energy R
atm.Because detection range is very short, can ignore atmosphere infrared radiation R
atmimpact obtains formula (3); By formula (1), calculate emissivity e
otime, be environmental radiation R in cancelling (2)
refimpact on infrared measurement of temperature, the present invention adopts reflected temperature compensation technique, eliminates the additional effect of ambient temperature to electronic package emissivity measurement, with the formula after compensating (4) radiation energy R
objsubstitution formula (1), calculates and obtains out each components and parts emissivity of electronic package more accurately.
Tested electronic package infrared energy: R
obj=e
oσ T
obj 4(1)
The infrared energy that thermal imaging system is surveyed:
R＝R
obj(T
obj)+R
ref(T
ref)+R
atm(T
atm) （2）
When short distance is measured, ignore atmosphere radiation impact:
R＝R
obj(T
obj)+R
ref(T
ref) （3）
After Ambient temperature compensation:
R
obj＝R-R
ref （4）
In formula:
R
obj, R
ref, R
atm---electronic package infrared energy, electronic package are to the radiation energy of Ambient, atmosphere radiation energy, and R is the infrared integrated radiant emittance that thermal imaging system is surveyed;
T
obj---electronic package surface temperature, K;
T
ref---electronic package Ambient temperature, K;
T
atm---atmospheric temperature, K.
Electronic package emissivity detection technique based on air thermal convection temperature control and multiple spot reflected temperature compensation control.Wherein, adopted casing intelligent temperature control technology to carry out thermal convection temperature control to measured object, make testee under natural convection environment in the more than 20 ℃ steady temperature higher than environment temperature, the requirement of surveying to meet infrared thermal imagery; Adopt large visual field infrared acquisition window design technology, realize a plurality of tested components and parts of electronic package are carried out to infrared acquisition simultaneously; Adopt the reflected temperature test board of multidrop environment reflected temperature analytical technology and 6 kinds of exemplary electronic materials, realize the compensation to a plurality of tested components and parts reflected temperature; Temperature control casing madial wall adopts 40 °～50 ° adjustable designs, to guarantee inwall infrared radiation R
2directly see through detection window to external radiation, do not enter infrared probe R
1interference Detection.
As one of them embodiment, the step of the corresponding electronic material reflection measurement of described selection plate, comprises the following steps:
According to the material behavior of each tested components and parts in described high-density packages electronic package, select respectively 6 kinds of electronic material reflection measurement plates, and be placed in the surface of described electronic package; Wherein, 6 kinds of electronic material reflection measurement plates comprise Si great garden sheet, PCB copper-clad plate, Al
2o
3the Cu plate of conduction band substrate, surface oxidation, ganoid Al plate, wrinkle tinfoil paper/wrinkle aluminium foil.
The reflected temperature test board of 6 kinds of exemplary electronic materials, comprising: Si garden built-in testing plate, cover copper PCB test board, Al
2o
3conduction band substrate test board, surface oxidation Cu test board, smooth surface Al test board, wrinkle tinfoil paper/wrinkle aluminium foil test board etc.
Preferably, detect emissivity system and temperature regulating device, can comprise: 1. temperature control casing; 2. intelligent temperature control system; 3. large scale infrared glass detection window; 4. infrared thermal imagery is popped one's head in; 5. tested electronic package.
As one of them embodiment, described temperature control casing has following architectural feature: outer wall is electric galvanized steel plain sheet, and inwall is mirror face stainless steel plate, fills the tank wall that poly-glass wool forms thermofin between inside and outside wall.Described temperature control casing has following architectural feature: upper inside is trial target placement space, and inner lower is air regulating channel.
Evenly controlled for realizing high-density packages electronic package temperature, patent of the present invention has adopted intelligent temperature control technology and casing temperature regulating device to carry out thermal convection temperature control to measured object, makes under the natural convection environment of testee in casing in even steady temperature state.Intelligent casing temperature regulating device disclosed by the invention, its composition characteristic comprises: temperature control casing and provide≤200 * 220 * 80mm sample placement space and sample stage; Input and output air port intelligent temperature control heating system; Cross-ventilation heat circulating system; Electronic package electric power supply control system.Its architectural feature comprises: outer wall is that electric galvanized steel plain sheet, inwall are between mirror face stainless steel plate, inside and outside wall, to fill the tank wall that poly-glass wool forms thermofin; Upper inside is that trial target placement space, inner lower are the air regulating channel inner space of (air regulating channel is comprised of centrifugal blower and passage and package board, and well heater regulates channel interior);
As one of them embodiment, described temperature control casing has following architectural feature: the chamber door of described temperature control casing has infrared glass detection window, for electronic package emissivity, detects.The diameter of described infrared glass detection window is 10mm.
Chamber door has designed the large scale infrared glass detection window that diameter is 10mm, for electronic package emissivity, detects.
As one of them embodiment, the inwall of described temperature control casing be designed to 40 °～50 ° adjustable.
For avoiding measured object by cabinet wall infrared radiation R
1reflex to probe R
2, the accuracy of disturbing emissivity to detect, temperature-controlled box inwall be designed to 40 °～50 ° adjustable, the infrared radiation of casing self is gone out by the direct transmission of infrared glass window, the reflection interference infrared probe of avoiding sample detects.
In step S101, electronic package (inoperative) heats up and controls: electronic package cavity sealing cap is opened, exposed dut temperature components and parts, be placed in the sample stage of temperature control device case, close upper box lid, keep assembly off working state; Adjust temperature-controlling system and select temperature conditions, select a certain temperature T of 50 ℃～125 ℃
a; By intelligent temperature control system regulating and controlling temperature, until electronic package temperature equals T
aand stable.
As one of them embodiment, described, temperature control casing is carried out to temperature control, make described electronic package temperature stabilization in the step of preset value, described preset value is a temperature value of 50 ℃～125 ℃.
Above-mentioned way is closing to reality service condition more, is easy to promote.
In step S102, electronic package reflection apparent temperature is measured: according to electronic package inside n tested components and parts material behavior, 6 kinds of exemplary electronic material reflection measurement plates selecting respectively the present invention to provide, be placed in MUT module under test surface, infrared probe is aimed at temperature regulating device infrared window, and test board is focused on; Detection system emissivity parameter is set to e=1.00, adjusts after the parameters such as thermal imaging system atmospheric temperature, humidity, infrared window transmissivity simultaneously, respectively test board is carried out to temperature sensing, i.e. the corresponding reflection apparent temperature T that obtains n components and parts
f1, T
f2..., T
fi..., T
fn.
As one of them embodiment, described step of described electronic material reflection measurement plate being carried out to temperature sensing, comprises the following steps:
Detection system emissivity parameter is set to 1, adjusts atmospheric temperature, humidity and the infrared window transmissivity of thermal imaging system, respectively test board is carried out to temperature sensing, and correspondence is obtained the reflection apparent temperature of each tested components and parts.
Above-mentioned way can get the reflection apparent temperature of each tested components and parts exactly, and is easy to realize, and cost is lower.
In step S103, electronic package Ambient temperature compensation: by the reflection apparent temperature T of n components and parts of actual measurement
f1, T
f2..., T
fi..., T
fn, input respectively thermal imaging system as reflected temperature parameters, as the Ambient temperature compensation to an electronic package n components and parts.
As one of them embodiment, described by the reflection apparent temperature of each tested components and parts that obtain, the step as the Ambient temperature compensation to each tested components and parts, comprises the following steps:
By the reflection apparent temperature of each tested components and parts that obtain, input respectively thermal imaging system as reflected temperature parameters, as the Ambient temperature compensation to each tested components and parts.
Above-mentioned way is easy to realize, and cost is lower.
In step S104, electronic package actual temperature is surveyed: arrange after Ambient temperature, remove reflection measurement plate, survey the temperature T of n components and parts of electronic package
j1, T
j2..., T
ji..., T
jn, the emissivity e to n tested components and parts respectively
1, e
2..., e
i..., e
nadjust, until the detecting temperature T of n components and parts
j1, T
j2..., T
ji..., T
jnequal actual temperature T in temperature-controlled box
a.
In step S105, electronic package emissivity is determined: according to T
j1, T
j2..., T
ji..., T
jn=T
atime emissivity e
i(i=1 ..., n) adjust parameter, be defined as the detected value of electronic package n components and parts emissivity.
The present invention adopts thermal convection temperature control technique and multiple spot reflected temperature Compensating Control, the detection of realization to electronic package emissivity, be applicable to the electronic package of the complicated encapsulating structures of various high density, the emissivity measurement that the inventive method appropriate products scope is wide, can solve various products.The detection temperature regulating device of the inventive method, madial wall adopts 40 °～50 ° adjustable project organizations, reduce to greatest extent the interference that sample brings casing infrared external reflection, the space of temperature regulating device reaches simultaneously: W230 * D250 * H113, sample temperature control scope reaches 50～125 ℃, temperature-controlled precision reaches ± and 1 ℃, temperature fluctuation reaches ± and 0.1 ℃, can more accurately when measuring emissivity, more accurately control electronic package temperature; The multiple spot reflected temperature Compensating Control of the inventive method simultaneously, has designed and developed the reflected temperature test board of 6 kinds of exemplary electronic materials, comprises Si great garden sheet, PCB copper-clad plate, Al
2o
3the Cu plate of conduction band substrate, surface oxidation, ganoid Al plate, wrinkle tinfoil paper/Zou aluminium foil etc., covered the typical material of electronic package main components, the reflection characteristic that has reflected well these materials, can effectively eliminate the impact that electronic package brings Ambient and reflected temperature is compensated.
Compare with general technology, high-density packages electronic package emissivity detection method of the present invention has provided a kind of for the electronic package emissivity detection method based on air thermal convection temperature control technique and the temperature compensation of pointwise Ambient, by adopting high precision air thermal convection temperature control technique, High Density Packaging and complicated encapsulating structure electronic package are carried out to bulk temperature control under off working state, realize tested electronic package temperature controlled known with cordless.On this basis, adopt infrared thermal imagery detection mode and reflected temperature Compensating Control, apparent temperature and actual temperature to each tested components and parts of electronic package inside are effectively surveyed, by tested components and parts reflected temperature, compensate, realize detection and the correction of all tested components and parts emissivity, the electronic package emissivity that solves High Density Packaging and complicated encapsulating structure detects a difficult problem.The emissivity measurement that the inventive method appropriate products scope is wide, can solve various products.
The preferred embodiment that provides emissivity test and the working temperature test of a microwave components below, further illustrates the operating process of the technology of the present invention and the beneficial effect bringing.
Certain microwave components is the electronic package of high reliable communication system support, now need to survey the temperature of 6 the key components normal operating conditionss in microwave components inside.First need to detect the slin emissivity of these 6 key componentses, then carry out temperature sensing.
The step of the concrete implementation and operation of the present embodiment is as follows:
Step 1, microwave components (inoperative) environment temperature is controlled.
The microwave components of opening after cap is placed in the temperature regulating device that model is IREMISSI-I, and A face unit is upward towards infrared probe, in off working state, by " temperature control panel " set temperature T
a=50 ℃, start Intelligent heating in temperature regulating device case, until the temperature inside the box stable after, microwave components temperature T now
jwith the temperature inside the box T
abalance.
Step 2, microwave components reflection apparent temperature is measured.
(T after microwave components temperature stabilization
j=T
a), by thermal imaging system, set input parameter emissivity e=1.00, by temperature regulating device " selection of reflection measurement plate " regulation and control, select 3 kinds of test board: Al respectively
2o
3conduction band substrate (approaching with crown cap/pottery envelope amplifier material), the Cu plate (approaching with oscillator sheathing material) of surface oxidation, wrinkle aluminium foil (approaching with plastic packaging amplifier 1, plastic packaging frequency synthesizer, chip resistor 4 and chip resistor 5 materials), after infrared probe focuses on test board respectively, reflect apparent temperature and measure, detect the apparent temperature T of 6 main components of microwave components
f1, T
f2..., T
f6.
Step 3, electronic package actual temperature is measured.
Complete after the measurement of test board reflected temperature, control " selection of reflection measurement plate " and regain reflecting plate, probe focuses on microwave components again, sets respectively thermal imaging system reflected temperature parameter T
f1, T
f2..., T
f6, and adjust respectively thermal imaging system emissivity respective value e
1, e
2..., e
6, electronic package is carried out to temperature survey, constantly adjust each emissivity e
iinput value, equals electronic package actual temperature (T until thermal imaging system is measured temperature
j1, T
j2..., T
j6=T
a).
Step 4, determines electronic package emissivity.
By step 3, measure electronic package inoperative temperature, work as T
j1, T
j2..., T
j6=T
atime, corresponding thermal imaging system emissivity is adjusted the emissivity e that input value is 6 main components
1, e
2..., e
6, in Table 1.
The emissivity e measured value of 6 main components of table 1 microwave components
| Sequence number | Title material | Radiance e |
| 1 | Plastic packaging amplifier 1 | 0.95 |
| 2 | Oscillator shell | 0.60 |
| 3 | Plastic packaging frequency synthesizer | 0.95 |
| 4 | Chip resistor 4 | 0.95 |
| 5 | Chip resistor 5 | 0.95 |
| 6 | Crown cap/pottery envelope amplifier | 0.90 |
Step 5, electronic package working temperature is measured.
According to the emissivity value of 6 main components of table 1 electronic package, as thermal imaging system emissivity parameter, input respectively, make electronic package in microwave duty, survey its Temperature Distribution and 6 main components surface temperatures under working and room temperature state, result is as follows.
Microwave components, A face unit, when in running order: cavity side table Tc=28 ℃, environment temperature Ta=23 ℃; Device surface temperature T: 30.1 ℃ of amplifiers, 27.5 ℃, oscillator shell, 31.1 ℃ of frequency synthesizers, 30.6 ℃ of resistance (two resistance are 30.6 ℃), 31.2 ℃, amplifier.
The present invention is the emissivity of each components and parts of direct-detection electronic package and assembled material quickly and easily, and then further its working temperature is carried out to quantitative detection, solved the difficult problem that prior art cannot detect High Density Packaging and complicated encapsulating structure electronic package emissivity and working temperature.Electronic package emissivity is to support the most important parameter of its temperature survey, by accurate detection emissivity parameter, not only can solve the quantitative detection that electronic package working temperature is measured, can also further to electronic package, carry out the design of Quantitative Reliability evaluation and optimization according to temperature measurement result, also be the significant data of its integrated equipment system reliability design, become an important foundation of support system Engineering Reliability.
The present invention, with high precision air thermal convection technology, carries out bulk temperature control to electronic package, realizes electronic package temperature controlled known with cordless, has avoided the direct detection contact of thermopair; The emissivity that is applicable to various high-density package structure electronic packages detects, and has solved the difficult problem that complicated encapsulating structure electronic component product temperature quantitatively detects; Cross-ventilation temperature regulating device, madial wall adopts 40 °～50 ° adjustable project organizations, guaranteed madial wall infrared radiation directly by infrared window to external radiation, and do not inject infrared probe interference detection result, reduced to greatest extent casing radiation and sample reflection to the impact of surveying; The present invention is easy and simple to handle, quick, applied widely, can be used for various electronic packages and the devices such as the electronic package of volume in 200 * 200 * 80mm, hydrid integrated circuit, discrete device; Temperature regulating device can be realized the accurate control of 50 ℃～125 ℃ of temperature ranges, and the emissivity that meets electronic package exemplary operation temperature range detects.
The above embodiment has only expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a high-density packages electronic package emissivity detection method, is characterized in that, comprises the following steps:
The electronic package that cavity sealing cap is opened is placed in temperature control casing, and wherein, the tested components and parts in described electronic package expose by the described cavity sealing cap of opening; Keeping described electronic package is off working state; Temperature control casing is carried out to temperature control, make described electronic package temperature stabilization in preset value;
According to the material behavior of each tested components and parts in described electronic package, select corresponding electronic material reflection measurement plate, and be placed in the surface of described electronic package; Utilize infrared probe to aim at the infrared window on described temperature control casing, described electronic material reflection measurement plate is focused on; Described electronic material reflection measurement plate is carried out to temperature sensing, obtain the reflection apparent temperature of each tested components and parts;
By the reflection apparent temperature of each tested components and parts that obtain, as the Ambient temperature compensation to each tested components and parts;
After described Ambient temperature compensation is set, remove described electronic material reflection measurement plate; Adjust respectively the emissivity of each tested components and parts, survey the temperature of described each tested components and parts;
When the temperature of each tested components and parts that detect equals described preset value, stop described adjustment, and the detected value using the adjusted value of current each tested components and parts emissivity as each tested components and parts emissivity.
2. high-density packages electronic package emissivity detection method according to claim 1, it is characterized in that, described, temperature control casing is carried out to temperature control, make described electronic package temperature stabilization in the step of preset value, described preset value is a temperature value of 50 ℃～125 ℃.
3. high-density packages electronic package emissivity detection method according to claim 1, is characterized in that, the step of the corresponding electronic material reflection measurement of described selection plate, comprises the following steps:
According to the material behavior of each tested components and parts in described electronic package, select respectively 6 kinds of electronic material reflection measurement plates, and be placed in the surface of described electronic package; Wherein, 6 kinds of electronic material reflection measurement plates comprise Si great garden sheet, PCB copper-clad plate, Al
2o
3the Cu plate of conduction band substrate, surface oxidation, ganoid Al plate, wrinkle tinfoil paper/wrinkle aluminium foil.
4. high-density packages electronic package emissivity detection method according to claim 1, is characterized in that, described step of described electronic material reflection measurement plate being carried out to temperature sensing, comprises the following steps:
Detection system emissivity parameter is set to 1, adjusts atmospheric temperature, humidity and the infrared window transmissivity of thermal imaging system, respectively test board is carried out to temperature sensing, and correspondence is obtained the reflection apparent temperature of each tested components and parts.
5. high-density packages electronic package emissivity detection method according to claim 1, it is characterized in that, described by the reflection apparent temperature of each tested components and parts that obtain, the step as the Ambient temperature compensation to each tested components and parts, comprises the following steps:
By the reflection apparent temperature of each tested components and parts that obtain, input respectively thermal imaging system as reflected temperature parameters, as the Ambient temperature compensation to each tested components and parts.
6. high-density packages electronic package emissivity detection method according to claim 1, it is characterized in that, described temperature control casing has following architectural feature: outer wall is electric galvanized steel plain sheet, and inwall is mirror face stainless steel plate, fills the tank wall that poly-glass wool forms thermofin between inside and outside wall.
7. high-density packages electronic package emissivity detection method according to claim 1, is characterized in that, described temperature control casing has following architectural feature: upper inside is trial target placement space, and inner lower is air regulating channel.
8. high-density packages electronic package emissivity detection method according to claim 1, is characterized in that, described temperature control casing has following architectural feature: the chamber door of described temperature control casing has infrared glass detection window, for electronic package emissivity, detects.
9. high-density packages electronic package emissivity detection method according to claim 8, is characterized in that, the diameter of described infrared glass detection window is 10mm.
10. high-density packages electronic package emissivity detection method according to claim 1, is characterized in that, the inwall of described temperature control casing be designed to 40 °～50 ° adjustable.
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