CN103515280A - Ejector pin device, lower electrode assembly, and assembly and disassembly methods of lower electrode assembly - Google Patents
Ejector pin device, lower electrode assembly, and assembly and disassembly methods of lower electrode assembly Download PDFInfo
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- CN103515280A CN103515280A CN201210200446.XA CN201210200446A CN103515280A CN 103515280 A CN103515280 A CN 103515280A CN 201210200446 A CN201210200446 A CN 201210200446A CN 103515280 A CN103515280 A CN 103515280A
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- thimble
- base
- electrostatic chuck
- protection device
- push pin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
Abstract
The invention discloses an ejector pin device. The ejector pin device comprises an ejector pin and an ejector pin base. The ejector pin is fixed on the ejector pin base. The ejector pin device is characterized in that the ejector pin device further comprises an ejector pin protection device which is detachably connected with the ejector pin base, and the ejector pin protection device is configured to be surrounded around the ejector pin when being connected onto the ejector pin base. The invention also discloses a lower electrode assembly, and assembly and disassembly methods of the lower electrode assembly. According to the invention, the deformation or fracture of the ejector pin due to the collision between an electrostatic chuck and the ejector pin in the assembly and disassembly processes of the lower electrode assembly can be reduced or avoided, so that the assembly and disassembly efficiency can be improved, the damage of the ejector pin and the influence of the damage of the ejector pin on the assembling and debugging of semiconductor machining equipment can be reduced and avoided, the production cost can be reduced, and the production efficiency can be improved.
Description
Technical field
The present invention relates to semiconductor technology, particularly push pin device, bottom electrode assembly and installation and removal method thereof.
Background technology
In semiconductor processing equipment, electrostatic chuck, for during semiconductor technology, utilizes the Electrostatic Absorption power between electrostatic chuck and wafer, and chip sucking is attached on electrostatic chuck to carry out the techniques such as etching of wafer.The push pin device in addition that coordinates electrostatic chuck to use together, utilizes push pin device can complete wafer taking a seat and disseating process on electrostatic chuck.
Refer to Fig. 1, wherein show at present conventional electrostatic chuck and the structure of push pin device.Wherein, electrostatic chuck 3 is fixed on electrostatic chuck pedestal 5, and is provided with location hole 6 in the submarginal position of electrostatic chuck 3, by location hole 6 is aimed to alignment pin 7, can help electrostatic chuck 3 to be fixed on electrostatic chuck pedestal 5; In the substantial middle position of electrostatic chuck 3, be provided with the centre hole 4 of the passage that rises or fall as thimble 1.Push pin device comprises thimble 1 and at the thimble base 2 of thimble 1 supported underneath thimble 1, thimble base 2 is fixed on thimble lowering or hoisting gear 8,
Thimble lowering or hoisting gear 8 is arranged on electrostatic chuck pedestal 5 inside, thereby thimble lowering or hoisting gear 8 can stretch and makes thimble 1 rise or fall along the centre hole 4 in electrostatic chuck.
In conjunction with Fig. 1, introduced the basic structure of electrostatic chuck and push pin device above, the wafer being undertaken by push pin device and electrostatic chuck below in conjunction with Fig. 2 A and Fig. 2 B explanation is taken a seat and disseats process.As shown in Figure 2 A, before processing one wafer 9, by thimble lowering or hoisting gear 8, thimble 1 is risen along centre hole 4, so that on the upper surface of the top ends of thimble 1 in electrostatic chuck 3, by manipulator, wafer 9 is placed on the thimble 1 of rise, wafer 9 is held, then thimble lowering or hoisting gear 8 makes thimble 1 fall along centre hole 4, so that under the upper surface of the top ends of thimble 1 in electrostatic chuck 3, thereby wafer 9 is placed on electrostatic chuck 3, as shown in Figure 2 B, this is for the process of taking a seat of wafer.After the machining of wafer 9, the electrostatic charge of releasing wafer 9, after treating that electric charge release is complete, thereby thimble lowering or hoisting gear 8 rises thimble 1 wafer 9 is risen, return to the situation shown in Fig. 2 A, then by manipulator, take wafer 9 away, this is the process that disseats of wafer, then carries out the processing of next wafer.
The process of being taken a seat and being disseated by above-mentioned wafer, can find out in semiconducter process, and thimble need repeatedly rise and fall along centre hole, therefore, in the installation process of push pin device and electrostatic chuck, need to guarantee thimble and centre hole complete matching.If thimble and centre hole do not line up, not only in technical process, thimble can not rise smoothly or fall along centre hole, and in the installation process of electrostatic chuck, is easy to occur electrostatic chuck and thimble to touch and causes the unfavorable situations such as thimble distortion or fracture.
In order to prevent above-mentioned unfavorable situation, in the installation process of push pin device and electrostatic chuck, taked at present following measure: first, in the installation process of push pin device, by thimble school tool, adjust the position of push pin device, behind the position of good push pin device to be adjusted, be fixed in again on lowering or hoisting gear 8, wherein, thimble school tool is provided with the centre hole consistent with electrostatic chuck 3, thereby can help to determine that whether the position of thimble 1 is suitable.Secondly, in the installation process of electrostatic chuck 3, by means of the alignment pin 7 on electrostatic chuck base 5, and the location hole 6 matching with alignment pin 7 on electrostatic chuck 3 carries out the installation of electrostatic chuck 3, alignment pin and location hole can play guiding function to electrostatic chuck in the installation process of electrostatic chuck, the probability that has reduced electrostatic chuck and thimble touching, contributes to realize the smooth installation of push pin device and electrostatic chuck.
Although above-mentioned measure is to a certain degree contributing to realize the alignment of thimble and centre hole, and reduce thimble and electrostatic chuck that touching occurs and cause the probability of thimble distortion or fracture, but still can not effectively avoid occurring electrostatic chuck with thimble touching in electrostatic chuck installation process and cause thimble distortion or rupture.This be because:
One, owing to utilizing thimble school tool to adjust the position of push pin device and push pin device is fixed on lowering or hoisting gear, be all by manually completing, thereby be easy to occur error, make thimble not on suitable position, therefore in the installation process of follow-up electrostatic chuck, be easy to occur the touching of thimble and electrostatic chuck, cause distortion or the fracture of thimble.
They are two years old, even if manually determine the correct position of thimble, but in the process of electrostatic chuck is installed, because alignment pin is tight with contacting of location hole on electrostatic chuck, coefficient of friction is very large, and electrostatic chuck has suitable weight, so staff is difficult to easily install electrostatic chuck, in the installation process of electrostatic chuck, be also easy to occur the touching of thimble and electrostatic chuck, cause distortion or the fracture of thimble.
They are three years old, unreasonable in thimble position, need to take off in the process that electrostatic chuck reinstalls, or in the process of other dismounting electrostatic chuck, similarly, because alignment pin is tight with contacting of location hole around electrostatic chuck, coefficient of friction is very large, and electrostatic chuck has suitable weight, staff is difficult to easily take off electrostatic chuck, if firmly careless slightly, just can cause the touching of thimble and electrostatic chuck, cause distortion or the fracture of thimble.
Therefore, in the installation process of the electrostatic chuck that caused for above-mentioned reasons and unloading process, the distortion of thimble or fracture will affect installation and the debugging of equipment, increase production cost, and cause the reduction of production efficiency.
Summary of the invention
In order to address the above problem, the invention provides a kind of push pin device, it can be in the installation and removal process of bottom electrode assembly, reduces or avoids the touching between thimble and electrostatic chuck.
For this reason; the invention provides a kind of push pin device; comprise thimble and thimble base; described thimble is fixed on thimble base; described push pin device also comprises the thimble protection device removably connecting with described thimble base, and described thimble protection device is configured to, and when it is connected on described thimble base, it is centered around described thimble around.
Wherein, described thimble protection device is the diameter that tubular structure and its internal diameter are greater than described thimble, and its external diameter is less than the internal diameter of the centre hole on electrostatic chuck described and that described push pin device is used in conjunction with.
Wherein, described thimble protection device comprises one or more guard members, and when described guard member is connected on described thimble base, the orthographic projection of described guard member in thimble susceptor surface is embedded in the gap between described thimble and centre hole.
Wherein, the connected mode between described thimble protection device and described thimble base comprises thread connecting mode or inserting mode.
Wherein, at described thimble protection device, the height when being connected to described thimble base is more than or equal to the height of described thimble.
Wherein, described thimble protection device is metal material.
By push pin device provided by the invention, its can reduce or avoid push pin device and be mated the installation process of bottom electrode assembly of use and unloading process in distortion or the fracture of the thimble that causes due to the collision of electrostatic chuck and thimble, thereby improve the efficiency of the installation and removal of electrostatic chuck, the impact on the installment and debugging of semiconductor processing equipment that reduces or avoided the damage of thimble and brought due to the damage of thimble, reduce production cost, and improved the efficiency of producing.
In order to address the above problem, the invention provides a kind of bottom electrode assembly, it can be in the installation and removal process of bottom electrode assembly, reduces or avoids the touching between thimble and electrostatic chuck.
For this reason, the invention provides a kind of bottom electrode assembly, comprise the electrostatic chuck that cooperatively interacts and the push pin device described in above-mentioned any one, and on described electrostatic chuck, be provided with the centre hole as thimble passage lanes, and described push pin device can be passed from described centre hole.
By bottom electrode assembly provided by the invention, it can reduce or avoid in the installation process of bottom electrode assembly and unloading process distortion or the fracture of the thimble that the collision due to electrostatic chuck and thimble causes, thereby improve the efficiency of the installation and removal of bottom electrode assembly, the impact on the installment and debugging of semiconductor processing equipment that reduces or avoided the damage of thimble and brought due to the damage of thimble, reduce production cost, and improved the efficiency of producing.
In order to address the above problem, the present invention also provides a kind of bottom electrode assembly installation method, and it can reduce or avoid the touching between thimble and electrostatic chuck.
For this reason, the invention provides a kind of bottom electrode assembly installation method, for above-mentioned bottom electrode assembly is installed, the method comprises:
Wherein, described step 101 specifically comprises:
Described thimble protection device is fixed on described thimble base, and utilizes thimble school tool to adjust the position of thimble base, then thimble base is fixed on thimble lowering or hoisting gear; Or
Utilize thimble school tool to adjust the position of thimble base, then thimble base is fixed on thimble lowering or hoisting gear, and described thimble protection device is fixed on described thimble base.
By bottom electrode assembly installation method provided by the invention; fixing thimble protection device in advance before fixing electrostatic chuck; can reduce or avoid like this distortion or the fracture of the thimble that causes due to the collision of electrostatic chuck and thimble in the installation process of bottom electrode assembly and in taking off process; thereby improve the installation effectiveness of electrostatic chuck; the impact on the installment and debugging of semiconductor processing equipment that reduces or avoided the damage of thimble and brought due to the damage of thimble; reduce production cost, and improved the efficiency of producing.
In order to address the above problem, the present invention also provides a kind of bottom electrode assembly method for dismounting, and it can reduce or avoid the touching between thimble and electrostatic chuck.
For this reason, the invention provides a kind of bottom electrode assembly method for dismounting, for dismantling above-mentioned bottom electrode assembly, the method comprises:
By bottom electrode assembly method for dismounting provided by the invention; fixing thimble protection device in advance before dismounting electrostatic chuck; can reduce or avoid like this electrostatic chuck take off process in distortion or the fracture of the thimble that causes due to the collision of electrostatic chuck and thimble; thereby improve the removal efficiency of electrostatic chuck; the impact on the installment and debugging of semiconductor processing equipment that reduces or avoided the damage of thimble and brought due to the damage of thimble; reduce production cost, and improved the efficiency of producing.
Accompanying drawing explanation
Fig. 1 is the structural representation of electrostatic chuck and push pin device in prior art;
Fig. 2 A and Fig. 2 B are the wafer that undertaken by push pin device and electrostatic chuck in prior art take a seat and the disseat schematic diagram of process;
The structural representation of the bottom electrode assembly that Fig. 3 provides for the embodiment of the present invention one;
The cross sectional representation of thimble protection device in the bottom electrode assembly that Fig. 4 A, Fig. 4 B, Fig. 4 C and Fig. 4 D provide for the embodiment of the present invention one;
Thimble protection device in the bottom electrode assembly that Fig. 5 A and Fig. 5 B provide for the embodiment of the present invention one and and thimble base between the schematic diagram of connected mode;
The schematic flow sheet of the bottom electrode assembly installation method that Fig. 6 provides for the embodiment of the present invention three;
The schematic flow sheet of the bottom electrode assembly method for dismounting that Fig. 7 provides for the embodiment of the present invention four.
Embodiment
For making those skilled in the art understand better technical scheme of the present invention, the bottom electrode assembly embodiment of the present invention being provided below in conjunction with accompanying drawing, push pin device, bottom electrode assembly installation method and bottom electrode assembly method for dismounting are described in detail.
The embodiment of the present invention one provides a kind of bottom electrode assembly.Refer to Fig. 3, the bottom electrode assembly that the embodiment of the present invention one provides comprises push pin device and the electrostatic chuck 35 being used in conjunction with this push pin device, and this push pin device comprises thimble 31, thimble base 32, thimble lowering or hoisting gear 33, thimble protection device 34.
Wherein, the push pin device in bottom electrode assembly and electrostatic chuck 35 are used in conjunction with, for completing workpiece the taking a seat or disseating process at processing chamber such as wafer.Common, the number of the thimble 31 on thimble base 32 can be but be not limited to three or four, in the embodiment of the present invention, take four describe as example.
The thimble using at present comprises metal needle, ceramic pin and resin pin etc.; in order to reduce or avoid the deformation and fracture of thimble 31 in the installation and removal process of bottom electrode assembly; push pin device in the embodiment of the present invention one also comprises the thimble protection device 34 removably connecting with described thimble base 32; this thimble protection device 34 is centered around around thimble 31 when being connected with thimble base 32; for intercepting the touching between electrostatic chuck 35 and thimble 31, thereby reduce or avoid the deformation and fracture of thimble.After electrostatic chuck 35 installs, can unload this thimble protection device 34, to guarantee the normal use of electrostatic chuck 35 and push pin device.Preferably, push pin device comprises the thimble protection device 34 consistent with thimble 31 numbers, to be respectively each thimble 31, provides protection.By this dismountable thimble protection device 34; can avoid due to touching, causing distortion or the fracture of thimble 31 in the installation of bottom electrode assembly and unloading process; thereby reduce or avoid the impact on the installment and debugging of semiconductor processing equipment, having improved production efficiency.
Below exemplary thimble protection device 34 is further detailed.
Refer to Fig. 4 A, it shows the cross sectional representation of exemplary thimble protection device 34.As shown in the figure, this thimble protection device 34 is tubular structure, and the inside and outside contour of the cross section of tubular structure is circle, and the internal diameter of tubular structure is greater than the diameter of thimble 31, and it is not shown that external diameter is less than the centre hole 36(of electrostatic chuck 35) internal diameter.The diameter that is greater than thimble 31 due to the internal diameter of thimble protection device 34 makes the thimble protection device 34 can be by thimble 31 around wherein; thereby thimble 31 is played a protective role; the external diameter of thimble protection device 34 is less than the internal diameter of the centre hole 36 of electrostatic chuck 35 simultaneously, to guarantee the normal mounting of electrostatic chuck 35.
Refer to Fig. 4 B, it shows the another kind of cross sectional representation of exemplary thimble protection device 34.Wherein thimble protection device 34 is tubular structure; the inside and outside contour of the cross section of tubular structure is square; the length of side of the interior profile of its cross section is greater than the diameter of thimble 31, and it is not shown that the catercorner length of the outline of its cross section is less than the centre hole 36(of electrostatic chuck 35) internal diameter.The length of side of the interior profile of tubular structure cross section is greater than the diameter of thimble 31 so that thimble protection device 34 can cover thimble 31; thereby thimble 31 is played a protective role; the catercorner length of the outline of the cross section of thimble protection device 34 is less than the internal diameter of the centre hole 36 of electrostatic chuck 35 simultaneously, to guarantee the installation of electrostatic chuck 35.
Refer to Fig. 4 C; it shows the another kind of cross sectional representation of exemplary thimble protection device 34; wherein thimble protection device 34 is tubular structure; the interior profile of tubular structure cross section is circular; and this circular diameter is greater than the diameter of thimble 31; the outline of the cross section of tubular structure is square, and this foursquare catercorner length to be less than centre hole 36(not shown) diameter.
Above-mentioned exemplary thimble protection device 34 be take tubular structure and is illustrated as example; at the internal diameter that meets tubular structure, be greater than the diameter of thimble; and the external diameter of tubular structure is less than in the situation of diameter of electrostatic chuck centre hole, and the cross section of this tubular structure can be also other shapes except the above-mentioned shape illustrating.In the present embodiment, internal diameter refers to that end points is arranged in the length of the line segment line of shortest length section on the profile of tubular structure cross section, and external diameter refers to that end points is arranged in the length of the line segment nose section on the outline of tubular structure cross section.For example, the shape of cross section of tubular structure can be interior profile for circular, and outline is polygon, and the internal diameter of tubular structure and external diameter meet respectively above-mentioned condition.
Except tubular structure, thimble protection device 34 can be comprised of one or more guard members.Refer to Fig. 4 D, it shows the another kind of cross sectional representation of exemplary thimble protection device 34, and wherein, the guard member 37 that thimble protection device 34 is L shaped pillar shape by 4 cross sections forms.When guard member 37 is connected on thimble base 32, it is centered around around thimble 31, and guard member 37 the lip-deep orthographic projection of thimble base 32 be embedded in described thimble 31 and centre hole 36(not shown) between gap in.By the thimble protection device being formed by guard member 37 34 of the present embodiment, can play a protective role to thimble 31, thereby reduce or avoid the touching between thimble 31 and electrostatic chuck 35 in the installation and removal process of bottom electrode assembly.Thimble protection device provided by the invention also can adopt the guard member of other numbers; by 3 cross sections, be for example that L shaped guard member forms; be arranged at respectively thimble around; the guard member that the embodiment of the present invention provides also can adopt other shape; for example can adopt cross section is the pillar shape of arc; except pillar shape, guard member also can adopt and can realize other structures that intercept thimble and electrostatic chuck function in addition.
Preferably, when thimble protection device 34 is connected on thimble base 32, the height of thimble protection device 34 is more than or equal to the height of described thimble 31.Wherein, the height of thimble protection device 34 refers to that it exceeds the height of thimble base 32 while being connected on thimble base 32, and the height of thimble 31 refers to that thimble 31 exceeds the height of the part of thimble base 32.Like this, thimble protection device 34 can be completely by thimble 31 around wherein, so that sufficient iris action to be provided.Preferably, thimble protection device 34 can be made by metal material, also can be made by other firm non-friable materials.Preferably; in order to facilitate the installation of thimble protection device 34; can the interior side bonds of thimble protection device 34 for example the material of sponge and so on as diaphragm, thereby prevent from occurring to touch with thimble 31 when thimble protection device 34 is installed and cause distortion or the breakage of thimble 31.In addition, thimble protection device 34 top can be sealing can be also open, can select according to the demand of processing technology, in the accompanying drawing of the embodiment of the present invention, take and openly illustrate as example.
Above the structure of thimble protection device 34 is illustrated, further illustrate thimble protection device 34 below and the thimble base 32 that is fixed between connected mode.
Refer to Fig. 5 A, it shows the connected mode between thimble protection device 34 and thimble base 32.Wherein, between thimble protection device 34 and thimble base 32, adopt thread connecting mode.Particularly, thimble protection device 34 lower end has screw thread 71, offers the screwed hole 72 mating with screw thread 71 on described thimble base 32, and preferably, the degree of depth of screw thread 71 is consistent with the degree of depth of screwed hole 72.By described screw thread 71 and described screwed hole 72, thimble protection device 34 can be fixed on described thimble base 32.Screwed hole 72 is opened in thimble 31 around, and after thimble protection device 34 is screwed in screwed hole 72, thimble protection device 34 can be by thimble 31 around wherein.The thimble protection device 34 of take in the present embodiment arranges and screwed hole 72 is set on screw thread 71, thimble base 32 describes as example; when thimble protection device 34 is tubular structure, also can adopt in thimble protection device 34 lower end internal thread hole is set, on thimble base 32, arrange the mode of screw thread.
Except the connected mode of above-mentioned screw thread, also can in other way thimble protection device 34 be fixed on thimble base 32, refer to Fig. 5 B, it shows the connected mode that adopts grafting between thimble protection device 34 and thimble base 32.Thimble protection device 34 lower end has plug 81, offers the slot 82 corresponding with plug 81 shapes on thimble base 32, and the degree of depth of preferred plug 81 is consistent with the degree of depth of slot 82.By the plug 81 of thimble protection device 34 bottoms is inserted in slot 82, thimble protection device 34 can be fixed on thimble base 32.Slot 82 is opened in thimble around, and after thimble protection device 34 is fixed in slot 82, thimble protection device 34 can be by thimble 31 around wherein.The plug of take in the present embodiment describes as toroidal as example, also can adopt the plug of other shape, for example, also can adopt the plug that comprises several plug terminals.The thimble protection device that the embodiment of the present invention provides is not limited to be connected with thimble base by above-mentioned two kinds of modes; guaranteeing under the prerequisite of firm connection and convenient installation and dismounting; thimble protection device also can adopt alternate manner to be connected with thimble base; for example; at thimble base, plug is set; in thimble protection device lower end, slot is set, the mode of utilizing plug to be connected with slot.For the thimble protection device of guard member form, can plug be set in the lower end of one or more guard members, and on thimble base, corresponding slot be set.
With respect to push pin device of the prior art; push pin device in the bottom electrode assembly that the embodiment of the present invention one provides comprises the thimble protection device removably connecting with thimble base; this thimble protection device is centered around thimble around on being connected to described thimble base time; for thimble provides protective effect; avoid in the installation process of bottom electrode assembly and unloading process distortion or the fracture of the thimble that the touching due to thimble and electrostatic chuck causes; avoid the impact on the installment and debugging of semiconductor processing equipment, improved production efficiency.
The embodiment of the present invention two provides a kind of push pin device, and this push pin device is identical or similar with push pin device in the bottom electrode assembly providing in above-described embodiment one.Thimble protection device in this push pin device is configured to when it is connected on described thimble base; can in the centre hole from the electrostatic chuck being used in conjunction with push pin device, pass; thereby guarantee the normal mounting of bottom electrode assembly; and after correct installation electrostatic chuck; thimble protection device can be pulled down, to guarantee the normal use of electrostatic chuck and push pin device.
The push pin device that the embodiment of the present invention two provides comprises the thimble protection device that can dismantle; this thimble protection device can be centered around thimble around; for thimble provides protective effect; reduce or avoid in the installation process of bottom electrode assembly and unloading process distortion or the fracture of the thimble that the touching due to thimble and electrostatic chuck causes; thereby reduce or avoided the impact on the installment and debugging of semiconductor processing equipment, having improved production efficiency.
The embodiment of the present invention three provides a kind of bottom electrode assembly installation method, the bottom electrode assembly providing for above-described embodiment one is installed, or for the push pin device that above-described embodiment two provides and the electrostatic chuck being used in conjunction with this push pin device are installed.Refer to Fig. 6, the embodiment of the present invention three provides a kind of bottom electrode assembly installation method, specifically comprises the steps:
Concrete, thimble protection device can be fixed on thimble base, and utilize thimble school tool to adjust the position of thimble base, then thimble base is fixed on thimble lowering or hoisting gear; Or utilize thimble school tool to adjust the position of thimble base, and thimble base is fixed on thimble lowering or hoisting gear, then thimble protection device is fixed on thimble base.Wherein on the tool of thimble school, there is the hole consistent with centre hole on electrostatic chuck, thereby help the position of location thimble base.If push pin device comprises the thimble protection device consistent with thimble number, a plurality of thimble protection devices are installed respectively.
Particularly, on electrostatic chuck base, alignment pin is installed, alignment pin is aimed to location hole corresponding on electrostatic chuck, utilize the guiding function of alignment pin and location hole that electrostatic chuck is arranged on electrostatic chuck base.Electrostatic chuck being arranged in the process on electrostatic chuck base, due to the protective effect of thimble protection device, avoided the touching of thimble and electrostatic chuck, thereby avoided touching distortion or the fracture of the thimble causing.
If thimble position is improper, in the process that rises or fall at thimble, may produce contact in electrostatic chuck, thereby affect thimble to the lifting of the safety and firmness of the workpiece of wafer and so on, therefore when thimble position is improper, need to reinstall, to guarantee the normal use of bottom electrode assembly.
If thimble protection device is to use thread connecting mode, thimble protection device can be screwed out from screwed hole, and thimble protection device be taken out from centre hole along the direction of thimble.If other connected mode is taken out thimble protection device from centre hole along the direction of thimble equally.If push pin device comprises a plurality of thimble protection devices, take off respectively all thimble protection devices.
The installation method providing by the embodiment of the present invention; in the process of the above-mentioned electrostatic chuck that installs or removes; obstruct due to thimble protection device; distortion or the fracture of the thimble that the touching due to thimble and electrostatic chuck causes have been avoided; thereby avoided the impact on the installment and debugging of semiconductor processing equipment; reduce production cost, improved production efficiency.
The embodiment of the present invention four provides a kind of bottom electrode assembly method for dismounting, for dismantling the bottom electrode assembly of above-described embodiment or the electrostatic chuck in bottom electrode assembly.Refer to Fig. 7, the bottom electrode assembly method for dismounting that the embodiment of the present invention four provides can comprise the steps:
If thimble protection device is to use thread connecting mode, thimble protection device can be enclosed within on thimble and along the direction of thimble and pass from centre hole, then in screwed hole, screw.If other connected mode, equally along the direction of thimble through centre hole fixing thimble protection device.If push pin device comprises a plurality of thimble protection devices, fix respectively all thimble protection devices.
Particularly, on electrostatic chuck base, alignment pin is installed, the guiding function of utilizing location hole corresponding on alignment pin on electrostatic chuck base and electrostatic chuck to provide, dismantles electrostatic chuck from electrostatic chuck base.
The method for dismounting providing by the embodiment of the present invention; in the process of above-mentioned dismounting electrostatic chuck; obstruct due to thimble protection device; distortion or the fracture of the thimble that the touching due to thimble and electrostatic chuck causes have been avoided; thereby avoided the impact on the installment and debugging of semiconductor processing equipment; reduce production cost, improved production efficiency.
Be understandable that, above execution mode is only used to principle of the present invention is described and the illustrative embodiments that adopts, yet the present invention is not limited thereto.For those skilled in the art, without departing from the spirit and substance in the present invention, can make various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.
Claims (10)
1. a push pin device; comprise thimble and thimble base; described thimble is fixed on thimble base; it is characterized in that; described push pin device also comprises the thimble protection device removably connecting with described thimble base, and described thimble protection device is configured to, and when it is connected on described thimble base, it is centered around described thimble around.
2. push pin device as claimed in claim 1, is characterized in that, described thimble protection device is the diameter that tubular structure and its internal diameter are greater than described thimble, and its external diameter is less than the internal diameter of the centre hole on electrostatic chuck described and that described push pin device is used in conjunction with.
3. as right is wanted the push pin device as described in 1; it is characterized in that; described thimble protection device comprises one or more guard members, and when described guard member is connected on described thimble base, the orthographic projection of described guard member in thimble susceptor surface is embedded in the gap between described thimble and centre hole.
4. push pin device as claimed any one in claims 1 to 3, is characterized in that, the connected mode between described thimble protection device and described thimble base comprises thread connecting mode or inserting mode.
5. push pin device as claimed any one in claims 1 to 3, is characterized in that, the height at described thimble protection device when being connected to described thimble base is more than or equal to the height of described thimble.
6. push pin device as claimed any one in claims 1 to 3, is characterized in that, described thimble protection device is metal material.
7. a bottom electrode assembly, comprise the electrostatic chuck and the push pin device that cooperatively interact, described push pin device comprises thimble and thimble base, and on described electrostatic chuck, be provided with the centre hole as thimble passage lanes, it is characterized in that, described push pin device is the push pin device described in claim 1-6 any one, and described push pin device can be passed from described centre hole.
8. a bottom electrode assembly installation method, for bottom electrode assembly claimed in claim 7 is installed, is characterized in that, the method comprises:
Step 101, fixedly thimble and thimble protection device;
Step 102, is arranged on electrostatic chuck on electrostatic chuck base;
Step 103, judges that whether the position of thimble is suitable, if suitable, continues step 104; If improper, from electrostatic chuck base, take off electrostatic chuck, forward step 101 to;
Step 104, removes thimble protection device.
9. method as claimed in claim 8, is characterized in that, described step 101 specifically comprises:
Described thimble protection device is fixed on described thimble base, and utilizes thimble school tool to adjust the position of thimble base, then thimble base is fixed on thimble lowering or hoisting gear; Or
Utilize thimble school tool to adjust the position of thimble base, then thimble base is fixed on thimble lowering or hoisting gear, and described thimble protection device is fixed on described thimble base.
10. a bottom electrode assembly method for dismounting, for dismantling bottom electrode assembly claimed in claim 7, is characterized in that, the method comprises:
Step 201, is fixed on thimble protection device on thimble base;
Step 202, dismantles electrostatic chuck from electrostatic chuck base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210200446.XA CN103515280B (en) | 2012-06-18 | 2012-06-18 | Push pin device, bottom electrode assembly and installation and removal method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210200446.XA CN103515280B (en) | 2012-06-18 | 2012-06-18 | Push pin device, bottom electrode assembly and installation and removal method thereof |
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| CN103515280A true CN103515280A (en) | 2014-01-15 |
| CN103515280B CN103515280B (en) | 2016-04-27 |
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| CN108399022A (en) * | 2018-01-18 | 2018-08-14 | 深圳市志凌伟业技术股份有限公司 | Mono-layer single-face multipoint electrode structure |
| CN109037138A (en) * | 2018-07-27 | 2018-12-18 | 广东阿达智能装备有限公司 | Thimble anti-collision structure and thimble module |
| CN111312653A (en) * | 2020-03-16 | 2020-06-19 | 北京北方华创微电子装备有限公司 | Wafer bearing device and semiconductor processing equipment |
| CN113414737A (en) * | 2021-07-09 | 2021-09-21 | 长鑫存储技术有限公司 | Thimble installation jig and method |
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| CN103515280B (en) | 2016-04-27 |
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Address after: 100176 No. 8 Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Beijing North China microelectronics equipment Co Ltd Address before: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Patentee before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing |