CN103562156B - Pcbn结构体、工具元件及其制作方法 - Google Patents

Pcbn结构体、工具元件及其制作方法 Download PDF

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CN103562156B
CN103562156B CN201280025517.5A CN201280025517A CN103562156B CN 103562156 B CN103562156 B CN 103562156B CN 201280025517 A CN201280025517 A CN 201280025517A CN 103562156 B CN103562156 B CN 103562156B
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superhard construction
degrees celsius
pcbn
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D·J·卡罗兰
A·伊万克维奇
N·墨非
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Abstract

一种用于处理超硬结构体的方法,所述方法包括:将超硬结构体加热到至少500摄氏度的处理温度,将超硬结构体以至少1摄氏度每秒的平均冷却速度和最多100摄氏度每秒的速度从处理温度冷却到小于约200摄氏度的温度,以提供处理过的超硬结构体。由该方法制造的PCBN结构体可以具有至少650Mpa的弯曲强度。

Description

PCBN结构体、工具元件及其制作方法
技术领域
本公开总体涉及超硬结构体、包括超硬结构体的工具元件及其制造方法。
背景技术
多晶金刚石(PCD)材料和多晶立方氮化硼(PCBN)材料是超硬材料的示例。PCBN材料包括嵌在基体中的立方氮化硼(cBN)材料的晶粒,所述基体可以包括金属和或陶瓷材料。PCD材料包括金刚石晶粒,其大多数彼此直接结合。超硬构造可以包括PCD或PCBN结构体,所述PCD或PCBN结构体与各嵌入的烧结碳化物基材一体地形成。一些超硬构造在被处理以形成用于工具的元件时可能易于被二维扭曲。
美国专利号6517902公开了一种热处理形式,其用于预形成具有结合至具有钴粘合剂的烧结碳化钨的基材的多晶金刚石的表面台的元件。该基材包括具有至少30体积%的密排六方晶体结构的钴粘合剂的界面区。
发明内容
从第一方面看,提供了一种用于处理超硬结构体的方法,所述超硬结构体例如是包括PCBN材料或由PCBN材料组成的超硬结构体,所述方法包括:将超硬结构体加热到至少约500摄氏度的处理温度,将超硬结构体以至多约100摄氏度每秒的平均冷却(淬火)速度从处理温度冷却(淬火)到小于约200摄氏度或环境温度。冷却温度可以是至少约1摄氏度每秒或至少约5摄氏度每秒。
本公开还设想了处理超硬结构体的方法的不同组合和变体,以下是其非限制性的和非穷尽性的示例。
在一些实施例中,超硬结构体可以包括PCBN材料或PCD材料(例如,热稳定PCD材料),或包括分散在包含SiC材料的基体中的多个金刚石晶粒的材料。在一些实施例中,所述超硬结构体可以包含至少40体积%和最多80体积%的cBN晶粒;所述超硬结构体可以包含平均尺寸为至多25微米的cBN晶粒;所述超硬结构体可以包含分散在基体中的cBN晶粒,该基体含有选自碳化钛、氮化钛、碳氮化钛、铝的硼化物和铝的氮化物中的至少一种材料;所述超硬结构体可以包括基体,所述基体包含组合平均杨氏模量为最多约350GPa的材料或材料的组合;和或所述超硬结构体可以包括基体,所述基体包括组合平均膨胀系数是至少4.5×10-6/K的材料或材料组合。
在一些形式中,超硬结构体可以包含PCBN结构体,所述PCBN结构体可以包含至少30体积%和最多80体积%的cBN晶粒。所述cBN晶粒可以具有最多约25微米、最多约10微米、最多约5微米或最多约2微米的平均尺寸。PCBN可以包含分散在基体中的cBN晶粒,该基体含有碳化钛、氮化钛、碳氮化钛、铝或钛的硼化物和或铝的氮化物或任意这些材料的任意组合。一个示例性PCBN结构体可以包括cBN晶粒或基本上由cBN晶粒组成,所述cBN晶粒分散在基体中,所述基体包含包括Ti的材料和包括Al的材料,cBN晶粒的含量是PCBN结构的至少约45体积%,且最多约75体积%。在实例的一个变体中,除了不可避免的少量的其它物质和杂质,基体可以由包括Ti的材料和包括Al的材料组成(即基本上由包括Ti的材料和包括Al的材料组成)。
在一些实施例中,超硬结构体可以包含PCBN结构体,所述PCBN结构体可以包含(组合平均)杨氏模量为最多约350Gpa或最多约300Gpa的材料或材料的组合。基体可包括(组合平均)热膨胀系数是至少约4.5×10-6/K或至少约8×10-6/K的材料或材料组合。
在一些实施例的变体中,处理温度可以是至少约600摄氏度或至少约700摄氏度。处理温度可以是最多约1100摄氏度。
一种示例性方法可以包括将超硬结构体以最多约50摄氏度每秒、20摄氏度每秒或最多10摄氏度每秒的平均淬火速度冷却至最多约200摄氏度或最多约100摄氏度的温度。在淬火前,可以将PCBN结构体加热至该温度持续至少约1分钟、至少约5分钟或至少约10分钟的时间段,使得PCBN结构体可以在其整个体积中具有基本相同的温度。
在一些实施例中,可以通过使所述超硬结构体在20摄氏度下与具有最多约0.4W/(m.K)的热传导率的流体接触来冷却所述超硬结构体。可以通过使所述超硬结构体与油接触来冷却所述超硬结构体。
在一种示例性方法中,超硬结构体可以包含PCBN结构体或基本由PCBN结构体组成,且可以通过使其与热导率显著小于水的热导率(例如,在20摄氏度显著小于约0.6W/(m.K))的流体接触来冷却所述超硬结构体。在一个特别的实施例中,流体的热导率在20摄氏度是最多约0.4W/(m.K)或最多约0.2W/(m.K),在某些变体中,可以通过使PCBN结构体与设计用于以控制速度进行淬火的油或聚合物溶液接触来冷却PCBN结构体。特别的变体可以包括将PCBN结构体浸没在流体中,将流体喷洒在PCBN结构体上或浇在PCBN结构体上。流体可以以受控(恒定或变化)的速度在PCBN结构上方流动,或者流体可以相对于PCBN结构体式为基本静态的。
在某些实施例中,所述方法可包括将处理过的超硬结构体加热至至少500摄氏度的温度持续至少约5分钟的时间段。
在某些实施例中,所述方法可以包括将冷却的超硬结构体再加热至至少约500摄氏度、至少约600摄氏度或至少约700摄氏度的再加热温度,或再加热至其开始冷却的温度。在一些变体中,超硬结构体可以在再加热温度保持至少约5分钟、至少约10分钟、至少约30分钟或至少约1小时。
在某些实施例中,该方法可以包括加工处理过的超硬结构体,以形成用于工具的元件。在一个实施例中,该方法可以包括加工处理过的超硬结构体以形成用于工具的元件,所述用于工具的元件可以被进一步加工以形成用于机床或其它切割或钻孔工具的插入件。例如,处理过的超硬构造可以通过激光、通过电火花加工(EDM)或其它装置切割以形成用于工具的元件,所述用于工具的元件可以通过例如研磨进一步加工。热处理后切割处理过的超硬构造很可能会导致具有改进尺寸公差(与热加工前切割超硬构造相比)的用于工具的元件。
从第二方面看,提供了一种具有至少约650Mpa、至少约700MPa或至少约800MPa的弯曲强度的PCBN结构体。
本公开还设想了超硬结构体的不同组合和变型,其中以下是非限制性的和非穷尽性的示例。
PCBN结构体可以包含至少约40体积%和最多80体积%的cBN晶粒;PCBN结构体可以包含具有平均尺寸为至多约25微米的cBN晶粒,和或PCBN结构体可以包含分散在基体中的cBN晶粒,所述基体包含选自碳化钛、氮化钛、碳氮化钛、铝的硼化物和铝的氮化物的至少一种材料。
根据第一方面的方法及其变体可能制造根据第二方面的增强的超硬结构体制造。
附图说明
下面参照附图说明非限制性实施例,其中:
图1示出了示例性PCBN构造的透视图;
图2示出了示例性PCBN结构体的透视图;
图3示出了示例性PCBN构造的平面图,示例性的PCBN元件从其切出;
图4示出了示例性工具插入件的透视图,包含PCBN元件;
图5示出了作为淬火温度差的函数的PCBN结构体的测量弯曲强度的图;
图6示出了作为淬火温度差的函数的PCBN结构体的测量弯曲强度的图。
具体实施方式
PCBN结构体可以基本由PCBN结构体组成,且可以接合至基材诸如烧结碳化物基材,或者PCBN结构体可以是基本独立的而不接合至基材。参照图1,示例性PCBN构造10包括PCBN结构体12,所述PCBN结构体12接合到烧结碳化物基材14。参照图2,示例性PCBN结构体12可以具有大体盘状形状且是独立的(而非接合到基材上)。
提供PCBN构造的示例性方法可见于美国专利第7867438号。
参照图3,可以切割处理过的PCBN结构体10,和或以其它方式加工以制造用于工具插入件的PCBN元件30。图4示出了工具插入件40,其包含PCBN元件30,所述PCBN元件30接合到承载体42上。
以下更详细地说明非限制性实施例。
提供了PCBN材料的两个不同等级的两套矩形样品46,制备长度为28.5mm、宽度为6.25mm、厚4.76mm的各样品。第一组由第一等级(或类型)的PCBN材料的PCBN样品组成,所述PCBN材料包含约50体积%的cBN晶粒,所述cBN晶粒的平均尺寸为约0.7微米至约1微米,其分散在基本上由碳氮化钛材料和铝的硼化物组成的基体中。第二组由第二等级的PCBN材料的PCBN样品组成,所述PCBN材料包含约84体积%的cBN晶粒,所述cBN晶粒的平均尺寸为约22微米,其分散在基本包含铝的氮化物材料和铝的硼化物的基体中。第一和第二组的PCBN样品仅由独立的PCBN结构体组成(即,其不接合到基材)。各样品PCBN材料的基体材料的性质总结在下面的表1中。
表1
对各组的15个样品在没有被处理过的情况下进行弯曲强度测试。弯曲强度是使用三点弯曲来测量并按照确定单个陶瓷的弯曲强度的英国标准(标准编号BSEN843:1)来计算。发现第一组的未经处理的样品的平均弯曲强度为大约430Mpa,发现第二组的未经处理的样品的平均弯曲强度是约630MPa。
将每组的其余样品进行各种热处理和随后的淬火(冷却)处理,包括通过水的淬火和通过轻油的淬火。在范围从240摄氏度到1100摄氏度的范围中的不同温度对不同的样品进行淬火(各样品已经在炉中在该温度下加热了约10分钟的一段时间)。通过从炉中移除样品并将其在20摄氏度的温度下浸入包含水或轻级油的大储存器中来进行淬火。因而,所使用的温度差的范围是从220摄氏度(即温度从240降低至20摄氏度)到1080摄氏度(即从1100降低至20摄氏度)。
使用水的淬火速度估计为约1000摄氏度每秒,使用轻油的淬火速度估计为约10摄氏度每秒。然后对处理过的样品测试弯曲强度,以测量其弯曲强度。
在第一组样品的情况下,与第一组未处理的样品相比,包括将其加热1080摄氏度持续两个小时然后使用水进行淬火的所有处理导致弯曲强度减小约20%,而使用油进行淬火导致弯曲强度没有变化。
接下来,通过将使用水进行淬火的某些样品加热回到淬火开始的温度并将其在该温度下保持约一个小时来对其进行退火,然后再测量其弯曲强度。通过水淬火然后从淬火温度进行退火的第一组的样品的弯曲强度是淬火温度差的函数,其示出在图5中。
在第二组样品的情况下,包括将其加热到1080摄氏度两个小时然后使用水进行淬火的处理也导致弯曲强度减小,但是使用油进行淬火导致平均弯曲强度明显上升,从约630MPa增加到约830MPa。在水中淬火之后的第二组样品和在油中淬火的(不同)第二组样品在图6中示出为淬火温度差的函数。
使用水对第二组样品进行快速淬火(其中淬火温度差在240摄氏度和375摄氏度之间)导致弯曲强度大幅度和不连续地下降。当淬火温度差小于240摄氏度时,不明显具有显著的弯曲强度变化。当使用水进行淬火的温度差是780摄氏度时,所获得的弯曲强度为约25GPa,这是非常低的。据观察,这些最后提到的样品的失效对应于非常低的能量,断裂从样品的中央区域开始。失效的材料也表现出从起始点延伸到样品边缘的长的未开口裂纹。还观察到表面颜色由深灰色到浅蓝色的显著变化,微观调查发现,接近样品表面处具有明显的微观空隙。
本文所用的某些术语的简要说明如下。
如本文所用,“超硬”或超级硬材料的维氏硬度为至少约25GPa。合成的和天然的金刚石,多晶金刚石(PCD),立方氮化硼(cBN)和多晶cBN(PCBN)材料是超硬材料的示例。合成金刚石(也称为人造金刚石)是已经能生产的金刚石材料。超硬材料的其它示例包括某些复合材料,所述复合材料包括由包括陶瓷材料的基体或者由烧结碳化物材料保持在一起的金刚石或cBN晶粒,所述陶瓷材料例如是碳化硅(SiC),所述烧结碳化物材料例如是钴结WC材料(例如,如在美国专利号5453105或6919040所说明的)。例如,某些碳化硅结合的金刚石材料可以包括至少约30体积%的金刚石晶粒,所述金刚石晶粒分散在SiC基体(其可能含有少量的碳化硅之外的形式的Si)中。碳化硅结合的金刚石材料的示例描述在美国专利号7008672、6709747、6179886、6447852、和国际申请的公开号WO2009/013713中。
PCBN材料包括立方氮化硼(cBN)晶粒,所述晶粒分散在包括金属或陶瓷材料的基体中。例如,PCBN材料可包括至少约35体积%或至少约50体积%的分散在基体材料中的cBN晶粒,所述基体材料包含含Ti的化合物(例如碳化钛、氮化钛、碳氮化钛)和/或含Al的化合物(如氮化铝)和/或含有金属Co和/或W的化合物。PCBN材料的某些变体(或“等级”)可包含至少约80体积%或甚至至少约90体积%cBN晶粒。
多晶金刚石(PCD)材料包含大量金刚石晶粒(即多个金刚石晶粒的聚集物),其主要部分是直接彼此键合,并且其中,金刚石的含量是材料的至少约80体积%。金刚石晶粒间的间隙可以是至少部分地填充有粘合剂材料,所述粘合剂材料包含用于合成金刚石的催化剂材料,或者所述间隙可以基本上是空的。用于合成金刚石的催化剂材料能够促进合成金刚石晶粒的生长,和/或在合成或天然金刚石的热力学稳定温度和压力下促进合成或天然金刚石晶粒的直接交互生长。用于金刚石的催化剂材料的实例是Fe、Ni、Co、Mn和包括其的某些合金。包含PCD材料的超硬结构体可包括至少一个区域,从该区域催化剂材料已被从间隙中移除,在金刚石晶粒间留下间隙空间。PCD材料可通过包括提供具有适于该等级的尺寸分布的金刚石晶粒的聚集物块体(mass)的工艺制造,任选将催化剂材料或添加剂材料引入该聚集物块体中,并在用于金刚石的催化剂材料的源的存在下使该聚集物块体经受金刚石比石墨更具热力学稳定性且催化剂材料熔融的温度。在这些条件下,熔融的催化剂材料可以从源渗透到聚集物块体中,且可能会在烧结工艺中促进金刚石晶粒之间的直接交互生长,以形成PCD结构体。聚集物块体可能包括松散的金刚石晶粒或由粘合剂材料保持在一起的金刚石晶粒。不同的PCD等级可能有不同的显微组织和不同的机械性能,如弹性(或杨氏)模量E、弹性模量、横向断裂强度(TRS)、韧性(如所谓K1C韧性)、硬度、密度和热膨胀系数(CTE)。不同的PCD等级在使用中的性能也不同。例如,不同的PCD等级的磨损率和耐断裂性可能不同。
热稳定的PCD材料中的至少一部分或体积在暴露于高于约400摄氏度或甚至高于约700摄氏度的温度后并不显现出明显的结构劣化或硬度或耐磨损性的恶化。例如,含有小于约2重量%的催化活性形式(如单质形式)的用于金刚石的催化剂金属(如Co、Fe、Ni、Mn)的PCD材料可以是热稳定的。基本不具有催化活性形式的催化剂材料的PCD材料是热稳定PCD材料的实例。PCD材料(其中间隙基本上是空或至少部分地填充有陶瓷材料诸如SiC或盐的材料诸如碳酸盐化合物)可以例如是热稳定的。所描述的热稳定PCD可以是具有至少一个显著区域的PCD结构,用于金刚石的催化剂材料已经出其中耗尽或催化剂材料呈较少催化活性的形式。
如上所述,可以通过在适合的粘合剂材料或催化剂材料的存在下将多个金刚石或cBN晶粒烧结到基材(如烧结碳化物基体)上来提供PCD材料和PCBN材料。如此提供的PCD或PCBN结构体可能被形成为接合到基材,成为包括在各结构形成为烧结体的工艺期间结合到基材的PCD或PCBN结构体的构造的一体部分。

Claims (9)

1.一种用于处理包含PCBN材料的超硬结构体的方法,所述方法包括:将超硬结构体加热到至少500摄氏度的处理温度,并将超硬结构体以1至100摄氏度每秒的平均冷却速度从处理温度冷却到小于200摄氏度的温度,以提供处理过的超硬结构体;和切割所述处理过的超硬结构体以形成用于工具的元件。
2.如权利要求1所述的方法,其中,通过使所述超硬结构体在20摄氏度下与具有最多0.4瓦特每米每开尔文(W/m.K)的热传导率的流体接触来冷却所述超硬结构体。
3.如权利要求1所述的方法,其中,通过使所述超硬结构体与油接触来冷却所述超硬结构体。
4.如权利要求1所述的方法,其中,所述超硬结构体包含至少40体积%和最多80体积%的cBN晶粒。
5.如权利要求1所述的方法,其中,所述超硬结构体包含具有平均尺寸为最多25微米的cBN晶粒。
6.如权利要求1所述的方法,其中,所述超硬结构体包含分散在基体中的cBN晶粒,所述基体含有选自碳化钛、氮化钛、碳氮化钛、铝的硼化物和铝的氮化物中的至少一种材料。
7.如权利要求1所述的方法,其中所述超硬结构体包括基体,所述基体包括组合平均杨氏模量为最多350吉帕斯卡(GPa)的材料或材料的组合。
8.如权利要求1所述的方法,其中,所述超硬结构体包括多个超硬晶粒和基体,所述基体包括组合平均热膨胀系数是至少4.5×10-6每开尔文(/K)的材料或材料组合。
9.如权利要求1所述的方法,包括将所述处理过的超硬结构体加热至至少500摄氏度的温度持续至少5分钟的时间段。
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GB2491255B (en) 2013-10-30
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