CN103531414A - Picosecond pulse laser cutting preparation method for grid-control traveling wave tube grid mesh - Google Patents
Picosecond pulse laser cutting preparation method for grid-control traveling wave tube grid mesh Download PDFInfo
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Abstract
The invention discloses a picosecond pulse laser cutting preparation method for a grid-control traveling wave tube grid mesh. The method comprises the following steps of performing cleaning, hydrogen burning and annealing on a grid mesh material, then pressing the grid mesh material through a die on a punching machine to form a spherical grid mesh blank with high curvature radius precision, performing destressing hydrogen burning on the blank to eliminate stress during processing to guarantee the stability of the curvature radius of a spherical cap of a grid mesh, and finally cutting the grid mesh by adopting picosecond pulse laser of an optimized technology to prepare the grid-control traveling wave tube grid mesh with high size precision and high consistency. According to the preparation method for the grid mesh of a grid-control traveling wave tube, specific technical parameters of picosecond laser cutting are screened through a large number of experiments, the operability is high, the technical design is reasonable, and the application range is large; the prepared grid mesh is high in size precision, high in consistency, high in yield and high in reliability and has an important application value; the shortcoming of an existing electric spark grid mesh processing technology can be effectively overcome.
Description
Technical field
The present invention relates to a kind of preparation method of travelling wave tube accessory, be specifically related to a kind of picosecond pulse laser cutting preparation method of grid-control TWT aperture plate.
Background technology
Travelling wave tube is that a kind of speed by modulation electron beam realizes the microwave tube of enlarging function, and the feature of travelling wave tube is bandwidth, it is high to gain, dynamic range is large and noise is low.Aperture plate is the strength member of grid-control TWT, but in prior art, the processing method of sphere aperture plate is that lathe strikes out sphere blank and uses spark machined aperture plate again, the aperture plate that this method prepares and the precision of electrospark electrode and clamping have much relations, exist the axiality of each wheel and the width accuracy of spoke of radial-vane grid to be difficult to the shortcoming guaranteeing, and the radial-vane grid of asymmetric figure, the aperture plate of a plurality of spherical crowns, the aperture plate that string diameter is less than 0.05mm is all difficult to processing, and the consistency of existing spark machined aperture plate is not high, thereby cause the travelling wave tube quality of assembling unstable.
Therefore necessary on the basis of prior art, a kind of technological design of design research and development is reasonable, workable, and the aperture plate dimensional accuracy for preparing is high, the preparation method of the grid-control TWT aperture plate of high conformity.
Summary of the invention
Goal of the invention: the object of the invention is in order to solve the deficiencies in the prior art, a kind of strong operability is provided, technological design is reasonable, processing line width, edge quality are good, can process arbitrary shape and size, the aperture plate dimensional accuracy aperture plate picosecond pulse laser high, high conformity preparing is cut preparation method.
Technical scheme: in order to realize above object, the technical solution used in the present invention is:
A picosecond pulse laser cutting preparation method for aperture plate, it comprises the following steps:
A, get aperture plate material with after punch die blanking, clean the greasy dirt of removing aperture plate material surface, then aperture plate material is placed in to hydrogen-burning stove annealing in hydrogen atmosphere annealing in process, then aperture plate material is placed on and on protruding spherical mould, with punch press, is pressed into center and is protruding spheric nahlock, obtain sphere aperture plate blank;
B, get the sphere aperture plate blank that step a obtains and clean, then the sphere aperture plate blank after cleaning is positioned over to hydrogen-burning stove annealing in hydrogen atmosphere annealing in process, the stress producing while removing moulding, obtains removing the sphere aperture plate blank of stress, standby;
C, get the sphere aperture plate blank that step b obtains and carry out picosecond laser cutting, concrete steps are: first base is fixed on the objective table of picosecond laser process equipment, proofread and correct the center of base, then sphere aperture plate blank is fixed on base with nut and trim ring, the center superposition of the center of base and sphere aperture plate blank, by the figure of CAD drafting needs processing, the laser cutting that is then picosecond with pulse, obtain the finished product of grid-control TWT aperture plate.
As preferred version, the picosecond pulse laser cutting preparation method of above-described grid-control TWT aperture plate, step a aperture plate material used is that thickness is 0.03 to 0.25mm molybdenum, molybdenum rhenium or oxygen-free copper, aperture plate picosecond pulse laser cutting technique provided by the invention, applied widely, can adopt the material cuttings such as oxygen-free copper, molybdenum or molybdenum rhenium to prepare the aperture plate of required complicated shape, can overcome prior art material and select limited deficiency.
As preferred version, the picosecond pulse laser of above-described grid-control TWT aperture plate cutting preparation method, the temperature of step a annealing in hydrogen atmosphere annealing in process is 650 ~ 950 ℃, annealing in hydrogen atmosphere annealing time is 10 ~ 20 minutes.Before compressing with punch press, it is in order more thoroughly to remove material surface impurity that the present invention carries out annealing in hydrogen atmosphere processing to aperture plate material, and can effectively remove the stress of aperture plate material self, increases the formability of aperture plate material.
As preferred version, the picosecond pulse laser of above-described grid-control TWT aperture plate cutting preparation method, the annealing in hydrogen atmosphere annealing treating process in step b is: when aperture plate material is molybdenum or molybdenum rhenium, at 950 ℃, annealing in hydrogen atmosphere annealing 15 minutes; When aperture plate material is oxygen-free copper, at 650 ℃, annealing in hydrogen atmosphere annealing 15 minutes.Through annealing in hydrogen atmosphere again, process, the stress producing in the time of can effectively removing moulding, obtains removing the sphere aperture plate blank of stress, guarantees the stability of aperture plate spherical crown radius of curvature.
As preferred version, the picosecond pulse laser of above-described grid-control TWT aperture plate cutting preparation method, in step c, the parameters of laser cutting of picosecond is: pulse duration is 8 ~ 12PS, and spot diameter is 0.01 ~ 0.02mm, and power is 0.8W ~ 4W.The required precision of the control gate aperture plate of travelling wave tube is high, and moulding is complex-shaped, adopt the spark machined mode of prior art to be difficult to processing, the present invention screens by great many of experiments, adopt the pulse laser mode of picosecond to process, the laser cutting process parameter that preferably obtains best picosecond, has the following advantages:
(1) there is high peak power, can process the various materials such as molybdenum, molybdenum rhenium or oxygen-free copper;
(2) processing line width, edge quality are good, and heat-affected zone is minimum even can be ignored; The picosecond pulse laser processing that the present invention adopts belongs to cold working, and its course of processing is: electronic state absorbs the eruption of---energy reaches lattice damage associative key---plasma.Present spark machined aperture plate technology, minimum can only be processed the live width of 0.05mm, and the present invention adopts picosecond pulse laser can process the live width of 0.03mm, and edge quality is good, has compared to the prior art obtained good technique effect.
(3) experimental result shows, the laser cutting of the picosecond that the present invention adopts can be processed the aperture plate of arbitrary shape and size, and graphics processing can be by CAD Software for Design; The technology of existing spark machined aperture plate can only be processed symmetric figure, and cannot process the aperture plate that spherical crown diameter is less than Φ 4mm; And picosecond pulse laser of the present invention can be processed any aperture plate that can draw figure, as the radial-vane grid of odd number decile, honeycomb grid, grid, note aperture plate etc., can overcome the limited deficiency of prior art machining shape more, obtained good technique effect.
As preferred version, the picosecond pulse laser of above-described grid-control TWT aperture plate cutting preparation method, in step b, cleaning way, for first with sodium hydroxide solution cleaning, then cleans with chromic acid solution.
Beneficial effect: the picosecond pulse laser cutting preparation method of grid-control TWT aperture plate provided by the invention compared with prior art has the following advantages:
The preparation method of the aperture plate of grid-control TWT provided by the invention, by great many of experiments, screen the concrete technology parameter of the laser cutting of picosecond, workable, technological design is reasonable, have wide range of applications, can prepare the aperture plate of all grid-control TWTs in existing electrovacuum industry, and the aperture plate dimensional accuracy of processing is high, high conformity, yields is high, reliability is high, has important using value, the aperture plate processing difficult problem that can effectively solve the unmanageable difficult problem of electrode of existing spark machined aperture plate technology and solve very small dimensions and complicated shape.
Accompanying drawing explanation
Fig. 1 is the structural representation of the honeycomb aperture plate for preparing of method of the present invention.
Fig. 2 is the wire-grid structure schematic diagram of the oxygen-free copper for preparing of method of the present invention.
Fig. 3 is the frock clamp mounting structure schematic diagram of method of the present invention picosecond pulse laser cutting while preparing.
Embodiment
Below in conjunction with the drawings and specific embodiments, further illustrate the present invention, should understand these embodiment is only not used in and limits the scope of the invention for the present invention is described, after having read the present invention, those skilled in the art all fall within the application's claims limited range to the modification of the various equivalent form of values of the present invention.
The preparation of embodiment 1 molybdenum honeycomb aperture plate processed
A picosecond pulse laser cutting preparation method for aperture plate, it comprises the following steps:
A, to get thickness be that 0.03 mm molybdenum aperture plate material processed is with after punch die blanking, clean the greasy dirt of removing aperture plate material surface, then aperture plate material is placed in to hydrogen-burning stove, at 800 ℃, annealing in hydrogen atmosphere annealing in process 15 minutes, then aperture plate material is placed on and on protruding spherical mould, with punch press, is pressed into center and is protruding spheric nahlock, obtain sphere aperture plate blank;
B, get the sphere aperture plate blank that step a obtains and first with sodium hydroxide solution, clean, and then clean with chromic acid solution, then the sphere aperture plate blank after cleaning is positioned over to hydrogen-burning stove, at 800 ℃, annealing in hydrogen atmosphere annealing in process 15 minutes; The stress producing while removing moulding, obtains removing the sphere aperture plate blank of stress, standby;
C, get the sphere aperture plate blank that step b obtains and carry out picosecond laser cutting, concrete steps are: first base (4) is fixed on the objective table of picosecond laser process equipment, proofread and correct the center of base (4), then sphere aperture plate blank (1) is fixed on base (4) with nut (2) and trim ring (3), the center superposition of the center of base (4) and sphere aperture plate blank (1), as shown in Figure 3, then with CAD, draw the figure that needs processing, then the laser cutting that is picosecond with pulse, obtain the finished product of grid-control TWT aperture plate, its structure as shown in Figure 1.
The picosecond pulse laser cutting preparation method of above-described grid-control TWT aperture plate, in step c, the parameters of laser cutting of picosecond is: pulse duration is 8 ~ 12PS, and spot diameter is 0.01mm, and power is 1W.
The preparation of the aperture plate of embodiment 2 oxygen-free coppers
A picosecond pulse laser cutting preparation method for aperture plate, it comprises the following steps:
A, to get thickness be 0.1mm oxygen-free copper aperture plate material with after punch die blanking, clean the greasy dirt of removing aperture plate material surface, then aperture plate material is placed in to hydrogen-burning stove, at 650 ℃, annealing in hydrogen atmosphere annealing in process 15 minutes, then aperture plate material is placed on and on protruding spherical mould, with punch press, is pressed into center and is protruding spheric nahlock, obtain sphere aperture plate blank;
B, get the sphere aperture plate blank that step a obtains and first with sodium hydroxide solution, clean, and then clean with chromic acid solution, then the sphere aperture plate blank after cleaning is positioned over to hydrogen-burning stove, at 650 ℃, annealing in hydrogen atmosphere annealing in process 15 minutes; The stress producing while removing moulding, obtains removing the sphere aperture plate blank of stress, standby;
C, get the sphere aperture plate blank that step b obtains and carry out picosecond laser cutting, concrete steps are: first base (4) is fixed on the objective table of picosecond laser process equipment, proofread and correct the center of base (4), then sphere aperture plate blank (1) is fixed on base (4) with nut (2) and trim ring (3), the center superposition of the center of base (4) and sphere aperture plate blank (1), as shown in Figure 3, with CAD, draw the figure that needs processing, then the laser cutting that is picosecond with pulse, obtain the finished product of grid-control TWT aperture plate, its structure as shown in Figure 2.
The picosecond pulse laser cutting preparation method of above-described grid-control TWT aperture plate, in step c, the parameters of laser cutting of picosecond is: pulse duration is 8 ~ 12PS, and spot diameter is 0.02mm, and power is 2W.
The preparation of the aperture plate of embodiment 3 molybdenum rheniums
A picosecond pulse laser cutting preparation method for aperture plate, it comprises the following steps:
A, to get thickness be 0.08mm molybdenum rhenium aperture plate material with after punch die blanking, clean the greasy dirt of removing aperture plate material surface, then aperture plate material is placed in to hydrogen-burning stove, at 900 ℃, annealing in hydrogen atmosphere annealing in process 20 minutes, then aperture plate material is placed on and on protruding spherical mould, with punch press, is pressed into center and is protruding spheric nahlock, obtain sphere aperture plate blank;
B, get the sphere aperture plate blank that step a obtains and first with sodium hydroxide solution, clean, and then clean with chromic acid solution, then the sphere aperture plate blank after cleaning is positioned over to hydrogen-burning stove, at 900 ℃, annealing in hydrogen atmosphere annealing in process 15 minutes; The stress producing while removing moulding, obtains removing the sphere aperture plate blank of stress, standby;
C, get the sphere aperture plate blank that step b obtains and carry out picosecond laser cutting, concrete steps are: first base (4) is fixed on the objective table of picosecond laser process equipment, proofread and correct the center of base (4), then sphere aperture plate blank (1) is fixed on base (4) with nut (2) and trim ring (3), the center superposition of the center of base (4) and sphere aperture plate blank (1), as shown in Figure 3, with CAD, draw the figure that needs processing, then the laser cutting that is picosecond with pulse, obtains the finished product of grid-control TWT aperture plate.
The picosecond pulse laser cutting preparation method of above-described grid-control TWT aperture plate, in step c, the parameters of laser cutting of picosecond is: pulse duration is 8 ~ 12PS, and spot diameter is 0.02mm, and power is 3W.
The electron emission test experience of embodiment 4 oxygen-free copper control gates
Get the travelling wave tube that control aperture plate assembling that embodiment 1 to 3 prepares obtains, measure the electronic transmitting efficiency of controlling aperture plate when travelling wave tube provides more than 2500 watts high impulse power output under 12 ~ 18GHz high-frequency, the electron stream passband of the travelling wave tube of the aperture plate assembling that experimental result shows to prepare by the embodiment of the present invention 1 to 3 is respectively 90%, 98%, 96%.
The aperture plate preparing through method provided by the invention, precision is high, stable performance, energy is the electron emission of suppressor grid obviously, greatly lowers the noise of transmitter, improve the stability of transmitter supply, and the work of receiver is more stable.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (6)
1. the picosecond pulse laser of a grid-control TWT aperture plate cutting preparation method, is characterized in that, it comprises the following steps:
A, get aperture plate material with after punch die blanking, clean the greasy dirt of removing aperture plate material surface, then aperture plate material is placed in to hydrogen-burning stove annealing in hydrogen atmosphere annealing in process, then aperture plate material is placed on and on protruding spherical mould, with punch press, is pressed into center and is protruding spheric nahlock, obtain sphere aperture plate blank;
B, get the sphere aperture plate blank that step a obtains and clean, then the sphere aperture plate blank after cleaning is positioned over to hydrogen-burning stove annealing in hydrogen atmosphere annealing in process, the stress producing while removing moulding, obtains removing the sphere aperture plate blank of stress, standby;
C, get the sphere aperture plate blank that step b obtains and carry out picosecond laser cutting, concrete steps are: first sphere aperture plate blank is fixed with frock clamp, specific practice is for to be first fixed on base (4) on the objective table of picosecond laser process equipment, proofread and correct the center of base (4), then sphere aperture plate blank (1) is fixed on base (4) with nut (2) and trim ring (3), the center superposition of the center of base (4) and sphere aperture plate blank (1), with CAD, draw the figure that needs processing, then the laser cutting that is picosecond with pulse, obtain the finished product of grid-control TWT aperture plate.
2. the picosecond pulse laser of grid-control TWT aperture plate according to claim 1 cutting preparation method, is characterized in that, step a aperture plate material used is that thickness is 0.03 to 0.25mm molybdenum, molybdenum rhenium or oxygen-free copper.
3. the picosecond pulse laser of grid-control TWT aperture plate according to claim 1 cutting preparation method, is characterized in that, the temperature of step a annealing in hydrogen atmosphere annealing in process is 650 ~ 950 ℃, and annealing in hydrogen atmosphere annealing time is 10 ~ 20 minutes.
4. the picosecond pulse laser of grid-control TWT aperture plate according to claim 1 cutting preparation method, is characterized in that, the annealing in hydrogen atmosphere annealing treating process in step b is: when aperture plate material is molybdenum or molybdenum rhenium, and at 950 ℃, annealing in hydrogen atmosphere annealing 15 minutes; When aperture plate material is oxygen-free copper, at 650 ℃, annealing in hydrogen atmosphere annealing 15 minutes.
5. according to the picosecond pulse laser cutting preparation method of the grid-control TWT aperture plate described in claim 1 to 4 any one, in step c, the parameters of laser cutting of picosecond is: pulse duration is 8 ~ 12PS, and spot diameter is 0.01 ~ 0.02mm, and power is 0.8W ~ 4W.
6. the picosecond pulse laser of grid-control TWT aperture plate according to claim 5 is cut preparation method, and in step b, cleaning way is for first cleaning with sodium hydroxide solution and then cleaning with chromic acid solution.
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