CN103648660A - Installation for the surface treatment of workpieces - Google Patents

Installation for the surface treatment of workpieces Download PDF

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Publication number
CN103648660A
CN103648660A CN201280035173.6A CN201280035173A CN103648660A CN 103648660 A CN103648660 A CN 103648660A CN 201280035173 A CN201280035173 A CN 201280035173A CN 103648660 A CN103648660 A CN 103648660A
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China
Prior art keywords
heat
equipment
pond
processing region
pump assembly
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CN201280035173.6A
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Chinese (zh)
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CN103648660B (en
Inventor
于尔根·韦舍克
沃尔夫冈·托比施
迪特马尔·威兰
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Toure Systems Inc.
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Duerr Systems AG
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/22—Servicing or operating apparatus or multistep processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/34—Methods of heating
    • C21D1/44—Methods of heating in heat-treatment baths
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • C21D9/0062—Heat-treating apparatus with a cooling or quenching zone

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)

Abstract

To create an installation for the surface treatment of workpieces which comprises at least one heat sink/treatment zone (118), to which heat is to be supplied during operation of the installation (100), and at least one heat source/treatment zone (120), from which heat is to be dissipated during operation of the installation (100), in which installation less energy is required to heat up the heat sink/treatment zone (118) and to cool the heat source/treatment zone 120, it is proposed that the installation comprise at least one heat pump device (124, 158, 176, 240) which is coupled, for absorbing heat, to at least one heat source/treatment zone (120) and, for dissipating heat, to at least one heat sink/treatment zone (118).

Description

For workpiece is carried out to surface-treated equipment
Technical field
The present invention relates to a kind ofly for workpiece is carried out to surface-treated equipment, it comprises that at least one heat sink processing region that will be fed to heat when equipment moves and at least one will therefrom derive the thermal source processing region of heat when equipment moves.
Background technology
This equipment that especially can be constructed to the parts japanning of vehicle body or vehicle body for workpiece being carried out to surface-treated equipment.
For vehicle body, prime and especially comprise the flow process stage of pretreatment and electrophoretic coating (for example ability cathode electrophoresis japanning).
The process step of for example carrying out degreasing in pretreated scope, phosphatization is processed and/or preferably carrying out passivation in infiltration pond.
The process step of electrophoretic coating also can be carried out in infiltration pond.At this, in infiltration pond, produce heat, this is because there is Ohmic resistance in dipping lacquer pond, has electric current to flow through this resistance in electrolytic coating process.
When degreasing and phosphatization are processed, treatment temperature is preferably higher than room temperature, thereby pretreatment pool is heated.Treatment temperature in electrophoretic enamelling pond preferably keeps approaching room temperature, thereby makes the heating of dipping lacquer pond based on when the electrolytic lacquering and be again cooled.
In known coating apparatus, for cooling dipping lacquer pond, use own independent cooler or use the temperature of central cooling device when influent stream, to be for example approximately 7 ℃ and when backflowing, be approximately the cooling medium of 12 ℃.The heat accumulating in cooler by recooling system, for example, is discharged in surrounding environment by air/fluid heat exchanger or cooling tower in unemployed situation.
For in pretreatment zone heat treated pond, as heat medium, use and be for example approximately the hot water of 80 ℃ to 100 ℃ from the influent stream temperature of central firing equipment.
Summary of the invention
The present invention based on task be realize a kind of start described type for workpiece is carried out to surface-treated equipment, it is in order to heat at least one heat sink processing region and at least one thermal source processing region to be carried out to the less energy of cooling needs.
According to the present invention, this task solves in the following manner in the equipment of feature of preamble with claim 1,, this equipment comprises at least one heat pump assembly, it is coupled in order to absorb heat and at least one thermal source processing region, and for release heat and at least one heat sink processing region coupling.
Compare the heat sink processing region of independent heating and independent cooling thermal source processing region, for example, for example, by be coupled at least one thermal source processing region (electrophoretic enamelling pond) and at least one heat sink processing region (treatment pond in pretreatment zone) of thermal technology, can reach the object of obvious saving energy.
Can be by a plurality of or allly all arrange and be spatially directly adjacent to thermal source processing region and heat sink processing region place for be coupled unit that thermal source processing region and heat sink processing region need of thermal technology at this, thus will by long pipeline, not be connected with central cooling device or heat sink processing region is connected with central firing equipment by the pipeline of growing by thermal source processing region.This is conducive to reduce equipment and expends, and therefore reduces the cost of investment needing.
By being coupled by heat pump assembly, can be identified for best temperature levels cooling and for heating depending on flow process.Especially can promote for cooling temperature levels, from for example common coolant temperature of about 10 ℃, rise to for example coolant temperature of about 20 ℃, and/or reduce the temperature levels for heating, from for example common heat medium temperature within the scope of about 80 ℃ to 100 ℃, drop to for example heat medium temperature of about 70 ℃.
In a kind of preferred design of the present invention, arrange, for workpiece is carried out to surface-treated equipment, be constructed to workpiece, especially the equipment of the parts of vehicle body or vehicle body japanning.
At least one is heat sink, and processing region can comprise the pretreatment pool of equipment, especially degreasing pond and/or phosphating pond.
At least one thermal source processing region can comprise dipping lacquer pond and/or the lock district of equipment.
Equipment Zha district especially can be prepended to the pretreatment zone of equipment.
At least one heat pump assembly of equipment can be connected with cooling circuit and/or be connected with heat cycles loop in order to absorb heat, wherein, and for absorbing the heat carrier of the heat of self-heat power processing region to circulate at this cooling circuit; Heat carrier for heat sink processing region release heat circulates in this heat cycles loop.
Can arrange in addition, equipment for absorbing heat and/or for the coupling of at least one heat pump assembly of release heat and the air circulation loop of equipment.
This air circulation loop especially can produce air curtain for the lock region at equipment.
At this particularly advantageously, equipment comprises for the air of air circulation loop being carried out to condenser cooling and/or dehumidifying.This condenser especially can be used in the cold-producing medium evaporating in the cooling medium closed circuit that is coupled to the heat pump assembly on air circulation loop.
Particularly advantageously, equipment comprises coagulation derivation conduit, derives conduit the coagulation freeze-outing can be flowed to the treatment pond of equipment, for example degreasing pond by this coagulation in condenser from air.By this way not only can be by the energy from air circulation loop, can also be by the fluid volatilizing from treatment pond defeated time treatment pond again.
In a kind of preferred design of the present invention, arrange, air circulation loop comprises the device for generation of air curtain, and pending workpiece can pass this air curtain when equipment moves.
This air curtain especially can be for separating the atmosphere that is positioned at air curtain front region of the atmosphere that is positioned at air curtain rear area of equipment and equipment.Therefore especially can avoid moist steam from one of them region, leak into surrounding environment and avoid bringing unholiness thing into through air curtain.
Particularly advantageously, for generation of the device of air curtain comprise for by the distribution of air flow guiding at air circulation loop to the device in the first air chamber and the second air chamber, wherein, nozzle for generation of the air beam of bunchy is placed on the first air chamber, and the leave opening adjacent with air curtain is placed on the second air chamber.In a kind of such design of the device for generation of air curtain, realize: the air beam of the bunchy producing by nozzle extracts the circulated air from the second air chamber.
At least one thermal source processing region of equipment can comprise flushing tank, preferably includes the treatment pond that is placed on pretreatment zone, especially the flushing tank of phosphating pond.Because it is conventionally nonsensical that the heat in input flushing tank continues to use in processing region below, so it is significant using heat pump, to take heat away from flushing tank (or a plurality of flushing tank), and if desired heat is used for to the heat sink processing region of surface-treated equipment with higher temperature levels feed-in.
In addition, at least one thermal source processing region of equipment can comprise activation pond, is preferably prepended to the activation pond of phosphating pond.In this activation pond, for example, nucleus is sprayed onto on surface of the work, so that the phosphatization below forms crystal in processing better.
Activate pond and preferably comprise the colloidal dispersion with titanium phosphorus core, it decays and loses activity within the time of the temperature correlation with activation pond.In order to control easily this decay process, the temperature activating in pond is arranged between about 35 ℃ and about 45 ℃.For example, when in pending workpiece is being prepended to the treating stations that activates pond, heat in (in degreasing pond), heat can be transfused to activation pond, when this may make to have at least, to activating pond, carries out cooling.
It is significant using in this case heat pump, to take heat away from activating pond, and heat is used for to the heat sink processing region of surface-treated equipment with higher temperature levels feed-in.
Stationary temperature guiding in order to ensure activating in pond can also arrange heater except the cooling device in activation pond.Especially when produce interrupting, activate pond and be cooled to treatment temperature when following, be just provided with heater.For example, when the pond increase in temperature that makes to activate pond when the heat input by workpiece surpasses predetermined rated value, be provided with cooling device.
In addition, at least one thermal source processing region of equipment can comprise nano coating pond, is preferably placed on the nano coating pond of degreasing pond and/or flushing tank.
Nano coating pond or thin layer pond can be used for being substituted in the phosphatization of carrying out in traditional workpiece coating and process.
In nano coating pond, for example on silane or zirconic chemical matrix, carry out coating, wherein, bed thickness arrives in the scope of about 200nm at about 20nm.Processing time in nano coating pond is for example arranged between about 30 seconds to about 120 seconds according to temperature.Carrying out phosphatization while processing, the temperature of phosphating pond need to reach about 40 ℃ to about 60 ℃, even and at the lower temperature between about 10 ℃ to 50 ℃ nano coating method also can move.Higher temperature causes higher bed thickness, and lower temperature causes less bed thickness.The particularly preferred temperature span in nano coating pond is in the scope of about 20 ℃ to about 30 ℃.
By accurately guiding the temperature in nano coating pond, except constructing complete layer, also realize uniform as far as possible layer thickness distribution in nano coating.When carrying out electrophoretic coating, especially anaphoresis japanning as electrodeposition process after nano coating, electrophoretic coating method has very responsive reaction to the different resistance of base material.If nano coating has difference in thickness, the different bed thickness of this coating that can produce from the electrophoretic coating by below, discover out so.
If workpiece is heated to more than 50 ℃ temperature in the pond that is prepended to nano coating pond, by workpiece, just heat input can be activated to pond so, thereby be expected to cooling nano coating pond.
It is significant using in this case heat pump, to take heat away in nano coating pond, and heat is used for to the heat sink processing region of surface-treated equipment with another temperature levels feed-in.
In order to ensure the guiding of temperature good especially in nano coating pond, as the alternative of cooling device or supplement and also the heater in pond can be set.Especially when disconnected aborning, nano coating pond is cooled to the treatment temperature of permission when following, needs heater.Especially when making the pond temperature in nano coating pond increase overrate by input heat, need cooling device.
Particularly advantageously, from nano coating pond or activate the heat taken away in pond by heat pump with higher temperature levels feed-in in the degreasing pond for surface-treated equipment.
Can guide consistently thus nano coating pond or activate the temperature in pond, this makes the electrophoretic coating carrying out have better japanning quality below.
In addition can reduce the cooling power for cooling nano coating pond or activation pond needs, and can reduce equally in order to heat the heating power of degreasing pond needs.
Because the efficiency COP(coefficient of performance of heat pump) depend on the horizontal T of high temperature of heat pump release heat and the low temperature level T that heat pump absorbs heat 0between poor (COP=T/ (T-T 0) * η compressorthe electrical power of=heat/compressor of transmitting), so, when at least one heat pump assembly comprises that at least two for by heat delivery during to the heat exchanger of relevant heat pump assembly, the improved efficiency of heat pump assembly.
Advantageously, at least two for heat delivery is connected to the heat exchanger in series of heat pump assembly, that is to say, successively cooled dose of percolation.
In addition advantageously, at least wherein two heat exchangers in hot side by the different heat carrier percolation of temperature, wherein, the temperature that the temperature that especially the first heat carrier (it at hot side percolation first at the first heat exchanger of cooled dose of percolation of cold side) has has lower than the second heat carrier (it at hot side percolation afterwards at the second heat exchanger of cooled dose of percolation of cold side).
Preferably, the thermal source processing regions coupling that at least two heat exchangers are different from two so that can for heat pump assembly transport from least two different thermal source processing regions, the heat on different temperature levels especially.Can promote low temperature level T by this way 0, and therefore raise the efficiency.
If heat pump assembly for example absorbs the heat in self-activation pond or nano coating pond, and by these thermal releases to degreasing pond, low temperature level is for example at about 30 ℃ so, and high temperature level is for example at about 60 ℃, obtains being thus approximately 5.5 COP.
But, if the cold-producing medium in the refrigerant circulation loop of heat pump assembly is first through the first heat exchanger (absorbing therein the heat in self-activation pond or nano coating pond), and then through the second heat exchanger, (absorb therein the heat from flushing tank, especially from the heat that is placed on the flushing tank in degreasing pond), low temperature level is for example promoted to about 40 ℃ or about 45 ℃ by this cascade guiding so, thus the efficiency COP of heat pump assembly is brought up to about 8.3 or about 11, this is obvious improvement.
The first heat exchanger and the second heat exchanger form the evaporimeter of heat pump assembly in this case jointly, wherein, the evaporation of the cold-producing medium in the refrigerant circulation loop of heat pump assembly can part be carried out in the second heat exchanger at the first evaporimeter and part, or in the first heat exchanger or completely, in the second heat exchanger, carries out completely.
According to of the present invention, for surface-treated equipment, comprise at least one heat pump assembly, it is coupled in order to absorb heat and at least one thermal source processing region, and for release heat and at least one heat sink processing region coupling.
For thermal source processing region that can be by Coupling device and heat sink processing region and utilize as much as possible energy saving potentiality, advantageously, this equipment comprises two or more heat pump assemblies, and they are in order to absorb the coupling of the heat thermal source processing region different from least two and/or for release heat and at least two different heat sink processing region couplings.
For example this equipment can comprise a heat pump assembly, and it is coupled in order to absorb heat and dipping lacquer pond, and for release heat and the coupling of one or more pretreatment pool, especially with degreasing pond and/or phosphating pond coupling.
Alternative or as a supplement, this equipment can also comprise a heat pump assembly, it is in order to absorb heat and flushing tank coupling, and for release heat and one or more pretreatment pool are coupled, is especially coupled with phosphating pond.
Alternative or as a supplement, this equipment also can comprise a heat pump assembly, and it is in order to absorb the air circulation loop coupling of heat and equipment, especially in order to produce air curtain in equipment Zha district, and for release heat and the coupling of one or more pretreatment pool, be especially coupled with degreasing pond.
Because especially may be by absorbing whole heats from the derivation of thermal source processing region by heat pump assembly with the heat sink processing region of relevant thermal source processing region coupling at the operation tempus intercalare of heat sink processing region, so advantageously, this equipment comprises for deriving the cooling device from the unnecessary heat of at least one heat pump assembly.
This cooling device is preferably arranged in the by-pass conduit of refrigerant circulation loop of heat pump assembly.
Because especially during the heating period of heat sink processing region, the heat demand of the heat sink processing region of equipment may surpass the thermal release of the thermal source processing region being coupled with relevant heat sink processing region by heat pump assembly, so advantageously, this equipment comprises for the heater at least one heat sink processing region by extra heat delivery.
This heater especially can be arranged in the heat cycles loop of the relevant heat sink processing region being coupled to heat pump assembly.
What in a kind of preferred design of the present invention, arrange is, at least one heat pump assembly comprises closed refrigerant circulation loop, it is in order to absorb thermal coupling to the cooling circuit of thermal source processing region, and is coupled on the heat cycles loop of heat sink processing region of equipment for release heat.
The invention still further relates to a kind of for workpiece being carried out to surface-treated method for workpiece is carried out to surface-treated equipment.
Another basic task of the present invention is to realize a kind of like this method, wherein, in order to heat, will be fed to the required energy of the heat sink processing region of heat still less when equipment moves.In addition the energy needing for the cooling thermal source processing region that will therefrom derive heat when equipment moves, should be still less.
According to the present invention, described task is by a kind of for workpiece is being carried out to surface-treated method being solved for workpiece being carried out to surface-treated equipment, and it comprises following methods step:
-work piece delivery is passed at least one heat sink processing region that will be fed to heat when equipment moves when equipment moves, will therefrom derive the thermal source processing region of heat with at least one; And
-at least one heat pump assembly is coupled in order to absorb heat at least one thermal source processing region, and for release heat, be coupled at least one heat sink processing region.
With respect to following methods, wherein, heat sink processing region is cooling by independent cooling device by independent heater heating and thermal source processing region, and not by the mutual thermal technology's coupling of these processing regions, by least one the heat sink processing region by least one heat pump assembly thermal technology Coupling device and at least one thermal source processing region, can realize obvious energy saving.
Accompanying drawing explanation
Other features and advantages of the present invention are illustrated themes of following description and embodiment.
In the accompanying drawings:
Fig. 1 illustrates for workpiece, the schematic block diagram of the surface-treated equipment of vehicle body especially, and wherein, this equipment comprises having the pretreatment zone of an entrance lock, a plurality of pretreatment pool and a flushing tank and the then dipping lacquer pond of pretreatment zone;
The cooling circuit in dipping lacquer pond is shown Fig. 2, the heat cycles loop of pretreatment zone and for the be coupled schematic block diagram of heat pump assembly in cooling circuit and heat cycles loop of thermal technology;
Fig. 3 illustrates for producing the air circulation loop of air curtain at entrance lock and for the be coupled schematic block diagram of heat pump assembly in heat cycles loop of pretreatment pool of air circulation loop and pretreatment zone of thermal technology;
Fig. 4 illustrates for workpiece being carried out to the schematic block diagram of a part for surface-treated equipment, wherein, this equipment comprise have at least one degreasing pond degreasing region, there is the flushing region of at least one flushing tank and there is the active region that at least one activates pond, and wherein, activating the cooling circuit in pond and the heat cycles loop in degreasing pond is coupled by heat pump assembly thermal technology;
Fig. 5 illustrates the schematic block diagram of embodiment of a kind of alternative of the equipment shown in Fig. 4, and wherein, heat pump assembly comprises additional heat exchanger, for being coupled the cooling circuit of flushing tank; And
Fig. 6 illustrates a kind of schematic block diagram corresponding to Fig. 4 of equipment, and wherein, the activation pond of the equipment shown in Fig. 4 is replaced by nano coating pond.
Element identical or functional equivalence all uses identical Reference numeral to represent in all figure.
The specific embodiment
Shown in Fig. 1 to 3, whole with the 100 surface-treated equipment for (unshowned) workpiece, especially vehicle body or car body component that represent, be for example configured to a kind of workpiece that is used to and paint and/or the equipment of coating.This equipment 100 comprises (see figure 1) pretreatment zone 102, and the direction of transfer 110 along workpiece in this pretreatment zone is followed by successively degreasing pond 104, coating pond 106, also has if desired (unshowned) passivation pool and one or more flushing tank 108.
Aforesaid part of appliance is for example for applying the coating of priming paint form to pending workpiece.Priming paint is in particular for anticorrosion, and preferably includes the material as the zirconium composite of trbasic zinc phosphate, organo-silicon compound (silane) or organic substrate.In addition can respectively the parkerizing process of the phosphating pond of describing or description be replaced with silane or zirconium composite treatment pond on a 50-50 basis.
Pretreatment zone 102 is followed dipping lacquer pond 112 below, and it for example can be configured to electrophoretic enamelling pond, especially anaphoresis dipping lacquer pond (KTL) or cataphoresis dipping lacquer pond.
Follow a plurality of other (unshowned) flow process stages below in dipping lacquer pond 112, for example drier (impregnating varnish hardens therein), for applying the processing region of substrate protective layer, for carrying out processing region and/or other driers of gap sealing operation.
Pending workpiece, especially vehicle body are conveyed through pretreatment zone 102 and processing region below by (unshowned) conveyer on direction of transfer 110, and especially dipping lacquer pond 112.
Pretreatment zone 102 is preferably arranged in the tunnel of sealing as far as possible, to the atmosphere of the atmosphere of pretreatment zone 102 and surrounding environment is separated.
Before entering pretreatment zone 102, workpiece is through entrance lock 114, wherein, in air circulation loop 122, produce air curtain 116(and see Fig. 3), thereby the atmosphere in the region that is positioned at pretreatment zone 102 the place aheads of the atmosphere of pretreatment zone 102 and equipment 100 is separated, and avoid moist steam to leak into surrounding environment from pretreatment zone 102, and avoid unholiness thing to be brought in pretreatment zone 102.
Through after entrance lock 114, first the workpiece in pretreatment zone 102 is removed other constituents (as body in white is made the polishing product of operation) and the bead of anticorrisive agent, deep-draw oil, particle form in degreasing pond 104.
In the coating pond 106 of following, (coating pond current design becomes phosphating pond), for example, be coated to zinc phosphate layer on workpiece, and process in ensuing passivation pool inner sealing phosphatization the crystal pores staying.
In following the dipping lacquer pond 112 of pretreatment zone 102, by electrolytic lacquering, be whole material surface, that is to say that crust also has sightless interior zone, as the threshold of vehicle body, japanning.Because dipping lacquer pond 112 presents the Ohmic resistance that has electric current process, so produce heat by the electrolytic coating to workpiece, this heat should be derived from dipping lacquer pond 112.
Treatment temperature in degreasing pond 104 and phosphating pond 106 is in the scope of about 45 ℃ to 65 ℃, and temperature in dipping lacquer pond 112 is in the scope of about 27 ℃ to about 34 ℃.
Therefore, described pretreatment pool is in equipment 100 run durations heating, and according to the present invention cooling dipping lacquer pond 112.
Therefore, degreasing pond 104 and phosphating pond 106 are will be fed to the heat sink processing region 118 of heat when equipment 100 operation, and dipping lacquer pond 112 is will therefrom derive the thermal source processing region 120 of heat when equipment 100 operation.
For the air circulation loop 122 at the interior generation air curtain 116 of entrance lock 114, are another thermal source processing regions, this is the interior heating of entrance lock 114 and the humidification in degreasing pond 104 adjacency with warm because of the air guiding in closed circuit.When leaving entrance lock 114, the moisture of the air in air circulation loop 122 is almost completely saturated.
In order to utilize the infiltration pond transfer heat that 112 heats of deriving are pretreatment zone 102 from dipping lacquer pond, equipment 100 comprises the first heat pump assembly 124, and it is called dipping lacquer heat pump assembly 126 and the heat cycles loop 130 thermal technology's couplings with pretreatment zone 102 by the cooling circuit in dipping lacquer pond 112 128 below.
As can finding out best in Fig. 1 and Fig. 2, dipping lacquer heat pump assembly 126 comprises refrigerant circulation loop 132, wherein, is followed by successively evaporimeter 134, compressor reducer 136, condenser 138 and choke valve 140 on the flow direction of cold-producing medium.As cold-producing medium, for example can use HFC-134a (trade name: R134a), H 2o, CO 2or like that.
The evaporimeter 134 of dipping lacquer heat pump assembly 126 is hot side joint (in this cooling circuit, circulation has heat carrier) to the cooling circuit 128 in dipping lacquer pond 112, to derive heat from dipping lacquer pond 112, and be transferred to the cold-producing medium in evaporimeter 134.As the heat carrier in cooling circuit 128, especially can make water, CO 2, R134a or like that.
The condenser 138 of dipping lacquer heat pump assembly 126 is received on the heat cycles loop 130 of pretreatment zone 102 at cold side, this heat cycles loop 130 of heat carrier percolation, the thermal release that this heat carrier absorbs the cold-producing medium in condenser 138 is to the heat cycles loop 142, degreasing pond in degreasing pond 104 and the phosphating pond heat cycles loop 144 of phosphating pond 106.
The heat cycles loop 130 of pretreatment zone 102 comprises the circulating pump 146 that is arranged in condenser 138 upstreams and heating kettle or the burner 148 that is arranged in condenser 138 downstreams, when the heat being provided by dipping lacquer pond 112 can not meet the heat demand of pretreatment zone 102 completely when equipment 100 is moving, or when the heating power that needs during the heating period of the impregnating bath in pretreatment zone 102 to improve (heating power of this raising is for example three times of heating power of needs when equipment 100 is moving), this heating kettle or burner are for heating extraly the heat carrier at heat cycles loop 130 circulation.
As the heat carrier in heat cycles loop 130, for example can make water, CO 2, R134a or like that.
Downstream at heating kettle 148, heat cycles loop 130 branches lead to degreasing pond heat exchanger 150 and the phosphating pond heat exchanger 152 in parallel with degreasing pond heat exchanger 150, wherein, in degreasing pond heat exchanger 150, heat from the heat carrier in heat cycles loop 130 is transferred to the heat carrier in heat cycles loop, degreasing pond 142, in phosphating pond heat exchanger 152, heat is transferred to the heat carrier phosphating pond heat cycles loop 144 from the heat carrier in heat cycles loop 130.
As the heat carrier in heat cycles loop, degreasing pond 142 and phosphating pond heat cycles loop 144, for example can make water, CO 2, R134a or like that.
Heat carrier in heat cycles loop, degreasing pond 142 passes to degreasing pond 104 by the heat absorbing in degreasing pond heat exchanger 150, and the heat carrier in phosphating pond heat cycles loop 144 passes to phosphating pond 106 by the heat absorbing in phosphating pond heat exchanger 152.
In the downstream of degreasing pond heat exchanger 150 and phosphating pond heat exchanger 152, the Liang Ge branch in heat cycles loop 130 concentrates in together again.Condenser 138 is returned to through circulating pump 146 in the heat cycles loop 130 reunifying.
Dipping lacquer pond 112 is preferably also cooling during intermittence in the production of equipment 100, wherein, keeps too running status, to prevent the precipitation of impregnating varnish for stirring the pump in dipping lacquer pond.
Heat can be for example in order to keep in the impregnating bath of the constant and feed-in pretreatment zone 102 of temperature levels, thereby by pond described in preheating can be after production stops for example, in very short time of (after finishing weekend) starting equipment 100.
For following situation,, heat budget between the heating cooling and pond of pretreatment zone 102 on the other hand in dipping lacquer pond 112 is uneven on the one hand, and pretreatment zone 102 can not be obtained enough heats from dipping lacquer heat pump assembly 126, especially the in the situation that of maintenance work, dipping lacquer heat pump assembly 126 is provided with by-pass conduit 154, is wherein arranging the cooling device 156 for cooling refrigeration agent.
By-pass conduit 154 gets out from refrigerant circulation loop between compressor 136 and condenser 138 for 132 minutes, and again passes into refrigerant circulation loop 132 between condenser 138 and choke valve 140.
Preferably design as follows cooling device 156, that is, make the cold-producing medium can for example, by the temperature difference (the Δ T in Fig. 2) of cooling at least about 60 ℃ of cooling device 156, the temperature difference of about 65 ℃.
When equipment 100 and the 126 normal operation of dipping lacquer heat pump assembly, dipping lacquer pond 112 has the temperature within the scope of about 27 ℃ to about 34 ℃.
Heat carrier in the cooling circuit 128 in dipping lacquer pond 112 enters the hot side of evaporimeter 134 with for example temperature of about 20 ℃, and heating reaches for example temperature of about 10 ℃ at the cold-producing medium of cold side percolation evaporimeter 134.
Heat carrier in cooling circuit 128 with the temperature of about 15 ℃ for example from evaporimeter 134 out, and turn back to dipping lacquer pond 112.
With for example about 100kW, to the cooling power within the scope of about 1.5MW, from dipping lacquer pond 112, take the heat (Q Fig. 2 away thus ab).
In the refrigerant circulation loop 132 of dipping lacquer heat pump assembly 126, in evaporimeter 134, the cold-producing medium of heating is compressed to for example final pressure of about 22 bar by compressor 136 from for example initial pressure of about 4 bar, and is heated to for example temperature levels of about 75 ℃.
Compressed and through the cold-producing medium of heating in condenser 138 to the heat carrier release heat (Q in Fig. 2 in the heat cycles loop 130 of pretreatment zone 102 zu).
The efficiency COP(coefficient of performance of dipping lacquer heat pump assembly 126) depend on the temperature T of the cold-producing medium in condenser 138 and the temperature T of the cold-producing medium in evaporimeter 134 0between poor, and the efficiency eta that depends on compressor 136 compressor(COP=T/ (T-T 0) * η compressor), and for example for cooling be approximately 2, in order to heat, be approximately 3.Therefore when cooling power is for example 600kW, can there is about 900kW for heating pretreatment region 102.
Heat carrier in the heat cycles loop 130 of pretreatment zone 102 is heated to for example temperature of about 70 ℃ in condenser 138.
In case there is a need, especially, in the heating period in the pond of pretreatment zone 102, heat carrier can further heat by heating kettle 148, for example, reach the temperature of about 80 ℃.
The heat carrier in the heat cycles loop 130 of the heat absorbing in heating kettle 148 if desired in condenser 138 neutralizations in degreasing pond heat exchanger 150 discharges to the heat carrier in heat cycles loop, degreasing pond 142, and the heat carrier in phosphating pond heat exchanger 152 discharges to phosphating pond heat cycles loop 144, thus the heat carrier in heat cycles loop 130 is cooled to for example temperature of about 65 ℃, and the heat carrier in heat cycles loop, degreasing pond 142 or phosphating pond heat cycles loop 144 is heated to the temperature within the scope of about 45 ℃ to about 65 ℃.
By utilizing the 102Nei pond, heat heating pretreatment region of taking away from dipping lacquer pond 112, because pretreatment zone 102 and dipping lacquer pond 112 are directly adjacent to, and produce on the spot the processing heat for pretreatment zone 102, can not will pretreatment zone 102 be connected on central heating kettle.
Be additional to if desired in processing heat, the especially heating process in the pond in pretreatment zone 102 that the heating power of dipping lacquer heat pump assembly 126 needs, by heating kettle 148 local, directly produce on the spot.Local heating kettle 148, the heat feed-in by dipping lacquer heat pump assembly 126, circulating pump 146 and the conduits needing form the circulatory system of local restricted.
The workpiece of heating in degreasing pond 104 is until phosphating pond 106 is cooled to the temperature in the scope of about 40 ℃, thereby can in phosphating pond 106, recycle and in degreasing pond 104, be input to the heat in workpiece, and workpiece needn't again be heated to the treatment temperature phosphating pond 106 as the situation when the degreasing from environment temperature.
In pond after phosphatization is processed, there is following performance:
Equipment 100 preferably includes the second heat pump assembly 158, and it is called flushing tank heat pump assembly 160 below, and the additional heat cycles of phosphating pond loop 162 is coupled as the mutual thermal technology of thermal source as heat sink and flushing tank cooling circuit 164.
The refrigerant circulation loop 168 of flushing tank heat pump assembly 160 comprises evaporimeter 166, be arranged in the compressor 170 in evaporimeter 166 downstreams, be arranged in compressor 170 downstreams condenser 172, be arranged in the choke valve 174 in condenser 172 downstreams, wherein, this evaporimeter is rinsed the heat carrier of pond cooling circuit 164 in hot side, water for example, percolation, and in this evaporimeter, cold-producing medium absorbs the heat from the heat carrier of flushing tank cooling circuit 164; This condenser at cold side by the heat carrier in the additional heat cycles of phosphating pond loop 162, water for example, percolation, and in this condenser, cold-producing medium is the heat carrier to the additional heat cycles of phosphating pond loop 162 by thermal release; The arranged downstream of this choke valve evaporimeter 166.
Consistent with the function of previously described dipping lacquer heat pump assembly 126 on the functional principle of flushing tank heat pump assembly 160.
By flushing tank heat pump assembly 160, from this flushing tank 108 or these flushing tanks 108, take away from the heat heat carrier of flushing tank cooling circuit 164, on the temperature levels of about 25 ℃ for example.These heats rise to for example temperature levels of about 70 ℃ by compressor 170, and discharge to the heat carrier in the additional heat cycles of phosphating pond loop 162, to heat extraly phosphating pond 106.
The additional heating power in the additional heat cycles of phosphating pond loop 162 is for example in the order of magnitude of the extremely about 200kW of about 40kW.
For can also be by the heat delivery of the air circulation loop 122 of the entrance lock 114 from pretreatment zone 102 the degreasing pond 104 to pretreatment zone 102, equipment 100 comprises the 3rd heat pump assembly 176, it is called lock heat pump assembly 178 below, and the air circulation loop 122 that makes entrance lock 114 as the additional heat cycles loop 180, degreasing pond in thermal source and degreasing pond 104 as heat sink mutual thermal technology's coupling.
As from can finding out best Fig. 3, the air circulation loop 122 of entrance lock 114 comprises ventilation blower 182, be arranged in the condenser 184 in ventilation blower 182 downstreams and be arranged in the branch 186 in condenser 184 downstreams, in this bifurcation, air circulation loop 112 is branched off into two conduit 188a and 188b.
In each conduit 188a, 188b, arranging adjustable valve 190, thereby the volume flow of circulated air can be distributed on two conduit 188a and 188b in an ideal way.
First conduit 188a passes into the first air chamber 192, air leaves this first air chamber through seam type nozzle 194, thereby make the air free beam of the bunchy that leaves form air curtain 116, this air curtain spreads all over from top to bottom pending workpiece and wears the lock chamber 196 of transporting.
The air being extracted by ventilation blower 182 arrives the bottom of lock chamber 196, enters suction chamber 200, and arrive therefrom the absorption side of ventilation blower 182 through suction channel 198.
Second conduit 188b passes into the second air chamber 202.The suction effect of air free beam of bunchy from the air of the second air chamber 202 based on forming air curtain 116 is through leaving opening 204 on the bottom of the second air chamber 202, by the air extraction leaving from seam type nozzle 194.
By extracting circulated air from the second air chamber 202 like this, prevented the space outerpace extracting air from entrance lock 114 from the air free beam of the bunchy of seam type nozzle 194.Therefore, by air curtain 116, the atmosphere in entrance lock 114 the place aheads is carried out separated with the atmosphere that is positioned at the pretreatment zone 102 at entrance lock 114 rears.
Lock heat pump assembly 178 comprises refrigerant circulation loop 206, wherein percolation has suitable cold-producing medium, HFC-134a (trade name: R134a), percolation has cold side (it therefore plays the effect of refrigerant evaporator for cold-producing medium), compressor 208, refrigerant condenser 210 and the choke valve 212 of condenser 184 successively for example.
Refrigerant condenser 210 is at cold side by the heat carrier percolation in additional heat cycles loop, degreasing pond 180, and described heat carrier absorbs the heat from the cold-producing medium of lock heat pump assembly 178 in refrigerant condenser 210, thereby heats extraly degreasing pond 104.
In condenser 184, in air circulation loop 122 air of guiding to the cold-producing medium release heat of lock heat pump assembly 178, the air in cooler condenser 184 thus, and make cooling airborne moisture condensation.The coagulation 214 forming is for example assembled on the bottom of condenser 184, and by coagulation, derives conduit 216 and flow to degreasing pond 104.
Therefore except thermal technology's circulation, also by the moisture generating material that 104 conveyings are condensed to degreasing pond, circulate.
For the lock air in cooler condenser 184, on the inner side of the condenser tube 218 of condenser 184, the cold-producing medium of lock heat pump assembly 178 is evaporated.
The moisture freeze-outing in air from condenser 184 is evaporation from degreasing pond 104 in advance at least in part.
In order to produce circulated air that air curtain 116 uses with for example about 15000Nm in entrance lock 114 3the volume flow of/h, in air circulation loop 122, especially heats in lock chamber 196, and water saturation.Volatilization loss is at for example about 0.25m 3/ h is to about 1m 3in the order of magnitude of/h, change, and therefore (when evaporation enthalpy is 2500kJ/kg) corresponding to about 170kW to about thermal loss of 700kW.
When lock temperature is about 40 ℃ to about 50 ℃, the serviceability temperature cold-producing medium about 30 ℃ time for example in cold-producing medium one side of condenser 184, for the airborne moisture of the lock that condenses.Cold-producing medium rises to for example temperature levels of about 70 ℃ by compressor 208, and adds heat cycles loop 180 for heating degreasing pond 104 by degreasing pond.
By using heat pump assembly 126,160 and 178, for workpiece being carried out to pretreatment zone 102 and the dipping lacquer pond 112 of surface-treated equipment 100, realizing obvious energy saving.
Because many units that need at this are spatially preferably mutually close, so the space consumption needing and equipment expend and invest that to expend be very little.
In Fig. 4 with shown in the mode of intercepting, whole with 100 that represent, for another embodiment of the surface-treated equipment of (unshowned) workpiece, especially vehicle body or car body component, be for example configured to a kind of workpiece that is used to and paint and/or the equipment of coating.This equipment especially comprises preprocessor region 102, wherein along the direction of transfer 110 of workpiece be followed by successively have at least one degreasing pond 104 degreasing region, there is the flushing region of at least one flushing tank 220 and there is the active region that at least one activates pond 222.
The transfer path of workpiece represents with arrow 224 in Fig. 4, and this arrow illustrates workpiece and slips into successively in different ponds, and again moves out from these ponds.
Pretreatment zone 102 for surface-treated equipment 100 can comprise other pretreatment pools, especially follows in the coating pond of activating 222 rears, pond.In coating pond, preferably apply the coating that contains trbasic zinc phosphate or silane or zirconium composite.
In addition; for surface-treated equipment 100, preferably include the dipping lacquer pond of following at pretreatment zone 102 rears; electrophoretic enamelling pond for example; and comprise a plurality of other (unshowned) flow process stages, for example dipping lacquer drier, for applying the processing region of substrate protective layer, for carrying out processing region and/or another drier of gap sealing operation.
In activating pond 222, in order to form better crystal in coating in the wings, nucleus is sprayed onto on the surface of workpiece.
Activate pond 222 and preferably comprise the colloidal dispersion with titanium phosphorus core, it according to temperature conditions along with time decay and lose activity.In order to control this decay process, the temperature activating in pond 222 remains between about 35 ℃ and about 45 ℃.When equipment 100 operation, if workpiece is heated in degreasing pond 104 and heat partly discharges in flushing tank 220 and partly in activating pond 222, so just arranges and carry out cooling to activating pond 222.
For example can be at several kilowatts to scope more than 100kW to the heat input activating in pond by workpiece.
On the contrary, while having no progeny aborning starting equipment 100, can arrange and heat activating pond, thereby make to activate pond 222, be heated to desirable treatment temperature.Therefore, equipment 100 comprises activation pond temperature control closed circuit 226, and it can for example, by heat carrier (water) percolation and comprise heat carrier pump 228.
Downstream at heat carrier pump 228, activate pond temperature control closed circuit 226 and be branched off into the cooling branch 234 that there is the heated branch 230 of reheat heat exchanger 232 and there is activation pond heat exchanger 236, wherein, in described heated branch, when should heat activation pond 222, the heat producing can be transferred on heat carrier by (unshowned) heater; When the cooling activation of needs pond, described cooling branch is at the be activated heat carrier percolation of pond temperature control closed circuit 226 of hot side.
Activate the evaporimeter 238 that pond heat exchanger 236 forms heat pump assembly 240 simultaneously.
Except evaporimeter 238(its at cold side by the cold-producing medium percolation of heat pump assembly 240, and in this evaporimeter, when cooling activation pond 222, cold-producing medium absorbs the heat of the heat carrier of self-activation pond temperature control closed circuit 226) in addition, the refrigerant circulation loop 242 of heat pump assembly 240 also comprises the compressor 244 that is arranged in evaporimeter 238 downstreams, be arranged in the condenser 246 and the choke valve 250 that is arranged in condenser 246 downstreams in compressor 244 downstreams, wherein, this condenser at cold side for example, by the heat carrier in heat cycles loop, degreasing pond 248 (water) percolation, and in this condenser, cold-producing medium is to the heat carrier release heat in heat cycles loop, degreasing pond 248, in this choke valve arranged downstream, evaporimeter 238.
Heat cycles loop, degreasing pond 248 is for heating degreasing pond 104, and except condenser 246, also comprises the heat carrier pump 252 that is arranged in condenser 246 upstreams.
The heat sink processing region 118 of degreasing pond 104 forming devices 100, and the thermal source processing region 120 of activation pond 222 forming devices 100 are at least like this during cooling activation pond 222.
By heat pump assembly 240, as heat sink heat cycles loop, degreasing pond 248 with as the mutual thermal technology's coupling of the activation pond temperature control closed circuit 226 of thermal source.
On the functional principle of heat pump assembly 240 with previously described, consistent for workpiece being carried out to the function of dipping lacquer heat pump assembly 126 of the first embodiment of surface-treated equipment 100.
By heat pump assembly 240, from activating pond 222, take heat heat carrier, on the temperature levels of about 30 ℃ for example of self-activation pond temperature control closed circuit 226 away.Described heat rises to for example temperature levels of about 60 ℃ by compressor 244, and discharges the heat carrier to heat cycles loop, degreasing pond 248, for (extraly if desired) heating degreasing pond 104.
By alternately opening, activate alternately cooling or heat activation pond 222 of the cooling branch 234 of pond temperature control closed circuit 226 or heated branch 230, make to activate in the temperature range of about 35 ℃ to about 45 ℃ that pond remains on pursuit.
The thermal power that flows to heat cycles loop, degreasing pond 248 from the refrigerant circulation loop 242 of heat pump assembly 240 for example approximately 51kW to the scope of about 204kW.The efficiency COP of heat pump assembly 240 is for example about 5.5.
At equipment 100 run durations, to activating pond 222, by water delivery device 254, carry the water (VEW-water) of water, especially desalted water or complete desalination, every square metre of water yield for the treatment of the surface of the work of coating is that about 0.5L is to about 1L.
At this, the surperficial throughput of equipment 100 is per hour can be treat coating surface of the work about 3000 square metres to treating in the scope of about 6000 square metres of surface of the work of coating.
By leading to the excess fluid of the water delivery device formation that activates pond 222, from activate pond 222, by overflow device 256, flow to flushing tank 220.
Being with the difference at the embodiment shown in Fig. 4 for workpiece being carried out to another embodiment of surface-treated equipment 100 shown in Fig. 5, heat pump assembly 240 not only with activate the 226 thermal technologies' couplings of pond temperature control closed circuit, also be used for flushing tank cooling circuit 258 thermal technologies' couplings of cooling flushing tank 220.
Flushing tank cooling circuit 258 comprises heat carrier pump 260 and is arranged in the flushing tank heat exchanger 262 in heat carrier pump 260 downstreams, and it is rinsed the heat carrier of pond cooling circuit 258 in hot side, water for example, percolation.
At cold side, flushing tank heat exchanger 262 is by the cold-producing medium percolation of heat pump assembly 240, and described cold-producing medium absorbs the heat from the heat carrier of flushing tank heat exchanger 262 at this.
Flushing tank heat exchanger 262 is arranged in and activates the downstream of pond heat exchanger 236 and the upstream of compressor 244 in the refrigerant circulation loop 242 of heat pump assembly 240, and together with activation pond heat exchanger 236, forms the evaporimeter 238 of heat pump assembly 240.
So in this case, the evaporimeter 238 of heat pump assembly 240 comprises that the level being comprised of a plurality of heat exchangers 236 and 262 is conjuncted.
Thus, rising leaving before entering compressor 244 for for example temperature levels of about 30 ℃ after activating pond heat exchanger 236 of cooling agent, for example, rise to about 40 ℃ or about 45 ℃.
Known ground, the efficiency of heat pump depends on poor between high temperature level (after compressor 244) and low temperature level (before compressor 244), and increases along with the decline of the difference of temperature levels.According to the present invention, by cascade, guide cold-producing medium through a plurality of heat exchangers, to improve the low temperature level of cold-producing medium.Therefore, the efficiency COP of heat pump assembly 240 for example brings up to about 8.3 value (when low temperature level is brought up to about 40 ℃) or brings up to for example about 11 value (when low temperature level is brought up to about 45 ℃) from for example about 5.5 value (that not cascade guides).
At this, in the cold-producing medium of heat pump assembly 240 can be in the first heat exchanger (activating pond heat exchanger 236) or the second heat exchanger (flushing tank heat exchanger 262) or a part in the first heat exchanger and a part in the second heat exchanger, evaporate.
In addition, shown in Fig. 5 for another embodiment of workpiece being carried out to surface-treated equipment 100 aspect structure and working method with consistent at the embodiment shown in Fig. 4, these contents are with reference to descriptions above.
Shown in Fig. 6 for workpiece being carried out to another embodiment of surface-treated equipment 100 and the difference between the embodiment shown in Fig. 4 especially, as having, activate the replacement that pond 222 and (unshowned) are followed the active region of phosphating pond thereafter, be provided with coating region or the nano coating region with conversion pool or nano coating pond 264.
This, especially can replace so far in common parkerized nano coating pond 264, on silane or zirconic chemical matrix or on other are suitable for constructing the material matrix of durable prime coat, carry out coating.
At this, zirconates especially can change into the coating consisting of zirconia.
The bed thickness of the coating producing on the workpiece in nano coating pond 264 is for example in the scope of the extremely about 200nm of about 20nm.Processing time according to temperature in the scope of about 30 seconds to about 120 seconds for example.
The temperature in nano coating pond 264 is preferably in the scope of about 10 ℃ to about 50 ℃, especially in the scope of about 20 ℃ to about 30 ℃.
For following situation, that is, heat when equipment 100 moves by the workpiece that heating is brought into later in degreasing pond 104 in nano coating pond 264, is worth if desired expectation, cooling nano coating pond 264 when equipment 100 operation.In the situation that having no progeny startup aborning, equipment 100 may need again to heat nano coating pond 164, so that by the temperature setting in nano coating pond 164 in the preferred range.
During cooling nano coating pond 264, the thermal source processing region 120 of itself forming device 100.
Nano coating pond temperature control closed circuit 266 can be configured to completely the same with the activation pond temperature control closed circuit 226 in the embodiment shown in Fig. 4 in principle, therefore it can be by receiving on heat pump assembly 240 corresponding to the nano coating pond heat exchanger 268 of previously described activation pond heat exchanger 236 as activating pond temperature control closed circuit 226, and therefore with the 248 thermal technologies' couplings of heat cycles loop, degreasing pond.
If 264 do not carry water to nano coating pond at equipment 100 run durations, can save in this embodiment according to the overflow device 256 that leads to flushing tank 220 arranging in the embodiment shown in Fig. 4 so yet.
In addition, shown in Fig. 6 for the embodiment that workpiece carried out to surface-treated equipment 100 aspect structure and working method with consistent at the embodiment shown in Fig. 4, these contents are with reference to descriptions above.
Even when replacing activation pond 222 with nano coating pond 264, it is conjuncted that the evaporimeter 238 of heat pump assembly 240 also can be configured to level multi-piece type, and especially except nano coating pond heat exchanger 268, also comprise flushing tank heat exchanger 262, wherein, the cold-producing medium of heat pump assembly 240 absorbs the heat from flushing tank cooling circuit 258, to improve the low temperature level of heat pump assembly 240, as above according to setting forth in the context of the embodiment shown in Fig. 5, these contents are with reference to descriptions above.

Claims (16)

1. for workpiece is carried out to surface-treated equipment, described equipment comprises that at least one will be fed to the heat sink processing region (118) of heat when described equipment (100) moves, when moving, described equipment (100) to therefrom derive the thermal source processing region (120) of heat with at least one, it is characterized in that, described equipment (100) comprises at least one heat pump assembly (124,158,176; 240), described heat pump assembly is coupled in order to absorb heat and at least one thermal source processing region (120), and for release heat and the coupling of at least one heat sink processing region (118).
2. according to equipment claimed in claim 1, it is characterized in that, described equipment (100) is configured to a kind of equipment that is used to workpiece japanning.
3. according to equipment claimed in claim 2, it is characterized in that the pretreatment pool of at least one is heat sink processing region (118) comprises described equipment (100).
4. according to the equipment described in claim 2 or 3, it is characterized in that, at least one thermal source processing region (120) comprises dipping lacquer pond (112) and/or the lock district of described equipment (100).
5. according to the equipment described in any one in claim 1 to 4, it is characterized in that, at least one heat pump assembly (176) is coupled with the air circulation loop (122) of described equipment (100).
6. according to equipment claimed in claim 5, it is characterized in that, described equipment (100) comprises for the air of described air circulation loop (122) being carried out to condenser (184) cooling and/or dehumidifying.
7. according to equipment claimed in claim 6, it is characterized in that, described equipment (100) comprises coagulation derivation conduit (216), derives conduit the coagulation freeze-outing can be flowed to the treatment pond of described equipment (100) by described coagulation in described condenser (184) from air.
8. according to the equipment described in any one in claim 5 to 7, it is characterized in that, described air circulation loop (122) comprises the device for generation of air curtain (116), and pending workpiece passes described air curtain when described equipment (100) moves.
9. according to equipment claimed in claim 8, it is characterized in that, the described device for generation of air curtain (116) comprises for the air flow of described air circulation loop (122) guiding being fitted on to the device of the first air chamber (192) and the second air chamber (202), wherein, nozzle for generation of the air beam of bunchy is placed on described the first air chamber (192), and the leave opening (204) adjacent with described air curtain (116) is placed on described the second air chamber (202).
10. according to the equipment described in any one in claim 2 to 9, it is characterized in that, at least one thermal source processing region (120) of described equipment (100) comprises flushing tank (108) and/or activates pond (222) and/or nano coating pond (264).
11. according to the equipment described in any one in claim 1 to 10, it is characterized in that, at least one heat pump assembly (240) comprises that at least two for the heat exchanger (236,262 to relevant heat pump assembly (240) by heat delivery; 268,262).
12. according to the equipment described in any one in claim 1 to 11, it is characterized in that, described equipment (100) comprises at least two heat pump assemblies (124,158,176), and described at least two heat pump assemblies are in order to absorb the coupling of the heat thermal source processing region (120) different from least two and/or for release heat and at least two different heat sink processing region (118) couplings.
13. according to the equipment described in any one in claim 1 to 12, it is characterized in that, described equipment (100) comprises for derive the cooling device (156) of unnecessary heat from least one heat pump assembly (124).
14. according to the equipment described in any one in claim 1 to 13, it is characterized in that, described equipment (100) comprises for the heater at least one heat sink processing region (118) by extra heat delivery.
15. according to the equipment described in any one in claim 1 to 14, it is characterized in that at least one heat pump assembly (124,158,176; 240) comprise closed refrigerant circulation loop (132,168,206; 242), described refrigerant circulation loop is in order to absorb thermal coupling to the cooling circuit (128,164,122 of the thermal source processing region (120) of described equipment (100); 226; 258) the upper and heat cycles loop (130,162,180 of being coupled to the heat sink processing region (118) of described equipment (100) for release heat; 248) on.
16. for carrying out surface-treated method for workpiece being carried out to surface-treated equipment (100) to workpiece, and described method comprises following methods step:
-work piece delivery will be fed to when described equipment (100) moves through at least one
The heat sink processing region (118) of heat, and at least one is transported at described equipment (100)
During row, to therefrom derive the thermal source processing region (120) of heat; And
-at least one heat pump assembly (124,158,176) is coupled in order to absorb heat
At least one thermal source processing region (120) is upper, and for release heat, be coupled to
On a few heat sink processing region (118).
CN201280035173.6A 2011-07-15 2012-02-29 For workpiece being carried out the equipment of surface process Active CN103648660B (en)

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DE102011051879A1 (en) 2013-01-17
DE102011051879B4 (en) 2023-11-09
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CN103648660B (en) 2016-08-17
EP2731730A1 (en) 2014-05-21

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