CN103620428B - The characteristic measurement method of electronic devices and components - Google Patents
The characteristic measurement method of electronic devices and components Download PDFInfo
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- CN103620428B CN103620428B CN201280029167.XA CN201280029167A CN103620428B CN 103620428 B CN103620428 B CN 103620428B CN 201280029167 A CN201280029167 A CN 201280029167A CN 103620428 B CN103620428 B CN 103620428B
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- components
- electronic devices
- measuring
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- measuring system
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
Abstract
The invention provides the characteristic measurement method of the electronic devices and components of the mobility that can improve measuring appliance.The method uses a measuring appliance measurement to carry the characteristic of the electronic devices and components of IC.Carry out successively (a) start electronic devices and components make its be in can measuring state the 1st process 60a, 60b, (b) use measuring appliance measurements be in can measuring state electronic devices and components characteristic the 2nd process 62a, 62b, c () stops the 3rd process 64a, 64b of the startup of electronic devices and components after writing data to electronic devices and components based on the measurement result obtained by the 2nd process 62a, 62b.In the feature measurement operation of carrying out the 2nd process 62a, 62b, the 1st process 60a, 60b is carried out to the electronic devices and components that can carry out the 2nd process 62a, 62b afterwards.
Description
Technical field
The present invention relates to the characteristic measurement method of electronic devices and components, be specifically related to the method that the characteristic of the electronic devices and components being equipped with IC is measured.
Background technology
The electronic devices and components such as IC chip make its action to electronic devices and components input test signal, carry out measurement characteristics by its response signal.
Such as, in patent documentation 1, disclose the method using multiple tester (measuring appliance) to measure electronic devices and components.In this measuring method, use multiple tester, after utilizing certain measure the item tester to measure the characteristic of electronic devices and components, carrying electronic devices and components, utilize another tester of other measure the item to measure the characteristic of electronic devices and components.
Prior art document
Patent documentation
Patent documentation 1: Japanese Patent Laid-Open 2010-156709 publication
Summary of the invention
Invent technical matters to be solved
As shown in patent documentation 1, when using multiple tester to measure, if the words that capacitor and wave filter etc. only have the components and parts of simple function are no problem, but if wireless communication modules etc. have multiple measure the item, and the words of the electronic devices and components of time are to a certain degree needed in order to start module, whenever measuring with tester, need the operation and the time that start electronic devices and components.
In addition, in wireless communication module etc., after measurement terminates, in order to by the storer in the Data write. module such as measurement result and stopping modular, also need operation and the time of carrying out above-mentioned action.
If carry out such startup and stop operation after being carried by electronic devices and components and be connected to tester, then starting and stopping therebetween, tester can be in measurement holding state, has the problem that feature measurement operation required time is elongated.In addition, in feature measurement operation, make tester produce the non-time of sowing owing to starting and stopping, the equipment cost marrying again product price will increase.The tester price used due to the feature measurement of wireless communication module etc. is high, so also large on the impact of manufacturing cost.
The present invention, in view of such truth, provides the characteristic measurement method of the electronic devices and components that can improve measuring appliance mobility.
The technical scheme that technical solution problem adopts
The present invention, for solving above-mentioned problem, provides the characteristic measurement method of electronic devices and components composed as follows.
The characteristic measurement method of electronic devices and components carries out following process successively to the electronic devices and components being equipped with IC: (a) the 1st process, in the 1st process, start above-mentioned electronic devices and components make it be in can measuring state; (b) the 2nd process, in the 2nd process, using measuring appliance to measure to be in through the above-mentioned 1st can the characteristic of above-mentioned electronic devices and components of measuring state; C () the 3rd processes, in the 3rd process, after writing data to above-mentioned electronic devices and components, stop the startup of above-mentioned electronic devices and components based on the measurement result obtained by above-mentioned 2nd process.Be in can the above-mentioned electronic devices and components of measuring state carrying out in the feature measurement operation of above-mentioned 2nd process to by the above-mentioned 1st, above-mentioned 1st process is being carried out to the above-mentioned electronic devices and components before the feature measurement carrying out above-mentioned 2nd process after this feature measurement operation.
According to said method, in the feature measurement operation of carrying out the 2nd process, the 1st process is being carried out to the electronic devices and components carrying out the 2nd process afterwards.By like this, shorten or save the stand-by time of the 2nd process, improve the mobility of measuring appliance.
Comparatively ideal, in above-mentioned feature measurement operation, above-mentioned 3rd process is carried out to the above-mentioned electronic devices and components having carried out above-mentioned 2nd process before this feature measurement operation.
In this case, measuring appliance, during certain electronic devices and components being carried out to the 3rd process, carries out the 2nd process to other electronic devices and components.By like this, the mobility of measuring appliance can be improved.
Comparatively ideal, use and comprise (a) and carry the multiple sub-measuring system of opertaing device that the fixture of above-mentioned electronic devices and components and (b) control the startup of the above-mentioned electronic devices and components be mounted on above-mentioned fixture, stopping and action.Above-mentioned measuring appliance only connects the above-mentioned opertaing device of an above-mentioned sub-measuring system, the above-mentioned opertaing device of this sub-measuring system is connected to the above-mentioned opertaing device of other above-mentioned sub-measuring systems.Use the above-mentioned opertaing device of this sub-measuring system, integral traffic control processes to the 3rd above-mentioned 1st process that the above-mentioned electronic devices and components be mounted on the above-mentioned fixture of each above-mentioned sub-measuring system carry out.
In this case, the Measurement situation of all sub-measuring systems grasped by opertaing device due to a sub-measuring system, carry out the optimization of measuring state, therefore can shorten Measuring Time, also likely save and connect the opertaing device of other sub-measuring systems and the wiring of measuring appliance.
The technique effect of invention
The present invention can improve the mobility of measuring appliance.
Accompanying drawing explanation
Fig. 1 is the basic block diagram of measuring system.(embodiment 1)
Fig. 2 is the structural drawing of measuring system.(embodiment 1)
Fig. 3 is sequential chart when measuring electronic devices and components.(embodiment 1)
Embodiment
Below with reference to Fig. 1 ~ Fig. 3, embodiments of the present invention are described.
" embodiment 1 ", about embodiments of the present invention, is described by reference to Fig. 1 ~ Fig. 3.
Fig. 1 is that the electronic devices and components being equipped with IC measured by use measuring appliance and RF tester 12---the basic block diagram of the measuring system 10 of the characteristic of wireless communication module 2a, 2b ..., 2x.As shown in Figure 1, a measuring appliance (RF tester) 12 is connected with multiple sub-measuring system 13a, 13b ..., 13x.
Sub-measuring system 13a, 13b ..., 13x have identical structure, each self-contained: be equipped with electronic devices and components 2a, 2b ..., 2x(wireless communication module A, B ..., X as measuring object) fixture 14a, 14b ..., 14x(platform A, platform B ..., platform X); And control to be mounted in electronic devices and components 2a on fixture 14a, 14b ..., 14x, 2b ..., the startup of 2x, the opertaing device 20a of stopping and action, 20b ..., 20x(module control PC).The fixture 14a of sub-measuring system 13a, 13b ..., 13x, 14b ..., 14x(platform A, platform B ..., platform X) and opertaing device 20a, 20b ..., 20x be connected with measuring appliance 12 respectively.
The characteristic measurement method of the electronic devices and components of embodiment 1 is, be mounted in electronic part characteristic on the fixture of certain sub-measuring system measuring with measuring appliance 12, during carrying out the 2nd process, other measuring systems are carried out (a) the 1st process, in the 1st process, start the electronic devices and components be mounted on fixture make it be in can measuring state, b () the 3rd processes, in the 3rd process, the measurement result obtained is processed based on by the 2nd, to the electronic devices and components write data completing the measurement (the 2nd process) undertaken by measuring appliance 12, afterwards, stop the startup of these electronic devices and components, c () the 4th processes, in the 4th process, exchange the electronic devices and components be mounted on fixture.
By the method, shorten or save measuring appliance 12 being in the time of measuring holding state, the time of sowing of measuring appliance 12 actual measurement electronic part characteristic can be elongated.That is, by carrying out the 1st process to other electronic devices and components during certain electronic devices and components being carried out to the 2nd process, shortening or saving when then carrying out the 2nd process and waiting for the stand-by time that the 1st process terminates, improving the mobility of measuring appliance.In addition, measuring appliance, during certain electronic devices and components being carried out to the 3rd and the 4th process, carries out the 2nd process to other electronic devices and components, can improve the mobility of measuring appliance thus.
Below, by reference to Fig. 2 and Fig. 3, concrete example during existence 2 sub-measuring systems is described.
Fig. 2 is the structural drawing of measuring system 10a comprising 2 sub-measuring system 13a, 13b.As shown in Figure 2, sub-measuring system 13a, 13b are each self-contained: be equipped with electronic devices and components 2a, 2b(wireless communication module A, B) fixture 14a, 14b(platform A, platform B); Control to be mounted in control circuit substrate 22a, 22b of the startup of electronic devices and components 2a, 2b on fixture 14a, 14b, stopping and action; Power supply 28a, 28b; And opertaing device 20a, 20b(module controls with PC A, B).
Each fixture 14a, 14b are connected to measuring appliance 12 by RF cable 30a, 30b, are connected to control circuit substrate 22a, 22b by flat cable 31a, 31b.Fixture 14a, 14b and control circuit substrate 22a, 22b are connected to power supply 28a, 28b each via feed cable 36a ~ 39a, 36b ~ 39b, are powered by power supply 28a, 28b.Opertaing device 20a, 20b are connected with control circuit substrate 22a, 22b by UART cable 32a, 32b, are connected with power supply 28a, 28b by GPIB cable 34a, 34b.Opertaing device 20a, 20b action to control circuit substrate 22a, 22b and power supply 28a, 28b controls.
Opertaing device 20a, 20b of sub-measuring system 13a, 13b are connected to each other by LAN cable 35.The opertaing device 20a of a sub-measuring system 13a is only had to be connected with measuring appliance 12 by USB cable 33.The opertaing device 20a of one sub-measuring system 13a incorporates the control of measuring system 10a entirety.That is, the opertaing device 20a of a sub-measuring system 13a incorporates the control that electronic devices and components 2a, 2b that fixture 14a, the 14b to each sub-measuring system 13a, 13b carries carry out the 1st and even the 4th process.
Now, opertaing device 20a due to a sub-measuring system 13a can grasp the Measurement situation of all sub-measuring system 13a, 13b, optimize measuring state, so can Measuring Time be shortened, and the connection opertaing device 20b of other sub-measuring system 13b and the wiring of measuring appliance 20 can be saved.
Below, by reference to the sequential chart of Fig. 3, illustrate and use measuring system 10a to measure action during electronic part characteristic.
As shown in Fig. 3 (a), measuring appliance 12 remains that measurable ON(is open-minded) state.
Interval 51, the 1st process 60a is carried out to the electronic devices and components (modules A) be mounted on the fixture of a sub-measuring system.And in this interval 51, the 2nd process 62b is carried out to the electronic devices and components be mounted on the fixture of other sub-measuring systems (module B).
Next interval 52, the 2nd process 62a is carried out to the electronic devices and components (modules A) be mounted on the fixture of a sub-measuring system.And in this interval 52,3rd process 64b is carried out to the electronic devices and components be mounted on the fixture of other sub-measuring systems (module B), next carry out the 4th process 68b exchanging the electronic devices and components on the fixture being mounted in other sub-measuring systems, afterwards the 1st process 60b is carried out to the electronic devices and components be newly mounted on the fixture of other sub-measuring systems (module B).
Next interval 53, the 2nd process 62b is carried out to the electronic devices and components be mounted on the fixture of other sub-measuring systems (module B).In addition, in this interval 53,3rd process 64a is carried out to the electronic devices and components (modules A) be mounted on the fixture of a sub-measuring system, next carry out the 4th process 68a exchanging the electronic devices and components on the fixture being mounted in a sub-measuring system, afterwards the 1st process 60a is carried out to the electronic devices and components (modules A) be newly mounted on the fixture of a sub-measuring system.
Similarly in the following, in interval 54,55 ..., 2 sub-measuring systems are hocketed (a) the 2nd process 62a, 62b, and (b) the 3rd process 64a, 64b, the 4th process 68a, 68b and the 1st process 60a, 60b.
When the electronic devices and components as measuring object are wireless communication modules, opertaing device 20a carries out following action.
In the 1st process 60a, 60b, in order to the wireless communication module be mounted on fixture 14a, 14b can be measured, carry out control to perform initial setting, namely, switch on power 28a, 28b, start the wireless communication module be mounted on fixture 14a, 14b, the data (Config file) that should read when wireless communication module starts are read, the wireless communication module that foundation is mounted on fixture 14a, 14b and the communication etc. between control circuit substrate 22a, 22b from the storer of the wireless communication module be mounted in fixture 14a, 14b.
In the 2nd process 62a, 62b, carry out control and make, from control circuit substrate 22a, 22b sending control signal, to make the wireless communication module action be mounted on fixture 14a, 14b, the electrical characteristics such as transmission, reception under using measuring appliance 12 to measure wireless frequency.
At the 3rd process 64a, in 64b, carrying out control makes based on the 2nd process 62a, in 62b, the result of measurement characteristics processes data, calculate the data (qualified rejection number according to etc.) that can utilize in after this operation, data calculated and being used for are identified data (MAC Address etc.) write of wireless communication module is mounted in fixture 14a, storer in wireless communication module on 14b, next, make to be mounted in fixture 14a, wireless communication module on 14b and control circuit substrate 22a, sign off between 22b, then stop from power supply 28a, 28b is to being mounted in fixture 14a, wireless communication module power supply on 14b.
In the encapsulation of wireless communication module after feature measurement (bale packing) operation, the qualified rejection number in storer, according to being read, only has certified products can packed (taping).
The time that wireless communication module needs when the 2nd process carrying out RF measurement is very long, therefore measure at the RF carrying out a sub-measuring system in the feature measurement operation of (the 2nd process), in other sub-measuring systems, for the electronic devices and components carrying out RF measurement (the 2nd process) after this feature measurement operation, the 1st process can be carried out.
If the 1st time of process needed for 60a, 60b was t1, the 2nd time of process needed for 62a, 62b was t2, and the 3rd time of process needed for 64a, 64b was t3, and the 4th time of process needed for 68a, 68b was t4, if met
t2≥t1＋t3＋t4，
Then carry out alternately measuring to 2 sub-measuring system 13a, 13b by use measuring appliance 12, thus the mobility of measuring appliance 12 can be made to be 100%.
In general, will meet
n×t2≥t1＋t3＋t4
Minimum positive integer be n, if the quantity of sub-measuring system be set to (1+n), by using 1 measuring appliance to measure each sub-measuring system, the mobility of measuring appliance can be made to be 100%.
" summary " as above illustrates, during feature measurement is carried out to the electronic devices and components be mounted on the fixture of certain sub-measuring system, the process of measuring front and back is carried out to other sub-measuring systems, can shorten or save the measurement stand-by time of measuring appliance, elongate the time of sowing of measuring appliance, the mobility of measuring appliance can be improved.The mobility of measuring appliance improves, and can suppress service charge and equipment investment etc., can reduce the cost needed for feature measurement of electronic devices and components.
In addition, the present invention is not confined to above-mentioned embodiment, can also be implemented by additional various change.
Label declaration
2a, 2b ..., 2x electronic devices and components
10,10a measuring system
12 measuring appliances
13a, 13b ..., 13x measuring system
14a, 14b ..., 14x fixture
20a, 20b ..., 20x opertaing device
22a, 22b control circuit substrate
28a, 28b power supply
51 ~ 55 is interval
60a, 60b the 1st processes
62a, 62b the 2nd processes
64a, 64b the 3rd processes
68a, 68b the 4th processes
Claims (2)
1. a characteristic measurement method for electronic devices and components, the characteristic measurement method of these electronic devices and components carries out following process successively to the electronic devices and components being equipped with IC:
1st process, in the 1st process, start described electronic devices and components make it be in can measuring state;
2nd process, in the 2nd process, uses measuring appliance to be in can the characteristic of described electronic devices and components of measuring state to measure by the described 1st; And
3rd process, in the 3rd process, according to the measurement result obtained by described 2nd process after described electronic devices and components write data, stops the startup of described electronic devices and components,
The feature of the characteristic measurement method of these electronic devices and components is,
Be in can the described electronic devices and components of measuring state carrying out in the feature measurement operation of described 2nd process to by the described 1st, to carry out after this feature measurement operation described 2nd process, described electronic devices and components before feature measurement carry out described 1st process
Use multiple sub-measuring system, the plurality of sub-measuring system comprises respectively:
Carry the fixture of described electronic devices and components; And
Control to be mounted in the opertaing device of the startup of described electronic devices and components on described fixture, stopping and action,
The described fixture of measuring system sub-described in each is connected respectively to measuring appliance,
Described measuring appliance only connects the described opertaing device of a described sub-measuring system in the described opertaing device of sub-measuring system described in each, the described opertaing device of this sub-measuring system is connected to the described opertaing device of sub-measuring system described in other,
Use the described opertaing device of this sub-measuring system, integral traffic control processes to the 3rd described 1st process that the described electronic devices and components be mounted on the described fixture of sub-measuring system described in each carry out.
2. the characteristic measurement method of electronic devices and components as claimed in claim 1, is characterized in that,
In described feature measurement operation, to the described electronic devices and components having carried out described 2nd process before this feature measurement operation, carry out described 3rd process.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-133904 | 2011-06-16 | ||
| JP2011133904 | 2011-06-16 | ||
| PCT/JP2012/064924 WO2012173093A1 (en) | 2011-06-16 | 2012-06-11 | Method for measuring characteristics of electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103620428A CN103620428A (en) | 2014-03-05 |
| CN103620428B true CN103620428B (en) | 2015-12-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280029167.XA Expired - Fee Related CN103620428B (en) | 2011-06-16 | 2012-06-11 | The characteristic measurement method of electronic devices and components |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5673819B2 (en) |
| CN (1) | CN103620428B (en) |
| WO (1) | WO2012173093A1 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6087844A (en) * | 1996-09-27 | 2000-07-11 | Ando Electric Co., Ltd. | IC testing device |
| CN101819238A (en) * | 2004-07-23 | 2010-09-01 | 株式会社爱德万测试 | Electronic device test apparatus |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61153574A (en) * | 1984-12-26 | 1986-07-12 | Nec Corp | Testing device for semiconductor device |
| JP3201368B2 (en) * | 1999-01-18 | 2001-08-20 | 日本電気株式会社 | Semiconductor integrated circuit and test method therefor |
| WO2008072639A1 (en) * | 2006-12-13 | 2008-06-19 | Advantest Corporation | Testing apparatus, testing method and connecting section |
-
2012
- 2012-06-11 JP JP2013520548A patent/JP5673819B2/en not_active Expired - Fee Related
- 2012-06-11 WO PCT/JP2012/064924 patent/WO2012173093A1/en active Application Filing
- 2012-06-11 CN CN201280029167.XA patent/CN103620428B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6087844A (en) * | 1996-09-27 | 2000-07-11 | Ando Electric Co., Ltd. | IC testing device |
| CN101819238A (en) * | 2004-07-23 | 2010-09-01 | 株式会社爱德万测试 | Electronic device test apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2012173093A1 (en) | 2015-02-23 |
| JP5673819B2 (en) | 2015-02-18 |
| WO2012173093A1 (en) | 2012-12-20 |
| CN103620428A (en) | 2014-03-05 |
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