GB1013265A - Thermoelectric device assembly - Google Patents
Thermoelectric device assemblyInfo
- Publication number
- GB1013265A GB1013265A GB34223/62A GB3422362A GB1013265A GB 1013265 A GB1013265 A GB 1013265A GB 34223/62 A GB34223/62 A GB 34223/62A GB 3422362 A GB3422362 A GB 3422362A GB 1013265 A GB1013265 A GB 1013265A
- Authority
- GB
- United Kingdom
- Prior art keywords
- assembly
- pellets
- compartments
- insulating
- thermo
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
Abstract
1,013,265. Thermo-electric assembly. WESTINGHOUSE ELECTRIC CORPORATION. Sept. 6, 1962 [Nov. 8, 1961], No. 34223/62. Heading H1K. A thermo-electric assembly is formed from an insulating frame member having several spaced open-ended compartments, each containing a single thermoelectric pellet and conductive connections provided by plasma jetspraying, bonded to the ends of each pellet. In the embodiment shown in the Figure, semiconductor pellets 8 of alternate P and N-type material of e.g. bismuth tellurium selenide, lead telluride, bismuth antimony telluride or zinc antimonido, are placed in open-ended compartments 6 in a frame 4 of insulating material such as mica, ceramics, glass, fibre or silicon resin. The separating walls of the compartments between each pair of thermoelectrically opposite pellets are cut back or of reduced height adjacent the opposite surfaces 9 of the pellets. Conductive material 10 is then applied by plasma jet-spraying to provide thermal and electrical connection between adjacent pellets. External leads 12 for the assembly are soldered or brazed to two separate conductive layers 10. The ends of the insulating member not coated with conductive material may be provided with fins for cooling or liquid may be circulated around these ends of the assembly. The assembly may be of polygonal or circular section.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15097661A | 1961-11-08 | 1961-11-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1013265A true GB1013265A (en) | 1965-12-15 |
Family
ID=22536803
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB34223/62A Expired GB1013265A (en) | 1961-11-08 | 1962-09-06 | Thermoelectric device assembly |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE1896154U (en) |
GB (1) | GB1013265A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2377174A1 (en) * | 2008-12-19 | 2011-10-19 | Hi-Z Technology, Inc. | High temperature, high efficiency thermoelectric module |
CN103579485A (en) * | 2013-11-12 | 2014-02-12 | 中国科学院宁波材料技术与工程研究所 | Thermoelectricity module |
CN105762267A (en) * | 2014-12-19 | 2016-07-13 | 中国电子科技集团公司第十八研究所 | Integrated thermoelectric module |
US11056633B2 (en) | 2016-01-21 | 2021-07-06 | Evonik Operations Gmbh | Rational method for the powder metallurgical production of thermoelectric components |
-
1962
- 1962-09-06 GB GB34223/62A patent/GB1013265A/en not_active Expired
- 1962-11-06 DE DEW29318U patent/DE1896154U/en not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2377174A1 (en) * | 2008-12-19 | 2011-10-19 | Hi-Z Technology, Inc. | High temperature, high efficiency thermoelectric module |
EP2377174A4 (en) * | 2008-12-19 | 2014-01-15 | Hi Z Technology Inc | High temperature, high efficiency thermoelectric module |
CN103579485A (en) * | 2013-11-12 | 2014-02-12 | 中国科学院宁波材料技术与工程研究所 | Thermoelectricity module |
CN103579485B (en) * | 2013-11-12 | 2016-04-13 | 中国科学院宁波材料技术与工程研究所 | A kind of electrothermal module |
CN105762267A (en) * | 2014-12-19 | 2016-07-13 | 中国电子科技集团公司第十八研究所 | Integrated thermoelectric module |
US11056633B2 (en) | 2016-01-21 | 2021-07-06 | Evonik Operations Gmbh | Rational method for the powder metallurgical production of thermoelectric components |
Also Published As
Publication number | Publication date |
---|---|
DE1896154U (en) | 1964-07-09 |
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