CN103663933B - The manufacture method of glass plate and the manufacture device of glass plate - Google Patents
The manufacture method of glass plate and the manufacture device of glass plate Download PDFInfo
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- CN103663933B CN103663933B CN201310378504.2A CN201310378504A CN103663933B CN 103663933 B CN103663933 B CN 103663933B CN 201310378504 A CN201310378504 A CN 201310378504A CN 103663933 B CN103663933 B CN 103663933B
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- formed body
- glass plate
- heat insulating
- length direction
- insulating member
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B18/00—Shaping glass in contact with the surface of a liquid
- C03B18/02—Forming sheets
- C03B18/18—Controlling or regulating the temperature of the float bath; Composition or purification of the float bath
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B18/00—Shaping glass in contact with the surface of a liquid
- C03B18/02—Forming sheets
- C03B18/16—Construction of the float tank; Use of material for the float tank; Coating or protection of the tank wall
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Liquid Crystal (AREA)
- Glass Compositions (AREA)
Abstract
The manufacture method of glass plate of the invention and the manufacture device of glass plate can suppress the heat of the formed body discharged via the support member of formed body, and suppress the deformation as caused by the thermal creep characteristic of formed body.The manufacture method of glass plate of the invention is melten glass is overflowed and is shunted from the upper surface of formed body (52), is collaborated and the manufacture method of the glass plate of progressive forming glass plate in the lower end of formed body (52).Formed body (52) is situated between every support member (54a, 54b) and heat insulating member (56a, 56b), and applies to be set in the state of the power of length direction in the both ends of the surface of the length direction to formed body (52).Support member (54a, 54b) is contacted with formed body (52).Heat insulating member (56a, 56b) is not contacted with formed body (52), and is contacted with support member (54a, 54b).Heat insulating member (56a, 56b) has the pyroconductivity small compared with support member (54a, 54b), and the compressive strength with more than 50MPa.
Description
Technical field
The present invention relates to the manufacture method and the manufacture device of glass plate of a kind of glass plate.
Background technology
Used in the flat-panel monitor such as liquid crystal display and plasma display (FPD, flat panel display)
Glass plate needs surface have flatness higher.Generally, such glass plate is by overflow down draw (overflow down
Draw) method manufacture.In overflow downdraw, such as patent document 1 (U.S. Patent No. 3,338,696) is described, flows into formed body
And the melten glass for overflowing is flowed down along the outer surface of formed body, collaborate in the lower end of formed body, simultaneously stretched one downwards
Face is configured to the glass of banding.
In overflow downdraw, formed body is arranged in the environment of the high temperature in forming furnace.In addition, be applied with formed body by
Loading caused by the weight of deadweight and glass.Therefore, the central portion of the length direction of formed body is easily because of thermal creep characteristic
Hang down downwards.Especially, in recent years, the maximization progress of glass, formed body has in the elongated tendency of length direction, therefore,
Become more notable by hanging down of causing of thermal creep characteristic.
In order to solve the problem, such as patent document 2 (Japanese Patent Laid-Open No. Sho 46-34437 publications) is described, using
From the two ends of the length direction of formed body, in the state of the power of length direction put on into formed body, the method for supporting formed body.
In the method, formed body is in the state of being supported by support block and hot-face insulation brick, to be endowed the compression stress of length direction, because
This deformation for resulting from thermal creep characteristic is inhibited.
In addition, in overflow downdraw, the Temperature Distribution of formed body is to the glass plate of the lower end progressive forming from formed body
Quality brings considerable influence.It is preferred that formed body does not especially have temperature difference higher in its length direction.Herein, to shaping
Body applies the compression stress of length direction and supports the methods described of formed body, if via the support member of formed body to stove
The heat of the formed body of outer release is larger, then the temperature difference of the length direction of formed body expands, and the quality to glass brings shadow
Ring.Specifically, the temperature difference of the melten glass that the temperature official post of formed body is flowed down along the surface of formed body is produced, and melts glass
The thickness difference of the glass plate of the temperature official post shaping of glass is produced.That is, the temperature difference of formed body is brought to the thickness deviation of glass plate
Influence.In addition, the Temperature Distribution of formed body also brings influence to the Temperature Distribution of the environment in forming furnace.Temperature in forming furnace
Distribution also in the same manner as the temperature difference of formed body, influence is brought on the thickness deviation of glass plate.In addition, being released to outside stove to compensate
The heat of the formed body put, it is necessary to heat is supplied from the outside of forming furnace to formed body.In order to solve the problem, in patent document 2,
Formed body is supported by hot-face insulation brick.
[background technology document]
[patent document]
[patent document 1] U.S. Patent No. 3,338,696
[patent document 2] Japanese Patent Laid-Open No. Sho 46-34437 publications
The content of the invention
[invention problem to be solved]
Herein, the part of formed body is supported to apply the compression stress of length direction must have sufficiently compression strong
Degree.However, in general, the brick with compressive strength higher is larger due to pyroconductivity, and easily discharges the heat in stove.Phase
Instead, although the hot-face insulation brick pyroconductivity described in patent document 2 is smaller, without sufficient compressive strength, therefore nothing
Method applies sufficient compression stress to formed body.When the compression stress of necessity and sufficiency is applied to formed body, hot-face insulation brick quilt is produced
The danger higher of destruction.
It is an object of the invention to provide a kind of heat of the formed body for suppressing and being discharged via the support member of formed body
Measure, and the manufacture of the manufacture method and glass plate of the glass plate of deformation of the suppression as caused by the thermal creep characteristic of formed body is filled
Put.
[technological means of solve problem]
The manufacture method of glass plate of the invention is melten glass is overflowed and is shunted from the upper surface of formed body, in shaping
Collaborate and the manufacture method of the glass plate of progressive forming glass plate the lower end of body.Formed body is situated between every support member and heat insulating member,
Apply to be set in the state of the power of length direction in the both ends of the surface of the length direction to formed body.Support member connects with formed body
Touch.Heat insulating member is not contacted with formed body, and is contacted with support member.Heat insulating member has the heat transfer small compared with support member
Rate, and, the compressive strength with more than 50MPa.
In the manufacture method of glass plate of the invention, the formed body used in overflow downdraw is in the length from formed body
The two ends in direction apply in the state of the power of length direction, are arranged in forming furnace.The central portion tool of the length direction of formed body
Result from thermal creep characteristic and easily hang down downwards.Therefore, by the compression to formed body applying length direction
Power, and suppress the deformation of formed body.In addition, formed body is situated between being arranged in forming furnace every support member and heat insulating member.Specifically
For, formed body is clipped by a pair of support members at the two ends of length direction.A pair of support members and then by a pair of insulations
Part, clips at the two ends of length direction.Formed body is situated between every a pair of support members and a pair of heat insulating members, by being arranged on outside forming furnace
Compression mechanism and apply the compression stress of length direction.Because the pyroconductivity of heat insulating member is smaller, so the ring in forming furnace
The heat in border and the heat of formed body are difficult the outside release to forming furnace along heat insulating member.Therefore, using heat insulating member, and it is good
The Temperature Distribution of the environment in formed body and forming furnace is kept well.In addition, being shaped because of the heat discharged from the inside of forming furnace
The excessive temperature of the compression mechanism of body rises and exceedes the heat resisting temperature of compression mechanism, and the damaged situation of compression mechanism can be by thermal insulation
Part is avoided.In addition, heat insulating member has the compressive strength of more than 50MPa, can be substantially resistant to by the length applied to formed body
The compression stress in direction.Therefore, the deformation of formed body of thermal creep characteristic of resulting from is fully suppressed.Furthermore it is preferred that insulation
Part includes mica.
In addition, in the manufacture method of glass plate of the invention, preferably heat insulating member has 2W/ (mK) heat transfer below
Rate.Now, heat insulating member has a substantially low pyroconductivity, thus can more effectively suppress the heat in formed body and forming furnace to
Discharged outside stove.
In addition, in the manufacture method of glass plate of the invention, preferably heat insulating member has 550 DEG C of (JIS C 2116：
1982) heat resisting temperature more than.The heat resisting temperature of heat insulating member is higher, and the restriction of the setting place of heat insulating member is fewer, therefore
Heat insulating member can be made to be contacted with support member at higher temperature and set.Thus, can be by making close to the exhausted of the high temperature side of formed body
Thickness increase of thermal part etc., and improve heat-insulating property.
Heat insulating member is shaped by with the different types of material of support member.The compressive strength of heat insulating member be 50MPa~
During 1000MPa, heat insulating member can be substantially resistant to the compression stress by the length direction applied to formed body, therefore it is special to result from thermal creep
The deformation of the formed body of property is fully inhibited.The compressive strength of heat insulating member is more preferably 100MPa~1000MPa, Jin Eryou
Elect 200MPa~1000MPa as.The assay method of the compressive strength of heat insulating member is JIS K 6911：2006.
In addition, the pyroconductivity of heat insulating member is preferably 0W/ (mK)~2W/ (mK).Now, because heat insulating member has
There is substantially low pyroconductivity, therefore can more effectively suppress the heat in formed body and forming furnace to situation about being discharged outside stove.Absolutely
The pyroconductivity of thermal part is more preferably 0W/ (mK)~1W/ (mK), and then preferably 0W/ (mK)~0.5W/ (m
K).The assay method of the pyroconductivity of heat insulating member is the laser flash method under normal temperature.
On the other hand, preferably support member is the fragment of brick with fire resistance higher with larger compressive strength.It is used as
The compressive strength of the fragment of brick of support member is 300MPa or so (JIS R 2206-1：2007), the pyroconductivity of fragment of brick is 4.0W/
(mK) left and right (JIS R 2616：2001).In addition, the compressive strength of the insulation brick with thermal insulation higher is 4MPa or so
(JIS R 2206-1：2007), the pyroconductivity of insulation brick is 0.35W/ (mK) left and right (JIS R 2616：2001).I.e., absolutely
Thermal part has the pyroconductivity smaller compared with support member.In addition, heat insulating member has the compressive strength bigger compared with insulation brick.
Additionally, heat insulating member is necessarily placed at the place of the heat resisting temperature no more than it.For example, can be by increasing supporting part
The thickness of part, or support member is divided into multiple in thickness direction and is clipped ceramic fiber paper between them and is hindered
The heat transfer of each contact surface, and realize the situation.
The manufacture method of glass plate of the invention is melten glass is overflowed and is shunted from the upper surface of formed body, in shaping
Collaborate and the manufacture method of the glass plate of progressive forming glass plate the lower end of body.Formed body is situated between every support member and heat insulating member,
And apply to be set in the state of the power of length direction in the both ends of the surface of the length direction to formed body.Support member connects with formed body
Touch.Heat insulating member is not contacted with formed body, and is contacted with support member.Heat insulating member includes mica.
In the manufacture method of glass plate of the invention, in order to the heat in formed body and forming furnace is difficult to release outside stove
The heat insulating member for using includes mica.For example, bag it is micaceous ceramics have heat resistance higher, relatively low pyroconductivity and compared with
Compressive strength high, has excellent property as heat insulating member.Therefore, by using micaceous heat insulating member is wrapped, can be more
Effectively achieve the formed body for being difficult to result from the heat in forming furnace to the effect and suppression that are discharged outside stove thermal creep characteristic
The effect of deformation.
In the manufacture method of glass plate of the invention, preferably glass plate is glass substrate for plane display device, additionally, it is preferred that
It is low temperature polycrystalline silicon glass substrate.
The manufacture device of glass plate of the invention includes formed body, support member and heat insulating member.Formed body is to make
Melten glass overflows and shunts, and collaborates and the part of progressive forming glass plate in lower section.Support member is contacted with formed body.It is adiabatic
Part is not contacted with formed body, and is contacted with support member.Formed body is situated between every support member and heat insulating member, and to formed body
Length direction both ends of the surface apply length direction power in the state of set.Heat insulating member has the heat biography small compared with support member
Conductance, and, the compressive strength with more than 50MPa.
[The effect of invention]
The manufacture method of glass plate of the invention and the manufacture device of glass plate can suppress via the support member of formed body
And the heat of the formed body for discharging, and suppress the deformation as caused by the thermal creep characteristic of formed body.
Brief description of the drawings
Fig. 1 is the monolithically fabricated figure of the device for producing glass sheet of implementation method.
Fig. 2 is the figure for representing the formed body being arranged in forming furnace.
Fig. 3 is the sectional view of formed body.
[explanation of symbol]
52 formed bodies
54a left supports part (support member)
54b right supports part (support member)
The left heat insulating members of 56a (heat insulating member)
The right heat insulating members of 56b (heat insulating member)
Specific embodiment
(1) device for producing glass sheet is monolithically fabricated
Simultaneously with reference to schema, one faces the implementation of the manufacture device of the manufacture method and glass plate of glass plate of the invention
Mode is illustrated.Fig. 1 is the ideograph of of the composition of the device for producing glass sheet 200 for representing present embodiment.Glass
Board manufacturing apparatus 200 include：Melt groove 40, defecator 41, agitating device 100, building mortion 42 and conduit 43a, 43b, 43c.
Conduit 43a is connected groove 40 is melted with defecator 41.With agitating device 100 be connected defecator 41 by conduit 43b.Conduit 43c will
Agitating device 100 is connected with building mortion 42.
Melt the melten glass produced in groove 40 and defecator 41 is flowed into by conduit 43a.That is clarified in defecator 41 is molten
Melt glass and agitating device 100 is flowed into by conduit 43b.The melten glass stirred in agitating device 100 is flowed into by conduit 43c
To building mortion 42.In building mortion 42, using overflow downdraw by melten glass molding glass band.Glass tape is after
Specific size is cut in step, and manufactures glass plate.The size of the width of glass plate be, for example, 500mm~
3500mm.The size of the length direction of glass plate is, for example, 500mm~3500mm.
The glass plate manufactured by the manufacture method of glass plate of the invention and the manufacture device of glass plate is used as liquid crystal
Show the flat-panel monitor of device, plasma display, organic EL (Electroluminescence, electroluminescent) display etc.
(FPD) glass substrate is particularly suitable for.As the glass substrate of FPD, alkali-free glass or the glass containing micro alkali can be used
Glass.The high temperature viscometrics of the glass substrate of FPD are higher.Specifically, with 102.5The temperature of the sticky melten glass of pool is
More than 1500 DEG C.High temperature viscometrics glass higher must uprise temperature during shaping, therefore following be drawn by thermal creep characteristic
The deformation for rising is more notable.
Melt in groove 40 although not shown, but possess the heating arrangements such as burner.In melting groove 40, by heating arrangements by glass
Raw material melts, and produces melten glass.Frit be can substantially obtain the glass of desired composition in the way of and make
It is standby.Used as one of the composition of glass, as the glass substrate of FPD, preferable alkali-free glass contains：SiO2：50 mass %
~70 mass %, Al2O3：0 mass %~25 mass %, B2O3：1 mass %~15 mass %, MgO：0 mass %~10 matter
Amount %, CaO：0 mass %~20 mass %, SrO：0 mass %~20 mass %, BaO：0 mass %~10 mass %.Herein,
Total content of MgO, CaO, SrO and BaO is 5 mass %~30 mass %.
In addition, as the glass substrate of FPD, it is possible to use the glass containing micro alkali comprising micro alkali metal.Contain
In having the glass of micro alkali, as composition, the R' comprising 0.1 mass %~0.5 mass %2O, preferably comprising 0.2 mass %
The R' of~0.5 mass %2O.Herein, at least a kind during R' is selected from Li, Na and K.Additionally, R'2The total of the content of O is alternatively
Not up to 0.1 mass %.
In addition, by glass produced by the present invention in addition to comprising the composition, and then can also contain SnO2：0.01 matter
Amount %~1 mass % (preferably 0.01 mass %~0.5 mass %), Fe2O3：0 mass %~0.2 mass % (preferably 0.01
Quality %~0.08 mass %), it is considered to carrying capacity of environment, can also contain substantially no As2O3、Sb2O3And PbO.
The frit that will be prepared in this way is put into melting groove 40.Melt in groove 40, frit is with correspondence
The temperature of the composition in it etc. and melt.Thus, in melting groove 40, for example, obtaining the melting of 1500 DEG C~1600 DEG C of high temperature
Glass.
Melt the melten glass obtained in groove 40 and defecator 41 is flowed into by conduit 43a from groove 40 is melted.Defecator
In 41 although not shown, but in the same manner as groove 40 is melted heating arrangements are set.In defecator 41, by making melten glass further
Heat up and clarify.For example, in defecator 41, the temperature of melten glass is more than 1550 DEG C, and then rises to more than 1600 DEG C.It is molten
Melt glass to be clarified by intensification, and small bubble included in melten glass is removed.
Clarified melten glass flows into agitating device 100 from defecator 41 by conduit 43b in defecator 41.Melting
Glass passes through cooled during conduit 43b.In agitating device 100, with molten to stir compared with temperature lower temperature in defecator 41
Melt glass.For example, in agitating device 100, untill the temperature of melten glass is cooled to 1250 DEG C~1450 DEG C.Additionally, stirring dress
Put in 100, the viscosity of melten glass is, for example, 500 pool~1300 pool.Melten glass is stirred and homogeneous in agitating device 100
Change.
The melten glass being homogenised in agitating device 100 flows into building mortion from agitating device 100 by conduit 43c
42.Be further cooled by when melten glass is by conduit 43c, and be cooled to be adapted to shaping viscosity untill.Melten glass is cold
But near such as 1200 DEG C.In building mortion 42, melten glass is shaped by overflow downdraw.Specifically, flow into
The melten glass that shape dress is put in 42 is supplied to the formed body 52 being arranged in forming furnace 50.Formed body 52 is formed by refractory brick
Shape, and the cross sectional shape with wedge-like.In the upper surface of formed body 52, groove is formed along the length direction of formed body 52.
Melten glass is supplied to the groove of the upper surface of formed body 52.From groove overflow melten glass along formed body 52 a pair of sides
Flow down downwards.A pair of the melten glass flowed down along the side of formed body 52 collaborate in the lower end of formed body 52, continuously into
Shape glass tape.Then glass tape, is cut to the glass plate of desired size with being cooled downward and gradually.
(2) composition of formed body
Fig. 2 is the skeleton diagram for representing the formed body 52 being arranged in forming furnace 50.In fig. 2, the length side of formed body 52
To being left and right directions.Hereinafter, " length direction " refers to the length direction of formed body 52.Formed body 52 has main body 52a, supply molten
Melt the end face 52c of the length direction of the upper surface groove 52b and formed body 52 of glass.Fig. 3 is the formed body of the III-III lines of Fig. 2
52 sectional view.Represent a pair of the melten glass for overflowing and flowing down from the upper surface groove 52b of formed body 52 in formed body in Fig. 3
52 lower end interflow, and shape the situation of glass tape.
As shown in Fig. 2 formed body 52 is situated between every a pair of support members 54a, 54b and a pair of heat insulating members 56a, 56b, and consolidate
It is scheduled on the furnace wall 50a of forming furnace 50.Hereinafter, the support member in Fig. 2 shown in left side is referred to as left support part 54a, by Fig. 2
Support member shown in right side is referred to as right support part 54b.In addition, the heat insulating member in Fig. 2 shown in left side is referred to as into left thermal insulation
Part 56a, right heat insulating member 56b is referred to as by the heat insulating member in Fig. 2 shown in right side.
Left support part 54a is contacted with formed body 52 and left heat insulating member 56a.Left heat insulating member 56a and left support part
54a is contacted, but is not contacted with formed body 52.Left support part 54a is contacted in the end face 52c of formed body 52 with formed body 52.
Left support part 54a the face that the end face 52c with formed body 52 is contacted to face in, contacted with left heat insulating member 56a.With
On explanation similarly be applied to right support part 54b and right heat insulating member 56b.
Formed body 52 is arranged on into the state of the end face 52c of the both sides to length direction applies the power of length direction
In shape stove 50.That is, as shown in Fig. 2 applying to be compressed into the compression stress F of body 52 in length direction in formed body 52.
Right support part 54b and right heat insulating member 56b are fixed on length direction by right end plate 58b.Right heat insulating member 56b
The face contacted with right support part 54b to face in, contacted with right end plate 58b.Right end plate 58b is linked to position adjustments
Mechanism 60.Position adjusting mechanism 60 can be according to the small change of the size of formed body 52 and forming furnace 50, and by right end plate 58b
Position be micro-adjusted in length direction.Right support part 54b, right heat insulating member 56b and right end plate 58b are by forming furnace 50
Furnace wall 50a and support.Right support part 54b is inserted into and is formed in the hole of furnace wall 50a.
Left support part 54a and left heat insulating member 56a is supported in the longitudinal direction by first member plate 58a.Left heat insulating member 56a
The face contacted with left support part 54a to face in, contacted with first member plate 58a.First member plate 58a is linked to formed body pressure
Contracting mechanism 62.Left support part 54a, left heat insulating member 56a and first member plate 58a are supported by the furnace wall 50a of forming furnace 50.Left branch
Support part part 54a is inserted into and is formed in the hole of furnace wall 50a.
Formed body compression mechanism 62 alongst presses first member plate 58a towards formed body 52, thus can be to shaping
Body 52 applies compression stress F.In present embodiment, formed body compression mechanism 62 is arranged on the outside of forming furnace 50, and with cylinder
62a and piston 62b.Using the air pressure inside cylinder 62a, and piston 62b can in the longitudinal direction be moved towards formed body 52
It is dynamic.Formed body compression mechanism 62 by making the air pressure variations inside cylinder 62a, and can adjust what formed body 52 was applied
Compression stress F.
Support member 54a, 54b is the fragment of brick with heat resistance higher and compressive strength higher.Heat insulating member 56a,
56b is that have the pyroconductivity low compared with support member 54a, 54b, and with the portion of compressive strength and heat resistance higher higher
Part.Specifically, heat insulating member 56a, 56b has 2W/ (mK) pyroconductivities below, and the compression with more than 50MPa
Intensity, and with more than 550 DEG C of heat resisting temperature.
The preference of heat insulating member 56a, 56b is the micaceous heat-insulating material of bag.For example, by up to horse 550L, (share is limited
Company's ridge portion mica industry is made), up to horse 700L (limited company's ridge portion mica industry is made) or mica ceramics TMC-
110 (Japanese special Tao Ye limited companies systems) and shape block examined from the viewpoint of pyroconductivity, heat resistance and compressive strength
Consider, preferably as heat insulating member 56a, 56b.
(3) feature
(3-1)
In the device for producing glass sheet 200 of present embodiment, the shaping of the glass tape formed by overflow downdraw is made
Formed body 52, as shown in Fig. 2 the end face 52c in the both sides to length direction applies the state of the compression stress F of length direction
Under, it is arranged on the inside of forming furnace 50.
Formed body 52 is arranged in the environment of the high temperature in forming furnace 50, and in formed body 52, apply by deadweight and
Loading caused by the weight of glass tape.Therefore, the central portion of the length direction of formed body 52 has and holds because of thermal creep characteristic
The tendency for easily hanging down downwards.Because the lower end of formed body 52 is the point of continuously molding glass band, therefore result from thermal creep
The deformation of the formed body 52 of characteristic may bring influence to the quality of manufactured glass plate.
In addition, the Temperature Distribution of formed body 52 quality of the glass plate of the lower end progressive forming from formed body 52 is brought compared with
Big influence.Specifically, the melting glass that the temperature official post of the length direction of formed body 52 is flowed down along the surface of formed body 52
The temperature difference of the length direction of glass is produced.The length direction of the temperature official post of the length direction of melten glass glass plate formed thereby
Thickness difference produce.That is, the temperature difference of the length direction of formed body 52 brings influence to the thickness deviation of glass plate.In addition, into
The Temperature Distribution of body 52 also brings influence to the Temperature Distribution of the environment in forming furnace 50.The length of the environment in forming furnace 50
The temperature difference in direction also in the same manner as the temperature difference of the length direction of formed body 52, influence is brought on the thickness deviation of glass plate.
In present embodiment, by applying the compression stress F of length direction to formed body 52, and it is special to suppress to result from thermal creep
The deformation of the formed body 52 of property.Compression stress F is the power that formed body 52 is compressed in length direction, can suppress the length of formed body 52
The deformation that the central portion in direction hangs down downwards.
In addition, formed body 52 is situated between every support member 54a, 54b and heat insulating member 56a, 56b, forming furnace 50 is supported on
It is internal.As shown in Fig. 2 formed body 52 is clipped in the both sides of length direction by a pair of support members 54a, 54b, and then, by a pair
Heat insulating member 56a, 56b are clipped.Heat insulating member 56a, 56b have 2W/ (mK) relatively low pyroconductivities below, therefore, into
The heat of the environment in shape stove 50 and the heat of formed body 52 are difficult to be released to the outside of forming furnace 50 along heat insulating member 56a, 56b
Put.Therefore, using heat insulating member 56a, 56b, the deterioration of the Temperature Distribution in formed body 52 and forming furnace 50 can be prevented.It is specific next
Say, using heat insulating member 56a, 56b, and the reduction of the temperature difference of the length direction of formed body 52, thus, the environment in forming furnace 50
The temperature difference of length direction also reduce.Therefore, heat insulating member 56a, 56b has the glass for reducing and being shaped from the lower end of formed body 52
The effect of the thickness difference of the length direction of glass plate.
In addition, using heat insulating member 56a, 56b, can avoid being arranged on shaping because of the heat discharged from the inside of forming furnace 50
The formed body compression mechanism 62 of the outside of stove 50 is damaged.Specifically, the lining of the cylinder 62a of formed body compression mechanism 62 can be avoided
Pad is deteriorated because of heat, it is impossible to maintain sealing property.
In addition, heat insulating member 56a, 56b have the compressive strength of more than 50MPa, therefore, can be substantially resistant to by by formed body pressure
The compression stress F of the length direction that contracting mechanism 62 is applied to formed body 52.Therefore, it is possible to use heat insulating member 56a, 56b, fully
Suppression result from thermal creep characteristic formed body 52 deformation.
(3-2)
The half of TFT (thin film transistor, thin film transistor (TFT)) etc. is formed on the surface of the glass substrate of FPD
Conductor element.In recent years, in order to realize the further High precision of display equipment, it is desirable to instead of conventional α-SiTFT,
Low temperature p-Si (polysilicon) TFT and oxide semiconductor are formed in the technology on the surface of glass substrate.
However, the step of low temperature p-SiTFT and oxide semiconductor are formed in the surface of glass substrate with by α-
The step of SiTFT is formed in the surface of glass substrate is compared to, it is necessary to heat treatment at higher temperature.Therefore, by low temperature p-Si
TFT and oxide semiconductor are formed in the glass plate on surface, it is desirable to the less property of percent thermal shrinkage.In order that percent thermal shrinkage subtracts
It is small, preferably improve the strain point of glass.However, there is strain point glass high liquidus temperature to uprise, it is viscous under liquidus temperature
Degree is the tendency of liquid phase viscosity step-down.In addition, the devitrification in order to prevent glass, it is necessary to the temperature of melten glass when making shaping compared with
The temperature of melten glass when α-SiTFT are with the shaping of glass substrate is higher, therefore, it is necessary to make environment inside forming furnace more
High temperature.Therefore, it is formed in the manufacturing step of the glass substrate on surface by low temperature p-SiTFT and oxide semiconductor, is risen
Because the deformation of the thermal creep characteristic in formed body becomes more notable.
The device for producing glass sheet 200 of present embodiment is come by using heat insulating member 56a, 56b with the feature
Support formed body 52, and be particularly suitable for using the flat-panel monitor of low temperature p-SiTFT and using the flat of oxide semiconductor
The manufacture of the glass substrate of panel display.Specifically, be particularly suitable for using low temperature p-SiTFT liquid crystal display,
And using oxide semiconductor liquid crystal display glass substrate manufacture.
By low temperature p-SiTFT and oxide semiconductor be formed in the glass plate on surface for example have more than 655 DEG C answer
Height, or, the liquid phase viscosity with the 45000 pool above.In addition, the composition of the glass plate is preferably SiO2：52 mass %~78
Quality %, Al2O3：3 mass %~25 mass %, B2O3：1 mass %~15 mass %, RO：3 mass %~20 mass %.This
Place, R be contain in glass plate selected from Mg, Ca, Sr and Ba at least a kind of composition.The glass plate is preferably with (SiO2+
Al2O3)/B2O3Represented mass ratio is 7~20 alkali-free glass or the glass containing micro alkali.
Low temperature p-SiTFT and oxide semiconductor are formed in the glass plate on surface to have strain point higher,
And with (SiO2+Al2O3Mass ratio represented by)/RO is more than 5, preferably more than 6, and then preferably more than 7.5.In addition, should
If glass plate β-OH values are too small, then the viscosity in high-temperature area is uprised and meltability reduction, in addition, it is also desirable to special ring
Border controls and cost uprises.On the other hand, if glass plate β-OH values are excessive, then strain point step-down.Therefore, the glass plate
Preferably β-the OH with 0.05/mm~0.3/mm are worth.In addition, the glass plate is in order to have strain point higher and prevent liquid phase
The reduction of viscosity, and the mass ratio represented with CaO/RO is as more than 0.3, preferably more than 0.5, more preferably more than 0.65.Separately
Outward, it is considered to carrying capacity of environment, the glass plate is preferably and contains substantially no As2O3、Sb2O3And PbO.
Claims (7)
1. a kind of manufacture method of glass plate, its melten glass for making to be cooled near 1200 DEG C overflows from the upper surface of formed body
Go out and shunt, collaborate and progressive forming glass plate in the lower end of the formed body, the glass plate is by low temperature polycrystalline silicon TFT
Or oxide semiconductor is formed in the glass plate on surface,
The formed body be situated between contacted every the support member contacted with the formed body and not with the formed body and with the support
The heat insulating member of component contact, the state of the power of the length direction is applied in the both ends of the surface of the length direction to the formed body
Lower setting,
The heat insulating member has the small pyroconductivity of the support member to reduce the temperature of the length direction of the formed body
Degree is poor, and with substantially resistant to the compressive strength of the compression stress by the length direction applied to the formed body, and can wrapping
Containing mica.
2. the manufacture method of glass plate according to claim 1, wherein
The heat insulating member has 2W/ (mK) pyroconductivities below.
3. the manufacture method of glass plate according to claim 1, wherein
The heat insulating member has more than 550 DEG C of heat resisting temperature.
4. the manufacture method of glass plate according to claim 2, wherein
The heat insulating member has more than 550 DEG C of heat resisting temperature.
5. a kind of manufacture method of glass plate, its melten glass for making to be cooled near 1200 DEG C overflows from the upper surface of formed body
Go out and shunt, collaborate and progressive forming glass plate in the lower end of the formed body, the glass plate is by low temperature polycrystalline silicon TFT
Or oxide semiconductor is formed in the glass plate on surface,
The formed body be situated between contacted every the support member contacted with the formed body and not with the formed body and with the support
The heat insulating member of component contact, the state of the power of the length direction is applied in the both ends of the surface of the length direction to the formed body
Lower setting,
The heat insulating member includes mica to reduce the temperature difference of the length direction of the formed body.
6. the manufacture method of glass plate according to any one of claim 1 to 5, wherein
The glass plate is glass substrate for plane display device.
7. a kind of manufacture device of glass plate, it includes：
Formed body, is used to make the melten glass being cooled near 1200 DEG C overflow and shunt, and collaborates and progressive forming in lower section
Glass plate, the glass plate is the glass plate that low temperature polycrystalline silicon TFT or oxide semiconductor are formed in surface；
Support member, contacts with the formed body；And
Heat insulating member, does not contact with the formed body and is contacted with the support member；
The formed body is situated between every the support member and the heat insulating member, and at the two ends of the length direction to the formed body
Set in the state of the power of the face applying length direction,
The heat insulating member has the small pyroconductivity of the support member to reduce the temperature of the length direction of the formed body
Degree is poor, and with substantially resistant to the compressive strength of the compression stress by the length direction applied to the formed body, and can wrapping
Containing mica.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-189578 | 2012-08-30 | ||
| JP2012189578A JP6017893B2 (en) | 2012-08-30 | 2012-08-30 | Glass plate manufacturing method and glass plate manufacturing apparatus |
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| Publication Number | Publication Date |
|---|---|
| CN103663933A CN103663933A (en) | 2014-03-26 |
| CN103663933B true CN103663933B (en) | 2017-06-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310378504.2A Active CN103663933B (en) | 2012-08-30 | 2013-08-27 | The manufacture method of glass plate and the manufacture device of glass plate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6017893B2 (en) |
| KR (1) | KR101660092B1 (en) |
| CN (1) | CN103663933B (en) |
| TW (1) | TWI538890B (en) |
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| CN113415977B (en) * | 2021-05-19 | 2023-06-09 | 河南旭阳光电科技有限公司 | Protective device, heating furnace and deformation prevention method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10167815A (en) * | 1996-11-29 | 1998-06-23 | Shinagawa Refract Co Ltd | Refractory for head of stopper of tundish |
| JP2004284843A (en) * | 2003-03-20 | 2004-10-14 | Nippon Electric Glass Co Ltd | Apparatus and method of forming plate glass |
| CN1579992A (en) * | 2003-08-08 | 2005-02-16 | 桂林矿产地质研究院 | Mica composite heat-proof insulated antistatic-pressure board |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3338696A (en) | 1964-05-06 | 1967-08-29 | Corning Glass Works | Sheet forming apparatus |
| US5216727A (en) * | 1992-05-08 | 1993-06-01 | At&T Bell Laboratories | Integrated nonlinear waveguide spectrometer |
| JP3142767B2 (en) * | 1996-01-17 | 2001-03-07 | トピー工業株式会社 | Manufacturing method of synthetic mica |
| JP4634437B2 (en) * | 2007-12-27 | 2011-02-16 | ザイオソフト株式会社 | Developed image projecting method, developed image projecting program, developed image projecting apparatus |
-
2012
- 2012-08-30 JP JP2012189578A patent/JP6017893B2/en active Active
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2013
- 2013-08-06 TW TW102128152A patent/TWI538890B/en active
- 2013-08-26 KR KR1020130100946A patent/KR101660092B1/en active IP Right Grant
- 2013-08-27 CN CN201310378504.2A patent/CN103663933B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10167815A (en) * | 1996-11-29 | 1998-06-23 | Shinagawa Refract Co Ltd | Refractory for head of stopper of tundish |
| JP2004284843A (en) * | 2003-03-20 | 2004-10-14 | Nippon Electric Glass Co Ltd | Apparatus and method of forming plate glass |
| CN1579992A (en) * | 2003-08-08 | 2005-02-16 | 桂林矿产地质研究院 | Mica composite heat-proof insulated antistatic-pressure board |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101660092B1 (en) | 2016-09-26 |
| JP2014047088A (en) | 2014-03-17 |
| KR20140029232A (en) | 2014-03-10 |
| JP6017893B2 (en) | 2016-11-02 |
| TW201408606A (en) | 2014-03-01 |
| CN103663933A (en) | 2014-03-26 |
| TWI538890B (en) | 2016-06-21 |
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