CN103458603A - Shielded reinforced PCB (printed circuit board) - Google Patents
Shielded reinforced PCB (printed circuit board) Download PDFInfo
- Publication number
- CN103458603A CN103458603A CN2012101724143A CN201210172414A CN103458603A CN 103458603 A CN103458603 A CN 103458603A CN 2012101724143 A CN2012101724143 A CN 2012101724143A CN 201210172414 A CN201210172414 A CN 201210172414A CN 103458603 A CN103458603 A CN 103458603A
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- pcb board
- wire rod
- shielding
- enhancement mode
- pcb
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Abstract
The invention discloses a shielded reinforced PCB (printed circuit board) which comprises a body and reinforcement wires. The reinforcement wires are arranged in the body, and electromagnetic shielding wires are further arranged in the body. By the aid of the shielded reinforced PCB, the technical problem of electromagnetic interference between adjacent boards or two adjacent layers of electronic components can be solved. The shielded reinforced PCB has the advantages that the electromagnetic shielding wires are arranged in the body, and the interference resistance of the body of the PCB is improved, so that the thickness of the PCB can be reduced under the condition that the strength of the PCB can be guaranteed, and the distance between two adjacent layers of components is shortened while the performance of the components is unaffected.
Description
Technical field
The present invention relates to a kind of printed circuit board (PCB), particularly a kind of shielding enhancement mode pcb board.
Background technology
Along with the development of information technology and the raising of associated fabrication techniques, it is the target of the diligent pursuit of present stage electronic information field institute and the direction of continuous progressive development that high speed information is processed with the high-speed and high-density information communication, and the running frequency of electronic component and the size of electronic component also constantly reduce equally.For example, computer main frequency has reached several GHz.
On high-frequency circuit, loss mainly is created in conductor and PCB, wherein particularly serious with the loss in PCB.When signal transmission, the problems such as high flow rate that these loss main manifestations are heating, noise and electrical power.Along with the operation frequency of electronic component and the raising of information density, the physical distance between electronic component and each circuit has been reduced to the weak current in electronic devices and components just phase mutual interference and impact can occur, thereby has affected the normal operation of electronic devices and components.Especially at the height of electronic devices and components in integrated multilayer PCB circuit board, it is particularly evident that this point embodies.
Summary of the invention
For addressing the above problem, the invention discloses a kind of shielding enhancement mode pcb board, the electromagnetic shielding wire rod that employing is filled in body, improved the antijamming capability of pcb board body itself, thereby can be in the situation that guarantee pcb board intensity, reduce thickness of slab, shorten the distance between the adjacent two layers components and parts, and do not affect the performance of components and parts.
Shielding enhancement mode pcb board disclosed by the invention comprises body and is filled in intrinsic intensity reinforcement wire rod that body also is filled with the electromagnetic shielding wire rod.Shielding enhancement mode pcb board disclosed by the invention, by fill the electromagnetic shielding wire rod in body, when improving the body hot strength, also effectively improved the anti-electromagnetic interference capability of pcb board body, improved on pcb board interference free performance between the adjacent two layers components and parts, reduce the interference between the adjacent two layers components and parts, improved the Stability and veracity of components and parts operations, thereby effectively improved the overall operation efficiency of circuit.
A kind of improvement of shielding enhancement mode pcb board disclosed by the invention, the electromagnetic shielding wire rod becomes layered arrangement in body.This improvement by arranging the wire rod of layered arrangement in body, be conducive to realize to producing the control of materials'use cost, reduce the use amount of shielding material in pcb board, thereby at the production control cost, when guaranteeing shield effectiveness, also realize multilayer setting and the protection of shielding construction in the body, effectively improved the interference free performance of pcb board.
Another of shielding enhancement mode pcb board disclosed by the invention improved, in body in electromagnetic shielding wire rod layer the dispersion density of wire rod identical.This improvement by evenly arranging electromagnetic shielding wire rod in body on pattern, effectively improved the stability of pcb board shielding properties, thereby effectively improved the total quality of pcb board, avoided skewness and the appearance of the inconsistent defect of screening ability everywhere on the pcb board that causes.
Another improvement of shielding enhancement mode pcb board disclosed by the invention, the electromagnetic shielding wire rod is metal whisker or conducting polymer nano wire.This improvement is the electromagnetic shielding wire rod by adopting metal whisker or conducting polymer nano wire, can effectively improve the compatibility of body and wire rod, can also strengthen the intensity of body, and not need other extra filling reinforcing material, also guaranteed the shielding properties of pcb board simultaneously.
Another improvement of shielding enhancement mode pcb board disclosed by the invention, metal whisker is iron whiskers or al whisker or silver-colored whisker.
Another improvement of shielding enhancement mode pcb board disclosed by the invention, the conducting polymer nano wire is polyacetylene nano wire or polyaniline nano-line or polythiophene nano wire or polypyrrole nano line.
Shielding enhancement mode pcb board disclosed by the invention by filling the equally distributed electromagnetic shielding wire rod of stratiform in body, enhancing body hot strength and anti-electromagnetic interference performance have been realized simultaneously, effectively improved on pcb board interference free performance between the adjacent two layers components and parts, reduced the interference between the adjacent two layers components and parts, improved the Stability and veracity of components and parts operations, thereby effectively improved the overall operation efficiency of circuit, and then effectively shortened the spacing of pcb board in the circuit, reduced multiple-plate volume.
Embodiment
Below in conjunction with embodiment, further illustrate the present invention, should understand following embodiment and only for the present invention is described, is not used in and limits the scope of the invention.
Shielding enhancement mode pcb board disclosed by the invention comprises body and is filled in intrinsic intensity reinforcement wire rod that body also is filled with the electromagnetic shielding wire rod.Shielding enhancement mode pcb board disclosed by the invention, by fill the electromagnetic shielding wire rod in body, when improving the body hot strength, also effectively improved the anti-electromagnetic interference capability of pcb board body, improved on pcb board interference free performance between the adjacent two layers components and parts, reduce the interference between the adjacent two layers components and parts, improved the Stability and veracity of components and parts operations, thereby effectively improved the overall operation efficiency of circuit.
As a kind of preferred, the electromagnetic shielding wire rod becomes layered arrangement in body.By the wire rod of layered arrangement is set in body, be conducive to realize to producing the control of materials'use cost, reduce the use amount of shielding material in pcb board, thereby at the production control cost, when guaranteeing shield effectiveness, also realize multilayer setting and the protection of shielding construction in the body, effectively improved the interference free performance of pcb board.
As a kind of preferably, in body in electromagnetic shielding wire rod layer the dispersion density of wire rod identical.This improvement by evenly arranging electromagnetic shielding wire rod in body on pattern, effectively improved the stability of pcb board shielding properties, thereby effectively improved the total quality of pcb board, avoided skewness and the appearance of the inconsistent defect of screening ability everywhere on the pcb board that causes.
As a kind of preferred, the electromagnetic shielding wire rod is metal whisker or conducting polymer nano wire.This improvement is the electromagnetic shielding wire rod by adopting metal whisker or conducting polymer nano wire, can effectively improve the compatibility of body and wire rod, can also strengthen the intensity of body, and not need other extra filling reinforcing material, also guaranteed the shielding properties of pcb board simultaneously.
As a kind of preferred, metal whisker is iron whiskers or al whisker or silver-colored whisker.
As a kind of preferred, the conducting polymer nano wire is polyacetylene nano wire or polyaniline nano-line or polythiophene nano wire or polypyrrole nano line.
The volume filling rate of the electromagnetic shielding wire rod in shielding enhancement mode pcb board body disclosed by the invention is no more than 20%, and electromagnetic shielding wire rod and the cumulative volume filling rate of intensity reinforcement wire rod in body are no more than 40%.For example, the electromagnetic shielding wire rod is with the one or any several mixture in iron whiskers or al whisker or silver-colored whisker or polyacetylene nano wire or polyaniline nano-line or polythiophene nano wire or polypyrrole nano line, wherein the diameter of whisker is less than 10 microns, and the diameter of nano wire is less than 100 nanometers.Intensity reinforcement wire rod adopts the packing material that glass fibre is body, wherein the volume filling rate of electromagnetic shielding wire rod is 10%, 15%, 20% or is not more than arbitrary value of 20%, surplus is intensity reinforcement wire rod, the cumulative volume filling rate be no more than 20%, 25%, 30%, 40% or the 20%-40% scope in arbitrary value.
Shielding enhancement mode pcb board disclosed by the invention by filling the equally distributed electromagnetic shielding wire rod of stratiform in body, enhancing body hot strength and anti-electromagnetic interference performance have been realized simultaneously, effectively improved on pcb board interference free performance between the adjacent two layers components and parts, reduced the interference between the adjacent two layers components and parts, improved the Stability and veracity of components and parts operations, thereby effectively improved the overall operation efficiency of circuit, and then effectively shortened the spacing of pcb board in the circuit, reduced multiple-plate volume.
The disclosed technological means of the present invention program is not limited only to the disclosed technological means of above-mentioned technological means, also comprises the technical scheme be comprised of above technical characterictic combination in any.
Claims (6)
1. a shielding enhancement mode pcb board, comprise body and be filled in intrinsic intensity reinforcement wire rod, and it is characterized in that: described body also is filled with the electromagnetic shielding wire rod.
2. shielding enhancement mode pcb board according to claim 1, it is characterized in that: described electromagnetic shielding wire rod becomes layered arrangement in body.
3. shielding enhancement mode pcb board according to claim 2 is characterized in that: in described body in electromagnetic shielding wire rod layer the dispersion density of wire rod identical.
4. shielding enhancement mode pcb board according to claim 3, it is characterized in that: described electromagnetic shielding wire rod is metal whisker or conducting polymer nano wire.
5. shielding enhancement mode pcb board according to claim 4, it is characterized in that: described metal whisker is iron whiskers or al whisker or silver-colored whisker.
6. shielding enhancement mode pcb board according to claim 4, it is characterized in that: described conducting polymer nano wire is polyacetylene nano wire or polyaniline nano-line or polythiophene nano wire or polypyrrole nano line.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012101724143A CN103458603A (en) | 2012-05-30 | 2012-05-30 | Shielded reinforced PCB (printed circuit board) |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012101724143A CN103458603A (en) | 2012-05-30 | 2012-05-30 | Shielded reinforced PCB (printed circuit board) |
Publications (1)
Publication Number | Publication Date |
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CN103458603A true CN103458603A (en) | 2013-12-18 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2012101724143A Pending CN103458603A (en) | 2012-05-30 | 2012-05-30 | Shielded reinforced PCB (printed circuit board) |
Country Status (1)
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10117089A (en) * | 1996-10-15 | 1998-05-06 | Kitagawa Ind Co Ltd | Electromagnetic wave shielding material |
JP2007299906A (en) * | 2006-04-28 | 2007-11-15 | Nitto Denko Corp | Article equipped with electromagnetic wave shielding sheet-like structure |
CN101164394A (en) * | 2005-04-18 | 2008-04-16 | 日东电工株式会社 | Structure having property for conducting or absorbing electromagnetic wave |
-
2012
- 2012-05-30 CN CN2012101724143A patent/CN103458603A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10117089A (en) * | 1996-10-15 | 1998-05-06 | Kitagawa Ind Co Ltd | Electromagnetic wave shielding material |
CN101164394A (en) * | 2005-04-18 | 2008-04-16 | 日东电工株式会社 | Structure having property for conducting or absorbing electromagnetic wave |
JP2007299906A (en) * | 2006-04-28 | 2007-11-15 | Nitto Denko Corp | Article equipped with electromagnetic wave shielding sheet-like structure |
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Effective date of abandoning: 20170801 |
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