CN103515506B - Light emitting diode packaging structure and its manufacturing method - Google Patents
Light emitting diode packaging structure and its manufacturing method Download PDFInfo
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- CN103515506B CN103515506B CN201210198065.2A CN201210198065A CN103515506B CN 103515506 B CN103515506 B CN 103515506B CN 201210198065 A CN201210198065 A CN 201210198065A CN 103515506 B CN103515506 B CN 103515506B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
Abstract
The invention discloses a light emitting diode packaging structure which comprises a substrate, an electrode formed on the substrate, a light emitting diode chip which is fixed on the substrate and is electrically connected with the electrode, a first reflector cup formed on the substrate and a packaging body which covers the light emitting diode chip on the substrate. The packaging structure provided by the invention also comprises a second reflector cup which encircles and covers the first reflector cup and the substrate. A reflective surface of the second reflector cup and the upper surface of a packaging layer together form a recessed surface. The invention also relates to a manufacturing method of the light emitting diode packaging structure.
Description
Technical field
The present invention relates to a kind of semiconductor package and its manufacture method, more particularly to a kind of LED package knot
Structure and its manufacture method.
Background technology
Compared to traditional luminous source, light emitting diode (Light Emitting Diode, LED) is with lightweight, body
The advantages of long-pending little, pollution low, life-span length, which is applied more and more widely as a kind of new luminous source.
Existing package structure for LED generally include substrate, the electrode formed on substrate, be fixed on substrate and
The light-emitting diode chip for backlight unit being electrically connected with the electrodes and the encapsulated layer of covering luminousing diode chip.In order to change in prior art
The light-out effect of kind package structure for LED would generally arrange a reflector around light-emitting diode chip for backlight unit, make luminous two
The light that pole pipe chip sends is reflected via reflector, so as to obtain the light of required angle.But physical dimension compared with
The inwall of the reflector in little package structure for LED is typically inclined-plane or faces directly, therefore can limit the angle of reflection of light
Degree, so as to cause overall light-out effect not good.
The content of the invention
In view of this, it is necessary to which a kind of package structure for LED that can improve light-out effect and its manufacturer are provided
Method.
A kind of package structure for LED, including substrate, the electrode being formed on substrate, be fixed on substrate and with electricity
Light-emitting diode chip for backlight unit that pole is electrically connected with, the first reflector being formed on substrate and it is filled in the first reflector and covers
Packaging body of the lid light-emitting diode chip for backlight unit on substrate, the packaging body are exiting surface away from the upper surface of light-emitting diode chip for backlight unit,
Also include the second reflector, second reflector encircles and covers the first reflector and substrate, second reflector it is anti-
The exiting surface that face is penetrated with encapsulated layer is collectively forming a concave surface.
A kind of package structure for LED manufacture method, comprises the following steps：
One substrate is provided, and electrode is formed on substrate；
Some first reflectors are formed on substrate；
Light-emitting diode chip for backlight unit is installed in the first reflector and is electrically connected with the electrode on substrate；
Packaging body is formed in the first reflector；
A coating is covered in the first reflector and the outside of substrate；
A depression is formed from coating to packaging body makes the coating for being covered in the first reflector top be formed as with recessed
Second reflector in face, the depression extend to packaging body from coating；And
Cutting substrate forms several package structure for LED.
The package structure for LED that embodiment of the present invention is provided is formed with camber line on the top of the first reflector
Second reflector of shape concave surface, Jing the second reflector reflection light be converged after again outgoing to strengthen the meeting of whole encapsulating structure
Poly- effect, so as to improve the light-out effect of package structure for LED, reaches the convergence light needed for requirement.
With reference to the accompanying drawings, with reference to specific embodiment, the invention will be further described.
Description of the drawings
The generalized section of the package structure for LED of the embodiment that Fig. 1 is provided for the present invention.
Schematic top plan views of the Fig. 2 for the package structure for LED in Fig. 1.
Elevational schematic views of the Fig. 3 for the package structure for LED in Fig. 1.
Fig. 4 to Figure 13 is obtained by each step in the manufacture process of the package structure for LED of an embodiment of the present invention
Package structure for LED generalized section.
Wherein, Fig. 4 be the present invention package structure for LED manufacture process in monolith substrate generalized section.
Fig. 5 is the schematic top plan view of monolith substrate in Fig. 4.
Fig. 6 is the schematic side view of monolith substrate in Fig. 4.
Fig. 7 is the elevational schematic view of monolith substrate in Fig. 4.
Main element symbol description
Package structure for LED 100
Substrate 10,10a
The first side wall 11
Second sidewall 12
3rd side wall 13
4th side wall 14
Upper surface 15
Lower surface 16
First groove 17
Second groove 18
Electrode 20
First electrode 21
Second electrode 22
Light-emitting diode chip for backlight unit 30
Wire 31
First reflector 40,40a
Outer wall 41,61
Inwall 42,62
Accommodation space 421
Roof 43
Packaging body 50
Exiting surface 51
Second reflector 60,60a
Concave surface 63
Coating 70
Mould 80
Convex surface 81
Following specific embodiment will further illustrate the present invention with reference to above-mentioned accompanying drawing.
Specific embodiment
Refer to Fig. 1 to Fig. 3, the package structure for LED 100 that first embodiment of the invention is provided, which includes base
Plate 10, on the substrate 10 spaced two electrode 20, it is fixed on first substrate 10 and luminous with what electrode 20 was electrically connected with
Diode chip for backlight unit 30, on substrate 10 and around light-emitting diode chip for backlight unit 30 the first reflector 40, cover light emitting diode
The packaging body 50 and one second reflector 60 of chip 30.
10 generally rectangular shaped tabular of the substrate, which includes four side walls, the first side wall 11, second sidewall the 12, the 3rd
Side wall 13 and the 4th side wall 14, four side walls are joined end to end successively, and wherein the first side wall 11 and the 3rd side wall 13 are relative, and second
Side wall 12 and the 4th side wall 14 are relative.The relative two ends of four side walls form two surfaces of substrate 10, i.e. upper surface respectively
15 and lower surface 16.The upper surface 15 is used to carry light-emitting diode chip for backlight unit 30.Some grooves are formed on the substrate 10, at this
In embodiment, the quantity of the groove is two, respectively the first groove 17 and the second groove 18.First groove 17 and second
Groove 18 is recessed from second sidewall 12 towards the direction of the 4th side wall 14 respectively, and through the upper surface 15 and lower surface of substrate 10
16, that is, first groove 17 and the second groove 18 are forming opening with upper surface 15 and 16 intersection of lower surface respectively.
The electrode 20 includes spaced first electrode 21 and second electrode 22, first electrode 21 and second electrode 22
The lower surface 16 of substrate 10 is extended to respectively via the inwall of the first groove 17 and the second groove 18 from the upper surface 15 of substrate 10.
The first electrode 21 and second electrode 22 cover opening that the first groove 17 and the second groove 18 formed at upper surface 15 so as to
Routing connection for light-emitting diode chip for backlight unit 30 provides more spaces, and it is recessed that first electrode 21 and second electrode 22 expose first
The opening that groove 17 and the second groove 18 are formed at lower surface 16.In other words, first groove 17 and the second groove 18 are only in base
Opening is exposed at the lower surface 16 of plate 10.When the package structure for LED 100 is used as lateral direction light emission light source, substrate 10
Second sidewall 12 be electrically connected with circuit board (not shown), first groove 17 and the second groove 18 are arranged towards circuit board,
The solders such as tin cream can be welded and fixed in the first groove 17 and the second groove 18, so as to circuit board can be made by scolding tin and
The electrode 20 being connected with the first groove 17, the second groove 18 is electrically connected.First groove 17, the second groove 18 are solder
There is provided accommodation space, prevent solder from melting and the All other routes form touch with circuit board, and then form short circuit.Certainly, if
When the package structure for LED 100 is not used as lateral direction light emission light source, first groove 17 and the second groove 18 can be saved
Go, the lower surface 16 of substrate 10 and circuit board are electrically connected with so as to package structure for LED 100 is accessed in circuit.
The light-emitting diode chip for backlight unit 30 is arranged at the upper surface 15 of substrate 10, and electric with first electrode 21 and second respectively
Pole 22 is located at the part of the upper surface 15 of substrate 10 and is electrically connected with.The light-emitting diode chip for backlight unit 30 can adopt die bond routing, flip
Connect etc. mode.In the present embodiment, the light-emitting diode chip for backlight unit 30 is fixed on one of electrode 20, and adopts wire
31 are connected with first electrode 21 and second electrode 22 respectively.
First reflector 40 is located at the upper surface 15 of substrate 10, and around light-emitting diode chip for backlight unit 30.This is first anti-
Penetrating cup 40 includes outer wall 41, inwall 42 and roof 43.The outer wall 41 is alignd with four side walls of substrate 10,42 cross section of inwall
Substantially oblong-shaped, which surrounds an accommodation space 421, and the bore of the accommodation space 421 is from the upper surface 15 of substrate 10 to remote
Direction from substrate 10 gradually increases, that is to say, that inwall 42 is outside to the direction away from substrate 10 from the upper surface 15 of substrate 10
Incline and extend.The roof 43 is along the direction connection outer wall 41 and inwall 42 parallel to substrate 10.The height of first reflector 40
More than the thickness of light-emitting diode chip for backlight unit 30.
First reflector 40 can also be made up of the material for not having reflecting properties.First reflector 40 is formed at substrate
Around wherein on 10 and by light-emitting diode chip for backlight unit 30, so as to form accommodation space 421 above light-emitting diode chip for backlight unit 30, it is
The formation of follow-up packaging body 50 provides space.First reflector 40 is enclosed located at the periphery of light-emitting diode chip for backlight unit 30, also be can use
In each light-emitting diode chip for backlight unit 30 and other elements are separated, play a part of insulating barrier, make each light-emitting diode chip for backlight unit
30 interference that other elements are protected from manufacturing process.
The packaging body 50 is filled in the accommodation space 421 that the first reflector 40 is surrounded.The packaging body 50 is away from luminous
The exiting surface 51 of diode chip for backlight unit 30 is a concave surface, that is, be covered in the thickness of packaging body 50 of the upper surface of substrate 10 from packaging body
50 center gradually increases to surrounding.Fluorescent material is evenly distributed with the packaging body 50.
Second reflector 60 surround substrate 10 and the first reflector 40 and covers the roof 43 of the first reflector 40.Should
Second reflector 60 includes outer wall 61 and inwall 62, and the outer wall 61 is located on outside four side walls of substrate 10, in the present embodiment
In, the side wall and the outside wall parallel of the first reflector 40 of the outer wall 61 and substrate 10 of the second reflector 60, and the second reflector
The height of 60 outer wall 61 is more than the height sum of substrate 10 and the first reflector 40.As outer wall 61 will be substrate 10 and first anti-
The outer wall for penetrating cup 40 is coated completely, therefore is also sealed both joints, is prevented from aqueous vapor or impurity from substrate 10 and first
The joint of reflector 40 is polluted into packaging body 50 to light-emitting diode chip for backlight unit 30.The inwall 62 and packaging body 50
Exiting surface 51 is docked at the roof 43 of the first reflector 40.In the present embodiment, the inwall 62 of the second reflector 60 is recessed
Curved surface, which is engaged with the exiting surface 51 of packaging body 50 and is collectively forming one and is smoothed towards 10 direction indent of substrate, area are bigger
Concave surface 63.That is, the smooth excessiveness at the roof 43 of the first reflector 40 of concave surface 63.In other embodiments, should
Concave surface 63 can also in non-smooth excessiveness at the roof 43 of the first reflector 40, such as concave surface 63 at the roof 43 with one compared with
Significantly turning, the i.e. spill of concave surface 63 can be adjusted setting according to actual needs.Light-emitting diode chip for backlight unit 30 sends
Light can shine package structure for LED 100 after reflecting via the first reflector 40 and/or the second reflector 60
It is outside.As the inwall 62 of the second reflector 60 is arc line shaped, it is easier to form the light of convergence than the structure of straight line or oblique line,
Go out light intensity beneficial to package structure for LED 100 is improved.
The package structure for LED 100 that embodiment of the present invention is provided is formed on the top of the first reflector 40 to be had
Second reflector 60 of concave curved surface, strengthens the convergence of rays effect of the reflection of the second reflectors of Jing 60, so as to improve light-emitting diodes
Pipe encapsulating structure 100 goes out light intensity.Additionally, the of the substrate 10 of package structure for LED 100 in present embodiment
The first groove 17 and the second groove 18 are formed on two side walls 12, accommodation space is provided for solders such as tin creams, so as to be beneficial to light source with
The electric connection of circuit board.
The present invention also provides the manufacture method of above-mentioned package structure for LED 100, below, will combine accompanying drawing to the system
The method of making is described in detail.
Refer to Fig. 4 to Fig. 7, there is provided a monolith substrate 10a, open up some mutual in the sidepiece of monolith substrate 10a
Every the first groove 17 and the second groove 18, and in the upper and lower surface and the first groove 17 and the second groove 18 of monolith substrate 10a
It is middle that some spaced electrodes 20 are set.Monolith substrate 10a is in tabular.Monolith substrate 10a can adopt macromolecule material
The material such as material or composite board is made.Electrode 20 be layed in using metal material substrate 10a upper and lower surface and the first groove 17,
The internal face of the second groove 18 is formed, the metal material only the first groove 17 and the second groove 18 internal face lay and not
Whole first groove 17, the second groove 18 are filled up, therefore the first groove 17 and the second groove 18 remain in that the shape of its depression.
Electrode 20 covers the first groove 17 in the upper surface side of monolith substrate 10a and the second groove 18 is located at the monolith substrate upper surface
Opening, first groove 17 and the second groove 18 be located at the opening of the monolith substrate lower surface not by electrode 20 cover and whole
The lower surface side penetrating electrode 20 of structure base board 10a.
Fig. 8 is referred to, some first reflector 40a are formed on monolith substrate 10a.The correspondence per one first reflector 40a
Two adjacent electrodes 20.The reflecting surface of first reflector 40a is self-reflection cup top surface to tapered truncated cone-shaped of substrate 10a
Face.First reflector 40a can using resin or plastic or other material by paste or pressing mold by the way of tie with monolith substrate 10a
Close.The height of first reflector 40a is at 150 microns between 500 microns (μm).
Fig. 9 is referred to, some light-emitting diode chip for backlight unit 30 are installed in the first reflector 40a and electricity with substrate 10a
Pole 20 is electrically connected with.In the present embodiment, per one first reflector 40a in install a light-emitting diode chip for backlight unit 30.It is each
Light-emitting diode chip for backlight unit 30 is electrically connected with two adjacent electrodes 20 by way of die bond routing.In other embodiment
In, the light-emitting diode chip for backlight unit 30 can also utilize flip or the mode of eutectic to be combined with electrode 20.
Figure 10 is referred to, packaging body 50 is formed in the first reflector 40a with covering luminousing diode chip 30 in entirety
On substrate 10a.The packaging body 50 can be formed by the way of injection moulding or pressing mold molding.The top surface of the packaging body 50 and first
The either flush of reflector 40a, to form a common horizontal plane.
Figure 11 is referred to, outside in package structure for LED covers a coating 70, and the coating 70 has one
Fixed thickness, is covered in the top of the first reflector 40a and packaging body 50, and around the first reflector 40a and monolith substrate 10a
Sidepiece.The coating 70 can be formed by the way of with the first reflector 40a identicals material and by pressing mold.
Figure 12 and 13 is referred to, a depression 71 is formed from coating 70 to packaging body 50.The step provides a mould 80, should
Mould 80 has a downward projection of convex surface 81.The depression 71 is by convex surface 81 is passed through drill bit or hobboing cutter to coating 70 just
Cut on coating 70 or roll and formed.The depression 71 extends to packaging body 50 from 70 top surface of coating.In present embodiment
In, hobboing cutter of the mould 80 for cylindrical structure, depression 71 is by rotating the mould 80 vertically, making the cylinder in rotation
The side of mould 80 is moved from coating 70 to packaging body 50, until 80 side of mould contacted with the first reflector 40a, so as to
Depression 71 is formed in coating 70 and packaging body 50.Certainly, in other embodiments, if desired it is of different shapes depression 71,
Mould in rotary moving 80 is can also continue to, depression 71 is increased to horizontal direction, so as to meet different requirements.Adjacent two depression
Coating 70 between 71 retains original thickness, so as to the with concave surface 63 second reflection is formed on the first reflector 40a
Cup 60a and the exiting surface 51 with the packaging body 50 of 63 integrally formed indent of concave surface.Due to forming depression 71 using mould 80, from
And it is easily controlled the precision of depression 71, be conducive to making the higher depression 71 of precision, so as to ensure for reflection light
The concave surface of two reflector 60a has higher precision, it is ensured that the convergence of rays performance of package structure for LED 100 and effect
Rate.
Figure 13 is referred to, cuts substrate 10a and the second reflector 60a to form several detached light emitting diode envelopes
Assembling structure 100.
The package structure for LED 100 of the present invention has the mould 80 of convex surface 81 in coating 70 and encapsulation using one
Depression 71 is integrally formed on body 50, so as to form tool reflector with concave surfaces, compared with the modes such as ejection formation, to forming concave surface
Precision be easily controlled so that the precision of the concave surface of the reflector is higher, be beneficial to the light that light-emitting diode chip for backlight unit 30 sends
Line accurately can be assembled, and improve the luminous efficiency of package structure for LED 100.
It is understood that for the person of ordinary skill of the art, can be done with technology according to the present invention design
Go out other various corresponding changes and deformation, and all these changes and deformation should all belong to the protection model of the claims in the present invention
Enclose.
Claims (10)
1. a kind of package structure for LED, including substrate, the electrode being formed on substrate, be fixed on substrate and and electrode
The light-emitting diode chip for backlight unit of electric connection, the first reflector being formed on substrate and it is filled in the first reflector and covers
Packaging body of the light-emitting diode chip for backlight unit on substrate, the packaging body are exiting surface away from the upper surface of light-emitting diode chip for backlight unit, its
It is characterised by：Also include the second reflector, second reflector encircles and covers the first reflector and substrate, and described second is anti-
The reflecting surface of cup is penetrated in concave curved surface, the reflecting surface of the second reflector is collectively forming one towards substrate with the exiting surface of encapsulated layer
The bigger smooth surface of direction indent, area.
2. package structure for LED as claimed in claim 1, it is characterised in that：First reflector includes one and base
The parallel roof of plate, the reflecting surface of the second reflector are docked at the roof of the first reflector with the exiting surface of packaging body,
Smooth surface smooth excessiveness at the roof.
3. package structure for LED as claimed in claim 1, it is characterised in that：The substrate includes upper surface and following table
If the dry side wall between face and upper and lower surface, one of side wall of the substrate caves inward to be formed with and passes through respectively
Wear first groove and the second groove of upper and lower surface.
4. package structure for LED as claimed in claim 3, it is characterised in that：The electrode includes spaced
One electrode and second electrode, the first electrode extend to the lower surface of substrate from the upper surface of substrate via the first groove, and this
Two electrodes extend to the lower surface of substrate from the upper surface of substrate via the second groove.
5. package structure for LED as claimed in claim 4, it is characterised in that：First groove and the second groove are passed through
Wearing the upper and lower surface of substrate and opening being respectively formed in upper and lower surface, the first groove and the second groove are in substrate
The opening that upper surface is formed is partially covered by the electrodes.
6. package structure for LED as claimed in claim 3, it is characterised in that：The height of second reflector is more than
The joint of the height sum of substrate and the first reflector, the second reflector hermetic sealing substrate and the first reflector.
7. package structure for LED as claimed in claim 1, it is characterised in that：First reflector includes outer wall,
The outer wall is coplanar with the side wall of substrate, and second reflector includes outer wall, and second reflector surround and coats the first reflection
The outside wall parallel of the side wall of the outer wall and substrate of cup, the outer wall of second reflector and the first reflector.
8. a kind of package structure for LED manufacture method, comprises the following steps：
One substrate is provided, and electrode is formed on substrate；
Some first reflectors are formed on substrate；
Light-emitting diode chip for backlight unit is installed in the first reflector and is electrically connected with the electrode on substrate；
Packaging body is formed in the first reflector；
A coating is covered in the first reflector and the outside of substrate；
A depression is formed from coating to packaging body makes the coating for being covered in the first reflector top be formed as with concave curved surface
The second reflector, the depression extends to packaging body from coating, and the reflecting surface of second reflector is in concave curved surface, described the
The reflecting surface of two reflectors is collectively forming one towards the bigger smooth song of orientation substrate indent, area with the exiting surface of encapsulated layer
Face；And
Cutting substrate forms several package structure for LED.
9. package structure for LED manufacture method as claimed in claim 8, it is characterised in that：It is described from coating to envelope
Dress body forms a depression makes the coating for being covered in the first reflector top be formed as the step of the second reflector with concave curved surface
Suddenly it is coating to be cut or is ground by a mould with downward projection of convex surface to make.
10. package structure for LED manufacture method as claimed in claim 9, it is characterised in that：The mould is in cylinder
Shape, the depression are by rotating cylindrical mold vertically, make the cylindrical die side in rotation from coating to encapsulation
Body movement is until mould side is contacted with the first reflector and formed.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210198065.2A CN103515506B (en) | 2012-06-15 | 2012-06-15 | Light emitting diode packaging structure and its manufacturing method |
| TW101124470A TWI546985B (en) | 2012-06-15 | 2012-07-06 | Led package and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210198065.2A CN103515506B (en) | 2012-06-15 | 2012-06-15 | Light emitting diode packaging structure and its manufacturing method |
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| Publication Number | Publication Date |
|---|---|
| CN103515506A CN103515506A (en) | 2014-01-15 |
| CN103515506B true CN103515506B (en) | 2017-04-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210198065.2A Active CN103515506B (en) | 2012-06-15 | 2012-06-15 | Light emitting diode packaging structure and its manufacturing method |
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| TW (1) | TWI546985B (en) |
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|---|---|---|---|---|
| CN104134743A (en) * | 2014-06-17 | 2014-11-05 | 京东方光科技有限公司 | LED packaging structure and method, display device and illuminating device |
| JP7266961B2 (en) * | 2015-12-31 | 2023-05-01 | 晶元光電股▲ふん▼有限公司 | light emitting device |
| CN110892318B (en) * | 2017-07-13 | 2023-10-24 | 索尼公司 | Light emitting device, display device, and lighting device |
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| TWM341809U (en) * | 2008-04-24 | 2008-10-01 | Hsin Chang Prec Co Ltd | Structural improvement for supporting bracket of LED (light emitting diode) |
| CN102354693A (en) * | 2011-10-25 | 2012-02-15 | 佛山市国星光电股份有限公司 | Capsulation structure of surface light source including a plurality of reflection cups |
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| TW201351718A (en) | 2013-12-16 |
| TWI546985B (en) | 2016-08-21 |
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