CN103517541A - Shielded PCB multilayer board - Google Patents
Shielded PCB multilayer board Download PDFInfo
- Publication number
- CN103517541A CN103517541A CN201210198202.2A CN201210198202A CN103517541A CN 103517541 A CN103517541 A CN 103517541A CN 201210198202 A CN201210198202 A CN 201210198202A CN 103517541 A CN103517541 A CN 103517541A
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- shielding material
- electromagnetic shielding
- pcb board
- shield type
- layer sheet
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a shielded PCB multilayer board which comprises a top layer, a power plane, a ground layer, a bottom layer and an electromagnetic shielding material filled in at least a board layer. Technical problems are solved as follows: electromagnetic interference between adjacent boards or electronic components of two adjacent layers is reduced; and strength of the PCB board is raised. According to the shielded PCB multilayer board disclosed by the invention, the electromagnetic shielding material filled in the PCB board is adopted. Thus, anti-interference capability of a body of the PCB board is raised. In addition, strength of the PCB board is raised, thickness of the board is reduced, and the distance between components and parts of two adjacent layers is shortened, making it possible to further reduce volume and thickness of the product but not influencing performance of the components.
Description
Technical field
The present invention relates to a kind of printed circuit board (PCB), particularly a kind of shield type PCB multi-layer sheet.
Background technology
Along with the development of information technology and the raising of associated fabrication techniques, it is the target of the diligent pursuit of present stage electronic information field institute and the direction of continuous progressive development that high speed information is processed with high-speed and high-density information communication, and the running frequency of electronic component and the size of electronic component also constantly reduce equally.For example, computer main frequency has reached several GHz.
On high-frequency circuit, loss is mainly created in conductor and PCB, wherein particularly serious with the loss in PCB.When signal transmission, these loss main manifestations are the problems such as high flow rate of heating, noise and electrical power.Along with the operation frequency of electronic component and the raising of information density, the physical distance between electronic component and each circuit has been reduced to the weak current in electronic devices and components just can there is phase mutual interference and impact, thereby has affected the normal operation of electronic devices and components.Especially in the integrated multilayer PCB circuit board of the height of electronic devices and components, it is particularly evident that this point embodies.The thickness that reduces pcb board, will inevitably impact the bulk strength of pcb board, thereby may have influence on the affixed intensity of pcb board in circuit, and affects the operation of whole circuit and use safety.
Summary of the invention
For addressing the above problem, the invention discloses a kind of shield type PCB multi-layer sheet, the electromagnetic shielding material that employing is filled in pcb board, when improving pcb board body antijamming capability, also improve the intensity of pcb board, reduced thickness of slab, shortened the distance between adjacent two layers components and parts, make the volume and the thickness that further reduce product become possibility, and do not affect the performance of components and parts.
Shield type PCB multi-layer sheet disclosed by the invention, comprises top layer, bus plane, stratum, bottom and is filled in the electromagnetic shielding material at least one laminate plate.Shield type PCB multi-layer sheet disclosed by the invention, by fill electromagnetic shielding material in body, when improving body hot strength, also effectively improved the anti-electromagnetic interference capability of pcb board body, improved on pcb board interference free performance between adjacent two layers components and parts, reduced the interference between adjacent two layers components and parts, improved the Stability and veracity of components and parts operations, thereby effectively improved the overall operation efficiency of circuit, for reducing the realization that pcb board is thick under the prerequisite guaranteeing pcb board intensity, brought possibility, thereby can effectively reduce the multiple-plate thickness of PCB, improve wiring density, be conducive to reduce the volume of product, reduce the thickness of product.
The multiple-plate a kind of improvement of shield type PCB disclosed by the invention, electromagnetic shielding material becomes layered arrangement in bus plane.This improvement by arranging the electromagnetic shielding material of layered arrangement in bus plane, be conducive to realize to producing the control of materials'use cost, reduce the use amount of shielding material in pcb board, thereby at production control cost, when guaranteeing shield effectiveness, also realize multilayer setting and the protection of shielding construction in body, effectively improved the interference free performance of pcb board.
Multiple-plate another improvement of shield type PCB disclosed by the invention, in pcb board, in electromagnetic shielding material layer, the dispersion density of wire rod is identical.This improvement by evenly arranging electromagnetic shielding material in pcb board on pattern, stability and the quality homogeneity of pcb board shielding properties have effectively been improved, thereby effectively improved the total quality of pcb board, avoided skewness and the appearance of the inconsistent defect of screening ability everywhere on the pcb board that causes.
Multiple-plate another improvement of shield type PCB disclosed by the invention, electromagnetic shielding material is the metal whisker of diameter 4-6 micron or the conducting polymer nano wire of diameter 20-40 nanometer.This improvement is electromagnetic shielding material by adopting metal whisker or conducting polymer nano wire, can effectively improve the compatibility of body and wire rod, can also strengthen the intensity of body, and not need other extra filling reinforcing material, also guaranteed the shielding properties of pcb board simultaneously.
Multiple-plate another improvement of shield type PCB disclosed by the invention, metal whisker is iron whiskers or al whisker or silver-colored whisker.
Multiple-plate another improvement of shield type PCB disclosed by the invention, conducting polymer nano wire is polyacetylene nano wire or polyaniline nano-line or polythiophene nano wire or polypyrrole nano line.
Shield type PCB multi-layer sheet disclosed by the invention by filling the equally distributed electromagnetic shielding material of stratiform in pcb board, enhancing body hot strength and anti-electromagnetic interference performance have been realized simultaneously, effectively improved on pcb board interference free performance between adjacent two layers components and parts, reduced the interference between adjacent two layers components and parts, improved the Stability and veracity of components and parts operations, thereby effectively improved the overall operation efficiency of circuit, and then effectively shortened the spacing of pcb board in circuit, reduced multiple-plate volume, be conducive to reduce the volume of product, reduce the thickness of product.
Embodiment
Below in conjunction with embodiment, further illustrate the present invention, should understand following embodiment and only for the present invention is described, is not used in and limits the scope of the invention.
Shield type PCB multi-layer sheet disclosed by the invention, comprises top layer, bus plane, stratum, bottom and is filled in the electromagnetic shielding material at least one laminate plate.Shield type PCB multi-layer sheet disclosed by the invention, by fill electromagnetic shielding material in body, when improving body hot strength, also effectively improved the anti-electromagnetic interference capability of pcb board body, improved on pcb board interference free performance between adjacent two layers components and parts, reduced the interference between adjacent two layers components and parts, improved the Stability and veracity of components and parts operations, thereby effectively improved the overall operation efficiency of circuit, for reducing the realization that pcb board is thick under the prerequisite guaranteeing pcb board intensity, brought possibility, thereby can effectively reduce the multiple-plate thickness of PCB, improve wiring density, be conducive to reduce the volume of product, reduce the thickness of product.
As a kind of preferred, electromagnetic shielding material becomes layered arrangement in bus plane.By the electromagnetic shielding material of layered arrangement is set in bus plane, be conducive to realize to producing the control of materials'use cost, reduce the use amount of shielding material in pcb board, thereby at production control cost, when guaranteeing shield effectiveness, also realize multilayer setting and the protection of shielding construction in body, effectively improved the interference free performance of pcb board.
As a kind of preferred, in pcb board, in electromagnetic shielding material layer, the dispersion density of wire rod is identical.By electromagnetic shielding material in pcb board is evenly arranged on pattern, stability and the quality homogeneity of pcb board shielding properties have effectively been improved, thereby effectively improved the total quality of pcb board, avoided skewness and the appearance of the inconsistent defect of screening ability everywhere on the pcb board that causes.
As a kind of preferred, electromagnetic shielding material is the metal whisker of diameter 4-6 micron or the conducting polymer nano wire of diameter 20-40 nanometer.By adopting metal whisker or conducting polymer nano wire, it is electromagnetic shielding material, can effectively improve the compatibility of body and wire rod, can also strengthen the intensity of body, and not need other extra filling reinforcing material, also guaranteed the shielding properties of pcb board simultaneously.
As a kind of preferred, metal whisker is iron whiskers or al whisker or silver-colored whisker.
As a kind of preferred, conducting polymer nano wire is polyacetylene nano wire or polyaniline nano-line or polythiophene nano wire or polypyrrole nano line.
The volume filling rate of the electromagnetic shielding material in shield type PCB multi-layer sheet body disclosed by the invention is no more than 20%.For example, electromagnetic shielding material is with the one or any several mixture in iron whiskers or al whisker or silver-colored whisker or polyacetylene nano wire or polyaniline nano-line or polythiophene nano wire or polypyrrole nano line, wherein the diameter of whisker is the arbitrary value in 4 microns, 5 microns, 6 microns or 4-6 micron, the arbitrary value in diameter 20 nanometers, 30 nanometers, 40 nanometers or the 20-40 nanometer of nano wire.The volume filling rate of electromagnetic shielding material is 10%, 15%, 20% or is not more than arbitrary value of 20%.For realizing dispersed in pcb board of electromagnetic shielding material, electromagnetic shielding material with nylon stratum reticulare for depending on material, whisker or nano wire are evenly distributed on nylon stratum reticulare surface, are then carrying out the filling compacting of pcb board body, can also strengthen the intensity of pcb board simultaneously.
Shield type PCB multi-layer sheet disclosed by the invention by filling the equally distributed electromagnetic shielding material of stratiform in pcb board, enhancing body hot strength and anti-electromagnetic interference performance have been realized simultaneously, effectively improved on pcb board interference free performance between adjacent two layers components and parts, reduced the interference between adjacent two layers components and parts, improved the Stability and veracity of components and parts operations, thereby effectively improved the overall operation efficiency of circuit, and then effectively shortened the spacing of pcb board in circuit, reduced multiple-plate volume, be conducive to reduce the volume of product, reduce the thickness of product.
The disclosed technological means of the present invention program is not limited only to the disclosed technological means of above-mentioned technological means, also comprises the technical scheme being comprised of above technical characterictic combination in any.
Claims (6)
1. a shield type PCB multi-layer sheet, comprises top layer, bus plane, stratum and bottom, it is characterized in that: described shield type PCB multi-layer sheet also comprises the electromagnetic shielding material being filled at least one laminate plate.
2. shield type PCB multi-layer sheet according to claim 1, is characterized in that: described electromagnetic shielding material is filled in bus plane and becomes layered arrangement.
3. shield type PCB multi-layer sheet according to claim 2, is characterized in that: in described pcb board, in electromagnetic shielding material layer, the dispersion density of wire rod is identical.
4. shield type PCB multi-layer sheet according to claim 3, is characterized in that: described electromagnetic shielding material is the metal whisker of diameter 4-6 micron or the conducting polymer nano wire of diameter 20-40 nanometer.
5. shield type PCB multi-layer sheet according to claim 4, is characterized in that: described metal whisker is iron whiskers or al whisker or silver-colored whisker.
6. shield type PCB multi-layer sheet according to claim 4, is characterized in that: described conducting polymer nano wire is polyacetylene nano wire or polyaniline nano-line or polythiophene nano wire or polypyrrole nano line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210198202.2A CN103517541A (en) | 2012-06-15 | 2012-06-15 | Shielded PCB multilayer board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210198202.2A CN103517541A (en) | 2012-06-15 | 2012-06-15 | Shielded PCB multilayer board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103517541A true CN103517541A (en) | 2014-01-15 |
Family
ID=49899304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210198202.2A Pending CN103517541A (en) | 2012-06-15 | 2012-06-15 | Shielded PCB multilayer board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103517541A (en) |
-
2012
- 2012-06-15 CN CN201210198202.2A patent/CN103517541A/en active Pending
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140115 |