CN103663933A - Glass pane manufacturing method and glass pane manufacturing device - Google Patents
Glass pane manufacturing method and glass pane manufacturing device Download PDFInfo
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- CN103663933A CN103663933A CN201310378504.2A CN201310378504A CN103663933A CN 103663933 A CN103663933 A CN 103663933A CN 201310378504 A CN201310378504 A CN 201310378504A CN 103663933 A CN103663933 A CN 103663933A
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- Prior art keywords
- molding
- heat insulating
- insulating member
- glass
- sheet glass
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B18/00—Shaping glass in contact with the surface of a liquid
- C03B18/02—Forming sheets
- C03B18/18—Controlling or regulating the temperature of the float bath; Composition or purification of the float bath
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B18/00—Shaping glass in contact with the surface of a liquid
- C03B18/02—Forming sheets
- C03B18/16—Construction of the float tank; Use of material for the float tank; Coating or protection of the tank wall
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Liquid Crystal (AREA)
- Glass Compositions (AREA)
Abstract
The invention provides a glass pane manufacturing method and a glass pane manufacturing device, wherein the heat dispassion of a shaped body is inhibited via a support member for the shaped body. Meanwhile, the deformation of the shaped body due to the thermal creep thereof can be avoided. The glass pane manufacturing method comprises the steps of overflowing the molten glass from the upper end face of the shaped body (52) and then shunting the molten glass; and converging the molten glass at the lower end of the shaped body (52) to continuously form a glass pane. The shaped body (52) is arranged in such a manner that a force is respectively applied onto the two end surfaces of the shaped body along the length direction by means of supporting members (54a, 54b) and heat insulating members (56a, 56b). The supporting members (54a, 54b) are in contact with the shaped body (52), while the heat insulating members (56a, 56b) are not in contact with the shaped body (52) while being in contact with the supporting members (54a, 54b). Compared with the supporting members (54a, 54b), the heat insulating members (56a, 56b) are smaller in heat conductivity, and the compression strength thereof are larger than has over 50 MPa.
Description
Technical field
The present invention relates to a kind of manufacture method of sheet glass and the manufacturing installation of sheet glass.
Background technology
The sheet glass using in the flat-panel monitor such as liquid-crystal display and plasma display (FPD, flat panel display) requires surface to have higher Flatness.Conventionally, such sheet glass is by overflow down draw (overflow down draw) method manufacture.In overflow downdraw, as patent documentation 1 (United States Patent (USP) the 3rd, 338, No. 696) institute record, the melten glass that flows into molding and overflow flows down along the outside surface of molding, and at the interflow, lower end of molding, one side is configured as banded glass by the one side that stretches downwards.
In overflow downdraw, molding is arranged under the environment of the high temperature in forming furnace.In addition, in molding, be applied with by conducting oneself with dignity and the caused loading of weight of glass.Therefore, the central part of the length direction of molding is easily because thermal creep characteristic hangs down downwards.Especially, in recent years, the maximization of glass progress, molding has in the elongated tendency of length direction, and therefore, hanging down of being caused by thermal creep characteristic becomes more remarkable.
In order to address this problem, as patent documentation 2 (the clear 46-34437 communique of Japanese Patent Laid-Open) is recorded, use at the two ends of the length direction from molding, the power of length direction is put under the state of molding, support to the method for body.In the method, molding is under the state being supported by back-up block and fireinsulation brick, is endowed the force of compression of length direction, and the distortion of thermal creep characteristic of therefore resulting from is inhibited.
In addition, in overflow downdraw, the temperature distribution of molding is brought considerable influence to the quality of the sheet glass of the lower end continuous molding from molding.Be preferably body and especially at its length direction, do not there is higher temperature head.Herein, being applied to the force of compression of length direction, molding supports in the described method of body, if the heat of the molding discharging outside stove via the support component of molding is larger, the temperature head of the length direction of molding expands so, and the quality of glass is brought to impact.Specifically, the temperature head of the melten glass that the temperature official post of molding flows down along the surface of molding produces, and the thickness difference of the sheet glass that the temperature official post of melten glass is shaped produces.That is, the temperature head of molding is brought impact to the thickness deviation of sheet glass.In addition, the temperature distribution of molding is also brought impact to the temperature distribution of the environment in forming furnace.Temperature distribution in forming furnace also with the temperature head of molding similarly, the thickness deviation of sheet glass is brought to impact.In addition, in order to compensate the heat of the molding discharging outside stove, must to molding, supply with heat from the outside of forming furnace.In order to address this problem, in patent documentation 2, molding is supported by fireinsulation brick.
[background technology document]
[patent documentation]
[patent documentation 1] United States Patent (USP) the 3rd, 338, No. 696
The clear 46-34437 communique of [patent documentation 2] Japanese Patent Laid-Open
Summary of the invention
[inventing problem to be solved]
The parts that support to body in order to apply the force of compression of length direction herein, must have sufficient compressive strength.Yet, in general, there is the brick of higher compressive strength because thermal conductivity is larger, and easily discharge the heat in stove.On the contrary, although the fireinsulation brick thermal conductivity that patent documentation 2 is recorded is less, do not there is sufficient compressive strength, therefore cannot apply sufficient force of compression to molding.When molding is applied to the force of compression of necessity and sufficiency, produce the destroyed higher danger of fireinsulation brick.
The object of the present invention is to provide a kind of heat of the molding that suppresses to discharge via the support component of molding, and suppress the manufacture method of sheet glass and the manufacturing installation of sheet glass by the caused distortion of thermal creep characteristic of molding.
[technique means of dealing with problems]
The manufacture method of sheet glass of the present invention is to make melten glass overflow and shunt from the upper surface of molding, at the lower end interflow of molding and the manufacture method of the sheet glass of continuous molding sheet glass.Molding is situated between every support component and heat insulating member, under the state of power that the both ends of the surface of the length direction of molding is applied to length direction, arranges.Support component contacts with molding.Heat insulating member does not contact with molding, and contacts with support component.Heat insulating member has the thermal conductivity little compared with support component, and, there is compressive strength more than 50MPa.
In the manufacture method of sheet glass of the present invention, the molding using in overflow downdraw applies at the two ends of the length direction from molding the state of power of length direction, is arranged in forming furnace.The central part of the length direction of molding has the tendency that results from thermal creep characteristic and easily hang down downwards.Therefore, by molding being applied to the force of compression of length direction, and be suppressed to the distortion of body.In addition, molding is situated between and is arranged in forming furnace every support component and heat insulating member.Specifically, molding, by a pair of support component, clips at the two ends of length direction.A pair of support component and then by a pair of heat insulating member, clips at the two ends of length direction.Molding is situated between every a pair of support component and a pair of heat insulating member, applies the force of compression of length direction by being arranged on the compressing mechanism outside forming furnace.Because the thermal conductivity of heat insulating member is less, the outside so the heat of the environment in forming furnace and the heat of molding are difficult for along heat insulating member to forming furnace discharges.Therefore, utilize heat insulating member, and be held in well the temperature distribution of the environment in body and forming furnace.In addition, the excessive temperature of the compressing mechanism of the heat molding discharging because of inside from forming furnace rises and surpasses the heat resisting temperature of compressing mechanism, and the situation of compressing mechanism breakage can be avoided by heat insulating member.In addition, heat insulating member has compressive strength more than 50MPa, can fully tolerate the force of compression of the length direction that molding is applied.Therefore, resulting from the distortion of molding of thermal creep characteristic is fully suppressed.In addition, preferably heat insulating member comprises mica.
In addition, in the manufacture method of sheet glass of the present invention, preferably heat insulating member has the following thermal conductivity of 2W/ (mK).Now, heat insulating member has fully low thermal conductivity, and the heat that therefore can more effectively be suppressed in body and forming furnace discharges outside stove.
In addition, in the manufacture method of sheet glass of the present invention, preferably heat insulating member has 550 ℃ (JIS C2116:1982) above heat resisting temperature.Therefore the heat resisting temperature of heat insulating member is higher, and the restriction that place is set of heat insulating member is fewer, can make heat insulating member contact and arrange with the support component of high temperature more.Thus, can be by making to approach the thickness increase etc. of heat insulating member of the high temperature side of molding, and improve heat-insulating property.
Heat insulating member is by being shaped with the different types of material of support component.When the compressive strength of heat insulating member is 50MPa～1000MPa, heat insulating member can fully tolerate the force of compression of the length direction that molding is applied, and the distortion of molding of thermal creep characteristic of therefore resulting from is fully inhibited.The compressive strength of heat insulating member is 100MPa～1000MPa more preferably, and then is preferably 200MPa～1000MPa.The measuring method of the compressive strength of heat insulating member is JIS K6911:2006.
In addition, the thermal conductivity of heat insulating member is preferably 0W/ (mK)～2W/ (mK).Now, because heat insulating member has fully low thermal conductivity, therefore can more effectively be suppressed to the situation that the heat in body and forming furnace discharges outside stove.The thermal conductivity of heat insulating member is 0W/ (mK)～1W/ (mK) more preferably, and then is preferably 0W/ (mK)～0.5W/ (mK).The measuring method of the thermal conductivity of heat insulating member is the laser flash method under normal temperature.
On the other hand, preferably support component is the fragment of brick with higher fire performance and larger compressive strength.The compressive strength that is used as the fragment of brick of support component is 300MPa left and right (JIS R2206-1:2007), and the thermal conductivity of fragment of brick is 4.0W/ (mK) left and right (JIS R2616:2001).In addition, the compressive strength with the insulation brick of higher heat insulating ability is 4MPa left and right (JIS R2206-1:2007), and the thermal conductivity of insulation brick is 0.35W/ (mK) left and right (JIS R2616:2001).That is, heat insulating member has the thermal conductivity less compared with support component.In addition, heat insulating member has the compressive strength larger compared with insulation brick.
In addition, heat insulating member must be arranged on the place of the heat resisting temperature that is no more than it.For example, can pass through to increase the thickness of support component, or support component is divided into a plurality of and between them, clips ceramic fiber paper at thickness direction, hinder the thermal conduction of each contact surface, and realize described situation.
The manufacture method of sheet glass of the present invention is to make melten glass overflow and shunt from the upper surface of molding, at the lower end interflow of molding and the manufacture method of the sheet glass of continuous molding sheet glass.Molding is situated between every support component and heat insulating member, and arranges under the state of power that the both ends of the surface of the length direction of molding is applied to length direction.Support component contacts with molding.Heat insulating member does not contact with molding, and contacts with support component.Heat insulating member comprises mica.
In the manufacture method of sheet glass of the present invention, the heat insulating member using for the heat in molding and forming furnace being difficult for discharge outside stove comprises mica.For example, wrap micaceous pottery and there is higher thermotolerance, lower thermal conductivity and higher compressive strength, as heat insulating member, there is excellent character.Therefore, by use, wrap micaceous heat insulating member, can more effectively reach the effect of distortion that is difficult for the effect that the heat in forming furnace is discharged outside stove and suppresses to result from the molding of thermal creep characteristic.
In the manufacture method of sheet glass of the present invention, preferred glass plate is glass substrate for plane display device, in addition, is preferably low temperature polycrystalline silicon glass substrate.
The manufacturing installation of sheet glass of the present invention comprises molding, support component and heat insulating member.Molding be with so that melten glass overflow and shunt, below interflow and the parts of continuous molding sheet glass.Support component contacts with molding.Heat insulating member does not contact with molding, and contacts with support component.Molding is situated between every support component and heat insulating member, and arranges under the state of power that the both ends of the surface of the length direction of molding is applied to length direction.Heat insulating member has the thermal conductivity little compared with support component, and, there is compressive strength more than 50MPa.
[effect of invention]
The heat of the molding that the manufacture method of sheet glass of the present invention and the manufacturing installation of sheet glass can suppress to discharge via the support component of molding, and suppress the caused distortion of thermal creep characteristic by molding.
Accompanying drawing explanation
Fig. 1 is the whole pie graph of the device for producing glass sheet of embodiment.
Fig. 2 means the figure that is arranged on the molding in forming furnace.
Fig. 3 is the sectional view of molding.
[explanation of symbol]
52 moldinies
54a left support parts (support component)
54b right support parts (support component)
The left heat insulating member of 56a (heat insulating member)
The right heat insulating member of 56b (heat insulating member)
Embodiment
(1) integral body of device for producing glass sheet forms
One side is with reference to graphic, and an embodiment in the face of the manufacture method of sheet glass of the present invention and the manufacturing installation of sheet glass describes.Fig. 1 means the mode chart of an example of formation of the device for producing glass sheet 200 of present embodiment.Device for producing glass sheet 200 comprises: melt groove 40, clarifying tank 41, whipping appts 100, building mortion 42 and conduit 43a, 43b, 43c.Conduit 43a will melt groove 40 and be connected with clarifying tank 41.Conduit 43b is connected clarifying tank 41 with whipping appts 100.Conduit 43c is connected whipping appts 100 with building mortion 42.
Melt the melten glass producing in groove 40 and flow into clarifying tank 41 by conduit 43a.In clarifying tank 41, the melten glass of clarification flows into whipping appts 100 by conduit 43b.The melten glass stirring in whipping appts 100 flows into building mortion 42 by conduit 43c.In building mortion 42, utilize overflow downdraw and by melten glass molding glass band.Glass ribbon after step in be cut to specific size, and manufacture sheet glass.The size of the width of sheet glass is for example 500mm～3500mm.The size of the length direction of sheet glass is for example 500mm～3500mm.
By the manufacture method of sheet glass of the present invention and the manufacturing installation of sheet glass and the sheet glass of manufacturing as the glass substrate of flat-panel monitor (FPD) use of liquid-crystal display, plasma display, organic EL (Electroluminescence, electroluminescent) indicating meter etc., be particularly suitable for.The glass substrate of using as FPD, the glass that can use non-alkali glass or contain micro-alkali.The high temperature viscosity of the glass substrate that FPD uses is higher.Specifically, have 10
2.5the temperature of the melten glass of the viscosity of pool is more than 1500 ℃.The temperature when glass that high temperature viscosity is higher must make to be shaped uprises, therefore following more remarkable by the caused distortion of thermal creep characteristic.
Though not shown in melting groove 40, possess the heating arrangements such as burner.Melt in groove 40, by heating arrangements, frit is melted, and produce melten glass.Frit be with can obtain in fact desired composition glass mode and prepare.As an example of the composition of glass, the glass substrate of using as FPD and preferably non-alkali glass contain: SiO
2: 50 quality %～70 quality %, A1
2o
3: 0 quality %～25 quality %, B
2o
3: 1 quality %～15 quality %, MgO:0 quality %～10 quality %, CaO:0 quality %～20 quality %, SrO:0 quality %～20 quality %, BaO:0 quality %～10 quality %.Herein, the content of the total of MgO, CaO, SrO and BaO is 5 quality %～30 quality %.
In addition, the glass substrate of using as FPD, also can use and comprise the alkali-metal glass that contains micro-alkali of trace.In the glass that contains micro-alkali, as composition, the R ' that comprises 0.1 quality %～0.5 quality %
2o, is preferably the R ' that comprises 0.2 quality %～0.5 quality %
2o.Herein, R ' is for being selected from least a kind in Li, Na and K.In addition R ',
2the total of the content of O also can be and does not reach 0.1 quality %.
In addition, the glass of being manufactured by the present invention, except comprising described composition, also can and then contain SnO
2: 0.01 quality %～1 quality % (being preferably 0.01 quality %～0.5 quality %), Fe
2o
3: 0 quality %～0.2 quality % (being preferably 0.01 quality %～0.08 quality %), consider carrying capacity of environment, can not contain in fact As yet
2o
3, Sb
2o
3and PbO.
The frit of preparation is in this way fed into and is melted in groove 40.Melt in groove 40, frit melts with the temperature of the composition corresponding to it etc.Thus, melt in groove 40, for example, obtain the melten glass of the high temperature of 1500 ℃～1600 ℃.
Melt the melten glass obtaining in groove 40 and by conduit 43a, flow into clarifying tank 41 from melting groove 40.Though not shown in clarifying tank 41, with melting groove 40, heating arrangements is similarly being set.In clarifying tank 41, by making melten glass further heat up and clarify.For example, in clarifying tank 41, the temperature of melten glass is more than 1550 ℃, and then rises to more than 1600 ℃.Melten glass is clarified by heating up, and the small bubble comprising in melten glass is removed.
In clarifying tank 41, clarified melten glass flows into whipping appts 100 from clarifying tank 41 by conduit 43b.Melten glass is cooled during by conduit 43b.In whipping appts 100, with the lower temperature of the temperature compared with in clarifying tank 41, stir melten glass.For example, in whipping appts 100, the temperature of melten glass is cooled to till 1250 ℃～1450 ℃.In addition,, in whipping appts 100, the viscosity of melten glass is for example 500 pool～1300 pools.Melten glass is stirred and homogenizes in whipping appts 100.
The melten glass being homogenized in whipping appts 100 flows into building mortion 42 from whipping appts 100 by conduit 43c.Melten glass is further cooled during by conduit 43c, and till being cooled to the viscosity that is applicable to being shaped.Near melten glass is for example cooled to 1200 ℃.In building mortion 42, the shaping melten glass by overflow downdraw.Specifically, the melten glass flowing in building mortion 42 is supplied to the molding 52 being arranged in forming furnace 50.Molding 52 is shaped by refractory brick, and has the cross-sectional shape of wedge-like.At the upper surface of molding 52, along the length direction of molding 52 and forming groove.Melten glass is supplied to the groove of the upper surface of molding 52.The melten glass overflowing from groove flows down downwards along a pair of side of molding 52.The a pair of melten glass flowing down along the side of molding 52 is at the interflow, lower end of molding 52, continuously molding glass band.Glass ribbon, along with downward and being gradually cooled, then, is cut to desired big or small sheet glass.
(2) formation of molding
Fig. 2 means the sketch chart of the molding 52 being arranged in forming furnace 50.In Fig. 2, the length direction of molding 52 is left and right directions.Below, " length direction " refers to the length direction of molding 52.Molding 52 has main body 52a, supplies with the end face 52c of the upper surface groove 52b of melten glass and the length direction of molding 52.Fig. 3 is the sectional view of molding 52 of the III-III line of Fig. 2.In Fig. 3, representing from the upper surface groove 52b of molding 52 overflow and a pair of melten glass that flows down at the interflow, lower end of molding 52, and the situation of shaping glass ribbon.
As shown in Figure 2, molding 52 is situated between every a pair of support component 54a, 54b and a pair of heat insulating member 56a, 56b, and is fixed on the furnace wall 50a of forming furnace 50.Below, the support component shown in left side in Fig. 2 is called to left support parts 54a, the support component shown in right side in Fig. 2 is called to right support parts 54b.In addition, the heat insulating member shown in left side in Fig. 2 is called to left heat insulating member 56a, the heat insulating member shown in right side in Fig. 2 is called to right heat insulating member 56b.
Molding compressing mechanism 62 is alongst pressed first member plate 58a towards molding 52, can apply force of compression F to molding 52 thus.In present embodiment, molding compressing mechanism 62 is arranged on the outside of forming furnace 50, and has cylinder 62a and piston 62b.Utilize the air pressure of cylinder 62a inside, and piston 62b can move in the longitudinal direction towards molding 52.Molding compressing mechanism 62 can be by making the air pressure variations of cylinder 62a inside, and regulate the force of compression F that molding 52 is applied.
The preference of heat insulating member 56a, 56b is the micaceous thermal insulation material of bag.For example, by reaching horse 550L (the mica industry of ridge portion of limited-liability company is made), reach horse 700L (the mica industry of ridge portion of limited-liability company is made) or mica ceramics TMC-110 (Japanese special Tao Ye limited-liability company system) and the piece being shaped is considered from the viewpoint of thermal conductivity, thermotolerance and compressive strength, preferably as heat insulating member 56a, 56b.
(3) feature
(3-1)
In the device for producing glass sheet 200 of present embodiment, the molding 52 being used by the shaping of the formed glass ribbon of overflow downdraw, as shown in Figure 2, at the end face 52c to the both sides of length direction, apply under the state of force of compression F of length direction, be arranged on the inside of forming furnace 50.
In addition, the temperature distribution of molding 52 brings greater impact the quality of the sheet glass of the lower end continuous molding from molding 52.The temperature head of the length direction of the melten glass that specifically, the temperature official post of the length direction of molding 52 flows down along the surface of molding 52 produces.The thickness difference of the length direction of the sheet glass of the temperature official post formed thereby of the length direction of melten glass produces.That is, the temperature head of the length direction of molding 52 is brought impact to the thickness deviation of sheet glass.In addition, the temperature distribution of molding 52 is also brought impact to the temperature distribution of the environment in forming furnace 50.The temperature head of the length direction of the environment in forming furnace 50 also with the temperature head of the length direction of molding 52 similarly, the thickness deviation of sheet glass is brought to impact.
In present embodiment, by molding 52 being applied to the force of compression F of length direction, and suppress to result from the distortion of the molding 52 of thermal creep characteristic.Force of compression F is the power in length direction compression by molding 52, can be suppressed to the distortion that the central part of the length direction of body 52 hangs down downwards.
In addition, molding 52 is situated between every support component 54a, 54b and heat insulating member 56a, 56b, is supported on the inside of forming furnace 50.As shown in Figure 2, molding 52, in the both sides of length direction, is clipped by a pair of support component 54a, 54b, and then, by a pair of heat insulating member 56a, 56b, clipped. Heat insulating member 56a, 56b have the following lower thermal conductivity of 2W/ (mK), and therefore, the heat of the heat of the environment in forming furnace 50 and molding 50 is difficult for along heat insulating member 56a, 56b and discharges to the outside of forming furnace 50.Therefore, utilize heat insulating member 56a, 56b, can prevent the deterioration of the temperature distribution in molding 52 and forming furnace 50.Specifically, utilize heat insulating member 56a, 56b, and the temperature head of the length direction of molding 52 reduces, thus, the temperature head of the length direction of the environment in forming furnace 50 also reduces.Therefore, heat insulating member 56a, 56b have the effect of the thickness difference of the length direction that reduces the sheet glass being shaped from the lower end of molding 52.
In addition, utilize heat insulating member 56a, 56b, can avoid being arranged on because of the heat that the inside from forming furnace 50 discharges outside molding compressing mechanism 62 breakages of forming furnace 50.Specifically, can avoid molding compressing mechanism 62 cylinder 62a liner because of heat deteriorated, cannot maintain sealing property.
In addition, heat insulating member 56a, 56b have compressive strength more than 50MPa, therefore, can fully tolerate the force of compression F of the length direction being applied by 62 pairs of moldinies 50 of molding compressing mechanism.Therefore, also can use heat insulating member 56a, 56b, fully suppress to result from the distortion of the molding 50 of thermal creep characteristic.
(3-2)
The semiconductor element of the surface formation TFT (thin film transistor, thin film transistor) of the glass substrate of using at FPD etc.In recent years, in order to realize the further high-precision refinement of display equipment, require to replace α-SiTFT in the past, low temperature p-Si (polysilicon) TFT and oxide semiconductor are formed on to the surperficial technology of glass substrate.
Yet, low temperature p-SiTFT and oxide semiconductor are formed on to the surperficial step of glass substrate and compare with the surperficial step that α-SiTFT is formed on to glass substrate, need the more thermal treatment of high temperature.Therefore, low temperature p-SiTFT and oxide semiconductor are formed on to surperficial sheet glass, require the character that percent thermal shrinkage is less.For percent thermal shrinkage is reduced, be preferably the strain point that improves glass.Yet the glass that strain point is high has liquidus temperature and uprises, the viscosity under liquidus temperature is the tendency of liquid phase viscosity step-down.In addition, in order to prevent the devitrification of glass, the temperature of the temperature of the melten glass in the time of must making to be shaped melten glass during with the shaping of glass substrate compared with α-SiTFT is higher, and therefore, the environment that must make forming furnace inside is high temperature more.Therefore, low temperature p-SiTFT and oxide semiconductor are being formed in the manufacturing step of surperficial glass substrate, the distortion of thermal creep characteristic of molding of resulting from becomes more remarkable.
Heat insulating member 56a, 56b that the device for producing glass sheet 200 of present embodiment has described feature by use support to body 52, and the manufacture of the glass substrate that the flat-panel monitor that is particularly suitable for adopting the flat-panel monitor of low temperature p-SiTFT and adopt oxide semiconductor is used.Specifically, be particularly suitable for adopting the liquid-crystal display of low temperature p-SiTFT and adopt the manufacture of the glass substrate that the liquid-crystal display of oxide semiconductor uses.
Low temperature p-SiTFT and oxide semiconductor are formed on to surperficial sheet glass and for example there are 655 ℃ of above strain points, or, liquid phase viscosities more than 45000 pools there is.In addition, the composition of this sheet glass is preferably SiO
2: 52 quality %～78 quality %, Al
2o
3: 3 quality %～25 quality %, B
2o
3: 1 quality %～15 quality %, RO:3 quality %～20 quality %.Herein, R is the composition of at least a kind in Mg, Ca, Sr and Ba that is selected from containing in sheet glass.This sheet glass is preferably with (SiO
2+ Al
2o
3)/B
2o
3represented mass ratio is 7～20 non-alkali glass or the glass that contains micro-alkali.
Low temperature p-SiTFT and oxide semiconductor are formed on to surperficial sheet glass in order to have higher strain point, and with (SiO
2+ Al
2o
3the represented mass ratio of)/RO is more than 5, to be preferably more than 6, and then is preferably more than 7.5.In addition, if this sheet glass β-OH value is too small, the viscosity in high-temperature area uprises and meltability reduces so, in addition, also needs special environment to control and cost uprises.On the other hand, if this sheet glass β-OH value is excessive, strain point step-down so.Therefore, this sheet glass is preferably β-OH value with 0.05/mm～0.3/mm.In addition, this sheet glass is in order to have higher strain point and to prevent the reduction of liquid phase viscosity, and take mass ratio that CaO/RO represents as more than 0.3, is preferably more than 0.5, more preferably more than 0.65.In addition, consider carrying capacity of environment, this sheet glass is preferably and does not contain in fact As
2o
3, Sb
2o
3and PbO.
Claims (9)
1. a manufacture method for sheet glass, it makes melten glass overflow and shunt from the upper surface of molding, at the interflow, lower end of described molding and continuous molding sheet glass,
Described molding is situated between every the support component contacting with described molding and does not contact with described molding and the heat insulating member that contacts with described support component, under the state of power that the both ends of the surface of the length direction of described molding is applied to described length direction, arranges,
Described heat insulating member has the thermal conductivity that more described support component is little, and has the compressive strength that can fully tolerate the force of compression of the described length direction that described molding is applied.
2. the manufacture method of sheet glass according to claim 1, wherein
Described heat insulating member has the following thermal conductivity of 2W/ (mK).
3. the manufacture method of sheet glass according to claim 1, wherein
Described heat insulating member has 550 ℃ of above heat resisting temperatures.
4. the manufacture method of sheet glass according to claim 2, wherein
Described heat insulating member has 550 ℃ of above heat resisting temperatures.
5. a manufacture method for sheet glass, it makes melten glass overflow and shunt from the upper surface of molding, at the interflow, lower end of described molding and continuous molding sheet glass,
Described molding is situated between every the support component contacting with described molding and does not contact with described molding and the heat insulating member that contacts with described support component, under the state of power that the both ends of the surface of the length direction of described molding is applied to described length direction, arranges,
Described heat insulating member comprises mica.
6. according to the manufacture method of the sheet glass described in any one in claim 1 to 5, wherein
Described sheet glass is glass substrate for plane display device.
7. according to the manufacture method of the sheet glass described in any one in claim 1 to 5, wherein
Described sheet glass is low temperature polycrystalline silicon glass substrate.
8. the manufacture method of sheet glass according to claim 6, wherein
Described sheet glass is low temperature polycrystalline silicon glass substrate.
9. a manufacturing installation for sheet glass, it comprises:
Molding, with so that melten glass overflow and shunt, below interflow and continuous molding sheet glass;
Support component, contacts with described molding; And
Heat insulating member, does not contact and contacts with described support component with described molding;
Described molding is situated between every described support component and described heat insulating member, and arranges under the state of power that the both ends of the surface of the length direction of described molding is applied to described length direction,
Described heat insulating member has the thermal conductivity that more described support component is little, and has the compressive strength that can fully tolerate the force of compression of the described length direction that described molding is applied.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012189578A JP6017893B2 (en) | 2012-08-30 | 2012-08-30 | Glass plate manufacturing method and glass plate manufacturing apparatus |
| JP2012-189578 | 2012-08-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103663933A true CN103663933A (en) | 2014-03-26 |
| CN103663933B CN103663933B (en) | 2017-06-13 |
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|---|---|---|---|
| CN201310378504.2A Active CN103663933B (en) | 2012-08-30 | 2013-08-27 | The manufacture method of glass plate and the manufacture device of glass plate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6017893B2 (en) |
| KR (1) | KR101660092B1 (en) |
| CN (1) | CN103663933B (en) |
| TW (1) | TWI538890B (en) |
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| CN113415977B (en) * | 2021-05-19 | 2023-06-09 | 河南旭阳光电科技有限公司 | Protective device, heating furnace and deformation prevention method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10167815A (en) * | 1996-11-29 | 1998-06-23 | Shinagawa Refract Co Ltd | Refractory for head of stopper of tundish |
| JP2004284843A (en) * | 2003-03-20 | 2004-10-14 | Nippon Electric Glass Co Ltd | Apparatus and method of forming plate glass |
| CN1579992A (en) * | 2003-08-08 | 2005-02-16 | 桂林矿产地质研究院 | Mica composite heat-proof insulated antistatic-pressure board |
| JP4634437B2 (en) * | 2007-12-27 | 2011-02-16 | ザイオソフト株式会社 | Developed image projecting method, developed image projecting program, developed image projecting apparatus |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3338696A (en) | 1964-05-06 | 1967-08-29 | Corning Glass Works | Sheet forming apparatus |
| US5216727A (en) * | 1992-05-08 | 1993-06-01 | At&T Bell Laboratories | Integrated nonlinear waveguide spectrometer |
| JP3142767B2 (en) * | 1996-01-17 | 2001-03-07 | トピー工業株式会社 | Manufacturing method of synthetic mica |
-
2012
- 2012-08-30 JP JP2012189578A patent/JP6017893B2/en active Active
-
2013
- 2013-08-06 TW TW102128152A patent/TWI538890B/en active
- 2013-08-26 KR KR1020130100946A patent/KR101660092B1/en active IP Right Grant
- 2013-08-27 CN CN201310378504.2A patent/CN103663933B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10167815A (en) * | 1996-11-29 | 1998-06-23 | Shinagawa Refract Co Ltd | Refractory for head of stopper of tundish |
| JP2004284843A (en) * | 2003-03-20 | 2004-10-14 | Nippon Electric Glass Co Ltd | Apparatus and method of forming plate glass |
| CN1579992A (en) * | 2003-08-08 | 2005-02-16 | 桂林矿产地质研究院 | Mica composite heat-proof insulated antistatic-pressure board |
| JP4634437B2 (en) * | 2007-12-27 | 2011-02-16 | ザイオソフト株式会社 | Developed image projecting method, developed image projecting program, developed image projecting apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6017893B2 (en) | 2016-11-02 |
| CN103663933B (en) | 2017-06-13 |
| KR101660092B1 (en) | 2016-09-26 |
| KR20140029232A (en) | 2014-03-10 |
| TWI538890B (en) | 2016-06-21 |
| TW201408606A (en) | 2014-03-01 |
| JP2014047088A (en) | 2014-03-17 |
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