CN103659032A - Soldering tin band - Google Patents
Soldering tin band Download PDFInfo
- Publication number
- CN103659032A CN103659032A CN201210324270.9A CN201210324270A CN103659032A CN 103659032 A CN103659032 A CN 103659032A CN 201210324270 A CN201210324270 A CN 201210324270A CN 103659032 A CN103659032 A CN 103659032A
- Authority
- CN
- China
- Prior art keywords
- tin
- layer
- band
- solder
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a soldering tin band which comprises a supporting band and a plurality of soldering tin pieces. The soldering tin pieces are distributed on one surface of the supporting band at intervals, each soldering tin band comprises a tin layer and a soldering flux layer, each tin layer is fixedly connected to the surface of the supporting band, and each soldering flux layer wraps the surface of the corresponding tin layer. The soldering tin band can improve soldering efficiency and soldering accuracy, the surface of the soldering band is good in oxidation resistance, and soldering quality can be improved.
Description
Technical field
The present invention relates to scolding tin technical field, particularly a kind of scolding tin band.
Background technology
Tradition is used for the welding of terminal and terminal, the welding of terminal and wire rod, and the welding of pcb board and terminal, the technique of the welding of pcb board and wire rod is mainly to utilize solder stick welding, with manual type, by the mode of electric iron and solder stick, welds.The mode speed of welding of this traditional solder stick welding is slow, and welding quality is unstable, and pad size is not easy to control, if product size is very little, likely causing cannot accurate welding.And common solder stick surface oxidation-resistant ability, easily oxidation deterioration, affects welding quality and intensity.
Summary of the invention
In order to overcome above-mentioned defect, the invention provides a kind of scolding tin band, can improve welding efficiency and bonding accuracy, and scolding tin belt surface antioxygenic property is good, can improve welding quality.
The present invention for the technical scheme that solves its technical problem and adopt is: a kind of scolding tin band, comprise support belt and plurality of solder sheet, described solder plate is spaced apart on a surface of described support belt, and described solder plate comprises tin layer and scaling powder layer, described tin layer is fixedly connected on the surface of described support belt, and described scaling powder layer is coated on the surface of described tin layer.
As a further improvement on the present invention, the ratio of the thickness of described scaling powder layer and described tin layer is 1:20 to 1:30.
As a further improvement on the present invention, the ratio of the thickness of described scaling powder layer and described tin layer is 1:25.
As a further improvement on the present invention, described solder plate is shaped as rectangle sheet or round sheet.
As a further improvement on the present invention, between the adjacent solder plate on described scolding tin band, be also provided with locating hole.
As a further improvement on the present invention, described locating hole be shaped as circular or square.
The invention has the beneficial effects as follows: scolding tin band provided by the invention, there is support belt and the solder plate on described support belt spaced apart, can improve welding efficiency and bonding accuracy, and comprise tin layer and the scaling powder layer that is coated on described tin layer surface at described solder plate, scolding tin belt surface antioxygenic property is good, can improve welding quality.
Accompanying drawing explanation
Fig. 1 is the perspective view of the scolding tin band of first embodiment of the invention;
Fig. 2 is the perspective view of the scolding tin band of second embodiment of the invention; And
Fig. 3 is the generalized section of solder plate of the present invention.
Wherein, description of reference numerals is as follows:
1-support belt, 2-solder plate, 3-locating hole, 21-tin layer, 22-scaling powder layer.
The specific embodiment
Below in conjunction with accompanying drawing, technical scheme of the present invention is elaborated, but protection scope of the present invention is not limited to described embodiment.
Fig. 1 is the perspective view of the scolding tin band of first embodiment of the invention, the generalized section that Fig. 3 is solder plate of the present invention.Incorporated by reference to reference to Fig. 1 and Fig. 3, the scolding tin band that first embodiment of the invention provides, comprises support belt 1 and plurality of solder sheet 2, and described solder plate 2 is spaced apart on a surface of described support belt 1.Described solder plate 2 comprises tin layer 21 and scaling powder layer 22, and described tin layer 21 is fixedly connected on this surface of described support belt 1, and described scaling powder layer 22 is coated on the surface of described tin layer 21.
The proportion of the thickness of described scaling powder layer 22 and described tin layer 21 is 1:20 to 1:30.In other embodiments, the ratio of the thickness of described scaling powder layer 22 and described tin layer 21 is 1:25.Described solder plate 2 be shaped as rectangle sheet or round sheet.The main component of scaling powder layer 22 is rosin, and scaling powder layer 22 is directly arranged at the surface of tin layer 21, thus in when welding without artificial coating, and scaling powder layer has anti-oxidation, to reduce liquid scolding tin surface tension, promotes the effect of welding.
Fig. 2 is the perspective view of the scolding tin band of second embodiment of the invention.As shown in Figure 2, the scolding tin band that this second embodiment provides, comprises support belt 1, plurality of solder sheet 2 and a plurality of locating hole 3.Described solder plate 2 is spaced apart on a surface of described support belt 1.The concrete structure of described solder plate 2 is as described in above-mentioned the first embodiment, therefore do not repeat them here.This second embodiment compares with above-mentioned the first embodiment, and difference is, between the adjacent solder plate 2 on described scolding tin band, is provided with locating hole 3.In the welding of carrying out terminal and terminal, the welding of terminal and wire rod, the welding of pcb board and terminal, during the welding of pcb board and wire rod, can position by described plural locating hole 3, can further improve speed of welding and bonding accuracy.In one embodiment, described locating hole 3 be shaped as circular or square.
Scolding tin band provided by the invention, there is support belt and the solder plate on described support belt spaced apart, and comprise tin layer and the scaling powder layer that is coated on described tin layer surface at described solder plate, can improve welding efficiency and bonding accuracy, and scolding tin belt surface antioxygenic property is good, can improve welding quality.
Certainly; the present invention also can have other various embodiments; in the situation that not deviating from spirit of the present invention and essence thereof; know those skilled in the art when making according to the present invention various corresponding changes and distortion, but these corresponding changes and distortion all should belong to the protection domain that the claims in the present invention limit.
Claims (6)
1. a scolding tin band, it is characterized in that, comprise support belt and plurality of solder sheet, described solder plate is spaced apart on a surface of described support belt, and described solder plate comprises tin layer and scaling powder layer, described tin layer is fixedly connected on the surface of described support belt, and described scaling powder layer is coated on the surface of described tin layer.
2. scolding tin band as claimed in claim 1, is characterized in that, the ratio of the thickness of described scaling powder layer and described tin layer is 1:20 to 1:30.
3. solder tin furnace device as claimed in claim 1, is characterized in that, the ratio of the thickness of described scaling powder layer and described tin layer is 1:25.
4. solder tin furnace device as claimed in claim 1, is characterized in that, described solder plate be shaped as rectangle sheet or round sheet.
5. solder tin furnace device as claimed in claim 1, is characterized in that, between the adjacent solder plate on described scolding tin band, is also provided with locating hole.
6. solder tin furnace device as claimed in claim 1, is characterized in that, being shaped as of described locating hole is circular or square.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210324270.9A CN103659032A (en) | 2012-09-05 | 2012-09-05 | Soldering tin band |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210324270.9A CN103659032A (en) | 2012-09-05 | 2012-09-05 | Soldering tin band |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103659032A true CN103659032A (en) | 2014-03-26 |
Family
ID=50298468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210324270.9A Pending CN103659032A (en) | 2012-09-05 | 2012-09-05 | Soldering tin band |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103659032A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112605486A (en) * | 2020-12-16 | 2021-04-06 | 宁波施捷电子有限公司 | Ultrathin welding gasket, preparation method, welding method and semiconductor device |
-
2012
- 2012-09-05 CN CN201210324270.9A patent/CN103659032A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112605486A (en) * | 2020-12-16 | 2021-04-06 | 宁波施捷电子有限公司 | Ultrathin welding gasket, preparation method, welding method and semiconductor device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140326 |