CN103540439A - Anticorrosion cleaning agent for printed circuit board and preparation method of cleaning agent - Google Patents
Anticorrosion cleaning agent for printed circuit board and preparation method of cleaning agent Download PDFInfo
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- CN103540439A CN103540439A CN201310523697.6A CN201310523697A CN103540439A CN 103540439 A CN103540439 A CN 103540439A CN 201310523697 A CN201310523697 A CN 201310523697A CN 103540439 A CN103540439 A CN 103540439A
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- circuit board
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Abstract
The invention relates to an anticorrosion cleaning agent for a printed circuit board. The anticorrosion cleaning agent for the printed circuit board is prepared from the following materials in parts by weight: 4-5 parts of glycerinum, 5-8 parts of ethylparaben, 8-10 parts of 3-methyl-3-methoxy butanol, 1-2 parts of fatty acid alkanolamide, 3-4 parts of fatty alcohol-polyoxyethylene ether, 3-4 parts of cymene sodium sulfonate, 40-50 parts of ethyl alcohol, 2-3 parts of alkyl polyglucosides, 3-5 parts of tween 80, 4-5 parts of laurinol, 2-3 parts of urotropin, 4-5 parts of addition agent and 200-220 parts of deionized water. The cleaning agent is suitable for cleaning high-precision circuit boards rapidly. By adopting the addition agent, protective films can be formed on the surface of the circuit board to isolate air and prevent water and other molecules in air from corroding the circuit board. The addition agent is antioxidative and can prevent short circuit.
Description
Technical field
The present invention relates to clean-out system field, relate in particular to a kind of corrosion protection cleaning agent for printed circuit board and preparation method thereof.
Background technology
Along with the high speed development of unicircuit, the volume of circuit card is more and more less, and electronic component is more and more less, and density is increasing.If the dirt dust of the inside does not clean up in making processes, likely can cause the problems such as short circuit, corrosion, affect the normal operation of circuit card.At present majority circuit plate sanitising agent is all made with organism, and cleaning effect is good, is difficult for causing the problems such as short circuit, corrosion, and still, organic compound not only cost is high, and contaminate environment, damage the ozone layer, harmful to HUMAN HEALTH.Also have minority waterborne cleaning agent, but cleaning performance is limited, has security risk, require further improvement formula, technique, to reach clean thorough, pollution-free, the object of corroding little, healthy, circuit safety, reducing costs.
Summary of the invention
The object of the present invention is to provide a kind of corrosion protection cleaning agent for printed circuit board and preparation method thereof, this clean-out system has clean thorough, fast, the anlistatig advantage of cleaning speed.
Technical scheme of the present invention is as follows:
A cleaning agent for printed circuit board, is characterized in that being made by the raw material of following weight part: glycerine 4-5, ethyl p-hydroxybenzoate 5-8,3-methyl-3-methoxybutanol 8-10, fatty acid alkyl amide 1-2, fatty alcohol-polyoxyethylene ether 3-4, isopropyl benzene semi-annular jade pendant acid sodium 3-4, ethanol 40-50, alkyl polyglycoside 2-3, tween 80 3-5, lauryl alcohol 4-5, urotropine 2-3, auxiliary agent 4-5, deionized water 200-220;
Described auxiliary agent is made by the raw material of following weight part: Silane coupling reagent KH-570 2-3, phytic acid 1-2, methyl methacrylate 3-4, oxidation inhibitor 1035 1-2,2-aminoethyl 17 alkenyl imidazoline 1-2, ethanol 15-18; Preparation method mixes Silane coupling reagent KH-570, phytic acid, ethanol, is heated to 60-70 ℃, stirs after 20-30 minute, then adds other remaining component, is warming up to 80-85 ℃, stirs 30-40 minute, obtains.
The preparation method of described corrosion protection cleaning agent for printed circuit board, is characterized in that comprising the following steps: each raw material is mixed, under 1000-1200 rev/min of stirring, be heated to 60-70 ℃, stir 45-60 minute, obtain.Beneficial effect of the present invention
Clean-out system of the present invention is applicable to high-accuracy circuit card and cleans, totally quick.Auxiliary agent of the present invention can form protective membrane at circuit board surface, and isolated air, prevents water and other molecule open circuit potential plates in atmosphere, anti-oxidant, anti-short circuit.
Embodiment
A cleaning agent for printed circuit board, by following weight part (kilogram) raw material make: glycerine 5, ethyl p-hydroxybenzoate 5,3-methyl-3-methoxybutanol 8, fatty acid alkyl amide 1, fatty alcohol-polyoxyethylene ether 3, isopropyl benzene semi-annular jade pendant acid sodium 3, ethanol 40, alkyl polyglycoside 3, tween 80 3, lauryl alcohol 4, urotropine 2, auxiliary agent 4, deionized water 200-220;
Described auxiliary agent by following weight part (kilogram) raw material make: Silane coupling reagent KH-570 2.5, phytic acid 1.5, methyl methacrylate 3.5, oxidation inhibitor 1,035 1.5,2-aminoethyl 17 alkenyl imidazolines 1.5, ethanol 16; Preparation method mixes Silane coupling reagent KH-570, phytic acid, ethanol, is heated to 65 ℃, stirs after 25 minutes, then adds other remaining component, is warming up to 83 ℃, stirs 35 minutes, obtains.
The preparation method of described corrosion protection cleaning agent for printed circuit board, comprises the following steps: each raw material is mixed, under 1000-1200 rev/min of stirring, be heated to 60-70 ℃, stir 45-60 minute, obtain.
This corrosion protection cleaning agent for printed circuit board is used for cleaning copper printed circuit board (PCB), through 10 times of amplification detection of Olympus microscope, surface is clean without pollutents such as obvious rosin, scolding tin, greasy dirt, fingerprints, cleaning solution resistivity is greater than 2*106 Ω .cm, First Pass Yield reaches 87%, is better than normal level.
Claims (2)
1. a corrosion protection cleaning agent for printed circuit board, is characterized in that being made by the raw material of following weight part: glycerine 4-5, ethyl p-hydroxybenzoate 5-8,3-methyl-3-methoxybutanol 8-10, fatty acid alkyl amide 1-2, fatty alcohol-polyoxyethylene ether 3-4, isopropyl benzene semi-annular jade pendant acid sodium 3-4, ethanol 40-50, alkyl polyglycoside 2-3, tween 80 3-5, lauryl alcohol 4-5, urotropine 2-3, auxiliary agent 4-5, deionized water 200-220;
Described auxiliary agent is made by the raw material of following weight part: Silane coupling reagent KH-570 2-3, phytic acid 1-2, methyl methacrylate 3-4, oxidation inhibitor 1035 1-2,2-aminoethyl 17 alkenyl imidazoline 1-2, ethanol 15-18; Preparation method mixes Silane coupling reagent KH-570, phytic acid, ethanol, is heated to 60-70 ℃, stirs after 20-30 minute, then adds other remaining component, is warming up to 80-85 ℃, stirs 30-40 minute, obtains.
2. the preparation method of corrosion protection cleaning agent for printed circuit board according to claim 1, is characterized in that comprising the following steps: each raw material is mixed, under 1000-1200 rev/min of stirring, be heated to 60-70 ℃, stir 45-60 minute, obtain.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310523697.6A CN103540439A (en) | 2013-10-30 | 2013-10-30 | Anticorrosion cleaning agent for printed circuit board and preparation method of cleaning agent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310523697.6A CN103540439A (en) | 2013-10-30 | 2013-10-30 | Anticorrosion cleaning agent for printed circuit board and preparation method of cleaning agent |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103540439A true CN103540439A (en) | 2014-01-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310523697.6A Pending CN103540439A (en) | 2013-10-30 | 2013-10-30 | Anticorrosion cleaning agent for printed circuit board and preparation method of cleaning agent |
Country Status (1)
| Country | Link |
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| CN (1) | CN103540439A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105331453A (en) * | 2015-11-24 | 2016-02-17 | 桐城信邦电子有限公司 | Anticorrosive circuit board cleaning agent and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102373119A (en) * | 2010-08-09 | 2012-03-14 | 高丽娟 | Machine cleaning agent |
| CN102690736A (en) * | 2012-05-29 | 2012-09-26 | 上海弗杏康生物科技有限公司 | Oxidizing pre-cleaner for food industrial equipment and preparation method of oxidizing pre-cleaner |
| CN103215595A (en) * | 2013-02-04 | 2013-07-24 | 安徽省繁昌县皖南阀门铸造有限公司 | Metal rust-preventive oil comprising sorbitan monooleate |
-
2013
- 2013-10-30 CN CN201310523697.6A patent/CN103540439A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102373119A (en) * | 2010-08-09 | 2012-03-14 | 高丽娟 | Machine cleaning agent |
| CN102690736A (en) * | 2012-05-29 | 2012-09-26 | 上海弗杏康生物科技有限公司 | Oxidizing pre-cleaner for food industrial equipment and preparation method of oxidizing pre-cleaner |
| CN103215595A (en) * | 2013-02-04 | 2013-07-24 | 安徽省繁昌县皖南阀门铸造有限公司 | Metal rust-preventive oil comprising sorbitan monooleate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105331453A (en) * | 2015-11-24 | 2016-02-17 | 桐城信邦电子有限公司 | Anticorrosive circuit board cleaning agent and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140129 |