CN103579485B - A kind of electrothermal module - Google Patents
A kind of electrothermal module Download PDFInfo
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- CN103579485B CN103579485B CN201310560019.7A CN201310560019A CN103579485B CN 103579485 B CN103579485 B CN 103579485B CN 201310560019 A CN201310560019 A CN 201310560019A CN 103579485 B CN103579485 B CN 103579485B
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- flow deflector
- support frame
- electrothermal module
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- type particle
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Abstract
A kind of electrothermal module, this electrothermal module comprises upper substrate, upper flow deflector, P/N type particle, lower flow deflector, infrabasal plate and binding post, this electrothermal module also comprises the sandwich be made up of heat-insulating material, and this sandwich comprises flow deflector support frame, P/N type particulate support framework and lower flow deflector support frame; On this, flow deflector support frame is used for fixing upper flow deflector and is connected with upper substrate; This lower flow deflector support frame is used for fixing lower flow deflector and is connected with infrabasal plate; And this P/N type particle to load in P/N type particulate support framework and to be connected between flow deflector and lower flow deflector.Sandwich in electrothermal module of the present invention plays screening, global transfer, fixed support effect to P/N type particle, play fixed supporting role to flow deflector, reduces heat transfer to the impact of the conversion efficiency of thermoelectric of electrothermal module simultaneously.
Description
Technical field
The present invention relates to a kind of electrothermal module, be specifically related to a kind of sandwich of electrothermal module.
Background technology
Electrothermal module is mainly used in refrigeration and thermo-electric generation two aspects.
In refrigeration application, the refrigeration of electrothermal module, without the need to cold-producing medium, is not almost polluted environment, to freeze the destruction greatly reduced environment compared to employing freon refrigerant.
The refrigeration application of electrothermal module is also usually used in the control of local temperature, because it does not have moving component, self can not produce heat, can realize temperature and accurately control.Electrothermal module does not have moving component, has without wearing and tearing, noiseless, pollution-free, the advantages such as the life-span is long.
The thermo-electric generation of electrothermal module is applied to comprise and is utilized vehicle exhaust, industrial afterheat power generation, greatly can improve energy utilization rate, reduce the pollution to environment.Electrothermal module thermo-electric generation is applied, and for remote districts power, and the power supply of space station provides new approaches.
On market, existing electrothermal module is made up of upper and lower insulated substrate, up and down flow deflector, P/N type particle, binding post etc. substantially.On market existing electrothermal module flow deflector between, leave a large amount of gap between P/N type particle, so during electrothermal module work, heat is delivered to huyashi-chuuka (cold chinese-style noodles) by the air in these gaps from hot side, reduces hot side and the huyashi-chuuka (cold chinese-style noodles) temperature difference, thus reduces conversion efficiency of thermoelectric.In the manufacturing process of electrothermal module, different according to manufacture craft, between P/N type particle and flow deflector, easily produce dislocation between flow deflector and substrate, cause P/N type particle to contact uneven with flow deflector, flow deflector is skewness between substrate; Thus affect conversion efficiency of thermoelectric to a certain extent.
Summary of the invention
The object of this invention is to provide a kind of electrothermal module with sandwich, this sandwich makes the thermal conversion efficiency of electrothermal module improve, P/N particle and flow deflector are fixed support, and P/N type particle and flow deflector, not easily misplace between flow deflector and substrate, and flow deflector is evenly distributed on substrate.
For achieving the above object, the invention provides a kind of electrothermal module with sandwich.Electrothermal module of the present invention comprises upper substrate, upper flow deflector, P/N type particle, lower flow deflector, infrabasal plate and binding post, this electrothermal module also comprises sandwich, and this sandwich comprises flow deflector support frame, P/N type particulate support framework and lower flow deflector support frame; On this, flow deflector support frame is used for fixing upper flow deflector and is connected with upper substrate; This lower flow deflector support frame is used for fixing lower flow deflector and is connected with infrabasal plate; And this P/N type particle to load in P/N type particulate support framework described in this and to be connected between flow deflector and lower flow deflector.
Preferably, on this, flow deflector support frame and described lower flow deflector support frame fill the gap between described upper flow deflector between described lower flow deflector respectively, the air heat transfer in minimizing in flow deflector and lower flow deflector gap.
Preferably, this P/N type particulate support framework fills the gap between P/N type particle, reduces the air heat transfer of leading in P/N type particle gap.
Preferably, flow deflector support frame, lower flow deflector support frame and the frame structure of described P/N type particulate support framework all for being made up of multiple dividing plate on this.
Preferably, on this, the thickness of the dividing plate of flow deflector support frame is equal with the space between upper flow deflector, and on this, the height of flow deflector support frame is equal with upper flow deflector height; And space between the thickness of the dividing plate of this lower flow deflector support frame with lower flow deflector is equal, the height of this lower flow deflector support frame is equal with lower flow deflector height.
Preferably, the block board thickness of this P/N type particulate support framework is equal with the gap of P/N type particle, and the divider height of P/N type particulate support framework is equal with P/N type particle height.
Preferably, one end of this lower flow deflector support frame is provided with the connecting hole for connecting binding post.
Preferably, this P/N type particulate support framework and flow deflector support frame and this lower flow deflector support frame accurate fit on this, to reduce the dislocation rate of P/N type particle and upper flow deflector and lower flow deflector.
Preferably, this sandwich by conductive coefficient lower than 0.01W/(mK) material make.
Preferably, this sandwich is made up of vacuum heat-insulating plate, and vacuum heat-insulating plate is the integrated board be made up of rock wool or other suitable insulated heat material, such as ultra-fine fibre glass.
Set up sandwich in electrothermal module of the present invention, this sandwich plays screening, overall transhipment, fixed support effect to P/N type particle, play fixed supporting role to flow deflector, reduces heat transfer to the impact of the conversion efficiency of thermoelectric of electrothermal module simultaneously.
Accompanying drawing explanation
Fig. 1 is the structural representation without the electrothermal module of sandwich in prior art;
Fig. 2 is the structural representation of the flow deflector support frame of the sandwich of electrothermal module of the present invention;
Fig. 3 is the structural representation of the P/N type particulate support framework of the sandwich of electrothermal module of the present invention;
Fig. 4 is the decomposition texture schematic diagram of the electrothermal module with sandwich of the present invention; And
Fig. 5 is the structural perspective after the electrothermal module assembling of Fig. 4.
Embodiment
Below with reference to accompanying drawing, preferred embodiment of the present invention is described in detail, so that clearer understanding objects, features and advantages of the present invention.It should be understood that embodiment shown in the drawings is not limitation of the scope of the invention, and the connotation just in order to technical solution of the present invention is described.
Figure 1 shows that the structural representation of the electrothermal module without sandwich of prior art.As shown in Figure 1, this electrothermal module comprises upper substrate 1, upper flow deflector 3, P/N type particle 5, lower flow deflector 7, infrabasal plate 8 and binding post 9.On the one hand, without the electrothermal module of sandwich P/N type particle 5 between and there is a large amount of gap between upper flow deflector 3 and between lower flow deflector 7, air in these gaps is as medium, heat is delivered to huyashi-chuuka (cold chinese-style noodles) from the hot side of electrothermal module, reduce the temperature difference on the cold two sides of electrothermal module heat, thus reduce conversion efficiency of thermoelectric.On the other hand, in general, the thickness of single electrothermal module is about 20-50mm, P/N type particle in electrothermal module and upper and lower flow deflector volume is little, quantity large (about more than 200), without interlayer mechanism electrothermal module installation manufacturing process in P/N type particle and flow deflector fixing owing to lacking, between P/N type particle and flow deflector, between flow deflector and substrate, easily produce dislocation, thus cause P/N type particle contact with flow deflector insufficient, distribute on substrate also uneven.
In order to reduce the impact of heat transfer on conversion efficiency of thermoelectric, and make electrothermal module have the structure of fixed support at manufacturing process P/N type particle and flow deflector, the present invention devises P/N type particulate support framework and flow deflector support frame, fill the gap between P/N type particle and between flow deflector, framework employing is that the vacuum heat-insulating plate of main material is made with rock wool.
Fig. 2 is the structural representation of the lower flow deflector support frame 6 of the sandwich of the electrothermal module of one embodiment of the invention.Flow deflector support frame comprises a kind of possible embodiment that the flow deflector support frame structure shown in flow deflector support frame 2 and lower flow deflector support frame 6, Fig. 2 is only lower flow deflector support frame 6.The concrete structure of flow deflector support frame can construct according to the concrete shape of flow deflector and layout.In embodiment shown in Fig. 2, lower flow deflector support frame 6 is the frame structure be made up of multiple dividing plate 61, is provided with sees Fig. 4 for connecting binding post 9(in one end of flow deflector support frame 6) connecting hole 62.Dividing plate 61 thickness of lower flow deflector support frame 6 is equal with the gap between lower flow deflector, lower flow deflector support frame height is equal with lower flow deflector height, thus fixed support effect is played to lower flow deflector, make lower flow deflector evenly be distributed on substrate (substrate 8 in such as Fig. 4) regularly, reduce the dislocation probability between flow deflector and P/N type particle.
Upper flow deflector support frame 2 and lower flow deflector support frame 6 are made by vacuum heat-insulating plate, and the material of vacuum heat-insulating plate is preferably rock wool, but also can adopt other suitable insulated heat materials, such as glass fibre etc.The conductive coefficient of the vacuum heat-insulating plate that rock wool is made is about 0.006W/(mK), the conductive coefficient 0.023W/(mK far below air), effectively can reduce the impact of heat transfer on conversion efficiency of thermoelectric.
Fig. 3 is the schematic diagram of the P/N type particulate support framework 4 of sandwich of the present invention.P/N type particulate support framework 4 concrete structure can construct according to the layout of P/N type particle.In embodiment shown in Fig. 3 and Fig. 4, P/N type particulate support framework 4 has cuboid body 41, is separated out multiple space for holding P/N type particle in body 41 by dividing plate 42.The thickness of dividing plate 42 is equal with the gap of P/N type particle, P/N type particulate support frame height and P/N type particle contour, thus fixed support effect is played to P/N type particle, prevent from, at electrothermal module, P/N type particle in manufacturing process is installed to misplace with flow deflector and cause P/N type particle to contact with flow deflector insufficient, and in electrothermal module skewness.
P/N type particulate support framework 4 is made up of vacuum heat-insulating plate equally, and the material of this vacuum heat-insulating plate is preferably identical with the material of above-mentioned flow deflector support frame 6.Namely the material of this vacuum heat-insulating plate is preferably rock wool, but other also can be adopted to insulate suitable heat-barrier material lower than air thermal conductivity coefficient, etc.Because the conductive coefficient of vacuum heat-insulating plate is far below the conductive coefficient of air, heat transfer is delivered to huyashi-chuuka (cold chinese-style noodles) heat from hot side can be reduced by, ensure hot side and the huyashi-chuuka (cold chinese-style noodles) temperature difference, thus improve conversion efficiency of thermoelectric.
Fig. 4 is the decomposition texture schematic diagram of the electrothermal module with sandwich of the present invention.Fig. 5 is the structural perspective after the electrothermal module of Fig. 4 has been assembled.As shown in Figures 4 and 5, the electrothermal module 100 with sandwich comprises upper substrate 1, upper flow deflector support frame 2, upper flow deflector 3, P/N type particulate support framework 4, P/N type particle 5, lower flow deflector support frame 6, lower flow deflector 7, infrabasal plate 8 and binding post 9.After assembling, flow deflector is fixed on substrate, and the gap between flow deflector is filled by flow deflector support frame, and P/N type particle 5 is placed in P/N type particulate support framework and between upper flow deflector 3 and lower flow deflector 7.
Particularly, in electrothermal module processing (assembling) process, together with first to flow deflector and substrate integral solder; In welding process, adopt flow deflector support frame to be fixed by flow deflector, make flow deflector to be evenly fixed on substrate accurately.In process on P/N seeds implanted to flow deflector, first P/N type particle is placed in P/N type particulate support framework, can be greatly increased work efficiency by the transhipment of P/N type particulate support framework.Because P/N type particle is less, the quantity of the P/N type particle in single electrothermal module is a lot, and P/N type particulate support framework can be good at filtering out P/N type particle, can greatly increase work efficiency.After P/N type particle is covered with the flow deflector on substrate, in integral solder process, P/N type particulate support framework and flow deflector support frame accurate fit, make the dislocation rate of P/N type particle and flow deflector greatly reduce.
Compared to the electrothermal module without sandwich in prior art, the electrothermal module with sandwich of the present invention is due to the elimination in gap between the reduction of dislocation rate and flow deflector and between P/N type particle, and conversion efficiency of thermoelectric can improve 5% to 12%.
For example, the power output obtained by the composite assembly of multiple electrothermal module is the combination electrothermal module of 100W, due to the raising of conversion efficiency of thermoelectric, improves and calculates, within 1 year, can increase energy output 43.8 degree by minimum 5%.
Below described preferred embodiment of the present invention in detail, but it will be appreciated that, after having read above-mentioned instruction content of the present invention, those skilled in the art can make various changes or modifications the present invention.These equivalent form of values fall within the application's appended claims limited range equally.
Claims (9)
1. an electrothermal module, described electrothermal module comprises upper substrate, upper flow deflector, P/N type particle, lower flow deflector, infrabasal plate and binding post, it is characterized in that: described electrothermal module also comprises sandwich, described sandwich comprises flow deflector support frame, P/N type particulate support framework and lower flow deflector support frame; Wherein,
Described upper flow deflector support frame is used for fixing described upper flow deflector and is connected with described upper substrate;
Described lower flow deflector support frame is used for fixing described lower flow deflector and is connected with described infrabasal plate;
Described P/N type particle to load in described P/N type particulate support framework and is connected between described upper flow deflector and described lower flow deflector; And
Described upper flow deflector support frame and described lower flow deflector support frame fill the gap between described upper flow deflector and between described lower flow deflector respectively, reduce the air heat transfer in described upper flow deflector and described lower flow deflector gap.
2. electrothermal module according to claim 1, is characterized in that, described P/N type particulate support framework fills the gap between described P/N type particle, reduces the air heat transfer in described P/N type particle gap.
3. electrothermal module according to claim 1, is characterized in that, described upper flow deflector support frame, described lower flow deflector support frame and the frame structure of described P/N type particulate support framework all for being made up of multiple dividing plate.
4. electrothermal module according to claim 3, is characterized in that, the thickness of the dividing plate of described upper flow deflector support frame is equal with the space between described upper flow deflector, and the height of described upper flow deflector support frame is equal with described upper flow deflector height; And the thickness of the dividing plate of described lower flow deflector support frame is equal with the space between described lower flow deflector, the height of described lower flow deflector support frame is equal with described lower flow deflector height.
5. electrothermal module according to claim 3, is characterized in that, the block board thickness of described P/N type particulate support framework is equal with the gap of described P/N type particle, and the divider height of described P/N type particulate support framework is equal with described P/N type particle height.
6. electrothermal module according to claim 3, is characterized in that, one end of described lower flow deflector support frame is provided with the connecting hole for connecting described binding post.
7. electrothermal module according to claim 1, it is characterized in that, described P/N type particulate support framework and described upper flow deflector support frame and described lower flow deflector support frame accurate fit, to reduce the dislocation rate of described P/N type particle and described upper flow deflector and described lower flow deflector.
8. electrothermal module according to claim 1, is characterized in that, the conductive coefficient of described sandwich is lower than 0.01W/ (mK).
9. electrothermal module according to claim 8, is characterized in that, described sandwich is made up of vacuum heat-insulating plate, and described vacuum heat-insulating plate is the integrated board be made up of rock wool or ultra-fine fibre glass.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310560019.7A CN103579485B (en) | 2013-11-12 | 2013-11-12 | A kind of electrothermal module |
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| CN201310560019.7A CN103579485B (en) | 2013-11-12 | 2013-11-12 | A kind of electrothermal module |
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| CN103579485A CN103579485A (en) | 2014-02-12 |
| CN103579485B true CN103579485B (en) | 2016-04-13 |
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| CN110416399A (en) * | 2019-08-16 | 2019-11-05 | 韦良东 | A kind of semiconductor refrigerating heating chip structure |
| CN114643399B (en) * | 2020-12-21 | 2023-12-01 | 新奥科技发展有限公司 | Welding die for preparing skutterudite thermoelectric module and preparation method of module |
| CN114701351B (en) * | 2022-04-02 | 2024-06-21 | 重庆金康赛力斯新能源汽车设计院有限公司 | Radiator water tank capable of generating electricity and automobile |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1013265A (en) * | 1961-11-08 | 1965-12-15 | Westinghouse Electric Corp | Thermoelectric device assembly |
| US5064476A (en) * | 1990-09-17 | 1991-11-12 | Recine Sr Leonard J | Thermoelectric cooler and fabrication method |
| CN102308400A (en) * | 2008-12-19 | 2012-01-04 | Hi-Z技术股份有限公司 | High temperature, high efficiency thermoelectric module |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11257789A (en) * | 1998-03-10 | 1999-09-24 | Hitachi Ltd | Thermoelectric cooler and structure using it |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1013265A (en) * | 1961-11-08 | 1965-12-15 | Westinghouse Electric Corp | Thermoelectric device assembly |
| US5064476A (en) * | 1990-09-17 | 1991-11-12 | Recine Sr Leonard J | Thermoelectric cooler and fabrication method |
| CN102308400A (en) * | 2008-12-19 | 2012-01-04 | Hi-Z技术股份有限公司 | High temperature, high efficiency thermoelectric module |
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