CN103531666B - 一种处理物理冶金法单晶硅返工片的方法 - Google Patents
一种处理物理冶金法单晶硅返工片的方法 Download PDFInfo
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- CN103531666B CN103531666B CN201310522024.9A CN201310522024A CN103531666B CN 103531666 B CN103531666 B CN 103531666B CN 201310522024 A CN201310522024 A CN 201310522024A CN 103531666 B CN103531666 B CN 103531666B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02032—Preparing bulk and homogeneous wafers by reclaiming or re-processing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02079—Cleaning for reclaiming
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
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Application Number | Priority Date | Filing Date | Title |
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CN201310522024.9A CN103531666B (zh) | 2013-10-29 | 2013-10-29 | 一种处理物理冶金法单晶硅返工片的方法 |
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CN201310522024.9A CN103531666B (zh) | 2013-10-29 | 2013-10-29 | 一种处理物理冶金法单晶硅返工片的方法 |
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CN103531666A CN103531666A (zh) | 2014-01-22 |
CN103531666B true CN103531666B (zh) | 2016-03-09 |
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CN201310522024.9A Active CN103531666B (zh) | 2013-10-29 | 2013-10-29 | 一种处理物理冶金法单晶硅返工片的方法 |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101217169A (zh) * | 2007-12-27 | 2008-07-09 | 江阴浚鑫科技有限公司 | 一种晶体硅太阳能电池片印刷后次品返工方法 |
WO2010080069A2 (en) * | 2009-01-06 | 2010-07-15 | Frontken (Singapore) Pte Ltd | Techniques for maintaining a substrate processing system |
CN102074617A (zh) * | 2010-12-02 | 2011-05-25 | 上海超日(洛阳)太阳能有限公司 | 一种丝网印刷返工硅片的处理方法 |
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2013
- 2013-10-29 CN CN201310522024.9A patent/CN103531666B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101217169A (zh) * | 2007-12-27 | 2008-07-09 | 江阴浚鑫科技有限公司 | 一种晶体硅太阳能电池片印刷后次品返工方法 |
WO2010080069A2 (en) * | 2009-01-06 | 2010-07-15 | Frontken (Singapore) Pte Ltd | Techniques for maintaining a substrate processing system |
CN102074617A (zh) * | 2010-12-02 | 2011-05-25 | 上海超日(洛阳)太阳能有限公司 | 一种丝网印刷返工硅片的处理方法 |
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C14 | Grant of patent or utility model | ||
CB03 | Change of inventor or designer information |
Inventor after: An Baijun Inventor after: Kang Anjun Inventor after: Ma Zhiheng Inventor after: Peng Wenqiang Inventor after: Liao Jiangang Inventor after: Ding Yan Inventor after: Li Guili Inventor before: Peng Wenqiang Inventor before: Liao Jiangang Inventor before: Ding Yan Inventor before: Li Guili |
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