CN103528874A - Separating method of carborundum particles on surface of diamond wire - Google Patents

Separating method of carborundum particles on surface of diamond wire Download PDF

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Publication number
CN103528874A
CN103528874A CN201310444799.9A CN201310444799A CN103528874A CN 103528874 A CN103528874 A CN 103528874A CN 201310444799 A CN201310444799 A CN 201310444799A CN 103528874 A CN103528874 A CN 103528874A
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CN
China
Prior art keywords
diamond wire
silicon carbide
particles
beaker
separating method
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Pending
Application number
CN201310444799.9A
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Chinese (zh)
Inventor
丁玲
张吉仁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Weixing New Building Materials Co Ltd
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Zhejiang Weixing New Building Materials Co Ltd
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Priority to CN201310444799.9A priority Critical patent/CN103528874A/en
Publication of CN103528874A publication Critical patent/CN103528874A/en
Pending legal-status Critical Current

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  • Carbon And Carbon Compounds (AREA)

Abstract

The invention discloses a separating method of carborundum particles on a surface of a diamond wire. The separating method comprises the following steps: a step I of adding 100ml of concentrated nitric acid and 15ml of concentrated hydrochloric acid into a beaker contained with the diamond wire, sufficiently stirring; a step II of heating up the beaker while stirring until the diamond wire is completely dissolved in liquor; and a step III of washing the materials in the beaker by using clear water, and drying after washing to obtain separated carborundum particles. The separating method disclosed by the invention has higher operability, repeatability and reproducibility. According to the separating method disclosed by the invention, a diamond wire base material and a coating on the carborundum surface can be rapidly dissolved by adopting a chemical reagent; meanwhile, the chemical reagent does not react with the carborundum, so that the obtained carborundum particles are full, complete and free of residual steel wires and coating. Besides, the separating method is simple to operate, low in cost and convenient for popularization.

Description

The separation method of a kind of diamond wire surface particles of silicon carbide
Technical field
The present invention relates to the separation method of a kind of diamond wire surface particles of silicon carbide.
Background technology
Diamond wire is the steel wire that a kind of surface is coated with emery, it is generally used for the article of the materials such as cutting sapphire, the emery quantity on diamond wire surface directly affects the effect of cutting, required according to technology, need to measure the quantity of diamond wire surface particles of silicon carbide.
At present, the separation method associative operation of diamond wire surface particles of silicon carbide does not have unified operation standard, thereby cannot guarantee that isolated emery meets the requirement detecting.Therefore a kind of method of operating is simple, the exploitation of the separation method of diamond wire thoroughly diamond wire separated with emery surface particles of silicon carbide is necessary.
Summary of the invention
Technical matters to be solved by this invention is to provide the separation method of a kind of diamond wire surface particles of silicon carbide, and this separation method makes the particles of silicon carbide after separation surperficial without remaining coating, noresidue steel wire.
For addressing the above problem, the technology used in the present invention problem is:
A separation method for diamond wire surface particles of silicon carbide, comprises the steps:
Step 1, adds 100ml red fuming nitric acid (RFNA) and 15ml concentrated hydrochloric acid successively to filling in the beaker of diamond wire, fully stirs;
Step 2, heats beaker while stirring, until diamond wire is dissolved in solution completely;
Step 3, washs with clear water the material in beaker, after washing, dries and can obtain isolated particles of silicon carbide again.
As preferably, in step 1, the length of diamond wire is 3~5cm.
As preferably, in step 2, the temperature of heating is 280~320 ℃.
As preferably, in step 3, described drying unit is baking oven, and described bake out temperature is 100~120 ℃.
As preferably, the particle diameter of described particles of silicon carbide is 100um.
Beneficial effect: than prior art, separation method of the present invention has very high operability, repeatability and reproducibility, this method adopts chemical reagent fast the coating on diamond wire matrix and emery surface to be dissolved, this chemical reagent does not but react with emery simultaneously, thereby make the particles of silicon carbide that obtains complete, complete, without remaining steel wire and coating, separation method of the present invention has conveniently obtained surface clean, without the residual particles of silicon carbide of steel wire, by the particles of silicon carbide obtaining by its quantity of microscopic examination and shape, thereby can show that emery is used the degree of wear of front and back, the inventive method is simple to operate, cost is low, be convenient to promote.
Embodiment
A separation method for diamond wire surface particles of silicon carbide, comprises the steps:
Step 1, by 10 long be that the diamond wire of 3~5cm is placed in 400ml beaker, in beaker, add successively 100ml red fuming nitric acid (RFNA) and 15ml concentrated hydrochloric acid, with glass bar, the material in beaker is fully stirred;
Step 2, heats beaker while stirring, and the temperature of heating is 280~320 ℃, until diamond wire is dissolved in liquid completely;
Step 3, washs with clear water the material in beaker, washs after 3~5 times, and the material after washing is placed in baking oven, and oven temperature is 100~120 ℃, and baking time is that 4~6h can obtain isolated particles of silicon carbide.Resulting particles of silicon carbide particle diameter is 100um.
Obviously, above-described embodiment is only for example of the present invention is clearly described, and is not the restriction to embodiments of the present invention.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without also giving all embodiments.And these belong to apparent variation that spirit of the present invention extended out or change still among protection scope of the present invention.The above is only the preferred embodiment of the present invention; be noted that for those skilled in the art; under the premise without departing from the principles of the invention, can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.

Claims (5)

1. a separation method for diamond wire surface particles of silicon carbide, is characterized in that: comprise the steps:
Step 1, adds 100ml red fuming nitric acid (RFNA) and 15ml concentrated hydrochloric acid successively to filling in the beaker of diamond wire, fully stirs;
Step 2, heats beaker while stirring, until diamond wire is dissolved in solution completely;
Step 3, washs with clear water the material in beaker, after washing, dries and can obtain isolated particles of silicon carbide again.
2. the separation method of diamond wire according to claim 1 surface particles of silicon carbide, is characterized in that: in step 1, the length of diamond wire is 3~5cm.
3. the separation method of diamond wire according to claim 1 surface particles of silicon carbide, is characterized in that: in step 2, the temperature of heating is 280~320 ℃.
4. the separation method of diamond wire according to claim 1 surface particles of silicon carbide, is characterized in that: in step 3, described drying unit is baking oven, and described bake out temperature is 100~120 ℃.
5. the separation method of diamond wire according to claim 1 surface particles of silicon carbide, is characterized in that: the particle diameter of described particles of silicon carbide is 100um.
CN201310444799.9A 2013-09-26 2013-09-26 Separating method of carborundum particles on surface of diamond wire Pending CN103528874A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310444799.9A CN103528874A (en) 2013-09-26 2013-09-26 Separating method of carborundum particles on surface of diamond wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310444799.9A CN103528874A (en) 2013-09-26 2013-09-26 Separating method of carborundum particles on surface of diamond wire

Publications (1)

Publication Number Publication Date
CN103528874A true CN103528874A (en) 2014-01-22

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107436276A (en) * 2017-07-21 2017-12-05 镇江仁德新能源科技有限公司 A kind of method for detecting diamond wire diamond particles

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3475942B2 (en) * 2001-06-25 2003-12-10 住友電気工業株式会社 Surface condition inspection equipment for wire saws
JP3827675B2 (en) * 2004-02-26 2006-09-27 株式会社ノリタケスーパーアブレーシブ Cutting device
CN101691216A (en) * 2009-10-05 2010-04-07 山东科技大学 Method for recycling silicon carbide and co-producing white carbon black from waste mortar for wire cutting
CN101745514A (en) * 2008-12-02 2010-06-23 北京有色金属研究总院 Comprehensive resource recycling method for waste diamond tool
CN102079520A (en) * 2011-01-12 2011-06-01 虹京环保有限公司 Recycling method of silicon carbide
CN102275926A (en) * 2011-05-05 2011-12-14 王楚雯 Recovery method of silicon powder
CN102659111A (en) * 2012-04-28 2012-09-12 南京远齐环保科技有限公司 Method for recovering silicon and silicon carbide from silicon wafer cutting waste mortar
CN102660685A (en) * 2012-05-07 2012-09-12 南昌大学 Method for recycling waste diamond tool
CN102848480A (en) * 2011-06-30 2013-01-02 浙江思博恩新材料科技有限公司 Diamond recovery method for resin diamond scroll saw
CN102890039A (en) * 2011-07-22 2013-01-23 浙江思博恩新材料科技有限公司 Method and device for detecting density and distribution of diamond wire abrasive particles
TWI392647B (en) * 2009-05-11 2013-04-11 國立台灣大學 Recovery of silicon and silicon carbide powder from kerf loss slurry using particle phase-transfer method

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3475942B2 (en) * 2001-06-25 2003-12-10 住友電気工業株式会社 Surface condition inspection equipment for wire saws
JP3827675B2 (en) * 2004-02-26 2006-09-27 株式会社ノリタケスーパーアブレーシブ Cutting device
CN101745514A (en) * 2008-12-02 2010-06-23 北京有色金属研究总院 Comprehensive resource recycling method for waste diamond tool
TWI392647B (en) * 2009-05-11 2013-04-11 國立台灣大學 Recovery of silicon and silicon carbide powder from kerf loss slurry using particle phase-transfer method
CN101691216A (en) * 2009-10-05 2010-04-07 山东科技大学 Method for recycling silicon carbide and co-producing white carbon black from waste mortar for wire cutting
CN102079520A (en) * 2011-01-12 2011-06-01 虹京环保有限公司 Recycling method of silicon carbide
CN102275926A (en) * 2011-05-05 2011-12-14 王楚雯 Recovery method of silicon powder
CN102848480A (en) * 2011-06-30 2013-01-02 浙江思博恩新材料科技有限公司 Diamond recovery method for resin diamond scroll saw
CN102890039A (en) * 2011-07-22 2013-01-23 浙江思博恩新材料科技有限公司 Method and device for detecting density and distribution of diamond wire abrasive particles
CN102659111A (en) * 2012-04-28 2012-09-12 南京远齐环保科技有限公司 Method for recovering silicon and silicon carbide from silicon wafer cutting waste mortar
CN102660685A (en) * 2012-05-07 2012-09-12 南昌大学 Method for recycling waste diamond tool

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107436276A (en) * 2017-07-21 2017-12-05 镇江仁德新能源科技有限公司 A kind of method for detecting diamond wire diamond particles

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Application publication date: 20140122