CN103630827B - Integrated circuit automatic testing device - Google Patents
Integrated circuit automatic testing device Download PDFInfo
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- CN103630827B CN103630827B CN201310616203.9A CN201310616203A CN103630827B CN 103630827 B CN103630827 B CN 103630827B CN 201310616203 A CN201310616203 A CN 201310616203A CN 103630827 B CN103630827 B CN 103630827B
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Abstract
A kind of integrated circuit automatic testing device, this device includes the test section being positioned in a part for track component, IC chip being tested, test section is provided with the fixing device of the golden finger for fixing golden finger and for stopping the retention device of IC chip downstream under gravity, and wherein retention device includes: be arranged on the stop base on the track component of test section；It is constructed to be permeable to relative to stopping that base moves and by operation against the lower edge of IC chip thus stopping the stop pin of IC chip, can stop that pin provides the stop cylinder of actuating power；And it is pivotably mounted on the stop shifting block on stop base, stop that one end of shifting block is against stopping cylinder and by stopping cylinder activation, stops that the other end of shifting block coordinates so that stopping that pin moves with stop pin.The integrated circuit automatic testing device according to the present invention is adopted can accurately to control to stop the position of pin, it is to avoid the phenomenon that chip gets stuck or misplaces occurs.
Description
Technical field
The present invention relates to integrated circuit testing field, particularly relating to a kind of integrated circuit automatic testing device for IC chip being tested automatically stepping.
Background technology
In recent years, integrated circuit is widely used in every field, is the growth of geometrical progression for the demand of IC products.In order to comply with the raising of IC products production efficiency, the existing technological means that integrated circuit is tested automatically stepping at present, it is possible to save substantial amounts of manpower and materials.The integrated circuit automatic testing device of the technological means of current existing automatic test stepping is applicable to the automatic test of the integrated circuit of the various packing forms such as DIP, SOP, SSOP.This integrated circuit automatic testing device generally comprises the upper working area, test section and the lower working area that set gradually from upstream to downstream, and IC chip moves through these three district successively along a track component under the action of gravity of chip itself.Upper working area, test section and lower working area are respectively provided with stop member, when IC chip is tested in this automatic testing equipment, ic core sector-meeting by stop member successively in upper working area, test section and lower working area stop, thus carrying out testing and sorting.But, the structure of existing test section comes with some shortcomings, the installation accuracy requirement of the retention device of such as test section is higher, additionally, stop that pin is easily encountered the burr on chip and caused the phenomenon that gets stuck in stop member, on the other hand, IC chip is tested by golden finger by integrated circuit automatic testing device, it is sometimes desirable to the position of golden finger is adjusted, but this adjustment is not easy to, therefore, integrated circuit automatic testing device is still to be modified.
Summary of the invention
In order to overcome above-mentioned the deficiencies in the prior art, make improvements especially for test section, the present invention provides a kind of integrated circuit automatic testing device, integrated circuit automatic testing device includes the test section being positioned in a part for track component, IC chip being tested, test section is provided with the fixing device of the golden finger for fixing golden finger and for stopping the retention device of IC chip downstream under gravity, wherein, retention device includes: stop base, stops that base is arranged on the track component of test section；Stopping pin, stopping that pin is constructed to be permeable to relative to stopping that base moves and can by operation against the lower edge of IC chip thus stopping IC chip downstream；Stop cylinder, stop that cylinder is for stopping that pin provides actuating power；And stop shifting block, stopping that shifting block is pivotably mounted on and stop on base, stopping that one end of shifting block is against stopping cylinder and by stopping cylinder activation, stops that the other end of shifting block coordinates so that stopping that pin moves with stop pin.
According to an aspect of the present invention, stop that needle set has projecting positions and retracted position, in projecting positions, stop pin can with a part for the lower edge of the IC chip on the track component being positioned at test section against, in retracted position, stop that pin does not contact the IC chip being positioned on track component.Additionally, retention device also includes being arranged on the spring stopping on pin, making stop pin bias towards projecting positions.
According to another aspect of the present invention, stop that pin is provided with and stops that shifting block is against the defining flange coordinated, limit, with this, the projecting positions stopping pin, and leave gap between the slidingsurface in stop pin and track component in projecting positions.It is preferred that stopping that the shape design of pin becomes with contacting between IC chip is face contact.
According to a further aspect of the invention, stop that cylinder is by stopping that cylinder fixed block is installed on stop base, stops cylinder fixed block and stops that base may be integrally formed or each independently forms.Stop cylinder fixed block or stop the slide-and-guide portion that can be provided with on base, stopping that pin is maintained in slide-and-guide portion and is led by slide-and-guide portion.
According to a further aspect of the invention, the fixing device of golden finger includes the golden finger fixed block being fixed on the track component of test section and the golden finger briquetting being connected to golden finger fixed block both sides.Usual golden finger is two, and each in two golden fingers is folded between golden finger fixed block and a golden finger briquetting respectively.It is preferred that golden finger fixed block is adjustable relative to the installation site of track component.
According to a further aspect of the invention, track component includes track and covers rail cover in orbit, and IC chip slides between track and rail cover along the slidingsurface of track, stops that base is fixed on rail cover.
According to a further aspect of the invention, integrated circuit automatic testing device also includes the upper working area being positioned at upstream, test section along track component, upper working area has upper working area retention device, upper working area retention device includes working area and stops that pin and the upper working area of actuating stop that the upper working area of pin stops cylinder, upper working area stops that needle set has projecting positions and retracted position, in projecting positions, upper working area stop pin be constructed to be permeable to and IC chip on track component lower edge a part against but and leave gap between the slidingsurface in track component, in retracted position, upper working area stops that pin does not contact the IC chip being positioned on track component.
According to a further aspect of the invention, integrated circuit automatic testing device also includes the lower working area being positioned at downstream, test section along track component, lower working area has lower working area retention device, lower working area retention device includes working area under lower working area stops pin and activates and stops that Zhen Xiazan district stops cylinder, lower working area stops that needle set has projecting positions and retracted position, in projecting positions, lower working area stop pin be constructed to be permeable to and IC chip on track component lower edge a part against but and leave gap between the slidingsurface in track component, in retracted position, lower working area stops that pin does not contact the IC chip being positioned on track component.
Adopting the integrated circuit automatic testing device according to the present invention, the retention device of test section has the stop base installed on the rail member, and therefore, positional accuracy is high.And, retention device have employed lever-type structure, and therefore, compact overall structure, installation accuracy is high.
Additionally, due to leave gap between the slidingsurface stopped in pin and track component of retention device, stop that pin can avoid IC chip burr, therefore, do not have and get stuck or the problem of IC chip Wrong localization.
On the other hand, due to the ad hoc structure of the fixing device of golden finger in the integrated circuit automatic testing device according to the present invention, it is possible to the position of two golden fingers is adjusted by adjusting the position of golden finger fixed block simultaneously.
Accompanying drawing explanation
Fig. 1 is the top view of a part for the integrated circuit automatic testing device according to the present invention.
Fig. 2 is the side view of the part shown in Fig. 1 of the integrated circuit automatic testing device according to the present invention.
Fig. 3 is the front view of the part shown in Fig. 1 of the integrated circuit automatic testing device according to the present invention.
Fig. 4 is the detail view illustrating test section barrier structure and golden finger fixed structure in the integrated circuit automatic testing device according to the present invention.
Fig. 5 is the front view of the unlucky side of the test section illustrating the integrated circuit automatic testing device according to the present invention.
Fig. 6 is the exploded perspective view illustrating test section barrier structure and golden finger fixed structure in the integrated circuit automatic testing device according to the present invention.
Detailed description of the invention
Below in conjunction with specific embodiments and the drawings, the invention will be further described; elaborate more details in the following description so that fully understanding the present invention; but the present invention obviously can implement with the multiple alternate manner being different from this description; those skilled in the art can do similar popularization, deduction according to practical situations when without prejudice to intension of the present invention, therefore should with content constraints protection scope of the present invention of this specific embodiment.
Fig. 1, Fig. 2 and Fig. 3 respectively illustrate the top view of a part of the integrated circuit automatic testing device 1 according to present pre-ferred embodiments, side view and front view.This part automatic testing equipment 1 of diagram includes working area 50, test section 30 and lower working area 60, and these three district is arranged along track component 10 from upstream to downstream.IC chip 80 to be measured initially enters working area 50 and stops here, if it is confirmed that test section 30 is idle, then IC chip 80 carries out test section 30 along track component 10 slide downward under gravity and tests, after completing test, continuation is slid downward into lower working area 60 by IC chip 80 under gravity.
Then, the structure with reference to Fig. 4, the test section 30 of 5 and 6 pairs of integrated circuit automatic testing devices 1 is described in detail.The test section 30 that IC chip 80 is tested is provided with for fixing the golden finger 33(testing element namely directly coordinated in test process with the pin of IC chip 80) the fixing device 39 of golden finger and for stopping the retention device 20 of IC chip 80 downstream under gravity.Retention device 20 mainly includes the stop base 21 being arranged on track component 10, the stop pin 22 playing barrier effect against IC chip 80, provides stopping cylinder 24 and from stop cylinder 24, actuating power being delivered to the stop shifting block 23 stopping pin 22 of actuating power for stop pin 22.In addition, in the illustrated embodiment, stop that being also provided with one on base 21 stops cylinder fixed block 25, for constant resistance cylinder 24, but it is understood that, by this stop cylinder fixed block 25 integrated stopping on base 21, namely can also can replace the structure of current two-piece type with all-in-one-piece stop base 21.
In retention device 20, stop that base 21 is fixedly mounted on track component 10, under the supporting role stopping base 21, stop cylinder 24, stop shifting block 23 and stop that pin 22 is configured to the structure of a lever, stop pin 22 is made to move between projecting positions and retracted position, at projecting positions, stop that pin 22 can with the lower edge of the IC chip 80 being positioned on track component 10 against thus stopping chip, at retracted position, stop that pin 22 does not stop or do not contact the IC chip 80 being positioned on track component 10, at this moment, chip 80 can downstream sliding.
The lever construction of retention device 20 can refer to Fig. 3 and Fig. 6, on the one hand, stop that cylinder 24 is by stopping that cylinder fixed block 25 is installed on stop base 21, stop that pin 22 is then maintained in the slide-and-guide portion stopped on cylinder fixed block 25 and by its guiding (in embodiment, stop that pin 22 can also by being positioned at the slide-and-guide portion guiding stopped on base), on the other hand, stop that shifting block 23 is pivotably mounted on stop base 21, stop that one end of shifting block 23 is against stopping cylinder 24 and by stopping that cylinder 24 activates, stop that the other end of shifting block 23 coordinates so that stopping that pin 22 moves with stop pin 22.Additionally, retention device 20 also includes the spring 26 stopping pin 22 for making stop pin 22 be arranged on, making stop pin 22 bias towards described projecting positions.The effect of retention device 20 is as follows: when needs stop IC chip 80, stop that cylinder 24 is failure to actuate, stop that pin 22 remains biased in projecting positions under the effect of spring 26, after IC chip 80 has been tested, started by automatic control system and stop cylinder 24, stop that cylinder 24 makes one end of stop shifting block 23 pivot towards the direction of track component 10, stop that one end of shifting block 23 and stop pin 22 cooperation is then contrary to pivot away from track component 10, thus overcoming the bias force of spring 26 to make stop pin 22 move to retracted position, at this moment stop pin 22 disengagement coordinates with IC chip 80, chip 80 just can along the downward sliding of track component 10.
When stopping that pin 22 is positioned at projecting positions, stop pin 22 preferably only contact with a part for the lower edge of IC chip 80 and not with the slidingsurface in track component 10 against.Such as, stop pin 22 only with the half high degree in contact of IC chip 80 lower edge.So, stop that pin 22 can avoid the burr on chip 80, so that it is guaranteed that each chips all rests on same position, also be able to avoid getting stuck simultaneously.When stop pin 22 not with the slidingsurface in track component 10 against, it is possible to against coordinate limit the projecting positions that stop pin 22 with stopping between shifting block 23 by stopping pin 22.Such as, stop and pin 22 can arrange the defining flange coordinated with the end stopping shifting block 23, stopping that pin 22 is in the process of the effect below-center offset of spring 26, when defining flange is resisted against on stop shifting block 23 end, stop that pin 22 will not be able to projection forward again, and stop the projecting positions of pin 22 be set as only with the part lower edge of IC chip 80, stopping and will leave suitable gap between front end and the slidingsurface of track component 10 of pin 22, the burr on chip can be accepted in the gap just.
Additionally, in order to ensure stopping that pin 22 can smoothly stop IC chip 80, it is possible to will stop that contacting between pin 22 and IC chip 80 is set to face contact, for instance, it is possible at least fore-end stopping pin 22 is configured with square-section.
Additionally, in accordance with the embodiments illustrated, track component 10 includes track 11 and covers rail cover 12 on the rail 11, and IC chip 80 slides between track 11 and rail cover 12 along the slidingsurface of track 11.When adopting the structure of this track component 10, stop that base 21 may be mounted on rail cover 12.
Then, it is described in detail with reference to Fig. 3,4 and 5 pairs of fixing devices 39 of golden finger.The fixing device 39 of golden finger includes the golden finger fixed block 31 being fixed on the track component 10 of test section 30 and the golden finger briquetting 32 being positioned at golden finger fixed block 31 both sides.Golden finger briquetting 32 is such as fixed on golden finger fixed block 31 by threaded fastener or card distribution structure, and golden finger fixed block 31 is adjustable relative to the fixed position of track component 10, such as multiple set screw hole is set at the dorsal part (namely contrary with slidingsurface side) of track component 10, such that it is able to be fixed on diverse location by golden finger fixed block 31 accordingly.Generally, being fixed between golden finger fixed block 31 and golden finger briquetting 32 by two golden finger 33 sandwicheds respectively, so, by regulating the golden finger briquetting 32 installation site relative to track component 10, the position of two golden fingers 33 can be adjusted in the lump.Test section 30 as shown in Figure 3 is provided with two identical test station 301 and 302, and correspondingly, two groups of fixing devices about 39 of golden finger are arranged side by side.
Additionally, as in figure 2 it is shown, integrated circuit automatic testing device 1 also includes golden finger activated cylinders 35, by this activated cylinders 35 can make golden finger 33 reliably with the pins contact of IC chip 80, in order to test.
As it is shown on figure 3, integrated circuit automatic testing device 1 also includes the upper working area 50 being positioned at upstream, test section 30 along track component 10.Upper working area 50 has upper working area retention device, as shown in Figure 2, upper working area retention device includes working area and stops pin 52 and activate the upper working area stop cylinder 53 of described upper working area stop pin 52, upper working area stops that pin 52 has projecting positions and retracted position equally, in projecting positions, upper working area stop the lower edge of pin 52 IC chip 80 that can and be arranged on track component 10 against but not and the slidingsurface of track component 10 against (namely stopping that between front end and the slidingsurface of pin 52 be have gap), at retracted position, upper working area stops that pin 52 does not stop or do not contact the IC chip 80 being positioned on described track component 10.
Additionally, similarly, integrated circuit automatic testing device 1 also includes the lower working area 60 being positioned at downstream, test section 30 along track component 10.Lower working area has lower working area retention device, as shown in Figure 2, lower working area retention device includes working area under lower working area stops pin 62 and activates and stops that the Xia Zan district of pin 62 stops cylinder 63, lower working area stops that pin 62 has projecting positions and retracted position equally, in projecting positions, lower working area stop the lower edge of pin 62 IC chip 80 that can and be arranged on track component 10 against but not and the slidingsurface of track component 10 against (namely descend between front end and the slidingsurface of working area stop pin 62 is have gap), at retracted position, lower working area stops that pin 62 does not stop or do not contact the IC chip 80 being positioned on described track component 10.
Adopting the integrated circuit automatic testing device 1 according to the present invention, the retention device 20 of test section 30 has the stop base 21 being arranged on track component 10, and therefore, positional accuracy is high.And, retention device 20 have employed lever-type structure, and therefore, compact overall structure, installation accuracy is high.
Additionally, due to leave gap between the slidingsurface stopped in pin 22 and track component 10 of retention device 20, stop that pin 22 can avoid IC chip 80 burr, therefore, do not have and get stuck or the problem of IC chip 80 Wrong localization.
On the other hand, due to the ad hoc structure of the fixing device 39 of golden finger in the integrated circuit automatic testing device 1 according to the present invention, it is possible to by adjusting the position of golden finger fixed block 31, the position of two golden fingers is adjusted simultaneously.
Although the present invention is with preferred embodiment openly as above, but it is not for limiting the present invention, and any those skilled in the art without departing from the spirit and scope of the present invention, can make possible variation and amendment.Therefore, every any amendment above example made according to the technical spirit of the present invention, all without departing from the content of technical solution of the present invention.
Claims (13)
1. an integrated circuit automatic testing device, described integrated circuit automatic testing device includes the test section being positioned in a part for track component, IC chip being tested, described test section is provided with the fixing device of the golden finger for fixing golden finger and for stopping the retention device of IC chip downstream under gravity, it is characterized in that, described retention device includes:
Stopping base, described stop base is arranged on the track component of described test section；
Stopping pin, described stop pin is constructed to be permeable to move relative to described stop base and can by operation against a part for the lower edge of IC chip thus stopping IC chip downstream；
Stopping cylinder, described stop cylinder is for stopping that pin provides actuating power；And
Stopping shifting block, described stop shifting block is pivotably mounted on described stop base, and one end of described stop shifting block is against described stop cylinder and by described stop cylinder activation, and the other end of described stop shifting block coordinates with described stop pin so that described stop pin moves.
2. integrated circuit automatic testing device as claimed in claim 1, it is characterized in that, described stop needle set has projecting positions and retracted position, in described projecting positions, described stop pin can with a described part for the lower edge of the IC chip on the track component being positioned at test section against, in described retracted position, described stop pin does not contact the IC chip being positioned on described track component.
3. integrated circuit automatic testing device as claimed in claim 2, it is characterised in that described retention device also includes being arranged on the spring stopping on pin, making stop pin bias towards described projecting positions.
4. integrated circuit automatic testing device as claimed in claim 2, it is characterized in that, described stop pin is provided with described stop shifting block against the defining flange coordinated, limit the described projecting positions of described stop pin with this, and stop described in described projecting positions and leave gap between the slidingsurface in pin and track component.
5. integrated circuit automatic testing device as claimed in claim 1, it is characterised in that it is face contact that the shape design of described stop pin becomes with contacting between IC chip.
6. integrated circuit automatic testing device as claimed in claim 1, it is characterised in that described stop cylinder is by stopping that cylinder fixed block is installed on described stop base, and described stop cylinder fixed block is integrally formed with stop base or each independently forms.
7. integrated circuit automatic testing device as claimed in claim 6, it is characterised in that described stop cylinder fixed block or described stop base are provided with slide-and-guide portion, described stop pin is maintained in described slide-and-guide portion and is led by described slide-and-guide portion.
8. integrated circuit automatic testing device as claimed in claim 1, it is characterised in that the fixing device of described golden finger includes the golden finger fixed block being fixed on the described track component of described test section and the golden finger briquetting being connected to described golden finger fixed block both sides.
9. integrated circuit automatic testing device as claimed in claim 8, it is characterised in that described golden finger is two, and each in two described golden fingers is folded between described golden finger fixed block and a described golden finger briquetting respectively.
10. integrated circuit automatic testing device as claimed in claim 8, it is characterised in that described golden finger fixed block is adjustable relative to the installation site of track component.
11. integrated circuit automatic testing device as claimed in claim 1, it is characterized in that, described track component includes track and covers rail cover on the track, IC chip slides between described track and described rail cover along the slidingsurface of described track, and described stop base is fixed on rail cover.
12. integrated circuit automatic testing device as claimed in claim 1, it is characterized in that, described integrated circuit automatic testing device also includes the upper working area being positioned at upstream, described test section along described track component, described upper working area has upper working area retention device, described upper working area retention device includes working area and stops pin and activate the upper working area stop cylinder of described upper working area stop pin, described upper working area stops that needle set has projecting positions and retracted position, in described projecting positions, described upper working area stop pin be constructed to be permeable to and IC chip on track component lower edge a part against but and leave gap between the slidingsurface in track component, in described retracted position, described upper working area stops that pin does not stop the IC chip being positioned on described track component.
13. integrated circuit automatic testing device as claimed in claim 1, it is characterized in that, described integrated circuit automatic testing device also includes the lower working area being positioned at downstream, described test section along described track component, described lower working area has lower working area retention device, described lower working area retention device includes lower working area and stops pin and activate described lower working area stop Zhen Xiazan district stop cylinder, described lower working area stops that needle set has projecting positions and retracted position, in described projecting positions, described lower working area stop pin be constructed to be permeable to and IC chip on track component lower edge a part against but and leave gap between the slidingsurface in track component, in described retracted position, described lower working area stops that pin does not stop the IC chip being positioned on described track component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310616203.9A CN103630827B (en) | 2013-11-27 | 2013-11-27 | Integrated circuit automatic testing device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310616203.9A CN103630827B (en) | 2013-11-27 | 2013-11-27 | Integrated circuit automatic testing device |
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| Publication Number | Publication Date |
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| CN103630827A CN103630827A (en) | 2014-03-12 |
| CN103630827B true CN103630827B (en) | 2016-07-06 |
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| CN201310616203.9A Active CN103630827B (en) | 2013-11-27 | 2013-11-27 | Integrated circuit automatic testing device |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104502641B (en) * | 2014-12-31 | 2018-11-02 | 杭州友旺电子有限公司 | Chip automatic testing equipment |
| CN111146124A (en) * | 2019-12-27 | 2020-05-12 | 上海华岭集成电路技术股份有限公司 | Optimization device for expanding automatic chip screening and testing contact surface |
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| US7196508B2 (en) * | 2005-03-22 | 2007-03-27 | Mirae Corporation | Handler for testing semiconductor devices |
| DE102007047678B4 (en) * | 2007-10-05 | 2010-02-11 | Multitest Elektronische Systeme Gmbh | Handling device for electronic components, in particular ICs, with pneumatic cylinder movement device for moving plungers |
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| CN2533473Y (en) * | 2002-02-06 | 2003-01-29 | 台康资讯股份有限公司 | Automatic circuit board PCI interface tester |
| CN101251572A (en) * | 2008-03-14 | 2008-08-27 | 江阴新基电子设备有限公司 | Test unit device for novel QFN integrated circuit testing separator |
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