CN103604378A - Silicon-steel sheet laser thickness measuring device - Google Patents

Silicon-steel sheet laser thickness measuring device Download PDF

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Publication number
CN103604378A
CN103604378A CN201310593606.6A CN201310593606A CN103604378A CN 103604378 A CN103604378 A CN 103604378A CN 201310593606 A CN201310593606 A CN 201310593606A CN 103604378 A CN103604378 A CN 103604378A
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China
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support
back shaft
lower side
thickness measuring
pinch roller
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CN201310593606.6A
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CN103604378B (en
Inventor
赵军
李林峰
孔明
郭天太
王道档
刘维
单良
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ZHEJIANG SHUANGHONG INTELLIGENT EQUIPMENT Co.,Ltd.
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HANGZHOU CHANGGENG MEASURING TECHNOLOGY Co Ltd
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Abstract

The invention provides a silicon-steel sheet laser thickness measuring device and relates to the technical field of measuring. The device comprises a support composed of an upper layer and a lower layer. Upper side plates are fixed on the left end and the right end of the upper layer of the support; lower side plates are fixed on the left end and the right end of the lower layer of the support; the distance between the two upper side plates is smaller than the distance between the two lower side plates; a support shaft is rotationally connected between the two lower side plates; a pair of rotatable pinch rollers spaced at a certain distance away from each other are arranged above the support shaft; a laser emitter and a CCD receiver are arranged above the distance between the two pinch rollers; the axes of the pinch rollers are parallel with the axis of the support shaft; the pinch rollers are connected with the upper layer of the support in an up-and-down motion mode through an arranged roller assembly; and the pinch rollers are crimped with the support shaft. The advantages are as follows: the support shaft and the pinch rollers of the thickness measuring device compact a silicon-steel sheet to be measured at three points in the same line so that the measuring precision is ensured. Only a pair of the laser emitter and the CCD receiver are needed so that the cost is saved. Besides, the structure is small and compact, the carrying is convenient, and the adaptation scope is wide.

Description

A kind of siliconized plate laser thickness measuring apparatus
Technical field
The present invention relates to field of measuring technique, especially relate to a kind of measurement mechanism to siliconized plate thickness.
Background technology
Siliconized plate is a kind of ferro-silicium of silicon content 0.5%~4.8%.It is a kind of soft magnetic material being widely used at electrical field, is mainly used in motor, generator, transformer, electromagnetic mechanism, relay electron device and measurement instrument.Electrician is conventionally rolled into standard-sized large sheet material with siliconized plate or band is used.The thickness evenness of siliconized plate is a very important quality characteristic.If siliconized plate central authorities are too large with the difference in thickness at edge, or the variation of the thickness of siliconized plate length direction is too large, all can have influence on the thickness unshakable in one's determination after assembling.Different thickness unshakable in one's determination, its permeance variation is also large, directly has influence on the characteristic of motor, generator, transformer, and therefore the thickness to siliconized plate production and in using detects particularly important.
The thickness detecting method of thin steel sheet is generally divided into two kinds of contact type measurement and non-contact measurements.Because contact measuring thickness device can cause certain damage to sheet material, therefore be applicable to off-line measurement, on-line measurement generally adopts non-contact measurement.Utilizing laser-CCD thickness measuring is conventional contactless measurement.Chinese patent application publication No. CN103063151A, on April 24 2013 Shen Qing Publication day, name is called the patent of invention of " a kind of thickness measurement with laser C type frame mechanism and adjustment using method ", discloses a kind of thickness measurement with laser C type frame machine structure.A kind of thickness measurement with laser C type frame mechanism, it also comprises that platform group is moved at angle, inferior horn moves platform group, bottom offset platform group to comprise C type frame housing, upper laser sensor, lower laser sensor, upper laser sensor moves platform group by upper angle and is connected to C type frame housing top, lower laser sensor by inferior horn move platform group, bottom offset platform group is connected to C type frame lower housing portion; Upper angle is moved platform group, inferior horn and is moved platform group and by two, adjust the orthogonal angles of direction respectively and move platform and form, and bottom offset platform group is adjusted the orthogonal displacement platforms of direction by two and formed.Upper-lower position by the laser sensor in two image data of C shape frame front end has been installed special adjusting gear, and utilize the light can this physical features of display beams path in suspension, laser sensor is being adjusted, and upper and lower two detected data of laser sensor are in static, the dynamically lower optimum measurement accuracy requirement that can both reach this sensor thus.This structure need to be settled at C shape frame front end the laser sensor of two image data, during calibration accuracy requirement higher, because too accurate self the vibration of equipment also can have a strong impact on laser instrument measurement result, therefore be not suitable for the application of factory's online production.
For the siliconized plate for high-power transformer, siliconized plate width is controlled at 40cm in producing.Its thickness is more even, generally there will not be and sharply increases phenomenon, but there will be the steady conversion in certain limit, and because process for surface coating is superior, siliconized plate surface reflection is better, can use up reflection class methods test thickness.Chinese patent Granted publication CN202485637U, on October 10 2012 Granted publication day, name is called the utility model patent of " the online dynamically non-contact laser thickness measuring system of a kind of sheet material ", discloses the online dynamically noncontact thickness measuring structure of a kind of sheet material.It comprises several laser feelers of one of them the roller top that is positioned at plate-extruding machine output terminal, laser feeler vertical irradiation is in the top of roller bus, several laser feelers are all connected with an industrial control host, and the output terminal of industrial control host is connected sheet material with one with acoustic-optic alarm respectively with the plate-extruding machine actuating unit that roller departs from.This utility model is provided with several laser feelers above one of them roller of plate-extruding machine output terminal, laser feeler is connected with industrial control host, operator can arrange the thickness upper lower limit value of product in industrial control host, when thickness transfinites, can send sound and light alarm.This structure has the thickness of several laser head sheet material measurements above roller, does not in fact need, because a plurality of laser instrument is just guaranteed the accuracy of final measured value.If when final measurement surpasses certain value, need to stop carrying sheet material, process.The sheet material of this structure can not guarantee to be adjacent to roller completely and there is no space in addition, has increased introducing error term, and the confidence level of measurement is lower.
Summary of the invention
In order solving in prior art, to measure the technical matters that sheet thickness exists error, to the invention provides a kind of on-line measurement device of siliconized plate thickness that siliconized plate upper surface is measured by light reflecting method.
Technical scheme of the present invention is: a kind of siliconized plate laser thickness measuring apparatus, it comprises by the upper and lower two-layer support forming, two ends, left and right, support upper strata are fixed with epipleural, two ends, support lower floor left and right are fixed with lower side panel, distance between two epipleurals is less than two distances between lower side panel, back shaft has been rotatably connected between two lower side panels, back shaft top is provided with a pair of at a distance of a determining deviation and rotating pinch roller, the top of two pinch roller spacing is provided with generating laser and CCD receiver, the axis of pinch roller is parallel with the axis of back shaft, pinch roller can be moved up and down and be connected with support upper strata by the press roll component arranging, pinch roller and the crimping of back shaft phase.Measuring thickness device is fixed on siliconized plate machining production line, the translation between back shaft and pinch roller of tested siliconized plate, the light beam of generating laser transmitting is reflexed to CCD receiver by siliconized plate upper surface, form live signal, by the computing terminal connecting, process, show and record real-time siliconized plate thickness.Apparatus structure compact, is easy to carry, and only needs a pair of generating laser transmitting and CCD receiver, cost-saving.Back shaft and pinch roller three point on a straight line compress siliconized plate, guarantee measuring accuracy.
As preferably, press roll component is provided with pressure roller, pressure roller is formed and is column by rectangular parallelepiped and cylinder connection, the upper and lower surface of pressure roller rectangular parallelepiped is connected with respectively spring, spring and support upper strata are fixed, and the end face of pressure roller rectangular parallelepiped is connected with guide pole, and epipleural is provided with gathering sill, guide pole embeds gathering sill, and pressure roller right cylinder is connected with pinch roller by the bearing arranging.Both guaranteed that pinch roller can compress the tested siliconized plate on back shaft, guaranteed again that siliconized plate can not be crushed to death and can not move or be out of shape, and had guaranteed measuring accuracy.
As preferably, lower side panel is provided with flanged bearing, and back shaft is connected with lower side panel by flanged bearing; During convenient installation, regulate back shaft, reduce back shaft site error.
As preferably, back shaft is multidiameter, and the diameter of axle of back shaft interlude is greater than the two ends diameter of axle; Facilitate back shaft processing to guarantee precision, back shaft position is moved on can trying one's best simultaneously, makes measuring thickness device more compact structure.
As preferably, support is also provided with plate after support header board and support, and after support header board and support, plate is hollow out; Alleviate support own wt, be convenient for carrying.
Compared with prior art, the invention has the beneficial effects as follows: the back shaft of measuring thickness device and pinch roller three point on a straight line compress tested siliconized plate, guarantee measuring accuracy.Only need a pair of generating laser transmitting and CCD receiver, cost-saving.Structure compact, is easy to carry, applied widely.
 
Accompanying drawing explanation
Accompanying drawing 1 is structural representation stereographic map of the present invention;
Accompanying drawing 2 is front view of the present invention;
Accompanying drawing 3 is A-A cut-open view in Fig. 2.
In figure: 1-support; 2-back shaft; The tested siliconized plate of 3-; 4-pinch roller; 5-press roll component; 6-CCD receiver; 7-generating laser; 11-lower side panel; 12-epipleural; 51-pressure roller; 52-spring; 53-guide pole; 121-gathering sill.
Embodiment
Below by embodiment, and by reference to the accompanying drawings, technical scheme of the present invention is described in further detail.
Embodiment 1:
As shown in Figure 1,2 and 3, a kind of siliconized plate laser thickness measuring apparatus, it comprises by the upper and lower two-layer support forming 1, support 1 is also provided with plate after support header board and support.In Fig. 2: figure left be support 1 left end, to scheme right-hand be the right-hand member of support 1; Close reader's is the front end of support 1, otherwise is the rear end of support 1; Figure top is that upper end, the figure below of support 1 is the lower end of support 1.Support 1 by rack plate, support header board, support after plate, rack side plate and support base plate form framed structure.The support dividing plate that is provided with level in the middle of support 1, separated in support dividing plate, support dividing plate is separated into lower-left, upper left, upper right and four of bottom rights cavity by support 1.After support header board and support, plate is hollow out.Support header board bottom has the stay of two intersections to form X-shaped, and stay upper end and support dividing plate are fixed, and stay lower end and support base plate are fixed.Support header board top is a diagonal brace bar, and diagonal brace bar upper end and rack plate are fixed, and diagonal brace bar lower end and support dividing plate are fixed.After support, plate is identical with support header board, repeats no more.Support 1 two ends, left and right, upper strata are fixed with epipleural 12, and support 1 two ends, lower floor left and right are fixed with lower side panel 11.For support 1 compact conformation, the setting of staggering of the epipleural 12 of support 1 and lower side panel 11, the distance between two epipleurals 12 is less than two distances between lower side panel 11.Lower end and the dividing plate of epipleural 12 are fixed, and upper end and the rack plate of epipleural 12 are fixed.Epipleural 12 is provided with gathering sill 121, and gathering sill 121 is elongated slot, and elongated slot is vertical support frame base plate from top to bottom.Gathering sill 121 connects the interior outside of epipleural 12.Two epipleurals 12 are respectively provided with a gathering sill 121.Epipleural 12 outsides are stretched out at two ends, support base plate left and right.The upper surface of the bottom of lower side panel 11 and support bottom end is fixed.Back shaft 2 has been rotatably connected between two lower side panels 11.Back shaft 2 is multidiameter, and the diameter of axle of back shaft 2 interludes is greater than the two ends diameter of axle.In support dividing plate, separated distance is greater than the length of back shaft 2 diameter shaft broad in the middle.Lower side panel 11 is provided with flanged bearing, and back shaft 2 is connected with lower side panel 11 by flanged bearing.Flanged bearing is fixed by screws in the medial surface of lower side panel 11, the end of back shaft 2 and flange bearing inner ring interference fit.Back shaft 2 tops are provided with a pair of apart a determining deviation and rotating pinch roller 4, and the axis of pinch roller 4 is parallel with the axis of back shaft 2, and pinch roller 4 can be moved up and down and be connected with support 1 upper strata by the press roll component 5 arranging.Press roll component 5 is provided with pressure roller 51, and pressure roller 51 is formed and is column by rectangular parallelepiped and cylinder connection, and the upper and lower surface of pressure roller 51 rectangular parallelepipeds is connected with respectively spring 52, and spring 52 is fixed with support 1 upper strata.Pressure roller 51 has a pair of, is separately positioned in support 1 upper left and upper right cavity.The upper surface of the present embodiment pressure roller 51 rectangular parallelepipeds is equipped with two springs 52, lower surfaces and is also equipped with two springs 52, and upper and lower two springs 52 are one group.One group of spring 52 is near pressure roller 51 rectangular parallelepipeds and cylinder connection place, and another group spring 52 is near pressure roller 51 rectangular parallelepiped another one ends.Pinch roller 4 and back shaft 2 phase crimping.The end face of pressure roller 51 rectangular parallelepipeds is connected with guide pole 53, and guide pole 53 embeds gathering sill 121.Pressure roller 51 right cylinders are connected with pinch roller 4 by the bearing arranging.Pinch roller 4 is in the form of annular discs, and pinch roller 4 centers and bearing outer ring are fixed, and the sidewall of bearing inner race and pressure roller 51 right cylinder ends is fixed.Pinch roller 4 positions, near the end of back shaft 2 diameter shaft broad in the middle, form spacing between two pinch rollers 4.The top of two pinch roller 4 spacing is provided with generating laser 7 and CCD receiver 6.Rack plate forms the corresponding Kai Liangge hole, position of spacing between two pinch rollers 4, and a hole is near support 1 front end, and another hole is near support 1 rear end.In front hole, be provided with Laser emission frame, generating laser 7 is installed on Laser emission frame, CCD receiver 6 is installed in metapore.
Support 1 is placed on the streamline of siliconized plate production, support 1 base plate and streamline are fixed by screw.Tested siliconized plate 3 is placed on the top of back shaft 2 interlude macro-axis journal axles, and pinch roller 4 is pushed down 3 two limits of tested siliconized plate.Generating laser 7 energisings, adjust generating laser 7 and CCD receiver 6 positions, the laser alignment that generating laser 7 is launched is placed on the upper surface of the tested siliconized plate 3 of back shaft 2 axis tops, and after laser is reflected by the upper surface of tested siliconized plate 3, CCD receiver 6 just in time receives.In Fig. 3, dotted line represents the light path of Laser emission, reflection and reception.The signal that CCD receiver 6 receives is received and is processed by the computing machine (not shown) connecting, and can calculate and record the variation in thickness of siliconized plate in online production run.

Claims (5)

1. a siliconized plate laser thickness measuring apparatus, it is characterized in that: it comprises by the upper and lower two-layer support forming (1), two ends, support (1) left and right, upper strata are fixed with epipleural (12), two ends, support (1) lower floor left and right are fixed with lower side panel (11), distance between two epipleurals (12) is less than the distance between two lower side panels (11), back shaft (2) has been rotatably connected between two lower side panels (11), back shaft (2) top is provided with a pair of at a distance of a determining deviation and rotating pinch roller (4), the top of two pinch rollers (4) spacing is provided with generating laser (7) and CCD receiver (6), the axis of described pinch roller (4) is parallel with the axis of described back shaft (2), described pinch roller (4) can be moved up and down and be connected with support (1) upper strata by the press roll component (5) arranging, described pinch roller (4) and back shaft (2) phase crimping.
2. a kind of siliconized plate laser thickness measuring apparatus according to claim 1, it is characterized in that: described press roll component (5) is provided with pressure roller (51), pressure roller (51) is formed and is column by rectangular parallelepiped and cylinder connection, pressure roller (51) rectangular parallelepiped upper, lower surface is connected with respectively spring (52), spring (52) is fixed with support (1) upper strata, the end face of pressure roller (51) rectangular parallelepiped is connected with guide pole (53), described epipleural (12) is provided with gathering sill (121), guide pole (53) embeds gathering sill (121), described pressure roller (51) right cylinder is connected with described pinch roller (4) by the bearing arranging.
3. a kind of siliconized plate laser thickness measuring apparatus according to claim 1, is characterized in that: described lower side panel (11) is provided with flanged bearing, and described back shaft (2) is connected with lower side panel (11) by flanged bearing.
4. according to a kind of siliconized plate laser thickness measuring apparatus described in claim 1 or 3, it is characterized in that: described back shaft (2) is multidiameter, and the diameter of axle of back shaft (2) interlude is greater than the two ends diameter of axle.
5. a kind of siliconized plate laser thickness measuring apparatus according to claim 1, is characterized in that: described support (1) is also provided with plate after support header board and support, and after support header board and support, plate is for engraving.
CN201310593606.6A 2013-11-22 2013-11-22 A kind of stalloy laser thickness measuring apparatus Active CN103604378B (en)

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Application Number Priority Date Filing Date Title
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106225683A (en) * 2016-08-22 2016-12-14 国家电网公司 Vertical hydrogenerator stator silicon steel plate radial displacement detection method
CN107328381A (en) * 2017-09-08 2017-11-07 电子科技大学中山学院 Low-loss high-strength silicon steel sheet thickness measuring device
CN110567386A (en) * 2019-10-14 2019-12-13 程晨 method and equipment for detecting flatness and height of formwork supporting top formwork
CN113118847A (en) * 2019-12-30 2021-07-16 宇环数控机床股份有限公司 Automatic transfer feeding device for piston ring cutting equipment

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101825438A (en) * 2010-05-26 2010-09-08 华中科技大学 Laser measuring device for measuring thickness of plate
CN102818530A (en) * 2012-09-12 2012-12-12 昆山允可精密工业技术有限公司 Instrument for measuring thickness of large-breadth precise thin sheet material

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101825438A (en) * 2010-05-26 2010-09-08 华中科技大学 Laser measuring device for measuring thickness of plate
CN102818530A (en) * 2012-09-12 2012-12-12 昆山允可精密工业技术有限公司 Instrument for measuring thickness of large-breadth precise thin sheet material

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106225683A (en) * 2016-08-22 2016-12-14 国家电网公司 Vertical hydrogenerator stator silicon steel plate radial displacement detection method
CN107328381A (en) * 2017-09-08 2017-11-07 电子科技大学中山学院 Low-loss high-strength silicon steel sheet thickness measuring device
CN107328381B (en) * 2017-09-08 2023-12-08 珠海轮盈机电有限公司 Low-loss high-strength silicon steel sheet thickness measuring device
CN110567386A (en) * 2019-10-14 2019-12-13 程晨 method and equipment for detecting flatness and height of formwork supporting top formwork
CN113118847A (en) * 2019-12-30 2021-07-16 宇环数控机床股份有限公司 Automatic transfer feeding device for piston ring cutting equipment

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Effective date of registration: 20200423

Address after: 317500 Room 401, building 5, Wenling technology business incubator, Wenqiao Town, Wenling City, Taizhou City, Zhejiang Province

Patentee after: ZHEJIANG SHUANGHONG INTELLIGENT EQUIPMENT Co.,Ltd.

Address before: 310018 room 258, Yifu technology building, modern science and Technology Institute, China Jiliang University, Zhejiang, Hangzhou economic and Technological Development Zone, 1006

Patentee before: HANGZHOU CHANGGENG MEASURING TECHNOLOGY Co.,Ltd.