CN103628103A - Pattern forming device and pattern forming method - Google Patents
Pattern forming device and pattern forming method Download PDFInfo
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- CN103628103A CN103628103A CN201310361890.4A CN201310361890A CN103628103A CN 103628103 A CN103628103 A CN 103628103A CN 201310361890 A CN201310361890 A CN 201310361890A CN 103628103 A CN103628103 A CN 103628103A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/22—Servicing or operating apparatus or multistep processes
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
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- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
A pattern forming device includes a plurality of tanks, and a power supply device. Each of the tanks has an open end having the same shape as a profile shape of a corresponding one of regions of a surface of a workpiece, in which different types of films are to be formed, and stores a corresponding one of electrodeposition solutions used to form the different types of films in a state where the open end is in contact with the surface. The power supply device applies a predetermined voltage to between the workpiece that serves as a first electrode, and each one of second electrodes in the tanks.
Description
Technical field
The application quotes the full content of the disclosed specification sheets of Japanese patent application 2012-183261, claims, accompanying drawing and the summary submitted on August 22nd, 2012.
The present invention relates to utilize galvanic deposit to form different types of epithelium in surperficial a plurality of regions of workpiece, and utilize these epitheliums on the surface of workpiece, to obtain patterning device and the pattern formation method of regulation film pattern.
Background technology
For example, in order to reduce the friction resistance of metal-made workpiece surface, sometimes on its surface, form resin involucra.As the known a kind of galvanic deposit of the method that is used to form such epithelium.; as shown in Figure 7; by having the interior configuration workpiece 92 of the tank 91 of the electrodeposit liquid (electrolytic solution) 90 that comprises resinous principle and opposite electrode 93 holding; and by applying volts DS to them; can make to be included in the surface that resinous principle in electrodeposit liquid 90 is attached to workpiece 92, form resin involucra.In addition, for example, as utilizing galvanic deposit to form the device of epithelium, the device that known JP 2000-256895 communique (with reference to Fig. 1) is recorded on the surface of workpiece.
In addition, as shown in Figure 8, in the surperficial a plurality of regions that utilize galvanic deposit at workpiece 95, form different types of epithelium, and utilize these epitheliums to form in the situation of the film pattern of stipulating, as described below, used mask in the past.In addition,, in Fig. 8, the surface of tabular workpiece 95 is divided into 9 region A1～A9.At region A2, A4, A6 and A8, form leather diaphragm.At region A1 and A9, be formed with and diverse the second epithelium of leather diaphragm.At region A3 and A7, be formed with and leather diaphragm and diverse the 3rd epithelium of the second epithelium.At region A5, be formed with and first, second and diverse the 4th epithelium of the 3rd epithelium.
When forming such film pattern, first, workpiece and opposite electrode are configured in the tank that holds the electrodeposit liquid that is useful on formation leather diaphragm.In addition, as shown in Fig. 9 (A), the cancellate mask M1 of the surface-coated lid of this workpiece.Then, by workpiece and opposite electrode are applied to volts DS, thereby form leather diaphragm (with reference to Fig. 9 (B)) at region A2, A4, A6 and the A8 of coverage mask M1.Next, the workpiece and the opposite electrode that are formed with leather diaphragm are configured in the tank that holds the electrodeposit liquid that is useful on formation the second epithelium.Wherein, as shown in Fig. 9 (C), the surperficial mask that covers this workpiece is replaced by other mask M2.Thus, region A1 and the A9 of coverage mask M2 do not form the second epithelium (with reference to Fig. 9 (D)).
Below, similarly, will be exchanged for mask M3(with reference to Fig. 9 (E)) work piece configuration in holding the tank that is useful on the electrodeposit liquid that forms the 3rd epithelium, at region A3 and A7, form the 3rd epithelium (Fig. 9 (F)).
In addition, will be capped mask M4(with reference to Fig. 9 (G) with reference to) work piece configuration in holding the tank that is useful on the electrodeposit liquid that forms the 4th epithelium, at region A5, form the 4th epithelium (Fig. 9 (H)).
As mentioned above, in order to utilize galvanic deposit to form different types of epithelium at surperficial a plurality of region A1～A9 of workpiece, and by these epitheliums, obtain the film pattern of stipulating, need to repeatedly work piece configuration be carried out in the diverse tank of electrodeposit liquid to the processing of repeatedly galvanic deposit.And existence need to be processed the mask of changing coating workpieces by each, consumes a large amount of process numbers therefore method in the past exists, product cost increases such problem.
Summary of the invention
The object of the invention is to provide the surperficial a plurality of regions utilizing galvanic deposit at workpiece to form different types of epithelium, and by these epitheliums, obtain in the situation of the film pattern of stipulating, can reduce the patterning device of process number and the pattern formation method that can reduce process number.
Utilize galvanic deposit to form different types of epithelium in surperficial a plurality of regions of workpiece, the patterning device that obtains an embodiment of the present invention of the film pattern of stipulating by these epitheliums is characterised in that on forming, possess: a plurality of tanks, they have the opening end identical shaped with the above-mentioned a plurality of regions that are formed with different types of epithelium outline shape separately, and this opening end is connected under the state on above-mentioned surface, accumulate respectively the electrodeposit liquid that is used to form different types of epithelium; Supply unit, it applies assigned voltage between each second electrode in the above-mentioned workpiece as the first electrode and above-mentioned a plurality of tank.
Accompanying drawing explanation
In conjunction with the detailed description and the accompanying drawings of most preferred embodiment, the feature that the present invention is foregoing and other and advantage must further to define.Same parts is given same reference numerals.
Fig. 1 means the stereographic map of the schematic configuration of patterning device of the present invention.
Fig. 2 means the figure that makes the tank state separated with workpiece.
Fig. 3 turns upside down tank, and the explanatory view that abutting part is represented upward.
Fig. 4 observes the explanatory view in the cross section of tank from main-vision surface.
Fig. 5 obtains the surperficial explanatory view of the workpiece of the film pattern of stipulating by patterning device.
Fig. 6 means the stereographic map of schematic configuration of the patterning device of other embodiments.
Fig. 7 is the explanatory view that device is in the past described.
Fig. 8 is the surperficial explanatory view of workpiece.
Fig. 9 is the explanatory view that pattern formation method is in the past described.
Embodiment
Below, based on accompanying drawing, embodiments of the present invention are described.Fig. 1 means the stereographic map of the schematic configuration of patterning device of the present invention.This patterning device is to utilize galvanic deposit to form different types of epithelium in a plurality of regions of the surperficial F of workpiece W, and by these epitheliums, obtains the device of the film pattern of regulation.Wherein, the reason that forms like this epithelium on the surface of workpiece W is for example in order to improve surperficial wear resistant or capable of reducing friction resistance.In addition, the film pattern with multiple epithelium being set is to change characteristic for the region by each surperficial F.
Fig. 5 utilizes the patterning device of present embodiment to obtain the explanatory view of surperficial F of workpiece W of the film pattern of regulation.In the present embodiment, workpiece W consists of metal sheet, and its surperficial F is divided into reticulation, has 9 region A1～A9.In addition, after can describe, this workpiece W is as electrode (the first electrode).In addition, for this surface F, utilize galvanic deposit to form 4 kinds of epitheliums, and obtain the film pattern based on these 4 kinds of epitheliums.Particularly, in region A2, A4, A6 and A8, be formed with leather diaphragm S1.At region A1 and A9, form and diverse the second epithelium S2 of leather diaphragm S1.At region A3 and A7, form and leather diaphragm S1 and diverse the 3rd epithelium S3 of the second epithelium S2.At region A5, form and first, second and the 3rd epithelium S1, S2 and diverse the 4th epithelium S4 of S3.
In Fig. 1, patterning device possesses a plurality of tanks 11～19.Fig. 2 means the figure that makes these tanks 11～19 state separated with workpiece W.In Fig. 1 and Fig. 2, patterning device possesses and at the surperficial F of workpiece W, forms the tank of aforementioned region A1～A9 same number of epithelium, in other words, and 9 tanks 11～19.For this patterning device, workpiece W is set to surperficial F upward, on the F of this surface, under the state of placing tank 11～19, is used.In other words, tank 11～19 has respectively the structure at surperficial F side (in other words, bottom side) opening, and makes the bottom of each tank be connected to the surperficial F of workpiece W and be used.Inner peripheral surface at each tank has long up and down barrel shape, and the bottom of these tanks 11～19 is as the abutting part 9 for surperficial F.Tank 11～19 bottom (opening end) is separately connected to respectively region A1～A9 neighboring separately.
Fig. 3 turns upside down tank 11～19, and by above-mentioned abutting part 9 towards the explanatory view representing.The shape of tank 11～19 opening end 21～29 is separately identical with region A1～A9 outline shape separately.In the present embodiment, A1～A9 outline shape separately in region is rectangle, and region A1～A9 shape is all identical.Therefore, opening end 21～29 shape is separately identical rectangle.These opening ends 21～29 become the abutting part 9 of the surperficial F that is connected to workpiece W.In addition, tank 11～19 respectively along its length (above-below direction) there is identical cross-sectional shape.
And in the present embodiment, these tanks 11～19 are configured to one.In other words, for example, by the inner-wall surface 12a of the inner-wall surface 11a of tank 11 tank 12 adjacent with it, formed the two sides of a shared sidewall.
And, opening end 21～29 is connected under the state of surperficial F, these tanks 11～19 can be accumulated respectively the electrodeposit liquid (electrolytic solution) that is used to form different types of epithelium.Fig. 4 observes the explanatory view in the cross section that represents tank 17,18 and 19 from main-vision surface.According to this Fig. 4, at tank 17,18 and 19, hold respectively and have different types of electrodeposit liquid L3, L1 and L2.The internal space of internal space separately of tank 11～19 and other tanks is independent and form, and electrodeposit liquid can not mix each other.
In Fig. 1, in the present embodiment, at tank 12,14,16 and 18, hold and be useful on the identical electrodeposit liquid L1 that forms leather diaphragm S1.At tank 11 and 19, hold and be useful on the identical electrodeposit liquid L2 that forms the second epithelium S2.At tank 13 and 17, hold and be useful on the identical electrodeposit liquid L3 that forms the 3rd epithelium S3.At tank 15, hold and be useful on the electrodeposit liquid L4 that forms the 4th epithelium S4.These electrodeposit liquids L1～L4 comprises respectively resinous principle, and resinous principle is separately different.Therefore, in the present embodiment, at surperficial F, be formed with different types of resinous epithelium S1～S4.
In addition, although not shown, go out, tank 11～19 is connected with server tank via pipe arrangement respectively, also can be configured to the electrodeposit liquid being accumulated in this server tank and to tank 11～19, supply with respectively via above-mentioned pipe arrangement.
In addition, patterning device possess prevent that sealing 8(that electrodeposit liquid leaks is with reference to Fig. 3 and Fig. 4).Sealing 8 is arranged on the opening end 21～29 of the tank 11～19 of the surperficial F that is connected to workpiece W.In other words, sealing 8 is arranged on the abutting part 9 of tank 11～19.Sealing 8 is such as consisting of resin materials such as rubber or silicon, by forming at opening end 21～29 binder resins.Adopt sealing portion can prevent from being connected under the state of surperficial F of workpiece W at the opening end 21～29 that makes tank 11～19, the electrodeposit liquid L1～L4 in tank 11～19 is from leakage between surperficial F and opening end 21～29.
Especially in the present embodiment, at the surperficial F of workpiece W, divide and the region (for example, A7 and A8) that comprises adjacency in a plurality of region A1～A9 of forming.Thus, be adjacent to each other configures the tank corresponding with these regions (being tank 17 and tank 18 in Fig. 4), even if also can prevent electrodeposit liquid L1(L3 in this case) leak and with electrodeposit liquid L3(L1 in adjacent tank) mix.
In addition, at the interior opposite electrode as the first electrode (workpiece W) of tank 11～19, be provided with second electrode 31～39(with reference to Fig. 4).In the present embodiment, at tank 11～19 inner-wall surface separately, be provided with electrode 31～39.That is, a part for tank 11～19 inner-wall surface separately becomes the second electrode 31～39.In addition, as mentioned above, at the abutting part 9 of tank 11～19, be provided with sealing 8.Thus, sealing portion 8 consists of dielectric material, and brings into play function as making the parts of electrical isolation between tank 11～19 and workpiece W.Thus, tank 11～19 inner-wall surface separately can become the second electrode.In other words, tank 11～19 can consist of the material with electroconductibility.
And this patterning device also possesses supply unit 10(with reference to Fig. 1).Supply unit 10 applies needed volts DS between each electrode of the second electrode 31～39 in the workpiece W as the first electrode and tank 11～19.Thus, at region A1～A9 of the surperficial F of workpiece W, form respectively and the different types of epithelium of adjacent area, obtain cancellate film pattern as shown in Figure 5.Especially in the present embodiment, supply unit 10 applies voltage simultaneously between each electrode of the second electrode 31～39 in the first electrode (workpiece W) and tank 11～19.Thus, carry out electrodeposition process simultaneously.
The patterning device that possesses above formation to utilizing forms different types of epithelium by galvanic deposit at the region of the surperficial F of workpiece W A1～A9, and the pattern formation method of the film pattern of stipulating by these epitheliums acquisitions describes.As depicted in figs. 1 and 2, in surperficial F for workpiece W, be formed with the region A1～A9 of different types of epithelium, the opening end 21～29(Fig. 3 that makes to have the shape identical with these regions A1～A9 outline shape separately with reference to) tank 11～19 be connected to aforementioned region A1～A9.
Then, at these tanks 11～19, hold respectively the electrodeposit liquid L1～L4 that is used to form different types of epithelium S1～S4, utilize supply unit 10 to apply volts DS between each electrode of the second electrode 31～39 in the workpiece W as the first electrode and tank 11～14.
By applying like this voltage, at region A1～A9 of the surperficial F of workpiece W, form different types of epithelium S1～S4, obtain the film pattern shown in Fig. 5.Therefore, for forming different types of epithelium S1～S4, the surperficial F at workpiece W do not need in the past such mask.Thus, the also not replacing of this mask, can reduce and be used to form the needed process number of film pattern.Its result is, can carry out at short notice the surface treatment of workpiece W, can contribute to the minimizing of product cost.
Particularly in the present embodiment, for accumulate respectively the state of needed electrodeposit liquid L1～L4 at tank 11～19, apply each electrode of the second electrode 31～39 and the voltage between the first electric power (workpiece W) simultaneously.Thus, can carry out galvanic deposit for region A1～A9 simultaneously, can form different types of epithelium S1～S4 simultaneously.
On the other hand, in the past, as utilize Fig. 9 illustrated, in order to form multiple epithelium for a plurality of regions, need to hold and have the tank of multiple electrodeposit liquid and multiple mask.Need to workpiece, carry out galvanic deposit while changing tank, and need to exchange mask when each replacing tank.If the replacing of mask and electrodeposition process are made as to an operation, in order to form 4 kinds of epithelium S1～S4, need to repeatedly carry out 4 times operation.Yet, according to present embodiment, do not need mask, and carry out electrodeposition process for All Ranges A1～A9 simultaneously, can pass through 1 operation, in other words at short notice, at the surperficial F of workpiece W, form 4 kinds of epithelium S1～S4.
In addition, about the control of using the electrodeposition process of supply unit 10 to use, can in all tanks 11～19, voltage, electric current etc. be controlled as identical condition, also can make tank 11～19 condition separately different.As condition, at least comprise at least one in electric current, voltage and application time.In order to carry out this control, supply unit 10 has the control part (not shown) for controlling this condition.This control part consists of the minicomputer with CPU, internal storage.
For example, in the embodiment shown in Fig. 1, power supply is single and applies needed voltage between each electrode of the second electrode 31～39 in the workpiece W as the first electrode and tank 11～19, and (for example utilize identical parameter, electric current, voltage) and identical operation (for example, the additional time) situation of carrying out electrodeposition process be illustrated.Yet, in addition, can also a power supply (with reference to Fig. 6) be set for a tank, the in the situation that of this Fig. 6, for tank 11～19, power supply V1～V9 is set.Therefore, can change parameter, operation by each tank and carry out electrodeposition process.Thus, for example, even if it is different to stockpile the characteristic of the electrodeposit liquid in tank 11～19, a side or the both sides that also can change in parameter and operation according to its characteristic carry out electrodeposition process.
Patterning device of the present invention is not limited to illustrated mode, can be also other modes within the scope of the invention.For example, workpiece W can not be tabular but cylindric or cylindric.A plurality of regions of dividing on the surface of workpiece and forming can not be other shapes of rectangle but the shape that comprises curved portion etc.And, so long as mate the outline shape in this region, form tank (opening end).
According to the present invention, because the surperficial a plurality of regions at workpiece utilize galvanic deposit to form different types of epithelium and obtain the film pattern of stipulating by these epitheliums, do not need in the past such mask, so do not need the replacing of mask, can reduce process number yet.
Claims (6)
1. a patterning device, utilizes galvanic deposit to form different types of epithelium in surperficial a plurality of regions of workpiece, and by these epitheliums, obtains the film pattern of regulation,
Described patterning device is characterised in that to possess:
A plurality of tanks, they have with the described a plurality of regions that form different types of epithelium outline shape is separately identical shaped opening end, and accumulates respectively the electrodeposit liquid that is used to form different types of epithelium this opening end is connected under the state on described surface; With
Supply unit, it applies assigned voltage between each second electrode in the described workpiece as the first electrode and described a plurality of tank.
2. patterning device according to claim 1, is characterized in that,
Described supply unit applies voltage simultaneously between the second electrode described in each in described the first electrode and described a plurality of tank.
3. patterning device according to claim 1, is characterized in that,
Also possess sealing, described sealing prevents that the electrodeposit liquid in described tank is connected at the opening end that makes this tank under the surperficial state of described workpiece between the surface of this workpiece and this opening end and leaks.
4. patterning device according to claim 2, is characterized in that,
Also possess sealing, described sealing prevents that the electrodeposit liquid in described tank is connected at the opening end that makes this tank under the surperficial state of described workpiece between the surface of this workpiece and this opening end and leaks.
5. according to the patterning device described in any one in claim 1～4, it is characterized in that,
At least a portion of the inner-wall surface of described a plurality of tanks is described the second electrode.
6. a pattern formation method, utilizes galvanic deposit to form different types of epithelium in surperficial a plurality of regions of workpiece, and by a little epitheliums, obtains the film pattern of regulation,
Described pattern formation method is characterised in that, comprising:
Make a plurality of tanks be connected to the step that forms a plurality of regions of different types of epithelium in the surface of described workpiece, it is identical shaped opening end that described a plurality of tanks have with these a plurality of regions outline shapes separately; With
In these tanks, accumulate respectively the electrodeposit liquid that is used to form different types of epithelium, and apply voltage between each second electrode in the described workpiece as the first electrode and described a plurality of tank.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-183261 | 2012-08-22 | ||
| JP2012183261A JP2014040633A (en) | 2012-08-22 | 2012-08-22 | Pattern formation apparatus and pattern formation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103628103A true CN103628103A (en) | 2014-03-12 |
Family
ID=49028916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310361890.4A Pending CN103628103A (en) | 2012-08-22 | 2013-08-19 | Pattern forming device and pattern forming method |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20140054176A1 (en) |
| EP (1) | EP2700737A3 (en) |
| JP (1) | JP2014040633A (en) |
| CN (1) | CN103628103A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105895904A (en) * | 2014-08-13 | 2016-08-24 | 法拉赛斯能源公司 | Process For Preparing And Recycling Cathode Active Materials For Lithium-Ion Batteries |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11408086B2 (en) * | 2015-05-14 | 2022-08-09 | Lacks Enterprises, Inc. | Method for creating multiple electrical current pathways on a work piece |
| US20220235481A1 (en) * | 2021-01-26 | 2022-07-28 | Seagate Technology Llc | Selective screen electroplating |
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| TW511142B (en) * | 2000-09-20 | 2002-11-21 | Ebara Corp | Plating apparatus and plating method for substrate |
| US20030070917A1 (en) * | 2001-10-11 | 2003-04-17 | Symyx Technologies, Inc. | Synthesis and characterization of materials for electrochemical cells |
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| US7544574B2 (en) * | 2005-10-11 | 2009-06-09 | Intermolecular, Inc. | Methods for discretized processing of regions of a substrate |
| JP2010236054A (en) * | 2009-03-31 | 2010-10-21 | Fujitsu Semiconductor Ltd | Method of manufacturing semiconductor device and plating apparatus |
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| US4315809A (en) * | 1979-04-23 | 1982-02-16 | Honeywell Inc. | Cluster core assembly for electroplating radioactive sources for an ionization smoke detector |
| JPS56102590A (en) * | 1979-08-09 | 1981-08-17 | Koichi Shimamura | Method and device for plating of microarea |
| US5571118A (en) * | 1995-01-05 | 1996-11-05 | Boutos; David | Apparatus for stimulating penile, scrotal, anal, vaginal and clitoral tissue |
| JP2000256895A (en) | 1999-03-08 | 2000-09-19 | Sankyo Seiki Mfg Co Ltd | System and method for electrodeposition coating |
| JP3513130B2 (en) * | 2001-10-11 | 2004-03-31 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | Plating apparatus and plating method |
| US20070029189A1 (en) * | 2005-08-02 | 2007-02-08 | The University Of Chicago | Combinatorial electrochemical deposition system |
-
2012
- 2012-08-22 JP JP2012183261A patent/JP2014040633A/en active Pending
-
2013
- 2013-08-02 US US13/957,865 patent/US20140054176A1/en not_active Abandoned
- 2013-08-19 CN CN201310361890.4A patent/CN103628103A/en active Pending
- 2013-08-20 EP EP13181003.8A patent/EP2700737A3/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW511142B (en) * | 2000-09-20 | 2002-11-21 | Ebara Corp | Plating apparatus and plating method for substrate |
| US20030070917A1 (en) * | 2001-10-11 | 2003-04-17 | Symyx Technologies, Inc. | Synthesis and characterization of materials for electrochemical cells |
| US20040168925A1 (en) * | 2002-10-09 | 2004-09-02 | Uziel Landau | Electrochemical system for analyzing performance and properties of electrolytic solutions |
| US7544574B2 (en) * | 2005-10-11 | 2009-06-09 | Intermolecular, Inc. | Methods for discretized processing of regions of a substrate |
| JP2010236054A (en) * | 2009-03-31 | 2010-10-21 | Fujitsu Semiconductor Ltd | Method of manufacturing semiconductor device and plating apparatus |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105895904A (en) * | 2014-08-13 | 2016-08-24 | 法拉赛斯能源公司 | Process For Preparing And Recycling Cathode Active Materials For Lithium-Ion Batteries |
| CN105895904B (en) * | 2014-08-13 | 2019-02-22 | 孚能科技（赣州）有限公司 | The method of the positive electrode active materials of preparation and recycling lithium ion battery |
Also Published As
| Publication number | Publication date |
|---|---|
| US20140054176A1 (en) | 2014-02-27 |
| EP2700737A3 (en) | 2015-05-27 |
| JP2014040633A (en) | 2014-03-06 |
| EP2700737A2 (en) | 2014-02-26 |
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