CN103646926A - 一种压力传感器芯片安装结构 - Google Patents

一种压力传感器芯片安装结构 Download PDF

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CN103646926A
CN103646926A CN201310618184.3A CN201310618184A CN103646926A CN 103646926 A CN103646926 A CN 103646926A CN 201310618184 A CN201310618184 A CN 201310618184A CN 103646926 A CN103646926 A CN 103646926A
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chip
hole
pressure sensor
substrate
sensor chip
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CN201310618184.3A
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CN103646926B (zh
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朱宗恒
孙广
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Wuhu causes the Electronics Co., Ltd. that is open to the traffic
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Wuhu Tonhe Automobile Fluid System Co Ltd
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Abstract

本发明公开了一种压力传感器芯片安装结构,包括基板(1)和芯片(2),基板(1)上设有通孔(11),芯片(2)安装在通孔(11)内,芯片(2)的外壁与通孔(11)的内壁通过胶(3)连接,芯片(2)两侧均能感受压力,提高了芯片(2)的利用率和工作效率,拓宽了芯片(2)的适用范围。

Description

一种压力传感器芯片安装结构
技术领域
本发明属于压力传感器技术领域,尤其涉及一种压力传感器芯片安装结构。
背景技术
传统压力传感器的芯片直接通过芯片底面与基板胶结,如图2所示,芯片只能感受一个方向的压力,效率低,适用环境有限。
发明内容
本发明所要解决的技术问题是提供一种芯片两侧均能感受压力的压力传感器芯片安装结构。
为了解决上述技术问题,本发明所采用的技术方案是:一种压力传感器芯片安装结构,包括基板和芯片,所述基板上设有通孔,所述芯片安装在通孔内,芯片的外壁与通孔的内壁通过胶连接。
所述芯片为两侧均能感受压力的芯片。
所述芯片外周设有垂直芯片方向延伸的延伸部,所述延伸部外壁与通孔通过胶连接。
本发明的优点在于,芯片安装在基板的通孔内,芯片两侧均能感受压力,提高了芯片的利用率和工作效率,拓宽了芯片的适用范围。
附图说明
图1为本发明一种压力传感器芯片安装结构的结构示意图;
图2为现有技术结构示意图;
上述图中的标记均为:1、基板,11、通孔,2、芯片,21、延伸部,3、胶。
具体实施方式
图1为本发明一种压力传感器芯片安装结构的结构示意图,包括基板1和芯片2,基板1上设有通孔11,芯片2安装在通孔11内,芯片2的外壁与通孔11的内壁通过胶3连接。芯片2为两侧均能感受压力的芯片。
芯片2外周设有垂直芯片2方向延伸的延伸部21,延伸部21外壁与通孔11通过胶3连接。通过延伸部21的外壁与通孔11连接,增大了芯片2与通孔11的接触面积,从而提高了芯片2的承载能力,使芯片2工作更加稳定可靠。
采用上述的结构后,芯片2安装在基板1的通孔11内,芯片2两侧均能感受压力,提高了芯片2的利用率和工作效率,拓宽了芯片2的适用范围。
上面结合附图对本发明进行了示例性描述,显然本发明具体实现并不受上述方式的限制,只要采用了本发明的方法构思和技术方案进行的各种非实质性的改进,或未经改进将本发明的构思和技术方案直接应用于其它场合的,均在本发明的保护范围之内。

Claims (3)

1.一种压力传感器芯片安装结构,包括基板(1)和芯片(2),其特征在于,所述基板(1)上设有通孔(11),所述芯片(2)安装在通孔(11)内,芯片(2)的外壁与通孔(11)的内壁通过胶(3)连接。
2.如权利要求1所述的压力传感器芯片安装结构,其特征在于,所述芯片(2)为两侧均能感受压力的芯片。
3.如权利要求1或2所述的芯片安装结构,其特征在于,所述芯片(2)外周设有垂直芯片(2)方向延伸的延伸部(21),所述延伸部(21)外壁与通孔(11)通过胶(3)连接。
CN201310618184.3A 2013-11-27 2013-11-27 一种压力传感器芯片安装结构 Expired - Fee Related CN103646926B (zh)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05187943A (ja) * 1992-01-16 1993-07-27 Mitsubishi Heavy Ind Ltd 圧力検出器
JPH07221222A (ja) * 1994-01-27 1995-08-18 Fujikura Ltd 半導体装置
JPH10185718A (ja) * 1996-12-20 1998-07-14 Nippon Seiki Co Ltd 圧力検出器
JPH10300617A (ja) * 1997-04-30 1998-11-13 Matsushita Electric Works Ltd 圧力センサの特性測定装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05187943A (ja) * 1992-01-16 1993-07-27 Mitsubishi Heavy Ind Ltd 圧力検出器
JPH07221222A (ja) * 1994-01-27 1995-08-18 Fujikura Ltd 半導体装置
JPH10185718A (ja) * 1996-12-20 1998-07-14 Nippon Seiki Co Ltd 圧力検出器
JPH10300617A (ja) * 1997-04-30 1998-11-13 Matsushita Electric Works Ltd 圧力センサの特性測定装置

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