CN103648660B - For workpiece being carried out the equipment of surface process - Google Patents
For workpiece being carried out the equipment of surface process Download PDFInfo
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- CN103648660B CN103648660B CN201280035173.6A CN201280035173A CN103648660B CN 103648660 B CN103648660 B CN 103648660B CN 201280035173 A CN201280035173 A CN 201280035173A CN 103648660 B CN103648660 B CN 103648660B
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- heat
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- pump device
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- 238000000034 method Methods 0.000 title claims abstract description 25
- 230000008569 process Effects 0.000 title abstract description 18
- 238000001816 cooling Methods 0.000 claims abstract description 59
- 238000010438 heat treatment Methods 0.000 claims description 100
- 230000004913 activation Effects 0.000 claims description 63
- 239000003507 refrigerant Substances 0.000 claims description 53
- 238000004381 surface treatment Methods 0.000 claims description 40
- 239000002103 nanocoating Substances 0.000 claims description 39
- 238000002203 pretreatment Methods 0.000 claims description 10
- 238000010168 coupling process Methods 0.000 claims description 9
- 238000005859 coupling reaction Methods 0.000 claims description 9
- 238000009434 installation Methods 0.000 claims description 7
- 238000010422 painting Methods 0.000 claims description 6
- 238000005238 degreasing Methods 0.000 description 60
- 238000000576 coating method Methods 0.000 description 18
- 238000011010 flushing procedure Methods 0.000 description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 17
- 238000003618 dip coating Methods 0.000 description 16
- 239000011248 coating agent Substances 0.000 description 14
- 239000010410 layer Substances 0.000 description 12
- 238000004070 electrodeposition Methods 0.000 description 9
- 239000003973 paint Substances 0.000 description 8
- 230000008878 coupling Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
- 238000005470 impregnation Methods 0.000 description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 239000002826 coolant Substances 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000011144 upstream manufacturing Methods 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 3
- 229910000165 zinc phosphate Inorganic materials 0.000 description 3
- LVGUZGTVOIAKKC-UHFFFAOYSA-N 1,1,1,2-tetrafluoroethane Chemical compound FCC(F)(F)F LVGUZGTVOIAKKC-UHFFFAOYSA-N 0.000 description 2
- 125000000129 anionic group Chemical group 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000001246 colloidal dispersion Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- ADDWXBZCQABCGO-UHFFFAOYSA-N titanium(iii) phosphide Chemical group [Ti]#P ADDWXBZCQABCGO-UHFFFAOYSA-N 0.000 description 2
- 150000003754 zirconium Chemical class 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000009428 plumbing Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 230000037452 priming Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 150000003755 zirconium compounds Chemical class 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/22—Servicing or operating apparatus or multistep processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
- C21D1/34—Methods of heating
- C21D1/44—Methods of heating in heat-treatment baths
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
- C21D9/0062—Heat-treating apparatus with a cooling or quenching zone
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
Abstract
In order to realize a kind of equipment for workpiece being carried out surface process, it include at least one when described equipment (100) runs the heat sink processing region (118) to heat to be delivered and at least one therefrom to derive the thermal source processing region (120) of heat when described equipment (100) runs, wherein, less energy is needed in order to heat heat sink processing region (118) and cooling thermal source processing region (120), it is proposed that, described equipment includes at least one heat pump assembly (124, 158, 176, 240), it couples with at least one thermal source processing region (120) to absorb heat, and couple to discharge heat and at least one heat sink processing region (118).
Description
Technical Field
The invention relates to a device for surface treatment of workpieces, comprising at least one heat sink treatment region to which heat is supplied during operation of the device and at least one heat source treatment region from which heat is removed during operation of the device.
Background
Such a device for the surface treatment of workpieces can be designed in particular as a device for painting vehicle bodies or parts of vehicle bodies.
The priming of vehicle bodies comprises in particular the stages of a process comprising a pretreatment and an electrocoating (for example cathodic electrocoating).
Within the scope of the pretreatment, for example, degreasing, phosphating and/or preferably passivation in an impregnation bath are carried out.
The flow steps of the electrocoating can also be carried out in an impregnation bath. In this case, heat is generated in the impregnation bath, since the impregnation bath has an ohmic resistance through which an electric current flows during the electrolytic coating process.
In the degreasing and phosphating treatment, the treatment temperature is preferably higher than room temperature so that the pretreatment tank is heated. The treatment temperature in the electrophoretic dip tank is preferably kept close to room temperature, so that the dip tank is cooled again on account of the heat generation during the electrolytic paint deposition.
In known painting systems, a separate cooler is used for cooling the paint bath or a central cooling system is used, the temperature of which is, for example, approximately 7 ℃ during the inflow and approximately 12 ℃ during the return. The heat accumulated in the cooler is released to the surroundings without being utilized by a recooling system, for example by an air/fluid heat exchanger or a cooling tower.
In order to heat the treatment basin in the pretreatment region, hot water from a central heating device with an inflow temperature of, for example, approximately 80 to 100 ℃ is used as the heating medium.
Disclosure of Invention
The object on which the invention is based is to provide a device for surface treatment of workpieces of the type mentioned at the beginning, which requires less energy for heating at least one heat sink treatment region and for cooling at least one heat source treatment region.
According to the invention, this object is achieved by an apparatus for the surface treatment of workpieces, i.e., the device comprising at least one heat sink treatment area to which heat is to be delivered when the device is in operation, and at least one heat source treatment area from which heat is to be conducted when the device is in operation, wherein the apparatus comprises at least one heat pump device coupled to at least one heat source processing area for absorbing heat and to at least one heat sink processing area for releasing heat, wherein at least one heat pump device is coupled to the air circulation circuit of the installation for absorbing heat and to one or more pre-treatment baths of the installation for releasing heat, wherein the air circulation circuit comprises means for generating an air curtain through which the workpiece to be treated passes during operation of the apparatus.
Significant energy savings can be achieved by thermally coupling at least one heat source treatment area (e.g., an electrophoretic dip tank) and at least one heat sink treatment area (e.g., a treatment tank within a pretreatment area) as compared to heating the heat sink treatment area and cooling the heat source treatment area separately.
In this case, several or all of the units required for the thermal coupling of the heat source treatment area and the heat sink treatment area can be arranged in the immediate spatial vicinity of the heat source treatment area and the heat sink treatment area, so that it is not necessary to connect the heat source treatment area to the central cooling system via long lines or to connect the heat sink treatment area to the central heating system via long lines. This advantageously reduces equipment costs and, therefore, the required investment costs.
The temperature levels for cooling and for heating can be determined optimally depending on the process by means of the coupling by means of the heat pump device. In particular, it is possible to raise the temperature level for cooling from a typical cooling medium temperature, for example of about 10 ℃, to a cooling medium temperature, for example of about 20 ℃, and/or to lower the temperature level for heating from a typical heating medium temperature, for example in the range of about 80 ℃ to 100 ℃, to a heating medium temperature, for example of about 70 ℃.
In a preferred embodiment of the invention, it is provided that the device for the surface treatment of workpieces is designed as a device for painting workpieces, in particular vehicle bodies or parts of vehicle bodies.
The at least one heat sink treatment area may comprise a pre-treatment tank, in particular a degreasing tank and/or a phosphating tank, of the device.
The at least one heat source treatment area may comprise a dip tank and/or a sluice area of the apparatus.
The gate region of the device may in particular be previously located in a pre-processing region of the device.
At least one heat pump device of the system can be connected to a cooling circuit and/or to a heating circuit for absorbing heat, wherein a heat carrier for absorbing heat from the heat source treatment region circulates in the cooling circuit; a heat carrier for releasing heat to the heat sink processing area circulates in the heating circulation loop.
It can also be provided that at least one heat pump device of the system for absorbing heat and/or for releasing heat is coupled to the air circuit of the system.
Such an air circulation circuit can be used in particular for generating an air curtain in the sluice region of the plant.
It is particularly advantageous here if the plant comprises a condenser for cooling and/or dehumidifying the air in the air circulation circuit. Such a condenser can be used in particular for evaporating a refrigerant in a cooling medium circuit of a heat pump device coupled to an air circuit.
It is particularly advantageous if the system comprises a condensate removal line, by means of which the condensate that has condensed out of the air in the condenser can be fed to a treatment tank, for example a degreasing tank, of the system. In this way, not only can energy be returned from the air circuit, but also the fluid evaporated from the treatment bath can be returned to the treatment bath.
In a preferred embodiment of the invention, it is provided that the air circuit comprises means for generating an air curtain through which the workpiece to be treated passes during operation of the device.
Such an air curtain can be used in particular to separate the atmosphere of the device in the region behind the air curtain from the atmosphere of the device in the region in front of the air curtain. In particular, it is thus possible to avoid moist steam from escaping from one of the regions into the surroundings and to avoid impurities being carried through the air curtain.
It is particularly advantageous if the device for generating the air curtain comprises means for distributing the air flow guided in the air circuit into a first air chamber and a second air chamber, wherein nozzles for generating the bundled air jets are arranged downstream of the first air chamber and an outlet opening adjacent to the air curtain is arranged downstream of the second air chamber. In one such embodiment of the device for generating an air curtain, the following is achieved: the circulating air from the second air chamber is extracted by means of a bundled air jet produced by the nozzles.
The at least one heat source treatment zone of the apparatus may comprise a rinsing bath, preferably a treatment bath, in particular a phosphating bath, which is placed after the pretreatment zone. Since it is generally not sensible to continue using the heat supplied to the rinsing bath in the subsequent treatment region, it is sensible to use a heat pump in order to remove heat from the rinsing bath(s) and, if necessary, to feed the heat at a higher temperature level into the heat sink treatment region of the device for surface treatment.
In addition, at least one heat source treatment zone of the apparatus may include an activation bath, preferably an activation bath that is preceded by a phosphating bath. In such an activation bath, for example, crystal nuclei are sprayed onto the workpiece surface in order to better form crystals in the subsequent phosphating treatment.
The activation cell preferably contains a colloidal dispersion with a titanium phosphorus core that decays and loses activity over a time related to the temperature of the activation cell. To facilitate control of the decay process, the temperature within the activation cell is set between about 35 ℃ and about 45 ℃. When the workpiece to be treated is heated in a treatment station which is located upstream of the activation bath (for example in a degreasing bath), heat is transferred into the activation bath, which may make it necessary to cool the activation bath at least in some cases.
The use of a heat pump in this case makes sense in order to draw heat away from the activation bath and to feed it at a higher temperature level into the heat sink treatment area of the device for surface treatment.
In order to ensure a constant temperature guidance in the activation bath, a heating device can be provided in addition to the cooling device of the activation bath. In particular, when the activation bath is cooled below the treatment temperature during a production interruption, a heating device is provided. For example, a cooling device is provided when the bath temperature of the activation bath increases beyond a predetermined target value due to the heat input through the workpiece.
Furthermore, at least one heat source treatment zone of the apparatus may comprise a nanocoating bath, preferably a nanocoating bath that is subsequently placed in the degreasing bath and/or the rinsing bath.
A nano-coating bath or a thin-layer bath may be used instead of the phosphating treatment performed in the conventional workpiece coating method.
The coating is performed in a nanocoating bath, for example, on a chemical substrate of silane or zirconia, wherein the layer thickness is in the range of about 20nm to about 200 nm. The processing time in the nanocoating bath is set, for example, between about 30 seconds and about 120 seconds depending on the temperature. In carrying out the phosphating treatment, the temperature of the phosphating bath needs to reach about 40 ℃ to about 60 ℃, and the nanocoating process can be operated even at relatively low temperatures between about 10 ℃ and 50 ℃. Higher temperatures lead to higher layer thicknesses and lower temperatures lead to smaller layer thicknesses. A particularly preferred temperature span for the nanocoating bath is in the range of about 20 ℃ to about 30 ℃.
By precisely directing the temperature of the nanocoating bath, in addition to the formation of a complete layer, a layer thickness distribution in the nanocoating that is as uniform as possible is achieved. When electrocoating, in particular anionic electrocoating, is carried out as an electrodeposition process after the nanocoating, the electrocoating process reacts very sensitively to different resistances of the substrate material. If the nanocoating has a thickness difference, this can be seen from the different layer thicknesses of the coating produced by the subsequent electrocoating.
If the workpiece is heated to a temperature above 50 ℃ in a bath that is preceded by a nanocoating bath, heat can be input into the activation bath through the workpiece, and it is expected that the nanocoating bath will cool.
It is expedient in this case to use a heat pump in order to draw heat away from the nanocoating bath and to feed it at another temperature level into the heat sink treatment area of the apparatus for surface treatment.
In order to ensure particularly good temperature guidance in the nanocoating bath, a heating device of the bath may also be provided as an alternative or in addition to the cooling device. Especially when the nanocoating pool cools below the allowable process temperature at production interruptions, a heating device is required. Cooling devices are required, in particular, when the bath temperature of the nanocoating bath increases beyond a nominal value by the input of heat.
It is particularly advantageous if the heat drawn off from the nanocoating bath or the activation bath is fed at a higher temperature level into the degreasing bath of the device for surface treatment by means of a heat pump.
The temperature in the nanocoating bath or in the activation bath can thereby be constantly guided, which leads to better paint quality of the subsequent electrocoating.
Furthermore, the cooling power required for cooling the nanocoating bath or the activation bath can be reduced, and the heating power required for heating the degreasing bath can likewise be reduced.
Because the efficiency COP (coefficient of performance) of a heat pump depends on the high temperature level T of heat released by the heat pump and the low temperature level T of heat absorbed by the heat pump0Difference between (COP ═ T/(T-T)0)×ηCompressor with a compressor housing having a plurality of compressor bladesHeat transferred/electric power of the compressor), the efficiency of the heat pump arrangement is increased when at least one heat pump arrangement comprises at least two heat exchangers for delivering heat to the associated heat pump arrangement.
Advantageously, at least two heat exchangers for supplying heat to the heat pump device are connected in series, i.e. are flowed through by the refrigerant in succession.
It is also advantageous if at least two of the heat exchangers are traversed by heat carriers of different temperatures on the hot side, wherein in particular the first heat carrier (which traverses the first heat exchanger on the hot side, through which the refrigerant first traverses on the cold side) has a lower temperature than the second heat carrier (which traverses the second heat exchanger on the hot side, through which the refrigerant later traverses on the cold side).
Preferably, the at least two heat exchangers are coupled to two different heat source process zones in order to be able to supply the heat pump device with heat from the at least two different heat source process zones, in particular at different temperature levels. In this way the low temperature level T can be raised0And thus improve efficiency.
If the heat pump device absorbs heat from the activation tank or the nanocoating tank, for example, and releases this heat to the degreasing tank, the low temperature level is, for example, at about 30 deg.c and the high temperature level is, for example, at about 60 deg.c, whereby a COP of about 5.5 is obtained.
However, if the refrigerant in the refrigerant circuit of the heat pump device first passes through the first heat exchanger, in which heat is absorbed from the activation bath or the nanocoating bath, and then passes through the second heat exchanger, in which heat is absorbed from the rinsing bath, in particular from the rinsing bath subsequently placed in the degreasing bath, the low temperature level is led, for example, to about 40 ℃ or about 45 ℃ by this cascade, whereby the efficiency COP of the heat pump device is increased to about 8.3 or about 11, which is a significant improvement.
The first heat exchanger and the second heat exchanger together form in this case an evaporator of the heat pump device, wherein the evaporation of the refrigerant in the refrigerant circuit of the heat pump device can take place partly in the first evaporator and partly in the second heat exchanger, or completely in the first heat exchanger or completely in the second heat exchanger.
The device for surface treatment according to the invention comprises at least one heat pump means which is coupled to at least one heat source treatment area for absorbing heat and to at least one heat sink treatment area for releasing heat.
In order to be able to exploit the energy saving potential as much as possible by coupling the heat source treatment area and the heat sink treatment area of the device, it is advantageous if the device comprises two or more heat pump arrangements which are coupled to at least two different heat source treatment areas for absorbing heat and/or to at least two different heat sink treatment areas for releasing heat.
For example, the device can comprise a heat pump device which is coupled to the dip tank for absorbing heat and to one or more pretreatment tanks, in particular to the degreasing tank and/or phosphating tank, for releasing heat.
Alternatively or additionally, the device may also comprise a heat pump device which is coupled to the rinsing bath for absorbing heat and to one or more pretreatment baths, in particular to the phosphating baths, for releasing heat.
Alternatively or additionally, the device may also comprise a heat pump device which is coupled to the air circuit of the device for absorbing heat, in particular for generating an air curtain in the lock region of the device, and to one or more pretreatment tanks, in particular degreasing tanks, for releasing heat.
Since, in particular during operational pauses of the heat sink treatment area, it may not be possible for the heat sink treatment area coupled to the heat source treatment area concerned by means of the heat pump device to absorb the entire amount of heat conducted away from the heat source treatment area, it is advantageous if the device comprises a cooling device for conducting away excess heat from at least one heat pump device.
Such a cooling device is preferably arranged in a bypass conduit of the refrigerant circulation circuit of the heat pump device.
Since the heat requirement of the heat sink treatment area of the device may exceed the heat release of the heat source treatment area coupled with the relevant heat sink treatment area by means of the heat pump device, in particular during the heating phase of the heat sink treatment area, it is advantageous if the device comprises a heating device for delivering additional heat to at least one heat sink treatment area.
Such a heating device can be arranged in particular in a heating circuit of an associated heat sink treatment area coupled to the heat pump device.
In a preferred embodiment of the invention, it is provided that the at least one heat pump device comprises a closed refrigerant circuit which is coupled to a cooling circuit of the heat source treatment region for absorbing heat and to a heating circuit of the heat sink treatment region of the installation for releasing heat.
The invention also relates to a method for surface treatment of a workpiece in an apparatus for surface treatment of a workpiece.
Another essential task of the invention is to achieve a method in which less energy is required for heating the heat sink treatment area to be delivered to the heat when the device is in operation. Furthermore, less energy should be required to cool the heat source process area from which heat is to be conducted away while the apparatus is in operation.
According to the invention, the object is achieved by a method for surface treatment of a workpiece in an apparatus for surface treatment of a workpiece, comprising the following method steps:
-conveying the workpiece through at least one heat sink treatment area to which heat is to be supplied during operation of the apparatus and at least one heat source treatment area from which heat is to be removed during operation of the apparatus; and
-coupling at least one heat pump device to at least one heat source treatment area for absorbing heat and to at least one heat sink treatment area for releasing heat.
With respect to the method in which the heat sink treatment region is heated by means of a separate heating device and the heat source treatment region is cooled by means of a separate cooling device without the treatment regions being thermally coupled to one another, a significant energy saving can be achieved by means of the at least one heat sink treatment region and the at least one heat source treatment region of the at least one heat pump device being thermally coupled.
Drawings
Further features and advantages of the invention are the subject matter of the following description and the illustration of the embodiments.
In the drawings:
fig. 1 shows a schematic block diagram of an apparatus for the surface treatment of workpieces, in particular vehicle bodies, wherein the apparatus comprises a pretreatment region with an inlet sluice, a plurality of pretreatment baths and a rinsing bath, and a dip-coating bath following the pretreatment region;
FIG. 2 shows a schematic block diagram of a cooling circuit of the paint dip tank, a heating circuit of the pretreatment region and a heat pump device for the thermal coupling of the cooling circuit and the heating circuit;
fig. 3 shows a schematic block diagram of a heat pump arrangement of an air circulation circuit for generating an air curtain in an inlet lock and a heating circulation circuit for thermally coupling the air circulation circuit and a pretreatment tank of a pretreatment area;
fig. 4 shows a schematic block diagram of a part of an apparatus for surface treatment of workpieces, wherein the apparatus comprises a degreasing region with at least one degreasing bath, a rinsing region with at least one rinsing bath and an activation region with at least one activation bath, and wherein a cooling circuit of the activation bath is thermally coupled to a heating circuit of the degreasing bath by means of a heat pump device;
fig. 5 shows a schematic block diagram of an alternative embodiment of the apparatus shown in fig. 4, wherein the heat pump device comprises an additional heat exchanger for coupling the cooling circuit of the rinsing bath; and
fig. 6 shows a schematic block diagram of a device corresponding to fig. 4, wherein the activation cell of the device shown in fig. 4 is replaced by a nanocoating cell.
Identical or functionally equivalent elements are denoted by the same reference numerals throughout the figures.
Detailed Description
The device shown in fig. 1 to 3 and designated as a whole by 100 for the surface treatment of workpieces (not shown), in particular vehicle bodies or vehicle body parts, is designed, for example, as a device for painting and/or coating workpieces. Such a device 100 comprises (see fig. 1) a pretreatment region 102, which is followed in the conveying direction 110 of the workpieces by a degreasing bath 104, a coating bath 106, if appropriate a passivation bath (not shown) and one or more rinsing baths 108.
The aforementioned equipment parts are used, for example, for applying coatings in the form of primers to workpieces to be treated. The primer is used in particular for corrosion protection and preferably comprises substances such as zinc phosphate, organosilicon compounds (silanes) or organic-based zirconium complexes. Furthermore, the phosphating baths described or the phosphating processes described can equally well be replaced by silane or zirconium compound treatment baths, respectively.
The pretreatment region 102 is followed by a dip tank 112, which can be configured, for example, as an electrophoretic dip tank, in particular as an anionic electrophoretic dip tank (KTL) or a cationic electrophoretic dip tank.
The dip tank 112 is followed by a number of further process stages (not shown), such as a dryer (in which the dip lacquer hardens), a treatment area for applying a protective layer of a substrate, a treatment area for performing a gap sealing operation, and/or other dryers.
The workpieces to be treated, in particular vehicle bodies, are conveyed in a conveying direction 110 by means of a conveyor (not shown) through the pretreatment region 102 and a subsequent treatment region, in particular a dip coating bath 112.
The pretreatment region 102 is preferably arranged in a tunnel which is as closed as possible in order to separate the atmosphere of the pretreatment region 102 from the atmosphere of the surrounding environment.
Before entering the pretreatment region 102, the workpieces pass through an inlet lock 114, in which an air curtain 116 (see fig. 3) is generated in an air circulation circuit 122, in order to separate the atmosphere of the pretreatment region 102 from the atmosphere of the region of the apparatus 100 located in front of the pretreatment region 102 and to avoid leakage of moist steam from the pretreatment region 102 into the ambient environment and to avoid impurities being brought into the pretreatment region 102.
After passing through the entry gate 114, the workpieces within the pretreatment region 102 are first stripped of corrosion inhibitors, deep drawing oils, other constituents in particulate form (e.g., buffed products of body-in-white manufacturing processes), and weld beads in the degreasing bath 104.
In a subsequent coating bath 106 (which is currently designed as a phosphating bath), for example a zinc phosphate layer is applied to the workpiece and the crystal pores left by the phosphating process are closed in a subsequent passivating bath.
In the dip coating bath 112 following the pretreatment region 102, the entire material surface, i.e. the outer skin, but also the non-visible interior regions, such as the door sills of the vehicle body, is coated with the electrolytic coating. Since the dip coating tank 112 exhibits an ohmic resistance to the passage of current, heat is generated by the electrolytic coating of the workpiece, which heat should be dissipated from the dip coating tank 112.
The treatment temperature in the degreasing bath 104 and the phosphating bath 106 is in the range of about 45 c to 65 c, while the temperature in the dip tank 112 is in the range of about 27 c to about 34 c.
The pretreatment tank is therefore heated during operation of the apparatus 100 and the dip-coating tank 112 is cooled according to the invention.
Thus, the degreasing bath 104 and the phosphating bath 106 are heat sink treatment areas 118 to which heat is to be supplied during operation of the apparatus 100, while the dip tank 112 is a heat source treatment area 120 from which heat is to be removed during operation of the apparatus 100.
The air circulation loop 122 for creating the air curtain 116 within the inlet lock 114 is another heat source treatment area because the air directed in the circulation loop is heated and humidified within the inlet lock 114 adjacent to the warm degreasing bath 104. Upon exiting the inlet gate 114, the air in the air circulation loop 122 is almost completely saturated with moisture.
In order to be able to use the heat conducted away from the dip tank 112 for supplying heat to the dip tank of the pretreatment region 102, the system 100 comprises a first heat pump device 124, which is referred to below as dip heat pump device 126 and which thermally couples a cooling circuit 128 of the dip tank 112 to a heating circuit 130 of the pretreatment region 102.
As can best be seen in fig. 1 and 2, the paint immersion heat pump arrangement 126 comprises a refrigerant circulation circuit 132, in which an evaporator 134, a compressor 136, a condenser 138 and a throttle 140 follow one another in the flow direction of the refrigerant. As the refrigerant, tetrafluoroethane (trade name: R134a) or H can be used2O、CO2Or the like.
The evaporator 134 of the dip coating heat pump device 126 is connected on the hot side to the cooling circuit 128 of the dip coating bath 112, around which a heat carrier circulates, in order to remove heat from the dip coating bath 112 and to transfer it to the refrigerant in the evaporator 134. In particular, water, CO, can be used as heat carrier in the cooling circuit 1282R134a or the like.
The condenser 138 of the dip coating heat pump device 126 is connected on the cold side to the heating circuit 130 of the pretreatment region 102, through which heating circuit 130 a heat carrier flows, which releases the heat absorbed by the refrigerant in the condenser 138 to a degreasing bath heating circuit 142 of the degreasing bath 104 and to a phosphating bath heating circuit 144 of the phosphating bath 106.
The heating circuit 130 of the pre-treatment zone 102 comprises a circulation pump 146 arranged upstream of the condenser 138 and a heating pot or burner 148 arranged downstream of the condenser 138 for additionally heating the heat carrier circulating in the heating circuit 130 when the heat supplied by the dip tank 112 does not fully satisfy the heat requirement of the pre-treatment zone 102 when the plant 100 is operating, or when an increased heating power is required during the heating phase of the dip tank of the pre-treatment zone 102 (which increased heating power is, for example, three times the heating power required when the plant 100 is operating).
As the heat carrier in the heating circuit 130, for example, water or CO may be used2R134a or the like.
Downstream of the heating kettle 148, the heating circuit 130 branches off into a degreasing bath heat exchanger 150, in which heat from the heat carrier of the heating circuit 130 is transferred to the heat carrier in the degreasing bath heating circuit 142, and a phosphating bath heat exchanger 152, which is connected in parallel to the degreasing bath heat exchanger 150, in which heat is transferred from the heat carrier of the heating circuit 130 to the heat carrier in the phosphating bath heating circuit 144.
As the heat carriers in the degreasing bath heating circuit 142 and the phosphating bath heating circuit 144, for example, water, CO, may be used2R134a or the like.
The heat carrier in the degreasing bath heating cycle loop 142 transfers heat absorbed in the degreasing bath heat exchanger 150 to the degreasing bath 104, and the heat carrier in the phosphating bath heating cycle loop 144 transfers heat absorbed in the phosphating bath heat exchanger 152 to the phosphating bath 106.
Downstream of the degreasing bath heat exchanger 150 and the phosphating bath heat exchanger 152, the two branches of the heating circulation circuit 130 are again grouped together. The re-unified heating cycle loop 130 returns to the condenser 138 through a circulation pump 146.
The dip tank 112 is preferably also cooled during production pauses of the device 100, wherein the pump for stirring the dip tank is likewise kept in operation in order to prevent sedimentation of the dip-coating paint.
Heat may be fed into the impregnation tank of the pre-treatment zone 102, for example in order to keep the temperature level constant, so that by preheating the tank the plant 100 can be started up in a short time after the production stops, for example after the weekend has ended.
In the case of an imbalance in the heat budget between the cooling of the dip-coating bath 112 on the one hand and the heating of the bath of the pretreatment region 102 on the other hand, and the pretreatment region 102 not being able to extract sufficient heat from the dip-coating heat pump device 126, in particular in the case of maintenance work, the dip-coating heat pump device 126 is provided with a bypass conduit 154 in which a cooling device 156 for cooling the refrigerant is arranged.
A bypass conduit 154 branches off from the refrigerant circuit 132 between the compressor 136 and the condenser 138 and opens into the refrigerant circuit 132 again between the condenser 138 and the throttle 140.
The cooling device 156 is preferably designed in such a way that the refrigerant can be cooled by means of the cooling device 156 with a temperature difference (Δ T in fig. 2) of at least about 60 ℃, for example a temperature difference of about 65 ℃.
During normal operation of the apparatus 100 and the dip heat pump apparatus 126, the dip tank 112 has a temperature in the range of about 27 c to about 34 c.
The heat carrier in the cooling circuit 128 of the dip tank 112 enters the hot side of the evaporator 134 at a temperature of, for example, about 20 c and heats the refrigerant flowing through the evaporator 134 on the cold side to a temperature of, for example, about 10 c.
The heat carrier in the cooling circuit 128 exits the evaporator 134 at a temperature of, for example, about 15 c and is returned to the dip tank 112.
Whereby heat is drawn from the dip tank 112 (Q in fig. 2) with a cooling power in the range of, for example, about 100kW to about 1.5MWab)。
In the refrigerant circuit 132 of the dip heat pump device 126, the refrigerant heated in the evaporator 134 is compressed by means of the compressor 136 from a starting pressure of, for example, approximately 4 bar to a final pressure of, for example, approximately 22 bar and is heated to a temperature level of, for example, approximately 75 ℃.
The compressed and heated refrigerant releases heat in condenser 138 to the heat carrier in the heating cycle circuit 130 of the pre-treatment zone 102 (Q in fig. 2)zu)。
The efficiency COP (coefficient of performance) of the dip-coating heat pump device 126 depends on the temperature T of the refrigerant in the condenser 138 and the temperature T of the refrigerant in the evaporator 1340Difference therebetween, and efficiency η dependent on compressor 136Compressor with a compressor housing having a plurality of compressor blades(COP=T/(T-T0)×ηCompressor with a compressor housing having a plurality of compressor blades) And is for example about 2 for cooling and about 3 for heating. Thus, when the cooling power is, for example, 600kW, there may be approximately 900kW for heating the pretreatment area 102.
The heat carrier in the heating cycle 130 of the pretreatment zone 102 is heated in the condenser 138 to a temperature of, for example, about 70 ℃.
In case of need, in particular during the heating phase of the basin of the pre-treatment zone 102, the heat carrier can be further heated, for example to a temperature of about 80 ℃, by means of the heating kettle 148.
The heat absorbed in the condenser 138 and, if necessary, in the heating kettle 148 is released by the heat carrier of the heating circuit 130 in the degreasing bath heat exchanger 150 to the heat carrier in the degreasing bath heating circuit 142 and by the heat carrier in the phosphating bath heat exchanger 152 to the phosphating bath heating circuit 144, whereby the heat carrier in the heating circuit 130 is cooled to a temperature of, for example, approximately 65 ℃ and the heat carrier in the degreasing bath heating circuit 142 or the phosphating bath heating circuit 144 is heated to a temperature in the range of approximately 45 ℃ to approximately 65 ℃.
By heating the bath within the pretreatment region 102 using heat drawn from the dip tank 112, it may not be necessary to couple the pretreatment region 102 to a central heating kettle since the pretreatment region 102 and the dip tank 112 are in direct proximity and the process heat for the pretreatment region 102 is generated locally.
The treatment heat, which is optionally added to the heating power requirement of the paint immersion heat pump device 126, is generated locally and directly in situ by means of the heating kettle 148, in particular during the heating of the bath in the pretreatment region 102. The local heating kettle 148, the heat feed by the dip heat pump apparatus 126, the circulation pump 146 and the required plumbing conduits form a partially confined circulation system.
The workpiece heated in the degreasing bath 104 is cooled to a temperature in the range of approximately 40 ℃ until the phosphating bath 106 cools, so that the heat input into the workpiece in the degreasing bath 104 can be reused in the phosphating bath 106 and the workpiece does not have to be heated again from the ambient temperature to the treatment temperature in the phosphating bath 106, as is the case in degreasing.
The tank after phosphating treatment has the following performances:
the plant 100 preferably comprises a second heat pump device 158, which is referred to below as a flushing sump heat pump device 160, and which thermally couples a phosphating sump additional heating circuit 162 as a heat sink and a flushing sump cooling circuit 164 as a heat source to one another.
The refrigerant circuit 168 of the flushing pool heat pump device 160 comprises an evaporator 166 through which a heat carrier of the flushing pool cooling circuit 164 flows on the hot side, for example water, a compressor 170 arranged downstream of the evaporator 166, a condenser 172 arranged downstream of the compressor 170, a throttle 174 arranged downstream of the condenser 172, and in which the refrigerant absorbs heat from the heat carrier of the flushing pool cooling circuit 164; which on the cold side is traversed by the heat carrier of the tank supplementary heating circuit 162, for example water, and in which the refrigerant releases heat to the heat carrier of the tank supplementary heating circuit 162; downstream of the throttle valve is arranged an evaporator 166.
The function of the flushing bath heat pump device 160 corresponds in principle to the function of the previously described paint immersion heat pump device 126.
The heat of the heat carrier from the flushing sump cooling circuit 164, at a temperature level of, for example, approximately 25 ℃, is removed from the flushing sump 108 or the flushing sumps 108 by means of the flushing sump heat pump device 160. This heat is raised by means of the compressor 170 to a temperature level of, for example, approximately 70 ℃ and is released to the phosphating tank to additionally heat the heat carrier in the circulation circuit 162 in order to additionally heat the phosphating tank 106.
The additional heating power of the phosphating bath additional heating circulation loop 162 is, for example, in the order of about 40kW to about 200 kW.
In order to be able to also convey the heat from the air circulation circuit 122 of the inlet sluice 114 of the pretreatment area 102 to the degreasing bath 104 of the pretreatment area 102, the apparatus 100 comprises a third heat pump device 176, which is referred to below as sluice heat pump device 178, and the air circulation circuit 122 of the inlet sluice 114 is thermally coupled to one another as a heat source and the degreasing bath additional heating circulation circuit 180 of the degreasing bath 104 as a heat sink.
As can be best seen from fig. 3, the air circulation circuit 122 of the inlet sluice 114 comprises a ventilator 182, a condenser 184 arranged downstream of the ventilator 182, and a branch 186 arranged downstream of the condenser 184, at which the air circulation circuit 112 branches into two branch ducts 188a and 188 b.
An adjustable flap 190 is arranged in each branch 188a, 188b, so that the volume flow of the circulating air can be distributed in a desired manner over the two branches 188a and 188 b.
The first branch conduit 188a opens into a first air chamber 192 from which air exits through slot nozzles 194 so that the exiting free beam of air forms an air curtain 116 that extends from top to bottom across a lock chamber 196 through which the workpiece to be processed is transported.
The air drawn by the ventilator 182 reaches the bottom of the lock chamber 196, passes through the suction channel 198 into the suction chamber 200 and from there to the suction side of the ventilator 182.
The second branch conduit 188b opens into a second air chamber 202. Air from the second air chamber 202 is drawn through the exit opening 204 on the bottom of the second air chamber 202 by the air exiting from the slot nozzle 194 based on the suction effect of the bundled free jets of air forming the air curtain 116.
By thus drawing circulating air from the second air plenum 202, the bundled free jets of air from the slit nozzle 194 are prevented from drawing air from the space outside the inlet gate 114. Thus, the atmosphere in front of the inlet lock 114 is separated from the atmosphere of the pretreatment region 102 behind the inlet lock 114 by the air curtain 116.
The sluice heat pump device 178 includes a refrigerant circulation circuit 206 through which a suitable refrigerant, such as tetrafluoroethane (trade name: R134a), passes in turn through the cold side of the condenser 184 (which thus functions as a refrigerant evaporator for the refrigerant), a compressor 208, a refrigerant condenser 210 and a throttle valve 212.
The refrigerant condenser 210 is traversed on the cold side by the heat carrier of the degreasing bath additional heating circuit 180, which absorbs heat from the refrigerant of the sluice heat pump device 178 in the refrigerant condenser 210, thereby additionally heating the degreasing bath 104.
In the condenser 184, the air guided in the air circulation circuit 122 releases heat to the refrigerant of the gate heat pump device 178, thereby cooling the air in the condenser 184 and condensing moisture in the cooled air. The condensate 214 formed collects, for example, at the bottom of the condenser 184 and is conveyed to the degreasing bath 104 via a condensate outlet conduit 216.
And thus circulates by delivering condensed moisture generating material to the degreasing bath 104 in addition to the thermal cycle.
To cool the lock air in the condenser 184, the refrigerant of the lock heat pump device 178 is evaporated on the inside of the condenser tubes 218 of the condenser 184.
The moisture condensed from the air in the condenser 184 is at least partially previously evaporated from the degreasing bath 104.
The circulating air used for generating the air curtain 116 in the inlet lock 114 is, for example, at about 15000Nm3The volumetric flow/h is heated in the air circulation circuit 122, in particular in the lock chamber 196, and is saturated with moisture. The loss on evaporation is, for example, about 0.25m3H to about 1m3In the order of magnitude of/h and thus (at an evaporation enthalpy of 2500 kJ/kg) corresponds to a heat loss of about 170kW to about 700 kW.
At a gate temperature of about 40 c to about 50 c, a refrigerant at a temperature of, for example, about 30 c is used on the refrigerant side of the condenser 184 for condensing moisture in the gate air. The refrigerant is raised by means of the compressor 208 to a temperature level of, for example, approximately 70 ℃, and the additional heating cycle 180 for heating the degreasing bath 104 is provided by means of the degreasing bath.
By using the heat pump devices 126, 160 and 178, a significant energy saving is achieved in the pretreatment area 102 and the dip tank 112 of the apparatus 100 for the surface treatment of workpieces.
Since many units required here are preferably located close to one another in space, the space and equipment and investment costs required are very low.
Another embodiment of a device, indicated as a whole by 100 and shown in fig. 4, for the surface treatment of workpieces (not shown), in particular vehicle bodies or vehicle body parts, is designed, for example, as a device for painting and/or coating workpieces. The apparatus comprises in particular a preprocessor area 102, wherein a degreasing area with at least one degreasing bath 104, a rinsing area with at least one rinsing bath 220 and an activation area with at least one activation bath 222 follow one another in the conveying direction 110 of the workpieces.
The path of travel of the workpieces is indicated in fig. 4 by the arrow 224, which shows the workpieces being submerged in different baths one after the other and being moved out of the baths again.
The pretreatment region 102 of the apparatus 100 for surface treatment may comprise further pretreatment baths, in particular a coating bath following the activation bath 222. A coating comprising zinc phosphate or silane or zirconium complex is preferably applied in the coating bath.
Furthermore, the apparatus 100 for surface treatment preferably comprises a dip tank, for example an electrophoretic dip tank, following the pretreatment region 102 and comprises a plurality of further (not shown) process stages, for example a dip dryer, a treatment region for applying a substrate protection layer, a treatment region for performing a gap sealing operation and/or a further dryer.
In the activation bath 222, crystal nuclei are sprayed onto the surface of the workpiece in order to better form crystals in the coating behind.
Activation cell 222 preferably comprises a colloidal dispersion having a titanium phosphorus core that decays with time and loses activity depending on temperature conditions. To control the decay process, the temperature within activation cell 222 is maintained between about 35 ℃ and about 45 ℃. During operation of the device 100, the activation bath 222 is cooled if the workpieces are heated in the degreasing bath 104 and the heat is released partly in the rinsing bath 220 and partly in the activation bath 222.
The heat input into the activation bath through the workpiece may be in the range of several kilowatts to over 100kW, for example.
Conversely, heating the activation bath may be provided when starting up the apparatus 100 after a production interruption, so that the activation bath 222 is heated to the desired treatment temperature. Thus, the plant 100 comprises an active cell temperature controlled circulation loop 226, which can be crossed by a heat carrier (for example water) and comprises a heat carrier pump 228.
Downstream of the heat carrier pump 228, the activation bath temperature-controlled circuit 226 branches into a heating branch 230 with a heating heat exchanger 232, in which heat generated by means of a heating device (not shown) can be transferred to the heat carrier when the activation bath 222 is to be heated, and a cooling branch 234 with an activation bath heat exchanger 236; when cooling of the active cell is required, the cooling branch is traversed on the hot side by the heat carrier of the active cell temperature-controlled circulation loop 226.
The activation pool heat exchanger 236 simultaneously forms the evaporator 238 of the heat pump arrangement 240.
In addition to the evaporator 238, through which the refrigerant of the heat pump device 240 flows on the cold side and in which the refrigerant absorbs heat from the heat carrier of the activation cell temperature-control circuit 226 when cooling the activation cell 222, the refrigerant circuit 242 of the heat pump device 240 also comprises a compressor 244 arranged downstream of the evaporator 238, a condenser 246 arranged downstream of the compressor 244 and a throttle valve 250 arranged downstream of the condenser 246, wherein the condenser is through-flowed on the cold side by the heat carrier (e.g. water) of the degreasing cell heating circuit 248 and in which the refrigerant releases heat to the heat carrier of the degreasing cell heating circuit 248; downstream of the throttle valve an evaporator 238 is arranged.
The degreasing bath heating cycle 248 is used to heat the degreasing bath 104 and comprises, in addition to the condenser 246, a heat carrier pump 252 arranged upstream of the condenser 246.
The degreasing bath 104 forms a heat sink treatment area 118 of the apparatus 100 and the activation bath 222 forms a heat source treatment area 120 of the apparatus 100, at least during cooling of the activation bath 222.
The degreasing bath heating circulation circuit 248 as a heat sink and the activation bath temperature-controlled circulation circuit 226 as a heat source are thermally coupled to each other by the heat pump device 240.
The function of the heat pump device 240 corresponds in principle to that of the previously described dip coating heat pump device 126 of the first embodiment of the apparatus 100 for the surface treatment of workpieces.
The heat of the heat carrier from the activation bath temperature-controlled circulation circuit 226, at a temperature level of, for example, approximately 30 ℃, is drawn off from the activation bath 222 by means of a heat pump device 240. The heat is raised by means of the compressor 244 to a temperature level of, for example, approximately 60 ℃ and is released to the heat carrier of the degreasing bath heating circuit 248 for (if necessary additionally) heating the degreasing bath 104.
The activation cell 222 is alternately cooled or heated by alternately opening either the cooling branch 234 or the heating branch 230 of the activation cell temperature controlled circulation loop 226 so that the activation cell is maintained within the desired temperature range of about 35 c to about 45 c.
The thermal power delivered from the refrigerant circulation circuit 242 of the heat pump device 240 to the degreasing bath heating circulation circuit 248 is in a range of, for example, about 51kW to about 204 kW. The efficiency COP of the heat pump arrangement 240 is for example about 5.5.
During operation of the device 100, water, in particular desalinated water or completely desalinated water (VEW water), is supplied to the activation reservoir 222 by means of the water supply 254, the amount of water per square meter of the workpiece surface to be coated being about 0.5L to about 1L.
Here, the surface throughput rate of the apparatus 100 may be in a range of about 3000 square meters of the workpiece surface to be coated to about 6000 square meters of the workpiece surface to be coated per hour.
Excess fluid formed by the water delivery means to the activation tank 222 is delivered from the activation tank 222 to the flush tank 220 through overflow means 256.
A further embodiment of the apparatus 100 for surface treatment of workpieces, which is shown in fig. 5, differs from the embodiment shown in fig. 4 in that the heat pump device 240 is not only thermally coupled to the active bath temperature-controlled circuit 226, but also to a rinse bath cooling circuit 258 for cooling the rinse bath 220.
The flushing sump cooling circuit 258 comprises a heat carrier pump 260 and a flushing sump heat exchanger 262 arranged downstream of the heat carrier pump 260, through which a heat carrier, for example water, of the flushing sump cooling circuit 258 flows on the hot side.
On the cold side, the flushing pool heat exchanger 262 is traversed by the refrigerant of the heat pump device 240, which absorbs heat from the heat carrier of the flushing pool heat exchanger 262.
The flushing pool heat exchanger 262 is arranged in the refrigerant circulation circuit 242 of the heat pump device 240 downstream of the activation pool heat exchanger 236 and upstream of the compressor 244, and together with the activation pool heat exchanger 236 forms the evaporator 238 of the heat pump device 240.
In this case, then, the evaporator 238 of the heat pump unit 240 comprises a cascade of a plurality of heat exchangers 236 and 262.
Thus, the temperature level of the coolant, which is, for example, about 30 ℃ after exiting the activation pool heat exchanger 236, rises, for example, to about 40 ℃ or about 45 ℃, before entering the compressor 244.
It is well known that the efficiency of a heat pump depends on the difference between the high temperature level (after compressor 244) and the low temperature level (before compressor 244), and increases as the difference in temperature levels decreases. According to the invention, the low temperature level of the refrigerant is increased by guiding the refrigerant through a plurality of heat exchangers in cascade. The efficiency COP of the heat pump arrangement 240 is thus increased from a value of, for example, approximately 5.5 (without cascade guidance) to a value of, for example, approximately 8.3 (when increasing the low temperature level to approximately 40 ℃) or to a value of, for example, approximately 11 (when increasing the low temperature level to approximately 45 ℃).
Here, the refrigerant of the heat pump device 240 may be evaporated in the first heat exchanger (activation bath heat exchanger 236) or in the second heat exchanger (flushing bath heat exchanger 262) or partly in the first heat exchanger and partly in the second heat exchanger.
Furthermore, the further embodiment of the apparatus 100 for surface treatment of workpieces shown in fig. 5 corresponds in construction and operation to the embodiment shown in fig. 4, to which reference is made to the preceding description.
The difference between the further embodiment of the device 100 for surface treatment of workpieces shown in fig. 6 and the embodiment shown in fig. 4 is, in particular, that instead of an activation region with an activation bath 222 and a phosphating bath (not shown) following it, a thin-layer region or a nanocoating region with a conversion bath or a nanocoating bath 264 is provided.
In this nanocoating bath 264, which can in particular replace the hitherto common phosphating, the coating process is carried out on a chemical substrate of silane or zirconia or on a substrate of another substance suitable for the construction of a durable primer layer.
In this case, the zirconium salt can be converted, in particular, into a coating composed of zirconium oxide.
The layer thickness of the coating produced on the workpiece in the nanocoating bath 264 is, for example, in the range of about 20nm to about 200 nm. The processing time is in the range of, for example, about 30 seconds to about 120 seconds depending on the temperature.
The temperature of the nanocoating bath 264 is preferably in the range of about 10 ℃ to about 50 ℃, especially in the range of about 20 ℃ to about 30 ℃.
For the case in which the nanocoating bath 264 is heated by the workpiece brought in after heating in the degreasing bath 104 while the apparatus 100 is in operation, it is desirable if the nanocoating bath 264 is cooled while the apparatus 100 is in operation. In the event that the apparatus 100 is started up after a production interruption, it may be necessary to heat the nanocoating bath 164 again in order to set the temperature of the nanocoating bath 164 within a desired range.
During cooling of the nanocoating pool 264, it itself forms the heat source treatment region 120 of the apparatus 100.
The nanocoating bath temperature-controlled circuit 266 can in principle be constructed exactly like the activation bath temperature-controlled circuit 226 in the embodiment shown in fig. 4, so that it, just like the activation bath temperature-controlled circuit 226, can be connected to the heat pump device 240 by means of a nanocoating bath heat exchanger 268 corresponding to the previously described activation bath heat exchanger 236 and is thus thermally coupled to the degreasing bath heating circuit 248.
The overflow 256 to the rinsing bath 220 provided in the embodiment according to fig. 4 can also be dispensed with in this embodiment if no water is supplied to the nanocoating bath 264 during operation of the device 100.
Furthermore, the embodiment of the apparatus 100 for surface treatment of workpieces shown in fig. 6 corresponds in construction and operation to the embodiment shown in fig. 4, to which reference is made to the preceding description.
Even when the activation bath 222 is replaced by the nanocoating bath 264, the evaporator 238 of the heat pump device 240 can be designed in multiple pieces as a cascade and in particular also comprise, in addition to the nanocoating bath heat exchanger 268, a rinsing bath heat exchanger 262, wherein the refrigerant of the heat pump device 240 absorbs heat from the rinsing bath cooling circuit 258 in order to increase the low temperature level of the heat pump device 240, as explained above in the context of the embodiment according to fig. 5, which is described with reference to the above description.
Claims (14)
1. Apparatus for the surface treatment of workpieces, comprising at least one heat sink treatment region (118) to which heat is to be supplied during operation of the apparatus (100) and at least one heat source treatment region (120) from which heat is to be removed during operation of the apparatus (100), wherein the apparatus (100) comprises at least one heat pump device (124, 158, 176; 240) which is coupled to the at least one heat source treatment region (120) for absorbing heat and to the at least one heat sink treatment region (118) for releasing heat,
wherein at least one heat pump device (176) is coupled to an air circulation circuit (122) of the installation (100) for absorbing heat and to one or more pre-treatment baths of the installation (100) for releasing heat,
wherein the air circulation circuit (122) comprises means for generating an air curtain (116) through which the workpiece to be treated passes during operation of the apparatus (100).
2. The apparatus for surface treatment of workpieces as claimed in claim 1, characterized in that the apparatus (100) is configured as an apparatus for painting workpieces.
3. An apparatus for surface treatment of workpieces according to claim 2, characterized in that at least one heat sink treatment area (118) comprises a pretreatment tank of the apparatus (100).
4. An apparatus for surface treatment of workpieces according to claim 2 or 3, characterized in that at least one heat source treatment area (120) comprises a dip tank (112) and/or a sluice of the apparatus (100).
5. An apparatus for surface treating workpieces according to any of claims 1 to 3, characterised in that the apparatus (100) comprises a condenser (184) for cooling and/or dehumidifying the air in the air circulation circuit (122).
6. An apparatus for the surface treatment of workpieces according to claim 5, characterized in that the apparatus (100) comprises a condensate outlet conduit (216), by means of which condensate condensed out of the air in the condenser (184) can be fed to a treatment basin of the apparatus (100).
7. An apparatus for surface treatment of workpieces according to any of claims 1 to 3, characterized in that the means for generating the air curtain (116) comprise means for distributing the air flow guided in the air circulation circuit (122) to a first air chamber (192) and a second air chamber (202), wherein nozzles for generating bundled air jets are placed after the first air chamber (192) and an exit opening (204) adjacent to the air curtain (116) is placed after the second air chamber (202).
8. An apparatus for surface treatment of workpieces according to claim 2 or 3, characterized in that at least one heat source treatment zone (120) of the apparatus (100) comprises a rinsing bath (108) and/or an activation bath (222) and/or a nanocoating bath (264).
9. An apparatus for surface treatment of workpieces according to any of claims 1 to 3, characterized in that at least one heat pump device (240) comprises at least two heat exchangers (236, 262; 268, 262) for conveying heat to the associated heat pump device (240).
10. An apparatus for surface treatment of workpieces according to any of claims 1 to 3, characterized in that the apparatus (100) comprises at least two heat pump devices (124, 158, 176) which are coupled to at least two different heat-source treatment areas (120) for absorbing heat and/or to at least two different heat-sink treatment areas (118) for releasing heat.
11. An apparatus for surface treating a workpiece according to any one of claims 1 to 3, characterised in that the apparatus (100) comprises a cooling device (156) for removing excess heat from at least one heat pump device (124).
12. An apparatus for surface treatment of workpieces according to any of claims 1 to 3, characterized in that the apparatus (100) comprises heating means for delivering additional heat to at least one heat sink treatment area (118).
13. An apparatus for surface treatment of workpieces according to any of claims 1 to 3, characterized in that at least one heat pump device (124, 158, 176; 240) comprises a closed refrigerant circuit (132, 168, 206; 242) which is coupled to a cooling circuit (128, 164, 122; 226; 258) of a heat source treatment area (120) of the apparatus (100) for absorbing heat and to a heating circuit (130, 162, 180; 248) of a heat sink treatment area (118) of the apparatus (100) for releasing heat.
14. Method for surface treatment of a workpiece in an apparatus (100) for surface treatment of a workpiece, comprising the method steps of:
-conveying the workpiece through at least one heat sink processing area (118) to which heat is to be delivered when the apparatus (100) is in operation, and at least one heat source processing area (120) from which heat is to be conducted away when the apparatus (100) is in operation; and
-coupling at least one heat pump device (124, 158, 176) to at least one heat source treatment area (120) for absorbing heat and to at least one heat sink treatment area (118) for releasing heat,
wherein,
at least one heat pump device (176) is coupled to the air circulation circuit (122) of the installation (100) for absorbing heat and to one or more pre-treatment baths of the installation (100) for releasing heat,
wherein the air circulation circuit (122) comprises means for generating an air curtain (116) through which the workpiece to be treated passes during operation of the apparatus (100).
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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DE102011051879.7 | 2011-07-15 | ||
DE102011051879.7A DE102011051879B4 (en) | 2011-07-15 | 2011-07-15 | System and method for the surface treatment of workpieces and use of such a system for painting workpieces |
PCT/EP2012/053469 WO2013010681A1 (en) | 2011-07-15 | 2012-02-29 | Installation for the surface treatment of workpieces |
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CN103648660A CN103648660A (en) | 2014-03-19 |
CN103648660B true CN103648660B (en) | 2016-08-17 |
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EP (1) | EP2731730B1 (en) |
CN (1) | CN103648660B (en) |
DE (1) | DE102011051879B4 (en) |
WO (1) | WO2013010681A1 (en) |
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EP3569743A1 (en) * | 2018-05-16 | 2019-11-20 | Henkel AG & Co. KGaA | Conveying frame cleaning in a process sequence for use in electro-dip coating |
JP7177620B2 (en) * | 2018-08-02 | 2022-11-24 | トリニティ工業株式会社 | Heat recovery device and electrodeposition coating system |
CN109338387B (en) * | 2018-10-19 | 2021-01-29 | 安庆中船柴油机有限公司 | Multifunctional metal surface treatment system and treatment method |
DE102019110636A1 (en) * | 2019-04-24 | 2020-10-29 | Dürr Systems Ag | Temperature treatment stage and treatment system for treating components |
CN114921835B (en) * | 2021-05-13 | 2023-07-25 | 宜兴大平杆塔制造有限公司 | Use process of waste heat utilization system for galvanization production |
DE102021126089B3 (en) | 2021-10-07 | 2022-09-01 | Geicotaikisha Gmbh | Procedure for load-dependent dryer adjustment and dryer |
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Also Published As
Publication number | Publication date |
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DE102011051879B4 (en) | 2023-11-09 |
DE102011051879A1 (en) | 2013-01-17 |
CN103648660A (en) | 2014-03-19 |
WO2013010681A1 (en) | 2013-01-24 |
EP2731730A1 (en) | 2014-05-21 |
EP2731730B1 (en) | 2016-04-27 |
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