CN103560073A - 一种pcb板芯片提取工艺 - Google Patents

一种pcb板芯片提取工艺 Download PDF

Info

Publication number
CN103560073A
CN103560073A CN201310524829.7A CN201310524829A CN103560073A CN 103560073 A CN103560073 A CN 103560073A CN 201310524829 A CN201310524829 A CN 201310524829A CN 103560073 A CN103560073 A CN 103560073A
Authority
CN
China
Prior art keywords
pcb board
chip
adhesive tape
pcb
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310524829.7A
Other languages
English (en)
Inventor
乔金彪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Si Erte Microtronics AS
Original Assignee
Suzhou Si Erte Microtronics AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Si Erte Microtronics AS filed Critical Suzhou Si Erte Microtronics AS
Priority to CN201310524829.7A priority Critical patent/CN103560073A/zh
Publication of CN103560073A publication Critical patent/CN103560073A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)

Abstract

本发明公开了一种PCB板芯片提取工艺，第一步，将PCB板放置在UV胶带贴膜装置中，对PCB板进行UV胶带的贴膜动作；第二步，将贴有UV胶带的PCB板放置在切割机上，对PCB板上的芯片进行切割分离动作；第三步，将贴有UV胶带的PCB板放置于设有UV灯管的紫外灯照射装置中，开启UV灯管的控制电源，对切割后的PCB板进行UV紫外光照射动作；第四步，打开氮气储存装置的控制阀门，对切割后的PCB板进行氮气吹送动作；第五步，提取切割分离的芯片。本发明提供的一种PCB板芯片提取工艺，将芯片和PCB板分开而不损伤芯片，在将芯片从UV胶带上拿取下来时，不会损害到芯片，去除UV胶带粘性的效果好，值得推广。

Description

一种PCB板芯片提取工艺
技术领域
本发明涉及PCB板领域，具体涉及一种PCB板芯片提取工艺。
背景技术
设有芯片的PCB板通常采用邮票孔的方式互相连接在一起，根据作业需要将PCB板上的芯片切割分开以便进行后续的操作，以往将PCB板上的芯片切割分开时，使用UV胶带黏住PCB板再进行切割，但是将芯片拿取下来时，由于UV胶带具有粘性的，导致芯片取下存在困难，且容易损失芯片，给企业带来经济损失。
发明内容
为了解决现有技术中存在的问题，本发明提供了一种PCB板芯片提取工艺，将芯片和PCB板分开而不损伤芯片，在将芯片从UV胶带上拿取下来时，不会损害到芯片，去除UV胶带粘性的效果好，值得推广。
为了实现上述目的，本发明所采用的技术方案为：
一种PCB板芯片提取工艺，其特征在于：
第一步，将PCB板放置在UV胶带贴膜装置中，对PCB板进行UV胶带的贴膜动作；
第二步，将贴有UV胶带的PCB板放置在切割机上，对PCB板上的芯片进行切割分离动作；
第三步，将贴有UV胶带的PCB板放置于设有UV灯管的紫外灯照射装置中，开启UV灯管的控制电源，对切割后的PCB板进行UV紫外光照射动作；
第四步，打开氮气储存装置的控制阀门，对切割后的PCB板进行氮气吹送动作；
第五步，提取切割分离的芯片。
前述的一种PCB板芯片提取工艺，其特征在于：所述第一步中的UV胶带贴于PCB板的下部。
前述的一种PCB板芯片提取工艺，其特征在于：所述第二步中的切割分离动作不切断位于PCB板下部的UV胶带。
前述的一种PCB板芯片提取工艺，其特征在于：所述UV灯管并列设置于PCB板上部。
本发明的有益效果是：本发明提供的一种PCB板芯片提取工艺，先将PCB板底部贴上UV胶带，再用切割机沿着芯片的边缘切割且不切断UV胶带，保证UV胶带的连续性，当PCB板上的芯片与PCB板本体分离后，将黏贴有芯片的UV胶带放置于设有UV灯管的紫外灯照射装置中，打开UV灯管的控制电源，UV灯管照射出的紫外光能有效去除掉UV胶带的粘性，便于将芯片从UV胶带上拿下来，在开启UV灯管的同时开启氮气的控制阀门，输入氮气，可将UV胶带的粘性去除得更好，且氮气化学性质很稳定，不会发生化学反应，也就不会对芯片的质量产生影响。
附图说明
图1是本发明的PCB板芯片提取工艺的流程示意图。
附图标记含义如下：
1：UV胶带贴膜装置；2：切割机；3：紫外灯照射装置；4：氮气储存装置。
具体实施方式
下面结合附图对本发明做进一步的描述。
如图1所示，PCB板芯片提取工艺，包括如下步骤：
第一步，将PCB板放置在UV胶带贴膜装置中，对PCB板进行UV胶带的贴膜动作，将UV胶带平整贴于PCB板的下部，不会对PCB板上部的芯片造成影响；
第二步，将贴有UV胶带的PCB板放置在切割机上，对PCB板上的芯片进行切割分离动作，进一步的，将贴有UV胶带的PCB板放置在切割机上并固定稳定后，使用切割机的切割刀片沿着芯片的边缘位置进行切割，将PCB板上的芯片和PCB本体进行分离，此时，切割刀片并不切断PCB板下部的UV胶带，即UV胶带仍为一个整体，只是PCB板本体及PCB板上的芯片相分离，且PCB板本体及芯片均黏贴在UV胶带上，便于后续对整条UV胶带进行处理，而不会由于UV胶带切断造成凌乱，影响后续作业；
第三步，将贴有UV胶带的PCB板放置于设有UV灯管的紫外灯照射装置中，开启UV灯管的控制电源，对切割后的PCB板进行UV紫外光照射动作，进一步的，此时，PCB板本体和芯片已经分离且均黏贴于UV胶带上，将UV胶带放置于紫外灯照射装置中，打开UV灯管进行照射，将UV灯管设置在PCB板的上部，即UV灯管设于黏贴有PCB板本体和芯片的UV胶带的上部，将UV灯管的光设置集中照射在PCB板上，保证有效去除掉UV胶带的粘性，且不损坏芯片；
第四步，打开氮气储存装置的控制阀门，对切割后的PCB板进行氮气吹送动作，在开启UV灯管控制电源的同时打开氮气储存装置的控制阀门，使得氮气吹送至PCB板周围，便于UV胶带的粘性更好的去除，且氮气化学性能很稳定，不会发生化学反应，也就不会对芯片的质量产生影响；
第五步，提取切割分离的芯片，将UV胶带的粘性去除掉后，芯片很容易就能从UV胶带上拿取下来，保证了芯片的质量。
该PCB板芯片提取工艺，提取后的芯片质量有保证，为企业带来较大的经济利润，值得推广。
以上显示和描述了本发明的基本原理、主要特征及优点。本行业的技术人员应该了解，本发明不受上述实施例的限制，上述实施例和说明书中描述的只是说明本发明的原理，在不脱离本发明精神和范围的前提下，本发明还会有各种变化和改进，这些变化和改进都落入要求保护的本发明范围内。本发明要求保护范围由所附的权利要求书及其等效物界定。

Claims (4)

1.一种PCB板芯片提取工艺，其特征在于：
第一步，将PCB板放置在UV胶带贴膜装置中，对PCB板进行UV胶带的贴膜动作；
第二步，将贴有UV胶带的PCB板放置在切割机上，对PCB板上的芯片进行切割分离动作；
第三步，将贴有UV胶带的PCB板放置于设有UV灯管的紫外灯照射装置中，开启UV灯管的控制电源，对切割后的PCB板进行UV紫外光照射动作；
第四步，打开氮气储存装置的控制阀门，对切割后的PCB板进行氮气吹送动作；
第五步，提取切割分离的芯片。
2.根据权利要求1所述的一种PCB板芯片提取工艺，其特征在于：所述第一步中的UV胶带贴于PCB板的下部。
3.根据权利要求1所述的一种PCB板芯片提取工艺，其特征在于：所述第二步中的切割分离动作不切断位于PCB板下部的UV胶带。
4.根据权利要求1所述的一种PCB板芯片提取工艺，其特征在于：所述UV灯管并列设置于PCB板上部。
CN201310524829.7A 2013-10-31 2013-10-31 一种pcb板芯片提取工艺 Pending CN103560073A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310524829.7A CN103560073A (zh) 2013-10-31 2013-10-31 一种pcb板芯片提取工艺

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310524829.7A CN103560073A (zh) 2013-10-31 2013-10-31 一种pcb板芯片提取工艺

Publications (1)

Publication Number Publication Date
CN103560073A true CN103560073A (zh) 2014-02-05

Family

ID=50014290

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310524829.7A Pending CN103560073A (zh) 2013-10-31 2013-10-31 一种pcb板芯片提取工艺

Country Status (1)

Country Link
CN (1) CN103560073A (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105047598A (zh) * 2015-06-23 2015-11-11 上海东煦电子科技有限公司 一种用于pcb基板切割工艺的贴膜方法
CN110407155A (zh) * 2019-06-28 2019-11-05 歌尔股份有限公司 Mems产品划片切割方法
CN117545184A (zh) * 2023-11-15 2024-02-09 苏州矽微电子科技有限公司 用于pcb基板贴膜的控制方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105047598A (zh) * 2015-06-23 2015-11-11 上海东煦电子科技有限公司 一种用于pcb基板切割工艺的贴膜方法
CN110407155A (zh) * 2019-06-28 2019-11-05 歌尔股份有限公司 Mems产品划片切割方法
CN117545184A (zh) * 2023-11-15 2024-02-09 苏州矽微电子科技有限公司 用于pcb基板贴膜的控制方法
CN117545184B (zh) * 2023-11-15 2024-04-30 苏州矽微电子科技有限公司 用于pcb基板贴膜的控制方法

Similar Documents

Publication Publication Date Title
CN103560073A (zh) 一种pcb板芯片提取工艺
ATE542611T1 (de) Verfahren sowie vorrichtung zum behandeln von flaschen oder dergleichen behälter
TW201618915A (zh) 廢料回收機構及其保護膜裁切模組
CN204414734U (zh) 双面胶自动贴胶装置
ATE492379T1 (de) Schneideinrichtung mit einer blasluft zuführenden spanabführvorrichtung
CN105047598A (zh) 一种用于pcb基板切割工艺的贴膜方法
CN107325739A (zh) 一种Mylar导电胶带的制备方法
CN103143507A (zh) 一种光电二极管芯片的筛选方法
CN204749369U (zh) 酒盒罩贴纸压紧装置
CN102837486A (zh) 一种商标标签裁切装置和工艺
CN109572084A (zh) 一种能够解决反离型问题的模切产品及其加工工艺
CN104089805A (zh) 一种卷烟纸试样的裁切装置
CN107187108B (zh) 一种可自动化排废的标签生产工艺
CN105392278B (zh) 一种局部无胶补强片成型设备
CN203680398U (zh) 一种自动去废料装置
CN103692479B (zh) 一种自动去废料装置
CN203486639U (zh) 一种带有拼接功能的自动分条机
CN110066607A (zh) 一种复合导电胶带的制备方法
CN203391377U (zh) 一种胶纸板切槽机的碎屑出料装置
CN204874300U (zh) 一种夹层玻璃全自动无人快速合片装置
CN204341470U (zh) 一种超声波自动超声压合、贴膜、切膜装置
CN206288778U (zh) 不干胶标签纸的模切装置
CN201986430U (zh) 菠萝除芽器
CN202684997U (zh) 刀模自动排废冲头
CN207509276U (zh) 一种多功能标签切标装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20140205