CN103582301A - Circuit board with embedded elements - Google Patents
Circuit board with embedded elements Download PDFInfo
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- CN103582301A CN103582301A CN201210260883.0A CN201210260883A CN103582301A CN 103582301 A CN103582301 A CN 103582301A CN 201210260883 A CN201210260883 A CN 201210260883A CN 103582301 A CN103582301 A CN 103582301A
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- circuit board
- embedded element
- substrate
- embedded
- line layer
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Abstract
The invention relates to a circuit board with embedded elements. At least one embedded element is arranged in the circuit board. At least one raised structural body is embedded into the circuit board, and at least one conductive through hole is formed in each raised structural body so that the raised structural bodies can be connected with contacts of the circuit board. Thus, the circuit board with the embedded elements solves the problem that because of the embedded elements, the distance between the contacts is large, and consequentially the contacts are difficult to connect. According to the circuit board with the embedded elements, the contact area can be reduced, and the circuit board is favorable for manufacturing high-density and fine circuits.
Description
Technical field
The present invention, about a kind of circuit board with embedded element, refers to a kind of embedded element that is applied to especially, can dwindle contact area, is conducive to the circuit board that high density and fine rule road make.
Background technology
Generally speaking, circuit base plate be mainly by multilayer through the line layer (patterned circuit layer) of patterning and dielectric layer (dielectric layer) alternately coincide form.Wherein, patterned line layer is to be formed through micro-shadow and etch process definition by copper foil layer (copper foil), and dielectric layer is disposed between patterned line layer, in order to isolate patterned line layer.In addition between the patterned line layer changing mutually,, be to see through to run through the plated-through-hole (Plating Through Hole, PTH) of dielectric layer or conduction duct (conductive via) and be electrically connected to each other.Finally, at the various electronic components of surface configuration (active member, passive device) of circuit base plate, and by the circuit design of internal wiring, reach the object of electric signal transmission (electrical signal propagation).
Yet, along with market need have demand compact and easy to carry for electronic product,, in current electronic product, by the electronic component design that was originally welded in circuit board, be therefore an embedded element that can be embedded in the inside of circuit board; Embedded element circuit board technology can improve passive device usefulness, reduce passive device quantity, and reduces the board area that passive device takies.Therefore, utilize the structure dress of embedded element circuit board technology to integrate, can be used for replacing traditional separate type passive device, such as capacitor, resistance and inductance etc., its advantage is for reducing the usage quantity of separate type passive device, and then relative production and the testing cost of reduction product, the solder joint number of minimizing passive device, improves product structure dress density and reliability etc.
In embedded element circuit board technology, in order to increase wiring area, multilayer circuit board has been used more conductive layer and has been buried the hole that passive device is used underground, such as guide hole (via), buried via hole (Buried vias) or blind hole (Blind vias) etc.If Fig. 1 is for practising as shown in the structural representation have multilayer circuit board, when this guide hole 11 is punched the circuit board 13 that is embedded with embedded element 12 conventionally, but because length is longer, makes to fill these guide holes 11 and do not form space or having any problem property of lockhole.Traditionally, can use electroless copper (Electroless copper) so that guide hole by metal as the Seed Layer of copper (seed layer) institute lining, then by electroplating this Seed Layer of coating.Length by guide hole is longer, therefore be more difficult to that plated material is lining in or fill guide hole and there is no sky nest, space or lockhole, this sky nest, space or lockhole have harmful effect for the conductivity of guide hole, and in order to maintain certain aspect ratio (ratio of the height of guide hole or length and width or diameter), its width or diameter are relatively large, therefore expose to the weld pad 14 of circuit board, also relative area is larger, is unfavorable for that high density and fine rule road make.
Capacitor can be divided into electrochemical capacitor and non-electrolytic capacitor substantially according to its function.And electrolytic capacitor can be divided into aluminium matter and the large class of tantalum matter two according to anodal material.Wherein with aluminum electrolytic capacitor for the most common, aluminum electrolytic capacitor, according to its element structure, can be divided into: 1. convoluted, 2. stack-up type.Kenel according to electrolyte is classified, and also has two kinds of liquid electrolytic capacitor and solid electrolytic capacitors.Wherein, the former life-span is decided by the time of electrolyte dry-out, thus if the in the situation that of 105 ℃, can operate the liquid electrolytic capacitor of 1000 hours, 10 ℃ of the every declines of its operating temperature, the life-span can double.And the electrolyte of solid electrolytic capacitor, because it is solid-state, without the dry anxiety of electrolyte, therefore the tool life-span is long.
Wherein, winding-type electrolytic capacitor utilizes winding method moulding, therefore its finished product overall volume is larger, especially thickness aspect cannot reach compact demand; In addition, though stack-up type electrolytic capacitor can consist of multilayer dielectric layer and multiple layer metal layer stack, and volume can microminaturization, increases utilization scope.But its processing procedure is complicated, cost is high, and short circuit ratio is a lot, manufacture process and assembling difficulty.
Summary of the invention
The present invention a kind of embedded element that can be applicable to is provided, can dwindle contact area, is conducive to the circuit board that high density and fine rule road make.
In circuit board of the present invention, be provided with at least one embedded element, in this circuit board, also embed and have at least one padded structure, this padded structure is provided with at least one conductive through hole, the contact that can connect this circuit board, solve to practise, there is distant because of contact that embedded element is caused, cause the difficulty of conducting, and the present invention can dwindle and connect aperture, hole and contact area is conducive to the making on high density and fine rule road.
According to above-mentioned primary structure feature, described circuit board at least includes: first substrate, second substrate, embedded element and padded structure, first, second surface that this first substrate is relative is respectively equipped with first, second patterned line layer, and this first, second patterned line layer is provided with at least one contact; This second substrate is provided with the 3rd, the 4th relative surface, and this first surface is located on the 4th surface, and is covered in this first patterned line layer, and the 3rd surface is also provided with the 3rd patterned line layer, and the 3rd patterned line layer is provided with at least one contact; This embedded element is embedded in this second substrate, and is connected with this contact; And this padded structure is embedded in this second substrate, this padded structure is provided with at least one conductive through hole, can connect the contact of this first patterned line layer and the 3rd patterned line layer.
According to above-mentioned primary structure feature, described padded structure is provided with a base material, the the 5th, the 6th surface that this base material is relative is respectively equipped with conducting circuit, and this conductive through hole is electrically connected the conducting circuit on the 5th, the 6th surface, and the conducting circuit on the 5th, the 6th surface is connected with contact respectively.
Above-mentioned embedded element can be the semiconductor having encapsulated or the naked wafer not encapsulating.
According to above-mentioned primary structure feature, the 3rd surface of described second substrate can further be provided with the 3rd substrate.
According to above-mentioned primary structure feature, described embedded element is connected with the contact of this first patterned line layer.
According to above-mentioned primary structure feature, described second substrate can be provided with opening for accommodating this embedded element.
According to above-mentioned primary structure feature, described embedded element and padded structure can first be arranged on this first surface, then pressing one resin material, are covered in this embedded element and padded structure, and form second substrate.
Accompanying drawing explanation
Fig. 1 is for practising the structural representation that has multilayer circuit board.
Fig. 2 is the first example structure schematic diagram of circuit board in the present invention.
Fig. 3 is the structure enlarged diagram of padded structure in the present invention.
Fig. 4 is the second example structure schematic diagram of circuit board in the present invention.
Fig. 5 is the 3rd example structure schematic diagram of circuit board in the present invention.
Figure number explanation:
Embedded element 12
Weld pad 14
Embedded element 21
Conductive through hole 221
The 5th surface 223
The 6th surface 224
Conducting circuit 225
The first patterned line layer 233
The second patterned line layer 234
The 3rd surface 241
The 4th surface 242
The 3rd patterned line layer 243
The 3rd substrate 25
Contact 30
Embodiment
As shown in circuit board the first example structure schematic diagram as of the present invention in Fig. 2, in circuit board 20 of the present invention, be provided with at least one embedded element 21, in this circuit board 20, also embed and have at least one padded structure 22, this padded structure 22 is provided with at least one conductive through hole 221, the contact 30 that can connect this upper and lower surface of circuit board, has distant because of upper and lower surface contacts to solve to practise, and causes the difficulty of conducting, and the present invention also can dwindle contact area, be conducive to the making on high density and fine rule road.
During whole implementation, this circuit board 20 at least includes: first substrate 23, second substrate 24, embedded element 21 and padded structure 22, first, second surface 231,232 that this first substrate 23 is relative is respectively equipped with first, second patterned line layer 233,234, and this first, second patterned line layer is provided with at least one contact 30; This second substrate 24 is provided with the 3rd, the 4th relative surface 241,242, this first surface 231 is located on the 4th surface 242, and be covered in this first patterned line layer 233, the 3rd surface 241 is also provided with the 3rd patterned line layer 243, the three patterned line layer and is provided with at least one contact 30; This embedded element 21 is embedded in this second substrate 24, and is connected with this contact 30; Wherein, this embedded element 21 can be the semiconductor having encapsulated or the naked wafer not encapsulating, and in embodiment as shown in the figure, this embedded element 21 is connected with the contact of this first patterned line layer 233.
And this padded structure 22 is embedded in this second substrate 24, shown in Fig. 3, this padded structure 22 is provided with a base material 222, the the 5th, the 6th surface 223,224 that this base material 222 is relative is respectively equipped with conducting circuit 225, this conductive through hole 221 is electrically connected the conducting circuit 225, the five on the 5th, the 6th surface, 225 difference of conducting circuit on the 6th surface can connect the contact 30 of this first patterned line layer and the 3rd patterned line layer; Certainly, also can be as shown in the figure, 30 of this conducting circuit 225 and this contacts are provided with conductive through hole 221.
Moreover as shown in the second embodiment of Fig. 4, the 3rd surface 241 of this second substrate can further be provided with the 3rd substrate 25, can increase line configuring; Certainly, the 3rd surface of the second surface of this first substrate or second substrate can further be provided with other electron component, as shown in the 3rd embodiment of Fig. 5, the second surface 232 of this first substrate can be provided with other electron component 40, also or the second surface of this first substrate can further there is the tetrabasal (not shown) of embedded element.
When the present invention makes, can be formed with opening for accommodating this embedded element in this second substrate specific location; Also or, this embedded element and padded structure can first be arranged on this first surface, then pressing one resin material or film (prepreg), are covered in this embedded element and padded structure, and form second substrate.
The present invention has circuit board to have following advantages compared to habit.
1. can solve to practise has distant because of contact that embedded element causes, causes the difficulty of conducting.
2. the present invention can dwindle contact area under fixing aspect ratio, is conducive to the making on high density and fine rule road.
3. this padded structure can form in second substrate process in pressing resin material, can form barricade with protection embedded element.
4. this padded structure can be installed on the first surface of first substrate with identical assembling mode with element simultaneously with welding or other conduction mode.
Claims (10)
1. a circuit board with embedded element, it is characterized in that, in this circuit board, be provided with at least one embedded element, in this circuit board, also embed and have at least one padded structure, this padded structure is provided with at least one conductive through hole, can connect the contact on this upper and lower surface of circuit board.
2. a circuit board with embedded element, is characterized in that, at least includes:
First substrate, first, second surface that this first substrate is relative is respectively equipped with first, second patterned line layer, and this first, second patterned line layer is provided with at least one contact;
Second substrate, this second substrate is provided with the 3rd, the 4th relative surface, and this first surface is located on the 4th surface, and is covered in this first patterned line layer, the 3rd surface is also provided with the 3rd patterned line layer, and the 3rd patterned line layer is provided with at least one contact;
Embedded element, is embedded in this second substrate, and is connected with this contact;
And padded structure, being embedded in this second substrate, this padded structure is provided with at least one conductive through hole, can connect the contact of this first patterned line layer and the 3rd patterned line layer.
3. the circuit board with embedded element as claimed in claim 1 or 2, it is characterized in that, this padded structure is provided with a base material, the the 5th, the 6th surface that this base material is relative is respectively equipped with conducting circuit, this conductive through hole is electrically connected the conducting circuit on the 5th, the 6th surface, and the conducting circuit on the 5th, the 6th surface is connected with contact respectively.
4. the circuit board with embedded element as claimed in claim 3, is characterized in that, between this conducting circuit and this contact, is provided with conductive through hole.
5. the circuit board with embedded element as claimed in claim 1 or 2, is characterized in that, this embedded element can be the semiconductor having encapsulated or the naked wafer not encapsulating.
6. the circuit board with embedded element as claimed in claim 2, is characterized in that, the 3rd surface of this second substrate can further be provided with the 3rd substrate.
7. the circuit board with embedded element as claimed in claim 2, is characterized in that, this embedded element is connected with the contact of this first patterned line layer.
8. the circuit board with embedded element as claimed in claim 2, is characterized in that, this second substrate is provided with opening for accommodating this embedded element.
9. the circuit board with embedded element as claimed in claim 2, is characterized in that, this embedded element and padded structure are first arranged on this first surface, then pressing one resin material, is covered in this embedded element and padded structure, and forms second substrate.
10. the circuit board with embedded element as claimed in claim 2, is characterized in that, this embedded element and padded structure are first arranged on this first surface, then pressing one film, is covered in this embedded element and padded structure, and forms second substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210260883.0A CN103582301A (en) | 2012-07-26 | 2012-07-26 | Circuit board with embedded elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210260883.0A CN103582301A (en) | 2012-07-26 | 2012-07-26 | Circuit board with embedded elements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103582301A true CN103582301A (en) | 2014-02-12 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210260883.0A Pending CN103582301A (en) | 2012-07-26 | 2012-07-26 | Circuit board with embedded elements |
Country Status (1)
| Country | Link |
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| CN (1) | CN103582301A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106255345A (en) * | 2016-08-20 | 2016-12-21 | 成都云士达科技有限公司 | A kind of manufacture method of odt circuit plate structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1697162A (en) * | 2004-05-14 | 2005-11-16 | 相互股份有限公司 | Structure for constructing and installing chip embedded typed semiconductor components |
| US20070096292A1 (en) * | 2005-10-27 | 2007-05-03 | Shinko Electric Industries Co., Ltd. | Electronic-part built-in substrate and manufacturing method therefor |
| CN101331814A (en) * | 2005-12-16 | 2008-12-24 | 揖斐电株式会社 | Multilayer printed wiring plate, and method for fabricating the same |
| CN101937899A (en) * | 2010-05-17 | 2011-01-05 | 日月光半导体制造股份有限公司 | Semiconductor package and packaging technology |
-
2012
- 2012-07-26 CN CN201210260883.0A patent/CN103582301A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1697162A (en) * | 2004-05-14 | 2005-11-16 | 相互股份有限公司 | Structure for constructing and installing chip embedded typed semiconductor components |
| US20070096292A1 (en) * | 2005-10-27 | 2007-05-03 | Shinko Electric Industries Co., Ltd. | Electronic-part built-in substrate and manufacturing method therefor |
| CN101331814A (en) * | 2005-12-16 | 2008-12-24 | 揖斐电株式会社 | Multilayer printed wiring plate, and method for fabricating the same |
| CN101937899A (en) * | 2010-05-17 | 2011-01-05 | 日月光半导体制造股份有限公司 | Semiconductor package and packaging technology |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106255345A (en) * | 2016-08-20 | 2016-12-21 | 成都云士达科技有限公司 | A kind of manufacture method of odt circuit plate structure |
| CN106255345B (en) * | 2016-08-20 | 2020-07-24 | 龙南骏亚精密电路有限公司 | Manufacturing method of double-layer circuit board structure |
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Application publication date: 20140212 |